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Please Join Us for an Open Forum with Gadi Singer VP & GM, Soc Intel’sIntel’s NewNew CategoryCategory ofof SoCSoC Designs,Designs, ProductsProducts JulyJuly 23, 23, 2008 2008 GadiGadi Singer Singer DougDoug DavisDavis ViceVice President,President, MobilityMobility GroupGroup ViceVice President,President, DigitalDigital EnterpriseEnterprise GroupGroup GeneralGeneral Manager,Manager, SoCSoC Enabling Enabling GroupGroup GeneralGeneral Manager,Manager, EmbeddedEmbedded && CommunicationCommunication GroupGroup IntelIntel CorporationCorporation IntelIntel CorporationCorporation Copyright © 2008, Intel Corporation Today’s News 9 Emerging category of smarter, purpose‐built SoC Designs. New levels of performance, power efficiency and complexity vs. traditional SoCs 9 Intel’s Smart SoC strategy: Intel architecture, advanced process technology, high performance computing, low power, high complexity expertise & R&D investment 9 >15 projects underway; Future SoCs based on Intel® Atom™ processor core; target growth areas 9 Perfectly timed with emerging need for persistently connected Internet devices 9 Introducing our first 8 new products; targeting a broad range of embedded, voice and security applications Copyright © 2008, Intel Corporation Designing Smart SoCs What is the emerging category that requires Smart SoCs? How is Intel poised to lead in this category? How is Intel internally structured for optimal development? Copyright © 2008, Intel Corporation Technology drivers Copyright © 2008, Intel Corporation Internet New Medium New Users New Uses > 1.2 B Mobile Internet Explosive emerging Location based Users in 2012 market growth services: 100X growth 100M TV households OTG Interactive watching internet video Entertainment on their TV by 2011 Tech-savvy & Internet generation Billions of embedded Connected in-car internet connected devices infotainment EMPIR E STATE BUILDI NG The Empire State Building is a 102-story Art Deco skyscraper in New York City, New York at the intersection of Fifth Avenue and West 34th Street. Its name is derived from the nickname for the state of New York. Sources: eMarketeer, The Diffusion Group, In-Stat Copyright © 2008, Intel Corporation Connectivity High bandwidth Rich Content Broad Reach >1.4B subscribers for 100 Mbps wireless by Hi-Def 3G/4G/WiMAX in 2012 2013 Encryption >33% annual growth in Multi-comms Asia/Pacific Gigabit Ethernet Uplink + Downlink Persistent connectivity * Source: Intel, ABI Research, 3GPP RAN1. 2010 numbers assume 2x2 MIMO; 2012 assumes 4x4 MIMO. * Source: Intel, ABI Research, 3GPP RAN1, In‐Stat Copyright © 2008, Intel Corporation Moore’s Law Economics of Moore’s Law Enabling • Supporting unprecedented complexity • 45nm -> 32nm -> 22nm • 100s of millions of transistor SoCs Continue the pace of dimension reduction and feature improvement Source: WSTS/Dataquest/Intel Copyright © 2008, Intel Corporation Emergence of Smart SoCs e ibl lex Smart, Flexible, d F Light & Simple an ) t Cs ar (P Sm Light and Simple (CE, Embedded) Intel Corporation Copyright © 2008, Performance & Capabilities & Performance IntelIntel SmartSmart SoCSoC Characteristics of Smart SoC Design Media Processing Complex Computing AV Display Graphics Complex Decoder Engine High performance, Low power: Fast CPU; Dynamic Encoder range; Performance per watt IA Tolapai CoreIA Scalable & low-power CoreIA CoreIAIA mem interconnect fabric CoreCores Multiple sophisticated sub-systems; Workload acceleration. Examples: Hi-def video, Security Memory Control I/O Complex High complexity & integration on die: >100M transistors Generic IA SoC Architecture Scalable & low-power I/O interconnect rd ce 3 Party IP IO Device evi O d Support of full operating systems and multi-source I complex software Simplified platform implementation Copyright © 2008, Intel Corporation *All information, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice “Exceptional user experience”-on-chip Enhanced Visual Computing 1B Transistors Higher Security & On-The-Go Manageability New IOs Multi-cores Next 5 years Complex accelerators Low power Sensors 1B Transistors Embedded Higher CPU performance DFM, DFT Copyright © 2008, Intel Corporation Intel advantage Intel High Process High HW & SW Architecture performance technology & complexity computing high volume handling leadership manufacturing expertise Extensive R&D investment Copyright © 2008, Intel Corporation SoCs For Multiple Market Segments, Growth Embedded CE ets MID Multiple mark IA Core + SoC Collateral + IP blocks Process technology & manufacturing capability Copyright © 2008, Intel Corporation Intel® Atom™ Processor Core • Ground-up new IA