Sistemes Encastats, Febrer 2012
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
System Design for Telecommunication Gateways
P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS Alexander Bachmutsky Nokia Siemens Networks, USA A John Wiley and Sons, Ltd., Publication P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS Alexander Bachmutsky Nokia Siemens Networks, USA A John Wiley and Sons, Ltd., Publication P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come This edition first published 2011 C 2011 John Wiley & Sons, Ltd Registered office John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West Sussex, PO19 8SQ, United Kingdom For details of our global editorial offices, for customer services and for information about how to apply for permission to reuse the copyright material in this book please see our website at www.wiley.com. The right of the author to be identified as the author of this work has been asserted in accordance with the Copyright, Designs and Patents Act 1988. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, except as permitted by the UK Copyright, Designs and Patents Act 1988, without the prior permission of the publisher. -
FA143 Modulstandards
Modulstandards im Vergleich Möglichkeiten und technische Limits der verschiedenen Aufsteck-Boards 1 Seit knapp 2 Jahrzehnten sind Aufsteckmodule verfügbar, die über standardisierte Schnittstellen an ein Doch was bedeuten diese Abkürzungen, Base-Board kontaktiert werden können. Die eindeu- welche Schnittstellen verbergen sich tigen Vorteile bescheren diesen Modulen eine immer dahinter und wo haben diese Konzepte stärker wachsende Nachfrage: Geringere Entwick- Ihre Vorteile im Vergleich zu anderen? lungszeit und -kosten, Verfügbarkeit, Skalierbarkeit von Performance und Preis, die Austauschbarkeit zwischen unterschiedlichen Anbietern und die Reduzierung von Risiken durch das Verwenden von zertifizierten Modulen Nachfolgend werden die geläufigen Abkürzungen rund sind Gründe, sich für Plug-On Boards zu entscheiden. um das Thema Plug-On Modul-Lösungen und Begriffe inkl. deren Schnittstellen und deren Möglichkeiten Die Anforderungen hinsichtlich Größe, Preis, Verfüg- näher erklärt. barkeit und die rasch voranschreitenden Chip-Tech- nologien stellen die Anbieter von Systemlösungen vor Package on a Package (PoP) Herausforderungen, die jedoch durch die Verwendung von Aufsteck-Modulen sehr gut managebar sind. Sind Ein „Package on a Package“ stapelt Einzel-Packages während der Designphase Anforderungen an Perfor- in Form von kleinen bestückten Platinen vertikal über- mance, Schnittstellen, Abmessungen, aber auch z.B. einander, welche durch Ball-Grid-Arrays miteinander Temperaturbereich und Störaussendung definiert, kann verbunden werden. Sozusagen -
Bagian-Bagian Komputer / PC (Computer Spare Part) | Bagus
2. Motherboard Motherboard atau biasa juga disebut mainboard merupakan sebuah papan utama dimana terdapat komponen-komponen serta chip controller yang bertugas mengatur lalu lintas data dalam sistem motherboard. Fungsi umum dari Motherboard adalah tempat memasangkan processor, RAM, VGA Card, Sound Card, Internal Modem, dan lain - lain. Motherboard juga merupakan bagian induk atau utama yang berada dalam CPU. Berfungsi sebagai papan circuit dari berbagai macam komponen pendukung lainnya. Di antara slot pada papan utama, terdapat slot yang khusus digunakan untuk pemasangan prosesor yang dinamakan soket dan slot 1. Motherboard memiliki beberapa jenis soket yang berbeda-beda, sesuai dengan perkembangan jenis prosesor. Berdasarkan penggunaan prosesornya, Motherboard (mobo) dibedakan menjadi 3 bagian, yaitu • Untuk Dual Processor • Untuk Intel Processor • Untuk AMD Processor Sebuah Motherboard terdapat beberapa komponen seperti : • Socket Processor • Chipset • Bus Controller • Slot Memory • Slot Expansion • Port Drive • BIOS • ROM • Power Connector Macam – macam bagan sebuah Motherboard : Form Factor Motherboard : Motherboard memiliki karakteristik dan ukuran yang berbeda-beda, yang biasa kita sebut form factor. Berikut ini adalah tabel perbandingan berbagai macam form factor dari Mobo : Name PCB Size (mm) WTX 356 × 425 AT 350 × 305 Baby-AT 330 × 216 BTX 325 × 266 ATX 305 × 244 EATX (Extended) 305 × 330 LPX 330 × 229 microBTX 264 × 267 NLX 254 × 228 DTX 244 × 203 FlexATX 229 × 191 Mini-DTX 203 × 170 EBX 203 × 146 microATX 171 × 171 Mini-ITX 170 × 170 EPIC (Express) 165 × 115 ESM 149 × 71 Nano-ITX 120 × 120 COM Express 125 × 95 ESMexpress 125 × 95 ETX/XTX 114 × 95 Pico-ITX 100 × 72 PC/104 (-Plus) 96 × 90 ESMini 95 × 55 Beagle Board 76 × 76 mobile-ITX 60 × 60 CoreExpress 58 × 65 Spesifikasi Motherboard Dalam pemilihan motherboard, tentu saja kita harus memperhatikan beberapa hal. -
Industrial Computing Small Form Factor Boards Tools & Software Standards & Services for ARM-Based Developmen
COVER STORY Standards & Services for ARM-based developments: The faster way to application-ready ARM platforms Special Features Industrial Computing Small Form Factor Boards Tools & Software VIEWPOINT Dear Reader, For a long time x86 processors was the dominant technology for em- bedded computing. But nowadays more and more ARM based micro- controllers are launched and be- come an useful alternative. The ad- vantage of ARM based multicore MCUs is their high performance at extremely low power which allows using it in mobile applications. Our cover story starting at page 12 de- scribes that small form factor boards and systems featuring ARM MCUs can be found already in the area of graphical user interfaces with touch-screen control, where upgrades from simple line displays to full graphic support are being carried out while using a minimum of power, or migration from x86 platforms to ARM is taking place. The extremely low energy consumption of the processors, which is around two to three watts, makes it possible to reduce the effort needed for a passive cooling solution to an absolute minimum, enabling developers to design very compact, flat/slim and above all portable devices, having a battery runtime which surpasses that of x86 systems to date. Application areas for mobile applications in harsh environments can be found, for example, in courier and parcel services, in machines maintained by service personnel, and equipment or in medical emergency services. All these applications profit from the advantages of a compact, power-saving technology as well as from the comfortable programmability of these processors on the basis of standard operating systems i.e. -
„The Perfect Match“
„The perfect match“ Den richtigen Modulstandard finden 1 Aufsteckmodule haben inzwischen den Markt erobert, programmierten Systemen und von lokalen zu dezen- denn ihre Vorteile zeigen sich sehr schnell: Sie bieten tralen, vernetzten und oftmals mobilen Anwendungen, eine kostengünstige und aufwandsarme Möglichkeit, von Tastensystemen zu berührungsloser Bedienung die erforderliche Leistung in Verbindung mit einem oder einer Kombination aus allem. Im Hinblick auf Trägerboard passgenau in die gewünschte Lösung zu eventuell fällige Erweiterungen, Prozessoptimierung, implementieren. Das reichhaltige Angebot am Markt Betriebssicherheit und einfache Wartung ist es eine birgt viele Optionen, aber damit auch die Qual der Wahl gute Erwägung, die notwendige Funktionalität auf ein zwischen verschiedenen Standards und Anbietern. Die Modul auszulagern. Die Rahmenbedingungen für hier unterschiedlichen Modul-Typen spielen ihre Vorteile be- eingesetzte Module sind gesetzt: Geringer