Brochure Power Electronics for EV Charges

11 29 18 40 03/2021 Note: All information is based on our present knowledge and is to be used for information purposes only. The specifications of our components may not be considered as an assurance of component characteristics. Power Electronics for DC Fast Chargers Fast DC for Electronics Power EV Chargers PERFORMANCE RANGE As electric vehicles become widespread, so must the infrastructure to charge them. One of the main requirements for the widespread use of electric vehicles is an accessible EV charging infrastructure. Governments and industries worldwide are preparing to invest in charging infrastructures. Availability and costs are the key to success in the fast growing EV Charger market. As the specialist in power electronics, we use state-of-the-art topologies featuring standard components, guaranteeing both excellent efficiency and availability. SEMIKRON offers a comprehensive portfolio of products that meet the needs of fast charge equipment from as little as 8kW up to the megawatt range. - Modular Power Blocks Products - Passenger EV Chargers PowerCell - Bus Chargers SEMITOP E1/E2 SEMiX 5 Compact designs and high power density SEMiX 3 Press-Fit High reliability to reduce downtime SEMITRANS Forward-looking topologies SKiM 63/93 High efficiency SEMIPACK Drivers Power Electronic Stacks Product Highlight Industrial Standard Combined with Superior Performance DC Fast Chargers require a power dense PFC, DC/DC, and output The thermal resistance is up 20% lower than the closest com- rectifier, all available in the SEMITOP E1/E2 packages. With a low petitor using standard thermal paste. Using High Performance inductance design, fast switching Si and SiC chips may be used to Thermal Paste (HPTP), a further 25% reduction is possible. their full potential. Achieve supply chain safety with this industrial standard module in a wide array of topologies. Thermal resistance Rth,j-s in K/W with standard thermal paste 100% 90% -20% Key features 80% Low inductance package 70% Multiple sourcing down to chip level 60% Best competitor SEMITOP E2 Optimised footprint 50% Flexible architecture 40% 2-screw concept 30% Press-Fit terminals 20% 12mm module height 10% No baseplate 0 SEMITOP® E1/E2 8kW up to 120kW 4 SEMIKRON Product Highlight Modular and Flexible Power for Your Charger Portfolio The 50kW PowerCell is a full power converter including PWM Key features controller and filters. With a modular design, the PowerCell 50kW rated power may be paralleled to 350kW and beyond. The output voltage 500VDC or 1000VDC Isolated output can seamlessly change between 500V and 1000V to meet DC DC Scalable for high power charging any power requirement in the market. CANopen communication protocol Easy integration and maintenance – all connections at the front Parallel operation for high power charging Integrated transformer for safe galvanic isolation 600 Payment Charging Systems Station Vmax=500V 500 Charging I/V Control Pmax=50kW 400 I/V Imax=1A 300 Voltage in V Imax=125A CANopen 200 SEMIKRON 50kW PowerCell Vmin=100V PFC+DC/DC 100 0 20 40 60 80 100 120 140 Current in A PowerCell 50kW up to 350kW SEMIKRON 5 6 SEMIKRON Product Portfolio Power Modules SEMIPACK® SEMiX® 3 Press-Fit SEMiX® 5 800V up to 2200V 100kW up to 400kW 50kW up to 150kW Bipolar modules from the Exceeding the standard for superior Extended standard for superior market leader performance thermal and dynamic performance 6 housing sizes SEMIPACK 1 to 6 Industry standard press-fit design with Industry standard baseplate module 800V to 2200V: 20A to 1360A 17mm high housing height 650V / 1200V / 1700V IGBT: 100A to 400A SEMIKRON diode and thyristor chips 650V / 1200V / 1700V IGBT: 225A to 700A Sixpack, NPC, TNPC, PFC, and half-controlled 1200V Hybrid SiC: 600A Bridge Rectifier topologies Diode and thyristor in un-, half- and full-controlled topologies Half-Bridge and split NPC topologies Optimised module layout for maximum heat transfer Different technologies for certain packages: Direct driver assembly high reliability pressure contact or Enhanced thermal and electrical diode Available with integrated shunt resistor cost-effective wire bonded modules performance Enhanced isolation voltage of 4.8kV/1s available on request SiC Schottky Diode modules up to 300A SEMITRANS® SKiM® 63/93 SEMITOP ® E1/E2 50kW up to 200kW 50kW up to 150kW 8kW up to 120kW The proven power electronics package High reliability design using sinter Extended standard for superior technology Robust industry standard package for thermal and dynamic performance multiple