architecture design for low-power operation • 10X lower power • 2008: Powering Silverthorne, Diamondville • Future: Powering next-generation of Intel’s Smart SoCs Copyright © 2008, Intel Corporation All products, dates, and figures are preliminary and subject to change without notice. SoC technology layer benefits Fast Turn-Around-Time Flexibility & Customization Cost/Power/Size optimization High Performance Copyright © 2008, Intel Corporation Intel’sIntel’s NewNew CategoryCategory ofof SoCSoC Designs,Designs, ProductsProducts DougDoug DavisDavis ViceVice President,President, DigitalDigital EnterpriseEnterprise GroupGroup GeneralGeneral Manager,Manager, EmbeddedEmbedded && CommunicationsCommunications GroupGroup IntelIntel CorporationCorporation Today:Today: BillionsBillions ofof ConnectedConnected DevicesDevices Notebook Desktop Server Embedded Nettop MID Netbook CommonCommon Element:Element: TheThe InternetInternet TheThe NextNext BillionsBillions ofof ConnectedConnected DevicesDevices CommonCommon Element:Element: TheThe EmbeddedEmbedded InternetInternet IntelIntel ArchitectureArchitecture forfor EmbeddedEmbedded DeliveringDelivering AppliedApplied ComputingComputing BeyondBeyond thethe PCPC && ServerServer >> 35003500 customerscustomers servingserving 3030 segmentssegments forfor 3030 yearsyears IntelIntel ArchitectureArchitecture ProcessorsProcessors forfor EmbeddedEmbedded yTraditional Intel Architecture ySmart SoCs for Embedded for Embedded Desktop Mobile Server • 45% Smaller Footprint with 34% yLow Power Intel Architecture Lower Power* • Full Feature SoC •Fan-less • Embedded Requirements • Ultra Low Power • Integrated Accelerators support with • Small Footprint Intel® QuickAssist Technology • Launched Q2’08 SmallerSmaller –– Cooler Cooler -- Faster Faster *Assumptions: Compares Intel® Pentium® M processor platform with external PCI crypto accelerator to EP80579 256 byte packets with 2048 IPsec VPN tunnels IntelIntel®® EP80579EP80579 IntegratedIntegrated ProcessorProcessor ProductProduct LineLine SmartSmart IAIA SystemSystem--OnOn--aa--ChipChip 45% Smaller Footprint with 34% Lower Power* Full-Feature SoC • 4 chips to 1 for smaller form factors • Integrated memory controller • 11 to 21 watts • Flexible integrated I/O • 600MHz to 1.2GHz • TDM & analog voice connectivity Embedded Requirements Intel® QuickAssist Technology • 7 year extended life cycle support • Integrated accelerators • Industrial temp • Software for security & VoIP • Intel Architecture compatible • > 1Gbps security processing • Multiple operating systems *Compared to previous platform containing the Intel® Pentium® M processor, Intel® 915GME GMCH, Intel® ICH6-M and Intel® IXP465 network processor Intel'sIntel's FirstFirst IntegratedIntegrated x86x86 SoCSoC withwith QuickAssistQuickAssist TechnologyTechnology Intel EP80579 Integrated Processor Product Line Intel® Pentium® M Processor Four Chips to One MCH Accel ICH TDM or Security LowerLower PowerPower ComprehensiveComprehensive I/OI/O SmallerSmaller FootprintFootprint IntegratedIntegrated AccelerationAcceleration IntelIntel®® EP80579EP80579 withwith IntelIntel®® QuickAssistQuickAssist Example - IPSec VPN Appliance 45%45% FootprintFootprint ReductionReduction 34%34% PowerPower SavingsSavings 32 in2 (206 cm2) 17 in2 31W 2 (110 cm ) 21W SolutionSolution AreaArea PowerPower EP80579 1-chip Solution Traditional IA 4-chip Solution (CPU + MCH + ICH + PCI Crypto Accelerator) Assumptions: Compares Intel® Pentium® M processor platform with external PCI crypto accelerator to EP80579 256 byte packets with 2048 IPsec VPN tunnels. RichRich SoCSoC EcosystemEcosystem forfor EmbeddedEmbedded andand CommunicationsCommunications HardwareHardware SoCSoC DevelopmentDevelopment ContinuesContinues Increased Performance and Performance per Watt EmbeddedEmbedded CECE MIDsMIDs Smart SoCs for Bringing the Internet Projected >10X embedded to TV Reduction In Idle Power Compared to Future Roadmap of IA performance, with 2008 Platform increased data and CE features control plane First Entry Into performance Optimized for CE Phone Form Factors Internet content compatibility First SoC for MIDs Intel Atom Architecture Source : Intel Roadmap. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. SummarySummary Intel is creating a new category of smarter, purpose-built SoC designs and products based on Intel architecture Intel unveiled 8 chips for embedded Intel chip design, factory, manufacturing and R&D expertise and investment enables SoC development Over 15 SoC designs planned Most will be based on the Intel Atom® processor yINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE
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