www.smallformfactors.com On the cover: www.pc104online.com Embedded displays, interfaces, and infotainment applications increasingly are incorporating high- performance graphics, such as in the Arbor Technology M1857, Infiniti QX dash nav system, and Kodak G4 photo processing kiosk shown on the cover. In response, small form factor systems are evolving to take the added strain, Volume 15 • Number 2 using the latest processing engines, such as AMD's Fusion series of APUs.
FEATURES COLUMNS
Small Form Factor SIG 6 IT'S A SMALL (FORM FACTOR) WORLD New PC/104 CPUs smooth upgrades Commercial Infotainment By Paul Rosenfeld Small form factor infotainment 10 PC/104 Consortium 8 10 system designers integrate new PC/104: The original COM module graphics capabilities By Jim Blazer By Christine Van De Graaf, Kontron 14 Euro Small Tech 9 In-vehicle infotainment system 13 Flying like a bird comparison table By Hermann Strass By Monique DeVoe, Editor’s Insight 54 Assistant Managing Editor Oh, Microsoft ... what haven't you done? By Chris A. Ciufo The Big Yet Small Picture DEPARTMENTS Interfaces, displays, and connectivity 17 Editor’s Choice Products 52, 53 Special requirements challenge 14 By Monique DeVoe handheld computer designers for telemedicine applications RESOURCE GUIDE By Dr. Qi Chen, Arbor Technology Profile Index 23 Don't mistake small for delicate: 17 Bringing rugged computing Complete systems 24 to compact environments I/O boards 24 By Barbara Schmitz, Industrial automation 30 MEN Mikro Elektronik GmbH MIL-SPEC 51 Packaging 31 AMD Fusion architecture boosts 21 Processor boards/SBCs 32 21 ETX and XTX performance Services 51 By Ron Mazza, congatec, Inc. Storage 52
WEB RESOURCES EVENTS
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Published by: PC/104 and Small Form Factors www.linkedin.com/groups?gid=1854269 2011 OpenSystems Media® © 2011 PC/104 and Small Form Factors All registered brands and trademarks used in PC/104 and Small Form Factors are property of their respective owners. ISSN: Print 1096-9764, ISSN Online 1550-0373 @sff_mag
4 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors TS-WIFIBOX-2 A Complete Solution for 802.11g WiFi Applications
Military & Aerospace Group
Chris Ciufo, Group Editorial Director Joann Toth, Senior Designer [email protected] Steph Sweet, Creative Director Monique DeVoe, Assistant Managing Editor [email protected] David Diomede, Art Director qty 1 185 Jennifer Hesse, Assistant Managing Editor Brandon Lewis, Copy Editor [email protected] Sharon Hess, Assistant Managing Editor Christine Capuano, Web/Editorial Assistant [email protected] Matt Jones, Web Developer Terri Thorson, Senior Editor (columns) [email protected] Laura Arsenault, Media Assistant Hermann Strass, European Analyst Phyllis Thompson, Circulation/Office Manager [email protected] [email protected] Sales Group
Dennis Doyle, Senior Account Manager International Sales Powered by a [email protected] Elvi Lee, Account Manager – Asia [email protected] Tom Varcie, Senior Account Manager 250 MHz ARM9 CPU [email protected] Ad Coordinator Rebecca Barker, Strategic Account Manager Joann Toth Low power (3.2 watts), fanless [email protected] [email protected] Power via 5-12 VDC, USB, PoE (opt.) Christine Long, Online Manager [email protected] Editorial/Business Office 64MB DDR-RAM Regional Sales Managers Barbara Quinlan, Midwest/Southwest 16626 E. Avenue of the Fountains, Ste. 201 256MB ultra-reliable XNAND drive [email protected] Fountain Hills, AZ 85268 Tel: 480-967-5581 Micro-SD Card slot Denis Seger, Southern California Fax: 480-837-6466 [email protected] RS-232, RS-485, CAN, RTC Website: www.opensystemsmedia.com Sydele Starr, Northern California [email protected] Publishers: John Black, Header with SPI and 11 DIO Michael Hopper, Ron Taylor, East Coast/Mid Atlantic 480Mbit/s USB, Ethernet, PoE option [email protected] Wayne Kristoff Vice President Editorial: Rosemary Kristoff Boots Linux 2.6.24 in < 3 seconds Reprints and PDFs Vice President Marketing & Sales: Patrick Hopper Un-brickable, boots from SD or flash Nan Holliday 800-259-0470 Business Manager: Karen Layman Customizable FPGA - 5K LUT [email protected] Optional DIN mountable enclosure
12 ACCES I/O Products, Inc. – USB embedded Ideal for gateway or firewall, protocol I/O solutions converter, web server, WiFi audio, 3 ADLINK Technology Inc. – Extreme rugged and unattended remote applications 55 AMD – AMD embedded G-Series processor 20 Advantech Corp. – Ruggedized solutions with RAF Male-Female Over 25 years in business Intel® AtomTM N455/D525 CPUs Never discontinued a product 2 Diamond Systems – Conduction cooling has Stacking Spacers arrived! Engineers on Tech Support 7 Excalibur Systems – Dragon Open Source Vision 19 Logic Supply – Genuine expertise Custom configurations and designs w/ 15 Parvus Corporation – Qualified to perform Use these precision-made components excellent pricing and turn-around time to build structurally secure standalone stacks. 5 RAF Electronic Hardware – RAF male-female Most products ship next day stacking spacers Compatible with more than 100 different 28, 29 LiPPERT Embedded Computers Inc. – Condition PC/104 ultra-compact bus board modules. monitoring by LEMT 5 Technologic Systems – TS-WIFIBOX-2 16 VersaLogic Corp. – This Tiger is as solid as a rock! Technologic SYSTEMS 11 WDL Systems – The power inside tomorrow’s technology We use our stuff. 56 WinSystems, Inc. – 1 GHz PC/104 SBC supports visit our TS-7800 powered website at networking and communications www.rafhdwe.com www.embeddedARM.com (480) 837-5200 SMALL FORM FACTOR SIG
By Paul Rosenfeld, SIF-SIG President
New PC/104 CPUs smooth upgrades
mbedded system OEMs who have deployed custom cards if necessary. And should cost be of more impor- PC/104-based applications during the past 10 to tance than a future I/O upgrade, depopulating the SUMIT con- 15 years are periodically faced with a need to nectors might also be possible to reduce cost for high-volume upgrade their CPU as processors and chipsets have applications. gone end-of-life. Over the past three years or so, this upgrade has been particularly problematic as PC/104 with SUMIT Onboard CPUs serve EOEMs who want to step up to a third-generation PC/104 CPU new designs too to ensure the longest possible life are faced with decisions But suppose an OEM is looking to create a new application – regarding which of the myriad of solutions is the best fit for not upgrade an existing one. Much of the aforementioned still their application. To make matters worse, OEMs can feel as applies. As the search commences for I/O modules to stack on though they are lost in a maze, as vendors and trade groups the CPU to implement system I/O (analog or digital I/O, serial all tout new technologies and bus interfaces that might not be ports, CAN bus or avionics network controllers, GPS or wire- relevant to the OEM’s particular implementation anyway. less cards, and more), OEMs will find that the largest selection by far is available with only a PC/104 (ISA) connector. To take The need is quite simple: The system OEM wants to replace full and efficient advantage of the hundreds of proven cards of a CPU card with a PC/104 (ISA) connector with a new CPU the PC/104 ecosystem, they will need a CPU card that provides card with a PC/104 (ISA) connector – and have the software a PC/104 (ISA) connector right on the CPU card. As mentioned, work transparently. OEMs might not much care whether it is the last thing anyone wants is a PCI-to-ISA or LPC-to-ISA bridge an Atom, a Core2 Duo, a Fusion, a Nano, or a tyrannosaurus. card, adding to stack height, adding cost, and perhaps requiring It just needs to be reasonably priced and stay in production for BIOS customization. And PC/104 with SUMIT Onboard CPUs at least five to seven years. are the only third-generation PC/104-compatible CPU cards with an onboard PC/104 connector. ... OEMs can feel secure, SUMIT makes PC/104 upgrades pain-free So, OEMs shouldn’t get bogged down in the SUMIT versus knowing if they want to upgrade PCI/104-Express debate nor should they spend cycles trying to determine which third-generation solution provides the best their bus technologies in the implementation of bus technologies not even used in their application. OEMs should also avoid wasting cycles trying to future, the SUMIT interface is figure out which type is compatible with which type. A specifica- tion with more USB ports or more PCI Express lanes is irrelevant there for them. if it doesn’t support the OEM’s existing I/O cards and legacy software.
The answer: PC/104 with SUMIT Onboard CPUs (otherwise Third-generation PC/104 expandable CPUs (including PC/104, known as SUMIT-ISM or SUMIT-104 CPUs) first and fore- EPIC, and EBX form factors) with onboard PC/104 (ISA) con- most provide a PC/104 (ISA) connector right on the CPU card nectors are available today from SFF-SIG members VersaLogic itself. PC/104 with SUMIT Onboard CPUs are the only third- and WinSystems. These CPUs provide the smoothest upgrade generation stackable CPUs (regardless of type) that offer a path for PC/104 and support the largest ecosystem of PC/104 I/O PC/104 (ISA) connector right on the CPU board. No bridge cards of any third-generation PC/104 CPUs. Plus, OEMs can feel cards required. No bridge cards means no increased stack secure, knowing if they want to upgrade their bus technologies in height, added cost, or increased software complexity through the future, the SUMIT interface is there for them. BIOS or driver changes.