sourcing in 6 housing sizes Power module in sixpack configuration Baseplate-less industry standard power with three separate half-bridges 600V / 650V / 1200V / 1700V IGBT: module in two housing sizes 25A to 900A 650V / 1200V / 1700V IGBT: Press-fit pins for solder-less connection to PCB 1200V SiC: 125A to 500A 300A to 900A 1200V Hybrid SiC: 450A 650V and 1200V: 10A to 250A Half-bridge, single switch and H-Bridge, Half-Bridge, Vienna rectifier, brake chopper topology Sixpack and buck/boost topologies fast rectifier topologies Multiple IGBT sources Low inductance design thanks to symmetrical layout Optimised mounting concept and pre-applied Increased power range in 62mm thanks High Performance Thermal Paste provide to portfolio extension in 1200V and 1700V Solder-free module and driver lowest thermal resistance in class half-bridges: PCB mounting Soft and fast switching 650V IGBT S5 and H5 1200V / 600A 1700V / 500A Hybrid and full SiC modules up to 1200V/250A SEMIKRON 7 Power Electronic Stack Platforms Fully Qualified Inverter Assemblies Tailored to Your Specific Needs Standard Stacks Customised Stacks SEMIKRON’s Power Electronic Stacks enable our customers to In addition to standard stacks, SEMIKRON has vast experience succeed in dynamic markets and meet any global challenge. in developing customer-specific solutions. Engineers are avail- We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages able in our stack centres around the globe to offer such solutions from 380V to 690V. Our standard stacks cover a output current by adapting existing platforms or designing customized converters. range from 70A to 4000A. Four key factors for your success Water-Cooled IGBT Stacks Shortest time to market SKiiPRACK Cost savings in R&D, production and qualification SEMIKUBE MLI Global SEMIKRON stack production footprint Highly experienced engineering team Air-Cooled IGBT Stacks SEMIKUBE SEMIKUBE SlimLine Diode/Thyristor Stacks SEMISTACK CLASSIC B6U/B6C/W3C SEMIKUBE® SlimLine Air-cooled IGBT Power Stack SEMIKRON 9 Product Portfolio IGBT Driver Above the Standard SEMIKRON’s unique product portfolio enables access to all Reliable established industries with a one-stop solution that combines SEMIKRON’s SKYPER and SKHI are well-known, highly robust and state-of-the-art power modules and driver electronics. reliable IGBT driver solutions under demanding environmental conditions. SEMIKRON’s IGBT drivers are available as two-channel driver Over many years of field operation experience the proprietary IGBT cores suitable for any standard semiconductor power module or driver technology has been relentlessly developed further. This as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, technology sets new standards for the essential features of safe SEMITRANS 10 and compatible modules. gate control, reliable gate protection and reinforced insulation. Cost Efficient Key factors Achieve outstanding system compactness and create space- and Reinforced insulation for signal and power transmission cost-effective inverter designs with SEMIKRON’s drivers, utilizing Two-channel driver highly integrated ASIC technology. Isolated DC-link voltage and Up to 1700V transients temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce Up to 1500V continuous DC bus voltage system costs significantly. 8Apk to 35Apk per channel 1W to 4.2W peak per channel Time Efficient Suitable for multi-level topologies and Generation 7 IGBT More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market. SKYPER & SKHI SKYPER SKYPER & SKHI Driver Cores Plug-and-Play Driver Adapter Board and Application Samples Two-channel driver cores for PCB Two-channel drivers for direct Adapter boards for driver core mounting integration with SEMIKRON ASIC module mounting with electrical to SEMIKRON IGBT and SiC modules technology and integrated safety or optical interface functions SEMIKRON 11 Thermal Interface Materials Stay Cool – Heat Dissipation is Our Job SEMIKRON was the first power module manufacturer on the Key features market to offer power modules with pre-applied thermal Increased productivity thanks to reduced handling costs and interface material. With more than two decades of field experi- improved logistics ence and more than 17 million pre-printed modules in the field, Low thermal resistance with optimised TIM layer thickness benchmarks are being set. The modules with pre-applied TIM Improved lifetime and reliability are printed in a clean environment on an automated and SPC Improved assembly robustness controlled

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