Formfaktor reichsbezogen aus, deshalb sollte zuerst eine genaue, und Stromverbrauch, wenig Gewicht sowie gute Ver- die jeweilige Anwendung betreffende Bedarfsanalyse fügbarkeit. Auch wenn die Anforderungen hinsichtlich erfolgen. Worauf ist bei der Auswahl des passenden PCIe-Schnittstellen und hoher Performance nicht Plug-on-Boards zu achten? Welche Faktoren spielen gegeben sind, ist die Leistungserwartung normaler- eine Rolle und welche Vorteile weisen die jeweiligen weise zu hoch für QSeven. Wachsende Funktionalität mit Visualisierung, Steuerung und eventuell multiplen Bedienmöglichkeiten erfordern eine flexible Software- 1997 – PC/104-Plus 2003 – PCI/104 2010 – FMC 2020 – COM-HPC Konfiguration für die Priorisierung der Prozesse, die 2001 – PMC 2005 – COM Express 2013 – ESMexpress 2006 – XMC Entscheidung zwischen reinen Bedien- und Ver- arbeitungsvorgängen. Höhere Performance erzeugt gewöhnlich eine höhere Verlustleistung und damit Wärmeentwicklung. Da viele HMIs jedoch mit Power- 2013 – m.2 over-Ethernet (PoE) bzw. -
Extremely Rugged Computer-On-Modules Powerful Small Form Factors for Harsh Embedded Environments Computer-On-Modules Powerpc-Based Esmexpress® Modules
Extremely Rugged Computer-on-Modules Powerful Small Form Factors for Harsh Embedded Environments Computer-on-Modules PowerPC-based ESMexpress® Modules Computer-On-Modules (COMs) are complete compu- ters on a plug-on module, perfectly suited for deman- ® ® ™ ding mobile and space-saving applications. Mobile XM51 – ESMexpress COM with PowerPC QorIQ P4080 applications are found in areas as diverse as trans- • Freescale™ QorIQ™ P4080, P4040 or P3041 portation, medical engineering, commercial vehicles • 64-bit Power Architecture e500mc CPU and ships and also in a growing number of cranes, • Up to 8 cores, up to 1.5 GHz construction machinery, trucks and tractors which are • Up to 16 GB ECC DDR3 SDRAM, 1 or 2 controllers equipped with small, robust human- machine inter- • -40°C to +85°C Tcase with qualified components faces. The XM51 is based on the Freescale™ PowerPC® QorIQ™ and runs at frequencies between 1.2 and 1.5 GHz. De- ESMexpress® sets out to make COMs a stable, cost- pending on the individual needs, up to eight processor cores, 16 GB ECC DDR3 SDRAM, 128 KB FRAM and 256 effective solution for a wider number of areas by MB Flash are available. addressing mechanical stability, rugged physical per- Interfaces include four USB 2.0 host ports and one USB client, two Gigabit Ethernet channels, dual 3-Gbit SATA, formance, and aggressive fanless cooling. To achieve and two PCI Express® x1 links. this, the populated PCB is mounted into an aluminum frame, which completely encloses the assembly. This Read more: www.men.de/000453 allows for conduction and convection cooling and enables power dissipation of up to 35 W. -
MM1 – Esmini™ COM with Intel® Atom™
Embedded Solutions for Transportation and Industrial Markets www.men.de/products/15MM01-.html MM1 – ESMini™ COM with Intel® Atom™ n Intel® Atom™ Z530 or Z510, up to 1.6 GHz n Up to 1 GB DDR2 SDRAM n 1 PCI Express® n Up to 2 Fast Ethernet interfaces n 8 USB 2.0 (1 client) n 2 UARTs n Up to 2 CAN bus interfaces n SDVO, LVDS n Intel® HD Audio n -40°C to +85°C Tcase screened (-25°C to +85°C Tcase with 1 GB DRAM) n Conduction cooling The MM1 is an ultra-small Computer-On-Module of comes with a Phoenix® Award BIOS configurable for the final the rugged ESMini™ family. Together with an application. application-specific carrier board it forms a semi- The MM1 is screened for operation in a -40°C to +85°C temperature custom solution for industrial, harsh, mobile and range (Tcase, -25°C to +85°C for board versions with 1 GB DRAM). As mission-critical environments. all ESMini™ modules it is embedded in a covered frame. This ensures The MM1 is controlled by the Intel® Atom™ processor, EMC protection and allows efficient conductive cooling. Air cooling is a first generation IA-32 core based on 45nm process also possible by applying a heat sink on top of the cover. Where technology. Due to the new power architecture of the operation temperatures are moderate, the module may even do without Intel® Atom™ CPU, the MM1 has a total power the frame and cover, with a suitable low-power processor and airflow. -