And if and when OEMs decide to upgrade their stacked I/O Small Form Factor SIG cards to new technologies – such as USB, PCI Express, or less 650-961-2473 expensive LPC, I2C, or SPI interfaces – the onboard SUMIT interface is already there to support this. Additionally, many [email protected] SUMIT-ISM I/O cards are already on the market, with more www.sff-sig.org introduced each year; or OEMs can simply develop their own
6 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors EXCALIBUR SYSTEMS PC/104 CONSORTIUM
By Jim Blazer, PC/104 Consortium Technical Committee Chairman PC/104: The original COM module
PC/104 is well known as a rugged, stackable PC. Its modular PCIe/104 Type 2 that was approved by the PC/104 Consortium design allows it to be easily adapted to many applications and March 21, 2011 adds USB 3.0, SATA, and LPC connectivity. makes field repairs and upgrades simple. What could be simpler than a computer where designers can pick and choose boards from What if Ethernet, serial I/O, digital I/O, or some other function is many suppliers and have confidence that everything will work needed? Many CPUs have these features and can be cabled directly together nicely? Designers can build stacks as tall or as short as to the CPU using its onboard connectors for these functions or needed to get necessary features, knowing that if a new function even have the I/O connectors made to stack to the motherboard for must be added later, they will not be “boxed in.” virtually unlimited “user I/O.”
Rethinking PC/104 applications Already building a custom CPU on the motherboard, but worried Whether it is computer-on-module or component-on-module, about being asked to put an Ethernet switch, CAN controller or COM is on many engineers’ minds today. But what about opto-isolated I/O later? Put a PC/104, PCI-104, or PCIe/104 bus using PC/104 as a COM module? PC/104 was the original on the motherboard and the ability to expand the system becomes COM module adopted as an open standard in March 1992 by the limitless. If designers cannot find the expansion module they need PC/104 Consortium. Its small 96 mm x 90 mm size coupled with from the many already on the market, a custom module can be built standard bus connectors makes it a perfect mezzanine module for for specific applications. For a broad selection of PC/104 products any size motherboard. An x86 CPU can take over a year to develop visit www.pc104.org and see what the PC/104 Consortium and is a highly complex mixture of hardware, BIOS, and software. members have to offer. It is the place for everything PC/104. However, if designers choose one of the many commercially available PC/104 CPUs on the market, standard ISA, PCI, Meet the new board (of directors) USB, or PCI Express bus expansion is included with processors The PC/104 Consortium maintains the specifications for ranging from low-power 486s to high-performance multicores. PC/104, PC/104-Plus, PCI-104, PCI/104-Express, and PCIe/104 connector configurations as well as 104, EPIC, and EBX form factors. The specifications are open and free to members and Stackable – PC/104 concept non-members alike. • Multiple boards stacked on CPU The PC/104 Consortium recently seated its new board of • I/O interfaces on any and directors and officers for the year after the annual meeting held all boards in conjunction with ESC Silicon Valley in May. They are: • Modular approach • – Only have boards and Jeff Milde, PC/104 Consortium – Executive Director • Len Crane, VersaLogic – Chairman and President functions needed • – Add or remove boards as Matthias Fellhauer, LiPPERT Embedded Computers GmbH – requirements change Director and Vice President • Alexander Buravlev, Fastwel – Director and Secretary/Treasurer • Lee Foss, Advanced Micro Peripherals – Director • Christine Van De Graaf, Kontron – Director • Jim Blazer, RTD Embedded Technologies – Director and Technical Committee Chair • Flemming Christensen, Sundance Multiprocessor Technology – Director
It is critical for the PC/104 Embedded Consortium to present a clear and focused presence of PC/104 technology to avoid confusion in the marketplace. We must protect the Consortium’s Mezzanine – trademarks, copyrights, and IP to safeguard members’ investments, COM concept and we will continue monitoring technological advancements for implemented by PC/104 possible inclusion into the PC/104 architecture. • Large motherboard with position to stack PC/104 CPU • [Figure 1 | PC/104 is most often viewed as just a stackable option, but when designers face a mezzanine requirement it works just as well.] Interface through bus and/or I/O connectors PC/104 Consortium • Expansion bus for additional cards as needed 916-270-2016 Figure 1 | PC/104 is most often viewed as just a stackable option, but [email protected] when designers face a mezzanine requirement it works just as well. www.pc104.org
8 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors EURO SMALL TECH
By Hermann Strass
Flying like a bird
Green technology for a white bird above visitors every hour on the hour during the Hannover Fair Human-made birds (airplanes, and so on) move by using propel- (see “European events” section). lers or jets on rigid airframes. Birds fly using only the muscle power of their wings. Birds measure, control, and regulate their Some parameters of SmartBird: motion through the air continuously and fully autonomously. • Torso length: 1.07 m Leonardo da Vinci has built rudimentary flapping wing models • Wingspan: 2.00 m trying to copy bird flight. In 1889, Otto Lilienthal in Germany • Weight: 0.450 Kg (about 1 lb) published the book on bird flight where he described in detail • Structure: lightweight carbon fiber the flight of seagulls. Dr. James DeLaurier and his research • Electrical power: 23 W team at the University of Toronto did an ornithological project where, in 2006, they succeeded for the first time in taking off Wing movement is key in aerodynamic efficiency from a runway with a flying device powered by a flapping-wing Flapping-wing flight is a combination of two principal move- mechanism. In August 2010, a flying machine propelled by ments. The wings beat up and down, using a lever mechanism its pilot’s muscle power alone covered a distance of about with a degree of deflection that increases from the body to the 150 meters after being towed to flying altitude. wing tip. At the same time, the wing twists such that its leading edge is directed upwards during the upward stroke for a positive In 2011, the engineers at the Bionic Learning Network of Festo, angle of attack, followed by a negative angle after a fraction of a a world leader in industrial automation and bionic technology, wing-beat period.
developed a flying device called SmartBird that is capable of [Figure 1 | The SmartBird’s wing movements mimic the active wing torsion of a seagull.] taking off on its own and flying by using its flapping wings. The onboard electronics control wing torsion in relation to wing SmartBird’s most important feature is active torsion of its wings. position. An integrated microcontroller calculates the opti- The goal of the SmartBird project was to produce an efficient mal setting of two servo motors and synchronizes the flapping structure with efficient resource and energy consumption. movement and torsion to precisely control the wing motion. Propulsion, lift in the wings, and a flight control unit were func- The active joint torsion drive requires controlled coordination tionally integrated into the body and tail regions of SmartBird. between the flapping and twisting movements through continu- Excellent aerodynamics, high power density for propulsion, lift, ous monitoring. Two-way radio communication with ZigBee and maximum agility for the flying device were also achieved. protocol is used to monitor the wing’s position and torsion as well as report battery charge, power consumption, and input by Small form factors fly inside SmartBird the pilot. The torsion control parameters are optimized in real- The Festo engineers functionally integrated coupled hybrid drive time, which allows the electronic control system to adapt to units. Efficiency in resource and energy consumption was reached changing requirements within a fraction of a second. SmartBird through minimal has an electrome- use of materials and chanical efficiency extremely light- factor of around weight construction. 45 percent, which This implementa- is better than a car tion of coupled engine. Measure- drives for linear and ments of circular rotary movement flight have demon- can be used in gen- strated an aerody- erators that derive namic efficiency energy from water, factor as high as like stroke wing 80 percent. generators or actua- tors in process auto- European events mation. Hannover Fair 2011 Figure 1 | The SmartBird’s wing movements mimic the active wing torsion of a seagull. (April 4-8) is The self-controlling claimed to be the electronics inside SmartBird reside on a small form-factor best-performing industrial fair of the last 10 years. More than board using the Stellaris MCU LM3S811 microcontroller from 6,500 exhibitors from 65 countries showed more than 5,000 Texas Instruments. This ARM Cortex-M3 based design features innovations to more than 230,000 visitors. high-performance 32-bit computing, a large selection of analog and digital I/O and other industrial embedded functions that are For more information, contact Hermann at not available on x86-based designs. SmartBird was shown flying [email protected].
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 9 IT'S A SMALL (FORM FACTOR) WORLD Commercial / Infotainment
Small form factor infotainment system designers integrate new graphics capabilities
By Christine Van De Graaf
Infotainment systems have evolved into smaller, more space-constrained behind other advancements. In the past six months, that reality has changed. System designs, and require improved graphics capabilities, long-term designers now have access to embedded boards and modules based on new graphics- availability, and cost-effective embedded computing solutions. It is intensive processor architectures that allow them to develop rich visual info- important to recognize when and where to upgrade from using an add-on tainment applications and eliminate the need for a dedicated graphics card. For graphics card to doing a completely new design that takes advantage of example, the AMD Embedded G-Series is the first processor family to integrate a next-generation SFF platforms that offer flexible and highly optimized new Fusion Accelerated Processing Unit native graphic functionalities. (APU) that merges x86 computing capa- bilities with the parallel computing power of a General-Purpose Graphics Processing he design requirements for today’s POS/POI interactive terminals, digital Unit (GPGPU) in a single computing unit. signage, gaming, and other infotainment applications now need the support of Dual processing had previously been the advanced high-definition imaging, video, and display interfaces. [In-vehicle domain of high-performance multicore infotainment is another example taking off in the consumer market. See sidebar designs, but is now available to designers on page 13.] The push toward increased graphics-intensive infotainment applica- of low-power SFF (25 W to 35 W max. tionsT is twofold – the latest processor architectures now feature more advanced graphic systems) applications. The AMD G-Series capabilities and the end-user public has come to expect that these systems provide the incorporates DirectX 11-capable discrete- same high-level graphics and sophisticated interactivity found in other consumer electron- level graphics, a parallel processing ics. Furthermore, infotainment systems have evolved into smaller, more space-constrained engine, and UVD 3.0, which is a dedicated designs, while at the same time need long-term availability and cost-effective embedded high-definition video acceleration block. computing solutions. Satisfying consumer expectations and integrating new processor The AMD APUs include five different graphics functionality in a small form factor infotainment system brings a whole new set of performance/power versions, providing design considerations. This discussion will highlight several types of typical infotainment a broad, single-platform approach that application examples, and present the deciding factors that determine when to upgrade enables OEMs to precisely match their legacy systems with an add-on graphics card or to do a totally new design that takes application requirements and allows devel- advantage of flexible and highly optimized native graphic functionalities. opment of a complete product line from low to high end on a single embedded Infotainment meets improved graphics performance platform without the need to adapt the OS Graphics performance is an embedded computing capability that has traditionally lagged and software to different chipsets. This
10 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors design uses the Fusion Controller Hub (A55M), which makes it easy for designers to move from a legacy to an AMD-based solution.
