01_PEE_0217.qxp_p01 Cover 24/04/2017 14:35 Page 1 ISSUE 2 – May 2017 www.power-mag.com POWER SEMICONDUCTORS Low Temperature Silver Sintering Improves Reliability of Power Semiconductors Also inside this issue Opinion | Market News | Industry News APEC 2017 | PCIM 2017 | Power Module Substrates Power Modules | Automotive Power | Products | Website Locator NEW 250 mm 89 mm Nürnberg, 16. – 18.05.2017 Visit us: 89 mm 172 mm Hall 9 Booth 210 PrimePACK TM 7G IGBT MODULES Upgrading to 1200A in PP2 and 1800A in PP3 Main features of enhanced package design Low internal stray inductance Optimized thermal management CTI > 600 Lower power losses by new X-Series chips Higher power cycling capability Higher continuous operating temperature up to 175°C New silicone gel for high temperature operation Power Dissipation at 6kHz 6 Gen vs 7 Gen Line-up Module rating: 1700V/1400A 1200V 1700V Prr -24% diode PP2 wheeling Free 900A 1200A Pf 1200A Poff PP3 IGBT 1400A 1400A Pon 1800A 1800A Psat 6 Gen 7 Gen PrimePACKTM is registered trademark of Infineon Technology AG, Germany. Fuji Electric Europe GmbH Fon +49(0)69 - 66 90 29 0 Goethering 58
[email protected] 63067 Offenbach/Main – Germany www.fujielectric-europe.com 02_pee_0217.indd 1 24/04/2017 14:03 p03 Contents.qxp_p03 Contents 24/04/2017 15:08 Page 3 CONTENTS 3 PAGE 6 PAGE 28 Editor Achim Scharf Tel: +49 (0)892865 9794 Fax: +49 (0)892800 132 Market News Tailoring Circuit Materials for Email:
[email protected] PEE looks at the latest Market News and company developments Power Electronic Applications Production Editor Chris Davis As electronic devices continue to shrink in size as they grow in power, demand Tel: +44 (0)1732 370340 PAGE 10 grows for power electronic circuits with increased power density.