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New Products and Services 01_PEE_0412_p01 Cover 17/04/2012 11:05 Page 1 ISSUE 3 – April/May 2012 www.power-mag.com POWER SEMICONDUCTORS New SiC Thin-Wafer Technology Paving the Way of Schottky Diodes with Improved Performance and Reliability Also inside this issue Opinion | Market News | PCIM 2012 | Industry News | Power Modules | Power Semiconductors | Automotive Power | Products | Website Locator | 02_PEE_0312_Layout 17/04/2012 08:23 Page 1 EconoDUAL™ 3 – Best in class Highest Power Density with 600 A modules with 650 V / 1200 V / 1700 V IGBT4 The ‘Best in class’ EconoDUAL™ 3 portfolio with new PressFIT auxiliary terminals : I FF600R07ME4_B11 I FF600R12ME4_B11 I FF600R17ME4_B11 The EconoDUAL™ 3 modules key applications: I Construction, commercial and agriculture vehicles I High performance drives I Wind applications The EconoDUAL™ 3 with optimized features: I Improved switching characteristics I Minimized thermal and electrical resistance I Enhanced mechanical robustness I PressFIT pins minimizes assembling costs and improves FIT rates www.infineon.com/highpower p03 Contents_p03 Contents 17/04/2012 11:27 Page 3 CONTENTS 3 PAGE 6 Editor Achim Scharf COVER STORY Tel: +49 (0)892865 9794 Market News Fax: +49 (0)892800 132 Email: [email protected] PEE looks at the latest Market News and company developments Production Editor Chris Davis PAGE 12 Tel: +44 (0)1732 370340 Financial Clare Jackson PCIM 2012 Tel: +44 (0)1732 370340 Fax: +44 (0)1732 360034 Circulation Manager Anne Backers PAGE 20 Tel: +44 (0)208 647 3133 Fax: +44 (0)208 669 8013 Industry News Email: [email protected] INTERNATIONAL SALES OFFICES Welding Diodes with Increased Mainland Europe: Victoria Hufmann, Norbert Hufmann Thermocycling Capability Tel: +49 911 9397 643 Fax: +49 911 9397 6459 New SiC Thin-Wafer Email: [email protected] Technology Paving Armin Wezel Hot Swap Controller for Continuous phone: +49 (0)30 52689192 the Way of Schottky mobile: +49 (0)172 767 8499 System Operation Email: [email protected] Diodes with Eastern US Improved LED-Driver Design for Replacement of Karen C Smith-Kernc Performance and email: [email protected] 100 W A19 Incandescent Bulbs Western US and Canada Reliability Alan A Kernc Tel: +1 717 397 7100 Silicon Carbide (SiC) Schottky barrier diodes (SBDs) PAGE 34 Fax: +1 717 397 7800 have been on the market since more than a decade email: [email protected] and sell today in millions of pieces per year, with proven quality in the field. The open SiC device market A Technology Platform for Italy has exceeded $50 million in 2010 (excluding Ferruccio Silvera defense-related and R&D contracts) with an Advanced Power Electronic Tel: +39 022 846 716 Email: [email protected] unexpectedly high penetration in the PV inverter segment where SiC Schottky diodes are now Japan: implemented in numerous systems, taking about 15% Systems Yoshinori Ikeda, of the SiC device sales. PFC systems are still the top Pacific Business Inc SiC device sales. The SKiN technology eliminates the weaknesses of the classical module design Tel: 81-(0)3-3661-6138 and introduces an integrated platform architecture for the design of compact and Fax: 81-(0)3-3661-6139 This confirms it as a mature technology, able to reliable power electronic systems. Email: [email protected] provide both full reliable and high-performance Uwe Scheuermann, Product Reliability devices. Moreover, the increasing request for energy Taiwan Manager, SEMIKRON Elektronik, Nuremberg, Germany efficiency experienced in the last years is at the base of Prisco Ind. Service Corp. the constantly growing observed in many applications. Tel: 886 2 2322 5266 Fax: 886 2 2322 2205 Besides high-end server and telecom SMPS, where SiC PAGE 38 Publisher & UK Sales Ian Atkinson SBDs have become a standard, increasing adoption is Tel: +44 (0)1732 370340 recorded mainly in solar inverters, motor drives and High-Speed GaN Switches TM Fax: +44 (0)1732 360034 lighting. Our cover story presents the new thinQ! 5th Generation (G5) of SiC Schottky diodes from Infineon Email: [email protected] Technologies. In G5, both the capacitive charge and for Motor Drives www.power-mag.com the forward voltage have been minimized through a Circulation and subscription: Power Electronics new and exclusive production process. The High speed, low loss, 600V GaN switches offer unique advantages to motor Europe is available for the following subscription improvements with respect to previous generations are drives. Increased bandwidth and improved system efficiency can be realized in a charges. Power Electronics Europe: annual charge discussed, with the support of direct application tests UK/NI £60, overseas $130, EUR 120; single copies results. Full story on page 30. range of applications, from workhorse induction motors to high-performance UK/NI £10, overseas US$32, EUR 25. Contact: servos. Jim Honea, Transphorm Inc., Jun Kang, Yaskawa America Inc., USA DFA Media, Cape House, 60a Priory Road, Tonbridge, Cover supplied by Infineon Technologies AG, Kent TN9 2BL Great Britain. Neubiberg, Germany Tel: +44 (0)1732 370340. Fax: +44 (0)1732 PAGE 42 360034. Refunds