Another boon for designers is that the new AMD G-Series processors operate at 9 W or 18 W. This lower power is an ideal thermal platform for fanless and rugged low-power applications, such as outdoor infotainment and kiosk systems or advertising panels. Figure 1 | Type 6 replaces legacy SFF graphic enablers: COM PCI pins in favor Express Type 6-based modules of using them to support digital The new PICMG COM Express Type 6 display interfaces pin-out standard was adopted in August and additional 2010 and was developed specifically to PCI Express lanes. support additional graphics and display capabilities now featured in the latest processor architectures (Figure 1). Type 6 enables native support for the expanded list of new display interfaces, keeping pace with other industry graphics stan- dards. Type 6 supports advanced graphics options by offering three new ports that are dedicated to new Digital Display Interfaces (DDIs). These interfaces are helpful in reducing cable and noise issues and provide enhanced image resolution, compared to traditional analog signal interfaces. DDIs are now separated from the PCI Express Graphics (PEG) port, ® ™ which allows for the parallel use of inte- Intel Atom Z5XX series up to grated high-definition graphics resulting 1.6 GHz with 512 MB memory in higher bandwidth, greater than 1 GHz, and reduced latency due to the increased Pre-installed with VxWorks 6.8 demo version PCI Express speed. Intel has selected PEG as its high-speed bus for external graph- 2x USB Stick with Wind River Software ics cards. Additionally, Type 6 allows a includes 30 days trial version graphics card to be used either for connect- Tilcon GraphicSuite 5.7 ing additional displays or as a GPGPU.
[Figure 1 | Type 6 replaces legacy PCI pins in favor of using them to support digital display interfaces and additional PCI Express lanes.] nanoETXexpress-SP Important for infotainment developers VXWorks Starter Kit is Type 6 pin-out support for the digital display DisplayPort standard from the Video Electronics Standards Association (VESA). Compared to HDMI, DisplayPort is a universal interconnect and is royalty- DM&P SoC CPU Vortex86DX- 800MHz free. DisplayPort has a much higher data transfer rate of 17.28 Gbps compared to PC/104 compliant, PCI-104 & PC/104+ (Optional) 2.835 Gbps with LVDS and 4.95 Gbps XGI Volari Z9s Chipset, 32MB VGA Memory with DVI. Adding to its flexibility, Integrated 10/100Mbps Ethernet DisplayPort’s auxiliary channel can be used for a broad range of multimedia Watchdog Timer, software programmable peripherals including touch-panel displays 256/512MB DDR2 onboard and USB connections. VDX-6354 Extended Temperature (-40C ~ +85C) Legacy add-on or new design Because of the availability of new graphics technologies and embedded platforms, many infotainment system OEMs will be faced with the same decision: Should I upgrade my existing application with an The Embedded Products Source add-on carrier board or does a new design make sense? These decisions ultimately www.wdlsystems.com 1.800.548.2319 [email protected] come down to cost, which takes in multi- ple factors. The factors to evaluate include
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 11 the platforms or technologies the current design is based upon, if any customization is The disadvantages of add-on cards are that needed, the length of time an application will be deployed, how many units are or will they usually require a right-edge connector. be deployed, and what are the power/performance/ruggedization requirements, product In space-constrained SFF designs, an edge roadmap, and go-to-market and user demands for the application. connector takes up more space (card-edge boards are typically 3" to 5" taller) and Where add-on cards make sense exposes it to additional shock and vibra- Add-on graphics cards are viable for cost-sensitive systems with shorter product life tion that can lead to signal integrity issues. expectations of two to three years and do not have to contend with harsh environmen- Plus, graphics card technology changes tal conditions, such as indoor digital signage and hotel or business information boards. quickly, often resulting in potential sup- These infotainment applications typically use current television technology, which is port and maintenance issues. Designing updated frequently. Even though these types of systems need to meet high consumer visual graphics capabilities onto a carrier board is expectations, they rarely require customization and do not need extended shock and a more rugged, long-term option, but does vibration ruggedization. These types of digital signage applications are most likely using require additional development time and a motherboard or an SBC, so upgrading the system with a graphics add-on card or car- resources. And, carrier boards are more rier board that allows designers to add graphics memory, graphics processing capabili- difficult to swap in and out if new func- ties, and other types of display support may be the most cost-effective solution to set up tionality changes are needed, as opposed multi-monitor systems that will most likely change on a regular basis. to having the needed features integrated directly onto the module or board.
When applications benefit from a new design By comparison, many infotainment applications such as POS/POI terminals can take embedded computing and graph- ics requirements to the extreme. These systems have long life requirements of seven years or more and their designs will support as many as several hundred deployed units. With almost constant use, these systems must be very rugged and may require moderate to major levels of customization. POS/POI and other inter- active kiosks can benefit from new design development based on the increased graphics performance and interface sup- port delivered in the latest SFF Computer- on-Modules (COMs) (Figure 2). COMs based on AMD’s Embedded G-Series processors give infotainment OEMs a notable advance, providing native high- performance graphics directly into the silicon and eliminating the need for an add-on graphics card.
Power savings are an additional benefit derived from integrated graphics technol- ogy. For example, COMs that incorporate the Universal Video Decoder 3.0 enable the CPU to “unload” when decoding video streams. Furthermore, rather than having to use separate graphics add-on cards that add to the power and system footprint, new graphics-intensive SFFs can now support decoding of up to three HD videos in parallel, and as many as four displays are supported by a rich variety of inter- faces including DisplayPort, DVI, HDMI, LVDS, and VGA.
[Figure 2 | POS/POI designs can take advantage of the native high-performance graphics capabilities integrated in new SFF COMs that also support long product life and rugged requirements.] Deciding to go with a new COM design provides customization advantages. A custom design is frequently needed to add interfaces and switching circuits, and can be accomplished on the COM’s carrier board. When carrier board design is complete, customization can be applied
12 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors to multiple generations through plug-and-play by swapping out Figure 2 | POS/POI designs can take one CPU module for the latest ver- advantage of the native sion. This developmental approach high-performance is optimal for systems that require graphics capabilities scalability from generation to integrated in new SFF generation, and also works for COMs that also support expected alterations in dynamic long product life and rugged requirements. markets within a single generation. SFFs deliver rich graphics for infotainment applications Cars: Big form factor, graphics-intensive, Infotainment designs are evolving infotainment devices to meet the high visual and graphics expectations of an increasingly New car In-Vehicle Infotainment (IVI) systems with rich graphical interfaces are becoming more common and more electronics-savvy consumer. sophisticated. Why? Device-savvy drivers are hungry for always-on information, media connectivity, and snazzy OEMs must make sound economi- features. System designers are quickly responding by beefing up IVI graphics and performance, and soon it might cal decisions based on multiple be difficult to find a new car without a dash screen. The following table lists OEM and aftermarket systems. factors when upgrading or adding new products. Welcome news for Infotainment Vehicle Software Comments designers is that they now have System Manufacturer access to an unprecedented level of graphics integration and stan- Unveiled at the 2006 Geneva International Motor Show, Microsoft Windows Blue&Me helps drivers connect mobile devices to their Fiat dards support that creates a new Blue&Me Fiat Mobile for vehicles, providing a hands-free system with voice technology Automotive foundation for delivering high- by Nuance Communications. performance multimedia content Debuting in 2012 Chevrolet vehicles, MyLink integrates OnStar in a power-efficient, small form safety features and additional entertainment features, but also has Chevy MyLink Chevrolet QNX factor platform suitable for a broad a touchscreen graphical interface in the dash, unlike the original range of infotainment applica- OnStar system. tions. New SFF COMs such as the Speech technology Originally introduced in about 1998, this system has gotten many Kontron microETXexpress-OH COMAND Mercedes-Benz by Nuance graphics upgrades for its in-dash panel and now is mostly focused provide the necessary native Communications on audio entertainment features. graphics support, parallel process- Microsoft Windows Ford, Lincoln, First seen at the 2007 Detroit International Auto Show, SYNC lets ing, and low power consumption Ford SYNC Embedded Mercury drivers control music and mobile phone use with voice commands. designers of infotainment systems Automotive require to deliver the rich visual Standing for intelligent Multi-Information Display, this system was experience users have come to first included in the redesigned 2012 Civic models. It includes Software details expect. Honda i-MID Honda features such as fuel economy tracking, turn-by-turn navigation, unavailable audio setting options, and drivers can customize it with their own backgrounds and colors. Christine Current: Wind River Van De VxWorks Introduced in 2001, the iDrive allows for audio system, navigation, Graaf is iDrive BMW Past: Microsoft communication, and climate control on the dash LCD display with the Product Windows CE for a controller on the center console. Automotive, QNX Manager for Kontron Launching in Kia models available in 2011, this new system America’s Kia UVO Kia Microsoft provides access to music stored in the device or other methods through a touch screen or voice commands. Embedded Products Chrysler, Dodge, Debuting in 2007, MyGIG features include various music and radio MyGIG QNX Neutrino RTOS Business Jeep options, navigation, and communication with voice controls. Unit. Christine has more than What could be considered the oldest IVI system with its introduc- 10 years of experience working tion in 1997 vehicles, OnStar is a little heavier on the “info-” than Buick, Cadillac, in the embedded computing OnStar QNX the “-tainment” with an emphasis on safety features, but it also Chevrolet, GMC technology industry and holds an includes hands-free calling and turn-by-turn navigation. Soon OnStar will be sold as an aftermarket system for any vehicle. MBA in marketing management from California State University, Introduced in 2010 models, Remote Touch uses a mouse-like Remote Touch Lexus Unknown East Bay, Hayward. controller to access entertainment, navigation, and in-car settings.
