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17. Semiconductors II Component Developers, Technologies, Fabrication 17. Semiconductors II Component Developers, Technologies, Fabrication 07-APR-2020 EIEN25 Power Electronics Devices, Converters, Control and Applications L18: Power semiconductor • Power semiconductor devices:W producers and developers (first two to begin with) – Semikron.comW – Infineon.com W • Exploring components – Physical layout and packing: Semikron Skillbox • Simulation tools – Set up your application (e-bike, BEV, etc) requirements, select and evaluate drive module • IGBT characterization – Equivalent circuit / Measurement Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 2 References 1. L. Lorenz, "Power semiconductors state-of-art and development trends", 2007 7th Internatonal Conference on Power Electronics, 2007, pp.683-686} [4692474] 2. H. Wang and F. Wang and J. Zhang, "Power Semiconductor Device Figure of Merit for High-Power- Density Converter Design Applications", IEEE Transactions on Electron Devices, V 55 n 1, Jan 2008, pp.466-470 [4399669] 3. J. W. Kolar and J. Biela and S. Waffler and T. Friedli and U. Badstuebner, "Performance trends and limitations of power electronic systems", 2010 6th International Conference on Integrated Power Electronics Systems, March 2010, pp.1-20 [5730686] 4. K. Takao and S. Harada and T. Shinohe and H. Ohashi, "Performance evaluation of all SiC power converters for realizing high power density of 50 W/cm3", The 2010 International Power Electronics Conference - ECCE ASIA -, June 2010, pp.2128-2134 [5543727] 5. L. Zhang and X. Yuan and X. Wu and C. Shi and J. Zhang and Y. Zhang, "Performance Evaluation of High-Power SiC MOSFET Modules in Comparison to Si IGBT Modules", IEEE Transactions on Power Electronics, V 34 n 2, Feb 2019, pp.1181-1196 [8356111] 6. G. Liu and K. Li and Y. Wang and H. Luo and H. Luo, "Recent advances and trend of HEV/EV-oriented power semiconductors – an overview", IET Power Electronics, V 13 n 3, 2020, pp.394-404} [9007085] 7. A. Wintrich, U. Nicolai, W. Tursky, T. Reimann, “Application Manual Power Semiconductors”, SEMIKRON International GmbH, 2015 1. https://www.semikron.com/service-support/application-manual.html Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 3 Power SC devices and development [6] • Faster dynamics? • Lower losses? • Higher switching frequency and efficiency? Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 4 Electric drive system • PE – switching for voltage conditioning DCV↔3φ-ACV • EDS – 2-level voltage source inverter fed grid and machines Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 5 Modulation spectra • Electrical machines: Sinusoidal phase alternation preferred and PWM voltage delivered • Voltage applied along the windings and across the insulation system • Not only transient voltage but also high harmonic content fed Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 6 Semiconductor device fabrication W W • Wafer – thin slice of semiconductor – Microfabrication processes W – Integrated circuits W • Power electronic substrate W – Direct Bonded Copper • Power electronic moduleW W – Power inverter Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 7 https://www.youtube.com/watch?v=bor0qLifjz4 Chip Manufacturing • From sand to high precision and quality semiconductor component Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 8 https://www.youtube.com/watch?v=qQ9IR4gvXDs Power module production line • Semikron MiniSKiiP power modules – advanced automated assembly 2 Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 9 Looking into SEMIKRON skillbox Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 10 Content of the skillbox • SEMIKRON has put together a SKillbox to show students the different packaging technologies used in power electronic systems. – https://www.semikron.com/about-semikron/news- press/detail/semikron-supports-academic-training-with-new- box-containing-power-electronics-components.html – collection of 16 power electronic components • Discussion on material and value chain – Focus on and around power semiconductor device Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 11 Looking into the box Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 12 Studying SEMIKRON • SKillbox, semisel, manual Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 13 SC application orientation • Application oriented technology development Integrated Gate Commutated Thyristor (IGCT), High Voltage (HV), Insulated Gate Bipolar Transistor (IGBT), Metal Oxide Semiconductor Field Effect Transistor (MOSFET), SuperJunction MOS (SJMOS), Flexible Alternating Current Transmission System (FACTS), High Voltage Direct Current (HVDC) Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 14 SC material development Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 15 Chip technology & Packaging Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 16 SC development challenges • Power capability – Higher voltage and temperature – Current share and inductance – Electromagnetic interference • Compactness and reliability – Power-overlay instead of bond-wires • Cooling integration – Double-sided active cooling Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 17 More from Less Infineon – The power modules GE Global Research – HybridPACK™ DSC (Double Power Overlay KW Sided Cooling) target hybrid and electric vehicles applications module. Designed for such as main inverters and 1200V 100A. The module generators (power range 40 to size is 43 mm by 24.5 mm, 50 kW). They have extremely and the total thickness is small dimensions of only 42 mm x 42.4 mm x 4.77 mm. 1.7mm. Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 18 IGBT module • Structure, characteristics, equivalent circuits and parameters Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 19 Selection and evaluation tools • Semikron – Simsel – Online calculation and simulation tool for losses, temperatures and optimal choice of power electronic components • Infineon – Discrete IGBT Motor Drive simulation Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 20 Topology & parameters • Topology selection • Parameter specification Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 21 Device and cooling selection • Forced cooling – Air – water Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 22 Load profile and losses Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 23 Outcomes from thermal analysis Air cooled Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 Water cooled 24 Evaluation Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 25 Discrete IGBT Motor Drive Simulator Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 26 Inverter Output Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 27 Inverter and component losses Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 28 Phase-A High and Low side losses IGBT Diode Diode IGBT Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 29 IGBT behaviour model • Short survey – Chapter 7 at SEMIKRON manual – K. Sheng, B. W. Williams, S.J. Finney, “A Review of IGBT models”, IEEE Trans Pow El., v 15 n 6, 2000 Lund University / LTH / IEA / Avo Reinap / EIEN25 / 2020-04-07 30 IGBT model and parameter extraction • P.O. Lauritzen, G. K. Andersen, M. Hesper, “A Basic IGBT Model with Easy Parameter Extraction” IEEE PESC 2001 • … Lund University / LTH / IEA / ARAvo / ReinapEIEN25 / /EIEN25 2019-04-09 / 2020-04-07 3131.
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