Spring 2007 PC/104 and Small Form Factors ©2007 Opensystems Publishing
y nl t O rin e P gl in r S Fo ©2007 OpenSystems Publishing. Not for distribution. y nl t O rin e P gl in r S Fo RSC# 2 @ ©2007 OpenSystems Publishing. Not for distribution. www.smallformfactors.com/rsc y nl t O rin e P gl in r S Fo ©2007 OpenSystems Publishing. Not for distribution. RSC# 3 @ www.smallformfactors.com/rsc www.smallformfactors.com www.pc104online.com Volume 11 • Number 1 COLUMNS FEATURES 8 PC/104 Embedded Consortium SPECIAL: Standards update PC/104 – the expandable embedded form factor for Planet Earth 14 Ultra-Mobile PC on the move in on-the-go business By Jonathan Miller applications 10 Focus on Form Factors By Gail Levy, TabletKiosk ETX 3.0: hassle-free path to SATA integration By Christine Van De Graaf ly 12 European Technology TECHNOLOGY: General-purposen I/O options New modules seek standardization 18 An I/O view of small form factor choices By Hermann Strass O By Eric Rossi,t EMAC 46 Editor’s Insight Traveling far? Consider changing buses Techi talk:n smart cameras By Chris A. Ciufo r 22 Q & A with Michael Engel, Vision Components GmbH P By Don Dingee DEPARTMENTS e 36 Editor’s Choice Products l TECHNOLOGY: Desktop trends By Don Dingee g 40 New Products in 26 PC/104 assimilates PCI Express By Chad Lumsden By Martin Mayer, Advanced Digital Logic S r 32 Low-power MCUs and the MPEG-4 challenge E-CASTS o By Dr. Øyvind Strøm, Atmel A Practical GuideF to Implementing Open Standards-Based High Availability PRODUCT GUIDE: Rugged and Mil-Spec March 22, 2 p.m. -
D02 - State of the Art
Building as a Service - BaaS Deliverable D02 - State of the Art Editor: Ingo Lück, Materna ITEA 2 Project 12011 February, 2nd 2015 D02 - State of the Art Version 1.0 Document properties Distribution Confidential Version Version 1.2 Editor Ingo Lück, Materna Authors/ Andreas Müller, TWT Contributors Martin Neubauer, TWT Svenja Borchers, TWT Marc-Oliver Pahl, Technische Universität München Benjamin Hof, Technische Universität München Christoph Niedermeier, Siemens Norbert Vicari, Siemens Michael Bahr, Siemens Darko Anicic, Siemens Sebastian Käbisch, Siemens Jelena Mitic, Siemens Nicolas Gümbel, Siemens Borja Ortiz, Everis Alejandro López, Everis Andrés Páez, Everis Miguel Díez, Everis Christophe Joubert, Prodevelop Daniel Gastón Iglesias, Prodevelop Vicente Sanjaime, Prodevelop Björn Butzin, Universität Rostosk Christoph Fiehe, Materna Jannis Müthing, Materna Niklas Röder, Materna Ingo Lück, Materna Malte Burkert, Technische Universität Dortmund Heiko Krumm, Technische Universität Dortmund Oliver Dohndorf, Technische Universität Dortmund Jürgen Maaß, Kieback&Peter ITEA2: Building as a Service - BaaS 2 D02 - State of the Art Version 1.0 Michael Christmann, Kieback&Peter Peter Michael Schmidt, Kieback&Peter GüneƔ Karabulut Kurt, Istanbul Technical University, Defne Pages 160 ITEA2: Building as a Service - BaaS 3 D02 - State of the Art Version 1.0 Abstract This document describes the State of the Art analysis of technologies, modeling- and architecture-approaches, which will be relevant for the BaaS project. Since the project schedule plans one iteration of the state of the art analysis, the deliverable D02 appears in two versions. This is the first version. It identifies, collects and analyses approaches which potentially may be of relevance for the project since they may deliver conception and solution element input to the development of the BaaS architecture, model, platform, building services and demonstrator applications. -