Featured in new Jetta models, the RNS 315 lets drivers control Kontron RNS 315 Volkswagen Unknown satellite radio and other music options in addition to navigation and optional voice-command mobile phone access. 510-284-1100
In the 2012 Prius, the Toyota Entune system connects to mobile christine.vandegraaf@ apps to provide various news, traffic, weather, sports, and other us.kontron.com Toyota Entune Toyota QNX information in addition to audio entertainment access with voice controls. www.kontron.com
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 13 THE BIG YET SMALL PICTURE Interfaces, displays, and connectivity Handheld computers need to include The handheld device must be lightweight special features before they can (less than 4 lbs) and both easy to carry and easy to operate. A comfortable built- become fully compatible with medical in handle is also often provided on the applications such as telemedicine. enclosure to improve portability. Docking stations are commonly used in medi- Special These additional features affect the cal facilities, for example, on walls or on design at all levels, and turn a generic medical carts that are wheeled around the medical facility, and are also used to device into a powerful new tool for provide a desktop alternative when needed. requirements medical usage. The handheld enclosure needs to be easily and reliably inserted into the docking elemedicine involves the use of com- station without needing any careful align- puters, mobile network connectivity, ment, which influences the design choices challenge and information technology within made for the docking connector. The over- Tthe patient care environment, with all device must be tough and fully drop mobile access in medical centers or at the resistant for day-to-day use, so rugged patient’s home. At first it may appear that design of all parts is a key requirement. handheld any suitably powerful handheld comput- ing device could potentially fulfill this Medical standards compliance role for telemedicine. However, the medi- Electronic devices for use in medical computer cal environment requires a particular set settings require high levels of performance of capabilities, peripherals, interfaces, and reliability, and patient safety is a fore- and connectivity that are needed before a most consideration. Medical computers generic handheld computer can become are therefore expected to meet demand- designers for acceptable and usable as an all-in-one ing standards compliance requirements. clinical tool. Medical handheld comput- ISO 13485 is a Medical Quality System ers are therefore a special class of mobile certification that ensures a device meets telemedicine handheld device that are needed for mobile strict quality requirements for the inter- telemedicine. The special requirements of national medical equipment market. This these devices affect the design at every standard also covers the detailed process applications level, from module to system, and some by which end-user requirements and specific examples of this include the medi- specifications are incorporated into the cal device-specific electrical certifications design. Certification to ISO 13485 ensures required, SBC considerations, and special that the product has been developed and By Dr. Qi Chen hot-swap redundancy features included manufactured using a full quality manage- in the battery management and charging ment process. A medical device must circuits. Medical application-specific also conform to medical safety standard interface devices, network connectivity UL60601 in the U.S. and to EN60601 in and OS, and longevity and change trace- Europe. To achieve successful approval to ability are also vital considerations. UL60601-1/EN60601-1 requires special care in the design. All external electrical Medical handheld device interfaces such as USB ports, serial ports, design features and Ethernet must have high levels of Typically, inside a handheld medical electrical isolation performance to meet computer is a powerful small form factor medical standards, with very low leakage SBC or module, with a baseboard, a high- currents and transformer isolation where resolution and easy-to-clean touch-screen necessary. Implementing the standard can display, batteries, and a carefully chosen also be a particular design challenge at the set of interface modules that provide spe- PCB design stage because of the require- cific capabilities for the medical applica- ment to comprehensively achieve the tion. The enclosure itself that carries all various conductor spacing requirements these components is custom made and has specified, and also care is required when a number of special features required for integrating an SBC with all the various the medical environment. For example, interface modules into the enclosure. easy cleaning of the enclosure exterior is a necessity, and protective covers with Specific single board computer gaskets are required for exposed electrical considerations connectors to prevent cleaning fluid from The SBC module within the enclosure is entering the connector or the internals designed to provide a fast and responsive of the enclosure. Some applications still computer operation, but along with rela- benefit from programmable function keys tively low power requirements (typically or dedicated selection/navigation keys so the whole system power, including screen, these are typically provided at the display should be below 15 W). The choice of periphery for improved user flexibility, but module is therefore a key part of the these keys must also be easily cleanable device’s design. Focus is placed on power and drip-proof. efficiency, which is always beneficial
14 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors for handheld devices, and the provision of additional circuitry and control firmware important in a safety-conscious medical a sufficient set of interfaces on the module for the power management section, but the setting. Magnetic Stripe Readers or Smart that well match the application require- feature itself provides a very large benefit Card Readers are also sometimes needed ments. Medical applications generally for the day-to-day usability of this class and can be included in the docking station need multiple USB ports to cater to the rel- of product. if they are not included in the handheld atively large number of USB-based periph- device itself. Cameras are also useful for erals such as web cameras, Bluetooth, Medical application-specific recording medical symptoms or patient barcode scanners, SD and SmartCard interface devices photographs, and a front-facing camera readers, and RFID. Touch-screen control- Medical handheld computers benefit from can serve for video communication with lers, whether using projective capacitive or a combination of specific built-in interface medical specialists or other staff. resistive touch, also typically use a USB devices that are not commonly found com- interface. A mini-card slot is also needed bined on other products. These devices Network connectivity and OS in the design for the flexibility to add include RFID and barcode scanners that Flexible network connectivity is a key in any special requirement functions for are used, for example, to scan patient tags requirement for a mobile device and is specific custom applications. or drug labels. Aside from the speed and usually provided by Wi-Fi when mobile, convenience of having this scan capabil- and by Ethernet LAN when installed Fanless design is a key capability for medi- ity built in, it also has the key benefit of into a docking station. Bluetooth also cal handheld computers because the equip- reducing data entry errors, which is very allows local connectivity to nearby tools ment needs to be cleaned and disinfected often, and fans make such cleaning much more difficult. But there are many other benefits to fanless systems too, including quiet operation, easier design of the enclo- sure (no air ports or airflow paths needed), and lower power allowing smaller, lighter- weight batteries to be used. However, successfully incorporating a fanless SBC requires that careful attention is paid to the thermal design for effective heat transfer and the use of efficient heat sink structures.
Removable hot-swap battery for continuous operation Medical handheld computers need to be capable of continuous mobile usage; Waiting for a recharge is not generally an option and might even be a safety issue during mobile patient care, so this class of device usually has a very important hot-swap redundant battery feature. This feature allows for continuous handheld operation of a battery-powered device without needing to connect to AC power adapters for battery recharges. A remov- able battery is provided along with a fixed internal battery. When the main removable battery is discharged, it can be hot-swap removed and replaced with a fully charged one while the internal battery retains the device power and continues uninterrupted operation for the user. However, the bat- tery management and charging circuit to handle this feature seamlessly and cor- rectly under all circumstances becomes a necessary part of the electronic design. The power architecture modification needed consists of two battery recharge circuits that are managed by firmware on the system microcontroller over a dual SMBus. Diode ORing of the power rails is then used to combine the three possible sources of system power, consisting of the primary removable battery, the fixed inter- nal battery, and the external 12 V power adapter supply. This relatively simple concept of a hot-swap redundant battery feature therefore requires significant
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 15 and devices. High-Speed Uplink Packet medical-specific features. This device Access (HSUPA) is included to allow is specifically intended to be used by flexible and fast uploads of data from doctors, nurses, and other medical staff as the handheld device when outside of a telemedicine-capable “mobile clinical the range of Wi-Fi, such as on a patient assistant.”
home visit when the device is outside the [Figure 1 | The Arbor Technology M1040, a handheld touch-screen computer designed for telemedicine.] medical center’s Wi-Fi coverage. A major Telemedicine handhelds: feature of medical handheld computers A valuable new medical tool is the software OS support, and typically Special features are needed in a handheld this includes a range of choices including device before it can be considered to be Windows XP Embedded, Windows CE, suitable for telemedicine applications. Linux, and QNX. Many software applica- These features affect the system design tions for example, are based on Windows, at all levels from modules and interfaces but some medical devices have to integrate to the detailed circuitry and mechanical with specific existing installed bases of IT design of the enclosure. Mobile tele- infrastructure, so flexibility of OS choice medicine using handheld computers that is important. include these features provides clinical Figure 1 | The Arbor Technology M1040, a staff with powerful tools to access and handheld touch-screen computer designed for Longevity and change traceability manage patient information, helping them telemedicine. Finally, medical products are designed provide better patient care. with a long lifetime expected, typically a minimum of five years, and every com- Dr. Qi Chen has more than 25 years of Ampro and Ampro Adlink before joining ponent and module needs full revision experience in technical and management Arbor Technology as Vice President of control and compliance provability for the roles for industry- Engineering and General Manager of relevant standards, which must be con- leading companies their U.S. office in San Jose. sidered during the design phase. Change in the U.S., U.K., traceability and quality assurance at all and China. She levels from module to full system are more obtained her Ph.D. Arbor Technology demanding for medical applications than in the U.K. and 408-452-8900 in many other application areas. Figure 1 previously worked [email protected] shows the Arbor Technology M1040, an as Sr. Director of www.arbor.com.t example of a handheld device that includes Engineering for both
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16 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors THE BIG YET SMALL PICTURE Interfaces, displays, and connectivity
Don’t mistake small for KLSPJH[L! Bringing rugged computing to compact environments
By Barbara Schmitz
ESMexpress and the even smaller ESMini combine ruggedization with the cost-savings of COMs to open the door for designers to Today, the proposed ANSI/VITA 59 RSE (Rugged System-On-Module Express) employ these compact embedded computers into a wider variety of standard, currently in development with VITA, capitalizes on the small form mobile, industrial, and rugged applications. factor and interchangeable concepts behind the original COM.0 standard. Yet ESMexpress, as it is also known, and its he original Computer-On-Module (COM) concept from the early 2000s was smaller cousin ESMini, take COMs to an important step in small form factor computing. The modular COM concept new levels of performance by including sought to enable the expansion and customization of an embedded system through rugged performance characteristics, such Tapplication-specific carrier boards. Configuring the I/O on an individual carrier as operating temperatures ranging from board according to an established industry standard allows the system designer to tailor -40 °C to +85 °C, shock resistance up to the functionality to the application, save development costs, and shorten time-to-market. 15 g/11 ms, and greater immunity from EMC emissions, while offering a broad Since the pure CPU functions can easily be standardized for many fields of use, the range of end-user choices for micropro- COM-based system can use a more or less standard plug-in CPU module. Only the carrier cessor architecture including Intel and board needs to be designed or adapted to the application, making this a less complex and PowerPC options, I/O versatility, and pro- less expensive proposition, and special I/O interfaces, memory devices, connectors, or gramming flexibility via changeable and form factors may be added to the carrier board for increased flexibility. Also, FPGA-based upgradable modules. functions can be added to a carrier board or to the CPU module, if desired. Reengineered for ruggedization One limitation to the COM concept was its inability to withstand rugged, shock- and ESMexpress is based on COM Express, vibration-laden environments. The reasons were two-fold. First, the connector was not and therefore the two share some important sturdy enough to avoid damage during more rigorous handling, such as moving from similarities. Both utilize the same compact location to location or during higher levels of vibration. Second, the module components 125 mm x 95 mm board size, implement themselves were unable to withstand this handling and vibration as well, since they were CPU functionality on a standardized mod- not fastened to the board in such a way that would allow them to remain unharmed. ule, and enable the carrier card to handle unique application requirements including This precluded the use of this highly cost-effective and modular concept in a number of I/O interfaces, extra memory devices, and harsh, mobile, and mission-critical embedded applications such as airplane, ship, and train connectors. But there are distinct differ- control; mobile test systems; mobile medical equipment; and industrial control systems. ences as well (Table 1, page 18).