on cancelled subscriptions will only be provided at the Publisher’s discretion, unless Power Integration for a Smoother specifically guaranteed within the terms of subscription offer. Hybrid Driving Experience Editorial information should be sent to The Editor, Power Electronics Europe, PO Box 340131, 80098 Hybrid cars provide an important stepping stone between the conventional Munich, Germany. The contents of Power Electronics Europe are combustion engine and full electric propulsion. Engine start-stop technology is a subject to reproduction in information storage and key component of the major hybrid powertrains in the market today, and will retrieval systems. All rights reserved. No part of this publication may be reproduced in any form or by any benefit from greater power electronic integration to improve performance and means, electronic or mechanical including reliability. David Jacquinod, Application and Marketing Manager, photocopying, recording or any information storage Automotive Business Unit, International Rectifier Corporation, USA or retrieval system without the express prior written consent of the publisher. Printed by: Garnett Dickinson. PAGE 44 ISSN 1748-3530 Product Update A digest of the latest innovations and new product launches PAGE 49 Website Product Locator Power Electronics Europe Issue 3 2012 www.power-mag.com 04_PEE_0312_Layout 17/04/2012 08:31 Page 1 Renewables World'sWorld's MostMost PowerfulPowerful 1700V1700V DualDual IGBTIGBT ModuleModule forfor HighHigh PowerPower EnergyEnergy ConversionConversion Please visit us: PCIM 2012, Hall 12, Stand 421 [email protected] · www.mitsubishichips.eu 05_PEE_0312_NEW_p05 Opinion 17/04/2012 08:32 Page 5 OPINION 5 Looking at New YOURYOUR EXPERT Technologies FOR ELECTRONICS in-house end equipment. The open SiC device market has exceeded $50 million in 2010 (excluding COOLING defense-related and R&D contracts) with an WeWe offer product unexpectedly high penetration in the PV inverter optimization and segment where SiC Schottky diodes are now development to our implemented in numerous sys tems, taking about customers with 15% of the SiC device sales. PFC systems are still the top SiC device sales. Although 6” SiC wafer CFD capacity is now ramping-up for LED production at Thermal Simulation The largest PCIM ever will open on May 8 on CREE, the power industry is not yet able to access it Nuremberg fairgrounds with an extensive conference in volume. program and a great exhibition in two halls. The This outlook is one of the reasons that PEE for the PCIM Europe conference together with the exhibition third time has organized a Special Session at PCIM has evolved over the years as a major technical 2012 on this subject. This Special Session on May 9 platform for discussing new developments within the (10.00 - 12.30, Room Paris) is structured from lower field of power electronics in the conference seminars up to high-power applications and will allow for direct and demonstrating new achievements at the comparison between technologies such as SiC and exhibition stands. GaN, particularly at the final panel discussion with all A range of new power devices based on Silicon presenters and auditorium. Five papers will be Building of Prototypes and Wide Bandgap material such as Silicon Carbide presented in this Special Session. The technical and (SiC) and Gallium Nitride (GaN) designed to meet electrical advantages of the AlGaN/GaN devices are the future requirements of power converters in terms understood and deployed successfully in RF of ultra high efficiency and high power density design application. To make these devices commercially will be discussed during the poster and oral sessions, successful for high voltage applications, also, new particularly within PEE’s Special Session “High aspects needed to be considered. These aspects, Frequency Switching Technologies & Devices for TTypeype TTestingesting which are of technical, topological and product Green Applications”. According to market researchers, strategical nature, are discussed and solutions are the GaN power device industry has probably presented in the paper presented by MicroGaN generated less than $2.5 million revenues in 2011, (Germany). The current status of the development as only two companies (International Rectifier & EPC and current performance of the required 600 to Corp.) are selling products on the open market. 1200 V rated GaN on Si based devices at However, the overall GaN activity has seen extra Inter national Rectifier (USA) are presented in the revenues as R&D contracts, qualification tests and sampling for qualified customers was extremely second paper. From these results, it can be seen that buoyant. At ve ry short term, IRF and EPC will likely high-voltage GaN based power devices can be expected to provide the same performance obtained DAU – CENTER OF remain the two main vendors of GaN power devices COMPETENCE on the open market in early 2012. This market is using SiC devices, at a cost much closer to high likely to stay below $10 million for devices, with the performance Silicon based technologies.
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