Low Power Intel Atom Z5xx Processor on a PC/104-Plus Form Factor
www.smallformfactors.com On the cover: www.pc104online.com Embedded displays, interfaces, and infotainment applications increasingly are incorporating high- performance graphics, such as in the Arbor Technology M1857, Infiniti QX dash nav system, and Kodak G4 photo processing kiosk shown on the cover. In response, small form factor systems are evolving to take the added strain, Volume 15 • Number 2 using the latest processing engines, such as AMD's Fusion series of APUs. FEATURES COLUMNS Small Form Factor SIG 6 IT'S A SMALL (FORM FACTOR) WORLD New PC/104 CPUs smooth upgrades Commercial Infotainment By Paul Rosenfeld Small form factor infotainment 10 PC/104 Consortium 8 10 system designers integrate new PC/104: The original COM module graphics capabilities By Jim Blazer By Christine Van De Graaf, Kontron 14 Euro Small Tech 9 In-vehicle infotainment system 13 Flying like a bird comparison table By Hermann Strass By Monique DeVoe, Editor’s Insight 54 Assistant Managing Editor Oh, Microsoft ... what haven't you done? By Chris A. Ciufo The Big Yet Small Picture DEPARTMENTS Interfaces, displays, and connectivity 17 Editor’s Choice Products 52, 53 Special requirements challenge 14 By Monique DeVoe handheld computer designers for telemedicine applications RESOURCE GUIDE By Dr. Qi Chen, Arbor Technology Profile Index 23 Don't mistake small for delicate: 17 Bringing rugged computing Complete systems 24 to compact environments I/O boards 24 By Barbara Schmitz, Industrial automation 30 MEN Mikro Elektronik GmbH MIL-SPEC 51 Packaging 31 AMD Fusion architecture boosts 21 Processor boards/SBCs 32 21 ETX and XTX performance Services 51 By Ron Mazza, congatec, Inc. -
Special Issue
130043_ICC01_ECE_Bas01_combine_Um_Heft 12.02.13 09:09 Seite 1 SPECIAL ISSUE VIEWPOINT Dear Readers, The turn of the year was quiet recently and the usual start in a new year is close for the embedded community – embedded world 2013 Exhibition & Conference which will be held in the show- ground of Nürnberg Messe from 26th to 28th of February. And once again it seems there is no limitation to its growth. Eleven years after its birth it is now the world’s biggest international ex- hibition and conference event on embedded system technology. “Embedded world will remain focused in 2013 but still grow ap- preciably. It is the largest event in the world for embedded system technologies and the most professional shop window,” explains Alexander Mattausch, Exhibition Manager of the embedded world Exhibition&Conference at Nürnberg Messe. “We are very pleased about yet more growth in terms of display space, number of new ex- hibitors and international share of exhibitors, which confirms the importance of the event,” he adds. Therefore this event is nowadays an absolutely necessity be for all of us in the Embedded industry. Beside the exhibition which covers five halls (Halls 1, 2, 4, 4A and 5) the conference will be located in the NCC East of the fairgrounds. Due to the trend towards unlimited access and use of the Internet via portable devices safety and security are two of the top themes at the embedded world Conference 2013 as well as ultra-low power. These themes apply to the whole conference with its varied segments. The electronic displays Conference is according to the organizer one of the most important in- formation and opinion platforms for developers, researchers, users and decision-makers. -