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 17 Eight mounting screws secure the entire Features ESMexpress COM Express physical assembly in place and ensure Organization/Standard ANSI-VITA 59 RSE PICMG COM.0 a positive connection for optimum heat transfer. Comparative thermographic Connectivity Exclusively serial high-speed Serial and mixed serial/legacy imaging demonstrates just how much of Pin-out Options Fixed (2x120 pins) Five different incompatible options a cooling effect adding the frame to the Shock/Vibration Rugged connector; all soldered components Not ruggedized PCB exerts on the design (Figure 2). Operating Temperatures Up to -55 °C to +125 °C -40 °C to +85 °C Without the conductive frame, the hottest Cooling Conduction and convection Cooling not solved spot on the module reaches a temperature Processor independent of more than 87 °C, yet is under 81 °C Processor Platforms x86 only (for example, x86, PowerPC, SFF) when the cover is secured. Similarly, the EMC 100% sealed metal housing Not addressed processor core, as well as several other components, drops an average of 4 °C Table 1 | Although built on the COMs concept, ESMexpress has distinct differences once the cover is screwed into place. that make it reliable in mobile, rugged environments.
[Figure 2 | The PCB/frame connection dissipates significantly more heat generated by the processor using the conductive frame (left) versus a unit with no cover (right).]
[Table 1 | Although built on the COMs concept, ESMexpress has distinct differences that make it reliable in mobile, rugged environments.] If additional cooling is needed, an external The rugged aspects of ESMexpress make it resistant against temperature, shock, vibration, heat transfer device (conduction) can be and EMC influences, and enable these boards to function reliably in life-critical applica- added or the board can be combined with tions or applications that entail high costs in case of failure. These include applications in a heat sink for heat dissipation (convec- ground transport or airborne equipment, practically any mobile computing environment, tion). Conversely, the dissipated heat can avionics or medical engineering, as well as outdoor computers and critical industrial also be led from the cover via the frame control equipment. to a carrier board that supports conduction cooling. Tough traits The electronics are completely housed in an aluminum enclosure that provides optimum Versatile communications EMC protection. The module is mounted on the carrier board, so all six sides are Modern serial buses, without switched hermetically sealed, and conforms to EN 55022 for radio disturbance, to EN 55024 and fabrics, are compatible with a variety of EN 61000-4-2 for electrostatic discharge (ESD), and to EN 55024 and EN 61000-4-4 standard operating systems. The exten- for burst (Figure 1). Maintained by the European Union, these standards offer limits sive range of communications protocols – and methods of measurement WRHQVXUHWKHUHOLDELOLW\DQGGXUDELOLW\RIHOHFWURQLFVZLWKLQ including PCI Express, Gigabit Ethernet, V\VWHPVRYHUH[WHQGHGSHULRGVRIWLPHRadiated and conducted emissions are regulated USB, SATA, SDVO, LVDS, and HD audio by EN 55022 and immunity is monitored by EN 55024. EN 61000-4-2 determines – supported by the ESMexpress standards, electronics’ immunity to ESD and EN 61000-4-4 defines the immunity of electronics to chipsets, and available carrier boards switching and transient noise inherent in the system. Both of these standards meet class B empower a wide variety of applications. limits where, after the equipment has been tested, it will continue to operate as intended without user intervention. Distinct interface execution varies depend-
[Figure 1 | The configuration withstands extreme shock and vibration via the aluminum housing, which also provides exceptional EMC protection.] ing on the application, but this rugged, The connector is especially rugged in part through its qualification for railway applica- compact concept allows a wide range of tions. It is specified for -55 °C to +125 °C and supports differential signals up to 8 GHz. options:
Optional conformal coating provides added protection for harsh operating environments • Up to eight USB 2.0 host ports (or seven where dust or moisture are concerns. Fully soldered connections provide shock-resistant host ports and one client port, adjustable and vibration-resistant performance rated to withstand 15 g/11 ms for shock and 1 g/10 Hz by software) provide data rates up to to 150 Hz for vibration (sinusoidal). 480 Mbps, offering flexibility for a wide range of end-use functions Keeping cool • Up to three Serial ATA (SATA) One of the more unique, and most important, aspects is the fanless cooling concept, communications ports, available through designed to dissipate up to 35 W. For compact environments that are densely packed with the ESMexpress connector via a a multitude of high-functioning compo- PATA-to-SATA converter, support nents, this proves critical to system reli- RAID functions and provide data ability to avoid failure due to heat build up. transfer rates up to 100 MBps • For PCI Express, there are four single- The metal frame, metal cover, and mechan- lane ports (4 x1) and one port that ical connections of the ESMexpress can be configured as 1 x16, 1 x8, 2 x4 assembly are important contributors to or 2 x1 the thermal performance of the overall • Ethernet options provide up to three design. Both the PCB itself and the metal 1 Gb ports of 1000BASE-T (also 10 Gb) frame help to draw heat away from the • Full-featured SDVO and LVDS ports processor and transfer it to the cover. The support graphics-oriented applications hottest components within the unit are also • High-definition audio is available via coupled directly to the cover. the ESMexpress connector • Extendable I/O, controlled through FPGAs, provides embedded system Figure 1 | The configuration withstands extreme designers with ample flexibility to shock and vibration via the aluminum housing, configure the specific I/O requirements which also provides exceptional EMC protection. they want
18 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors Figure 2 | The PCB/frame connection dissipates significantly more heat generated by the processor using the conductive frame (left) versus a unit with no cover (right).
The fixed assignment of the processor and the SDRAM functions on the CPU mod- Display port and HDMI support allows for a second GMBus defined on PCIe x16 split ule eliminates the need for complex and signals. A low voltage I/O mode (3.3 V or 1.5 V I/O) is available with the I/O reference expensive changes to that unit. Conversely, voltage indicated by the CPU board on the J1-43 pin. Serial RapidIO is supported on all licensing IP cores to execute specific I/O pins formerly dedicated to PCI Express. requirements through carrier board FPGAs is a quicker and more affordable way to Interoperability options adapt to custom application inputs while The signals on ESMexpress are led to two 120-pin connectors and exclusively defined keeping overall size to a minimum. for modern serial buses like PCI Express, Ethernet, SATA, and USB. The pin assignment is fixed without options in order to guarantee 100 percent interchangeability between Further size reduction with ESMini the modules. A variation also exists for designers requiring an even smaller form factor Any required legacy I/O as well as additional modularity can be realized using FPGAs that still boasts the rugged advantages of on the carrier board. This design facilitates a resource-sharing concept of using available ESMexpress and modular concepts inher- IP cores to configure the FPGAs and enhance specific functionality. With the FPGA ent in COM Express. With dimensions of functionality provided on the carrier board via a PCI Express link, instead of on the 95 mm x 55 mm, ESMini does not adhere COM module itself, the number of pins reserved for FPGA functions are less than if to the size conventions of the proposed the FPGA resided on the COM module. ANSI-VITA 59 RSE standard.
i
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 19 It does, however, include the same mounting frame and cover design for conductive cool- temperature operation and high resistance ing with comparable thermal, mechanical, and EMC performance levels as ESMexpress, to shock and vibration, open up the versa- as well as all the ruggedization features of its larger cousin (for example, an operating tility of the COM concept to a wider range temperature range of -40 °C to +85 °C). And the format complements the modern serial of applications than ever before: connectivity of ESMexpress with the added ability to provide industrial I/O like CAN and UART interfaces implemented through FPGA capabilities. • Signal, control, or passenger information systems in railway This capability also makes the ESMini an attractive option for mobile and rugged applica- applications tions where connectivity with legacy interfaces is an issue, since the module can easily • Industrial robotic applications, from and cost-effectively incorporate these older communication protocols on the FPGA. plastics production to semiconductor clean-room production and general Both the form factor and the pin assignment are variable. Thanks to this flexibility, automation individual I/O in the onboard FPGA can be implemented in addition to the serial I/O. • Extreme industrial environments such as highly precise, fast robots for motor Small solutions with big options vehicle production, or the control, Compact form factors are an attractive resource for space-constrained applications in fixed monitoring, and function management or mobile computing environments. Rugged design characteristics, including extended of a nuclear power plant • Demanding mobile computing needs such as medical equipment or transportation applications
And the broad range of high-speed serial interfaces – from USB (480 Mbps) and SATA (100 MBps) to Ethernet (1 Gb/10 Gb) and PCI Express (250 MBps) – plus the versatility of FPGA customization pro- vides cost-effective adaptation to a wide range of computing environment needs.
Compact embedded systems develop- ers who appreciate the advantages of the COM concept will now be able to extend development into more rugged- environment applications. And those who have been precluded from adopting the COM concept because of their extreme rugged requirements will now be able to access the cost-efficiency and convenience of COM technology to get new designs to market quicker than ever.
Barbara Schmitz is Chief Marketing Officer of MEN Mikro Elektronik. For the past 19 years, her work has included public relations, product positioning, and development and coordination of global sales channels. Barbara graduated from the University of Erlangen-Nürnberg, studied business economics in a Bad Harzburg business school correspondence course, and completed a marketing and communications apprenticeship in Nürnberg.
MEN Mikro Elektronik GmbH (215) 542-9575 [email protected] www.menmicro.com
20 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors THE BIG YET SMALL PICTURE Interfaces, displays, and connectivity AMD Fusion architecture boosts ETX and XTX performance
By Ron Mazza
ETX – one of the oldest and most widespread embedded COM standards – was threatened when Pentium M and Celeron M processors were discontinued, as was ETX’s sister standard XTX. This discontinuation left a gaping hole in the upper performance range, the demand of which continues to rise. AMD addresses this problem with its new, highly scalable embedded processor generation with Fusion architecture that enables the highest graphics and application processor performance with low power consumption for fanless designs.
COMs have established themselves on a broad basis over the last decade. They allow Improved processing with Fusion device developers to concentrate on their core competence. Developers can purchase The essential features of the new know-how intensive and therefore costly solutions in the field of processor and RAM AMD G-series processors are an ideal storage technology as pre-integrated solutions at a low price. In the long run, they can fit for the requirements of the small form then change them quite simply and without much integration effort on the module level. factor embedded market, especially for Thanks to these options, systems become fully scalable and the long-term availability on users of existing ETX or XTX modules, the module level increases as a result of the independence from the currently implemented which are mainly employed in industrial processor. and building automation, kiosk appli- cations, medical technology, gaming, Since its introduction around eight years ago, ETX has established itself as one of the most and (interactive) digital signage. What widely used standards across all performance and application classes. Those that do not all these applications have in common require ISA bus support can easily be switched to the identical XTX form factor standard. is the trend toward ever more realistic ETX and XTX enjoy immense popularity, also for current designs, due to the fact that (3D) visualization with high resolutions SATA has been supported since the release of version 3.03 of the ETX standard. up to HD. Even with the higher graphics performance required by high-resolution Following last year’s discontinuation of the Pentium M and Celeron M processors and the touch screen controls, the Fusion archi- 855/852 chipsets, doubts about the future of ETX and XTX for the upper performance tecture lets designers easily upgrade range have arisen in many respects. This is aggravated by the fact that modern applica- their machines and devices by changing tions and the trend toward touch screens, sophisticated user interfaces, and increasingly modules in order to enable modern larger displays with higher resolutions have placed much greater demands on graphics than and graphics-intensive user interfaces. previous processor generations could offer. In addition, maximum power consumption for This leads to completely new possi- fanless and battery-operated devices needs to be as low as possible and must not exceed the bilities in areas such as medical imaging upper limit of 20 W. The classic approach with current processors lacks graphics perfor- technology and analysis devices where mance when using low power consumption, especially in the 3D realm, or thermal power Fusion architecture can fully exploit the dissipation and space requirements increase disproportionately. AMD has addressed this advantages of parallel processing via the problem with a fundamentally new approach: the G-series Fusion architecture. APU for the relevant evaluations.
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 21 Specifically, AMD’s Fusion architecture combines the Central Processing Unit (CPU) and The Fusion architec- Graphics Processing Unit (GPU) on one chip to an Accelerated Processing Unit (APU). The graphics processor is a General Purpose Graphics Processing Unit (GPGPU), which ture, highly suitable distinguishes itself from a standard GPU by its flexible parallel processing units. Thereby, the GPGPU can also be used for general, compute-intensive, parallelizable operations, and for XTX and ETX can also considerably increase the performance in the non-graphics sphere. Typical uses include numerical mathematical applications and all types of encoding/decoding tasks, encryption and network packet processing in particular. applications, takes Increasing efficiency with parallel and serial tasks advantage of the The Fusion architecture, highly suitable for XTX and ETX applications, takes advantage of the fact that processes run mostly serially on a standard CPU. Under these circum- fact that processes stances, parallelization can only actually occur in multiprocessor systems or virtually via time-splicing control of the individual, relatively large processes. The situation is dif- ferent with a GPU: Here, tasks are distributed over many, very small and highly-specialized run mostly serially on engines, which are linked with one another according to their respective tasks and which manage the various tasks in each timestep in parallel. What is special about a GPGPU a standard CPU. is the fact that the individual processor tasks are not hard-wired as, for example, is the case with the vertex shader unit using a simple GPU. Instead, the particular tasks are freely configurable, similar to a network processor within a certain range. For the software developer special application (overall performance) this process remains transparent because the engines of the AMD G-series GPGPU are and for a 3D benchmark. Note that the based on proven standards such as DirectCompute from Microsoft and OpenCL (not to be maximum power consumption of the confused with OpenGL), and because AMD offers software development kits. systems can differ quite substantially.
[Figure 1 | Graphics performance comparison:
Internal tests demonstrate that the graphics performance of the AMD embedded G-series is higher than that of the Intel Core i5 520M.]
[Figure 2 | Overall performance comparison:
At normal clock rates the overall performance of the AMD G-T56N 1.6 GHz dual core APU is on par with Intel’s Core i5 520M.] Since real task formulations are seldom purely serial, there are, in practice, enormous [Sidebar 1 | The AMD G-series offers scalability for today’s graphics-intensive XTX and ETX applications.] efficiency advantages when using a fused APU, which can process both serial and Why choose an ETX or XTX parallel tasks. Traditional CPU architecture and programming tools are usually less module? suitable for vectorial data models with parallel multi-threads. The traditional CPU ETX and XTX (for applications without performance benchmarks, which were used to compare the performance of platforms, an ISA bus) are already implemented as are no longer meaningful. What will be decisive in the future, however, is the APU proven standards in millions of baseboards. performance, which can differ in otherwise identical embedded systems according to the However, for new projects and redesigns application, which can have more or less parallel tasks or threads. The standard 2D and 3D it is also often wise to implement proven graphics benchmarks offer a good indication of the potential of the APU as they describe standards. This is confirmed by the wide the maximum performance of the APU in a single graphics mode. Figures 1 and 2 illustrate range of ETX- and XTX-compatible the performance of preproduction Fusion APUs in comparison to other processors for a baseboards and periphery offered (cool- ing and housing, for example). Designers can stick to the specific interfaces and I/Os around standardized COM, using familiar technology and their core competencies. In this way, they can quickly and easily implement a new processor architecture like Fusion by means of a simple module exchange without much effort in terms of hardware.
For this purpose, congatec offers the ETX COM conga-EAF and the XTX COM conga-XAF. Both modules are based on the AMD G-series Fusion processors and Figure 1 | Graphics performance comparison: Internal tests demonstrate that the graphics the embedded controller hub Hudson E1, performance of the AMD embedded G-series is higher than that of the Intel Core i5 520M. and are available with single core proces- sors with 1.2 GHz or 1.5 GHz, or with dual core processors with 1.0, 1.4 or 1.6 Hz and a thermal power dissipation of between 9 W and 18 W. They come equipped with a single DDR3 SODIMM module with up to 4 GB/1066 Hz but can also support the standard DDR3 with 1.5 V as well as DDR3L with 1.35 V. For more information on congatec System-On-Modules visit: http://congatec.us/products.html?&L=6.
A guaranteed future for ETX and XTX applications The G-series Fusion architecture provides Figure 2 | Overall performance comparison: At normal clock rates the overall performance ETX and XTX small form factor applica- of the AMD G-T56N 1.6 GHz dual core APU is on par with Intel’s Core i5 520M. tions with an excellent ratio of computing
22 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors Overview of the AMD G-series: Scalability and specifications power to power consumption and enables battery-operated and/or Currently, all G-series Fusion processors are available as 5+2 year long-term embedded products fanless devices with high graphics with clock rates of 1.0 to 1.6 GHz in single and dual core APUs, each with a 512 KB cache per core. requirements, often for the first Depending on the clock rate and number of cores, system thermal design power ranges between time. What’s more, ETX and XTX 9 and 18 W. In addition to this, there is an ultra-low-power variant without a GPU. Apart from two modules with Fusion technology independent display controllers, the APU provides four additional PCI Express 2.0 lanes for system will remain future-proof for a long enhancements. As is common with AMD, the RAM memory with a 64-bit bus width is directly con- time to come, thereby facilitating nected to the APU. In line with the current trend toward small form factors, the G-series platform is easy entry into new dimensions of executed as a two-chip solution. The AMD A55E1 controller hub, which has been specially designed graphics performance and user- to meet the requirements of the embedded market, contains additional PCI, PCI Express, USB, SATA, friendly interfaces. and HD audio interfaces. Both chips are connected simply and securely via four PCI Express 2.0 lanes (see sidebar figure). Ron Mazza is General Manager at congatec. He has 33 years of management experience in technology companies, including five successful startups. Before helping found congatec, he contributed to the success of companies such as Zilog, Faraday Electronics, Phoenix Technologies, RFM, and VIA Technologies, mostly at the VP level or above. Before his transition to executive management, Mazza was a software engineer. congatec Inc. 858-457-2600 Sidebar 1 | The AMD G-series offers scalability for today’s graphics-intensive XTX and [email protected] ETX applications. www.congatec.us
AAEON Electronics, Inc. Processor boards/SBCs: COM Express 32 Kontron Processor boards/SBCs: PC/104 41 AAEON Electronics, Inc. Processor boards/SBCs: PC/104-Express 42 Kontron Processor boards/SBCs: More SBCs 50 ACCES I/O Products, Inc. I/O boards: Analog 24 Micro Technic Processor boards/SBCs: PC/104 42 ACCES I/O Products, Inc. I/O boards: Data acquisition 26 Parvus Corporation Packaging: Power supplies 31 ACCES I/O Products, Inc. I/O boards: Digital 26 Parvus Corporation MIL-SPEC: Rugged computers 51 ACCES I/O Products, Inc. I/O boards: Multifunction 27 PEAK-System Technik GmbH Industrial automation: CAN 30 Advanced Digital Logic (ADL) Processor boards/SBCs: PC/104-Express 44 Pinnacle Data Systems, Inc. Processor boards/SBCs: COM Express 34 Advantech Corp., USA Processor boards/SBCs: COM Express 32, 33 RAF Electronic Hardware Packaging: Connectors 31 Advantech Corp., USA Processor boards/SBCs: Mini-ITX 39 Sundance Multiprocessor I/O boards: FPGA and DSP 27 Advantech Corp., USA Processor boards/SBCs: More SBCs 47, 49 Technologic Systems Processor boards/SBCs: COM/SOM 36, 37 Ampro ADLINK Technology, Inc. Processor boards/SBCs: PC/104-Plus 44, 45 VersaLogic Corp. Processor boards/SBCs: PC/104-Plus 45 Artila Electronics Co., Ltd. Processor boards/SBCs: More SBCs 49 VIA Technologies Complete systems: Vehicle mount computers 24 AXIOMTEK Processor boards/SBCs: Pico-ITXe 47 VIA Technologies Processor boards/SBCs: COM Express 35 Connect Tech Inc. Processor boards/SBCs: Qseven 48 VIA Technologies Processor boards/SBCs: Mini-ITX 40 EMAC, Inc. Processor boards/SBCs: COM/SOM 35 VIA Technologies Processor boards/SBCs: Pico-ITX 46 EMAC, Inc. Processor boards/SBCs: PC/104 41 WinSystems, Inc. I/O boards: Analog 25 Emerson Network Power Processor boards/SBCs: COM Express 33 WinSystems, Inc. Processor boards/SBCs: EPIC 38 Emerson Network Power Processor boards/SBCs: More SBCs 50 WinSystems, Inc. Processor boards/SBCs: PC/104 43 Global American, Inc. Services: Embedded Systems Integrator 51 WinSystems, Inc. Processor boards/SBCs: PC/104-Plus 46 Kontron Processor boards/SBCs: COM Express 34 WinSystems, Inc. Storage: CompactFLASH 52 Kontron Processor boards/SBCs: Mini-ITX 40
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 23 PC/104 and Small Form Factors Resource Guide 24 I/O boards:Analog Complete systems:Vehicle mountcomputers
❙ For moreinformation, contact: embedded applications. high retentiontypeBconnector andcanbeusedforstacking A micro-fitUSBheaderconnector isprovidedinparallelwiththe can beperformedviaaprovided, easy-to-usesoftwareutility. simultaneously. Systemcalibrationspecifictouserrequirements All analogoutputchannelscanbeupdatedeitherindividually or Additional specificrangescanbeachievedasfactoryoptions. The boardsfeaturesbothunipolarandbipolaroutputranges. process control. signals. Idealapplicationsincludelightcontrol,motionand embedded applicationsthatrequirestableandaccurateoutput The USB-AOSeriescanbeusedinanassortmentofUSB-based outputs alongwithtwo16-bitanaloginputsand16digitalI/Olines. output modules.Upto16channelsof16-bitresolutionanalog USB-AO Seriesisaninnovativelineof12-and16-bitUSBanalog Small formfactorUSB-baseddataacquisitionandcontrol.The USB-AO SeriesMultifunctionUSBAnalogOutput www.accesio.com 858-550-9559 10623 RoselleStreet•SanDiego,CA92121USA ACCES I/OProducts,Inc. For moreinformation,contact: and dualGigabitnetworking. supports dualLVDS andVGAdisplayports,twoconfigurableCOMports erated HDmediaplaybackandmulti-displaysupport.TheVIAART-5450 efficiency togetherwithafullrangeoffeaturesincludinghardwareaccel- system processor, theVIAART-5450 bringsperformanceandenergy Featuring a64-bit1.0GHzVIANanoEprocessorandtheVX800media updates. and software-basedpowerdownschedulingforsystemmaintenance power managementoptionsincludingonandoffdelay, and anoptionalpowermanagementmodulethatallowsmoresophis The VIAART-5450 alsofeaturesaflexiblepowersourceinputofDC7-36V easy fanlessdesignimplementation,essentialforin-vehiclesystems. flash moduleforOSinstallation,theVIAART-5450 embeddedboxPCoffers wide operatingtemperaturerangeof-20°Cto+70°C.Employingacompact design thatcanwithstandvibrationsofupto5Gandshocks50Gwitha The compactVIAART-5450 usesauniquelyrobustaluminumchassis 3.5G support. nications optionsincludingBluetooth,Wi-Fi,GPRSandarangeof3G high-performance VIANanoE-Seriesprocessorandawealthofcommu- coupled withthenewEMIO-3450expansionmodule,bringingtogethera The VIAART-5450 isbasedonthemodularVIAEITX-3000Em-ITXboard Vehicle &FleetManagement VIA ART-5450, theCompactFanlessEmbeddedSystemfor www.viaembedded.com 510-683-3300 940 MissionCourt•Fremont,CA94539USA VIA Technologies
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PC/104 and SmallFormFactors [email protected] [email protected] ticated FEATURES FEATURES i i i i i i i i i i i i i i i i i i
(VIA PWM-1000) Optional powermanagementmodulesupportforignitionon/offdelay GPS support Optional 3Gmobilebroadbandmodule,wirelessLANand two Mini-PCIeslotsandoneSIMslot One VGA,twoLVDS, fourCOM,twoGigaLAN,USB,8-bitGPIO, Built inVIANano EMIO-3450 I/Ocard Embedded systemforEITX-3000embeddedboardstackedwith Shock resistantto50Gandvibration5G Fanless operatingtemperature:-20°Cupto+70°C Extended operating temperatureandDINrailmounting provisions high-retention design Type BUSBconnector featuresindustrialstrengthand Alternate micro-fitembeddedUSBheader connector mounting compatibility OEM version(boardonly)featuresPC/104 modulesizeand Two 16-bitanaloginputsand16linesofdigitalI/O Update outputsindividuallyorsimultaneously Real-time hardwarecalibrationperchannel Unipolar andbipolaroutputranges Up to16analogoutputswith12-or16-bitresolution Utility API,VIAStrongBoxsecurityserviceandmore Bundle withembeddedsoftwareservicesincludingVIAFliteDeck CE/FCC/e-mark, ISO7637-2compliant ™ Eprocessor(1MBL2Cache) www.smallformfactors.com/p52225 www.smallformfactors.com/p52375 PC/104 and Small Form Factors Resource Guide 25 ❙
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, and Linux ® www.smallformfactors.com/p41298 PC/104 and Small Form Factors Analog and digital I/O on one board 16-bit analog-to-digital (A/D) converter Conversion speed: 100k samples per second quad 12-bit digital-to-analog (D/A) converters Two programmable Each individual channel independently software Low noise onboard DC/DC converter No adjustment potentiometers or calibration needed with 24 capable of 48 bi-directional TTL-compatible digital I/O lines event sense interrupt generation Free software drivers in C, Windows +5V only operation -40ºC to +85ºC temperature operation Configurations available with A/D or D/A only
FEATURES i i i i i i i i i i i i , ® [email protected] For more information, contact: depopulated. This lowers the cost of the unit if these functions are not required for your application. Additional configurations are available as well; please contact an applications engineer with your requirements. depopulated, and another version with the D/A converters The PCM-MIO operates over the industrial temperature range of The PCM-MIO operates over the industrial for C, Windows -40°C to +85°C. Free software drivers are available onboard that can be software configured as input, output or output onboard that can be software configured as sense can generate interrupts if they with readback. Twenty-four and will interface a change of state. Each output can sink 12mA directly with opto-isolated modules. A total of 48 bi-directional TTL-compatible digital I/O lines are A total of 48 bi-directional TTL-compatible individual software programmable voltage ranges of ±5V, ±10V, ±10V, ranges of ±5V, individual software programmable voltage channels can be updated and cleared The output 0-10V. and 0-5V, industry stan- They also work with individually or simultaneously. dard signal conditioning modules. There are eight 12-bit digital-to-analog (D/A) converters with There are eight 12-bit digital-to-analog software-programmable input ranges are ±5V, ±10V, 0-5V, and 0-10V. and 0-10V. 0-5V, ±10V, input ranges are ±5V, software-programmable voltage protected to ±25V and can work The input channels are modules. directly with industry standard signal conditioning The board will support up to 16 single-ended input channels, eight up to 16 single-ended input channels, eight The board will support or various combinations of both. The differential input channels, The PCM-MIO is a versatile, PC/104-based analog input, analog analog is a versatile, PC/104-based The PCM-MIO board designed to meet customer demands output, and digital I/O high channel count analog and digital I/O. The for high-accuracy and converters and precision Linear Technology’s board is based upon require no external calibration. voltage references, which www.WinSystems.com A/D Multifunction WinSystems, Inc. WinSystems, USA TX 76011 • Arlington, Drive 715 Stadium 817-274-7553 WinSystems offers the board configured with the A/D converters WinSystems offers the board configured with and Linux. I/O boards: Analog boards: I/O PC/104 and Small Form Factors Resource Guide 26 I/O boards:Digital I/O boards:Dataacquisition
For moreinformation, contact: boards forquickandeasyconnectivity. accessories includeawidevariety ofcablesandscrewterminal type Bconnectorforstackingand embeddedapplications.Available USB headerconnectorisprovided inparallelwiththehighretention to reducecrosstalkandmaintain industrycompatibility. Amini pin 49ofeachconnectorwithgroundsonallevennumberedpins headers with24linesperconnector. Utility5VDCisavailableon These boardsuse2or4industrystandard50pinIDC-typeshrouded embedded OEM. portable, laptop,education,laboratory, industrialautomation,and indicators orsystemequipment.Applicationsincludehome, outputs forcontrollingexternaldevicessuchasLEDsandother USB-DIO-96 isusefulformonitoringdrycontactsorgenerating digital I/OtoanyPCorembeddedsystemwithaUSBport.The USB deviceisanidealsolutionforaddingportable,easy-to-install product features96or48industrialstrengthTTLdigitalI/Os.This Designed forcompactcontrolandmonitoringapplications,this USB-DIO-96 High-DensityDigitalI/O www.accesio.com 858-550-9559 10623 RoselleStreet•SanDiego,CA92121USA ACCES I/OProducts,Inc. For moreinformation,contact: monitoring, andcontrolincountlessembeddedapplications. real-world applicationssuchasprecisionmeasurement,analysis, data acquisitionandcontroldevicescanbeusedinmanycurrent ing, analyzing,andmonitoringinavarietyofapplications.These vide theuserwitheverythingneededtostartacquiring,measur- The small,compact,multifunctionI/ODAQ-PACK Seriesunitspro- voltage supply. tion, voltagedividers,smallsignalinputs,andsensorexcitation RTD measurement,bridgecompletion,thermocouplebreakdetec- performs signalconditioningsuchasRCfiltering,currentinputs, I/O capabilitiestoanyPCorembeddedsystemwithaUSBport.It for addingportable,easy-to-installhigh-speedanaloganddigital acquisition andcontrolsystem.Thesystemoffersanidealsolution The DAQ-PACK Seriesisahighlyintegratedmultifunctiondata Multifunction DAQ-PACK Series(Upto128Channels) www.accesio.com 858-550-9559 10623 RoselleStreet•SanDiego,CA92121USA ACCES I/OProducts,Inc. ❙
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PC/104 and SmallFormFactors [email protected] [email protected] i i i i i i i i FEATURES i i i i i i i i i i i FEATURES
mounting compatibility OEM version(boardonly)featuresPC/104 modulesizeand Resettable fused+5VDCoutputsper 50-pinconnector to ground,orfloating Jumper selectableI/Opulledupto5V forcontactmonitoring,down I/O Bufferscanbeenabledortri-stated underprogramcontrol capabilities All I/Olinesbufferedwith32mAsource,64mAsinkcurrent or outputs Twelve orsix8-bitportsindependentlyselectableforinputs High-speed USB2.0device,1.1backward-compatible 96 or48linesofdigitalI/O Autocalibration andoversamplingforreal-timeaccuratedata Wide rangeofflexiblesignalconditioningtypes programmable 18 inputranges,9unipolarandbipolar, per8-channel Flexible, softwareconfiguredfunctionality 12 or16-bitresolutionA/Dconverter Sustained samplingspeedsupto500kHz High-speed USB2.0multifunctionDAQ 32, 64,96,or128-channelsingle-endeddifferentialanaloginputs 16-bit programmablecounter/timer Two 16-bitanalogoutputsand16high-currentdigitalI/Olines A/D startsviasoftware,timer, orexternaltrigger www.smallformfactors.com/p42373 www.smallformfactors.com/p52224 PC/104 and Small Form Factors Resource Guide 27 ❙
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www.smallformfactors.com/p46480 www.smallformfactors.com/p52223 PC/104 and Small Form Factors watchdog timer card with software selectable timeout Plus Temperature measurement, monitor, and alarm measurement, monitor, Temperature Fan status and speed control PCI/104 power monitor/limit alarm interrupt Opto-isolated input to trigger reset General purpose opto-isolated input, two outputs general purpose 8-bit A/D inputs Two External fused 5V and 12V power Light sensor for enclosure security Extended temperature (-40°C to +85°C) available PC/104- from 4μsec open collector reset outputs Watchdog
9. I/O Expansion header 120-LVDS/LVTTL 10. External power connector 11. Optional: Dual optical fibre transceivers 1. PowerPC Xilinx Virtex-5 FX100T FPGA with embedded 2. 512MB DDR2 SDRAM (64M x 32-bit) 3. 3x QDR2 SRAM (2M x 36-bit) 4. Onboard Flash memory for FPGA configuration 5. PCI Express x1 or x4 6. ports Dual SATA 7. USB 2.0 interface 8. MicroSD Flash socket FEATURES FEATURES i i i i i i i i i i i
i i i i i i i i i i i Watchdog Timer Board Timer Watchdog [email protected] [email protected] Plus , Waterside • Chesham, HP5 1PS United Kingdom 1PS United HP5 • Chesham, , Waterside “ Sundance House Sundance UK: +44-1494-793-167 | USA: +1-214-272-0395 | EMEAI: +39-3491-766-760 | USA: +1-214-272-0395 UK: +44-1494-793-167 For more information, contact: Many I/O resources and customizable expansion headers are Many I/O resources and customizable expansion via mezzanine available to easily interface with external equipments cards. The SMT105 is designed for a variety of applications including for a variety of applications including The SMT105 is designed digital recording, automation, control, real-time data acquisition, communications and vision. Xilinx Virtex-5 FX100T FPGA with a PowerPC It features the large The FPGA is directly interfaced core for embedded processing. memory for buffering to the right mix of high-density DDR2 SDRAM as well as PCI Express and ultra-fast QDR2 SRAM memory banks, for high-bandwidth data transfers. SUNDANCE, one of the leading manufacturers of advanced manufacturers one of the leading SUNDANCE, (DSP), multicore and reconfigurable COTS digital signal processing of to the Series-1: a complete range systems, added the SMT105 boards stackable FPGA-centric form factor, PCI/104-Express small and aimed toward deployment in ruggedized for rapid prototyping embedded systems. www.PCI104.biz | www.SUNDANCE.com www.PCI104.biz Developer's Board FPGA SMT105: PCI/104-Express Sundance Multiprocessor Technology Multiprocessor Sundance ” For more information, contact: and even a security light sensor that can be used to detect if the darkened interior of an enclosure is opened. Want more?! One general purpose optically isolated input, two more?! One Want isolated digital outputs to control/switch external events, two non-isolated digital outputs, two general purpose A/D inputs, temperature, voltage, fan speed, humidity, and more. The board temperature, voltage, fan speed, humidity, was designed to allow for complete peace of mind when planning your next PC/104-based embedded system. Applications include kiosks, industrial automation, military/mission-critical, asset man- agement and tracking, retail, medical, embedded OEM, temperature measurement, and many others which require self-reliant embed- ded systems. control a variety of system hardware parameters such as This feature-rich Watchdog board will vigilantly stand guard over board will vigilantly stand guard This feature-rich Watchdog failures. The board your system and will help avoid costly system can be used to monitor the operation of your application program as well as operating system and will initiate a system reset in case of lockup. In addition, the P104-WDG-CSMA can monitor and www.accesio.com P104-WDG-CSMA PC/104- ACCES I/O Products, Inc. 10623 Roselle Street • San Diego, CA 92121 USA 858-550-9559 I/O boards: FPGA and DSP and FPGA boards: I/O I/O boards: Multifunction Condition Monitoring by LEMT
If your system must be secure, stable and running at optimum performance, Main Features constant monitoring, „Condition Monitoring“, is crucial. LEMT, being upward Device identifi cation compatible with eAPI, provides this Condition Monitoring. Device status indication For example, you can Redundant Fail Safe BIOS Continuously keep the optimum balance between Power and performance in Storage of board specifi c data battery-powered systems. Measuring of current consumption Optimize maintenance of often problematic stand-alone devices. „Secure“ and „User“ Flash LEMT - Condition Monitoring gives you a constant overview of the device´s status and thus allows high uptimes. Keep repair costs and downtime low. LEMT helps here providing error codes and storing relevant data for analysis and repair.
CoreExpress®-ECO2 Toucan-TC Cool LiteRunner-LX800 Format: CoreExpress® Format: COM Express Format: PCI/104-Express Atom™ E6xxT Processor, Atom™ E6xxT Processor, Geode™-LX800 Processor, 2 GB RAM 2 GB RAM 1 GB RAM
CoreExpress®-A310 Toucan-QM57 Cool XpressRunner-GS45 Format: CoreExpress® Format: COM Express Format: PCI/104-Express Armada A310 ARM, Core™ i7 Processor, Core™ 2 Duo Processor, 512 MB RAM 8 GB RAM 2 GB RAM
Thunderbird-E3100 Format: Mini-ITX Core™ Duo Processor, 8 GB RAM
Hurricane-QM57 Hurricane-LX800 Format: EPIC Format: EPIC Core™ i7 Processor, Geode™-LX800 Processor, 8 GB RAM 1 GB RAM
For more than 25 years LiPPERT has been utilizing the latest technologies, the LiPPERT offers effi cient and rugged highest integration levels, and outstanding processing power. They provide products for market segments as their customers with the maximum possible performance, while maintaining a diverse as minimum of power dissipation. s Automotive, Integrated monitoring functions provide the user with the highest level of sys- s Medical, tem and functionality management. s Military, s Aerospace, and s Automation.
Save time and money, keep your system under control and bring the best possible products to ma Do you need to know, on-line and immediately, what is happening with your remote system? „LEMT is for you.”
LEMT Architecture
LiPPERT Embedded Computers Inc. 2220 Northmont Parkway Suite 250 Duluth, GA 30096 Phone (770) 295 0031 · Fax (678) 417 6273 Toll Free (866) 587 8681 [email protected] · www.lippertembedded.com arket. LiPPERT´s Condition Monitoring can help you. www.lippertembedded.com/lemt.html PC/104 and Small Form Factors Resource Guide 30 Industrial automation:CAN Industrial automation:CAN
Windows The packageisalsosuppliedwiththeCANmonitorPCAN-Viewfor to 500VbetweenthePCandCANsides. opto-decoupled versionsalsoguaranteegalvanicisolationofup The cardisavailableasasingleordualchannelversion. D-Sub plugontheslotbracketsupplied. can bestackedtogether. TheCANbusisconnectedusinga9-pin two CANnetworkstoaPCI/104-Expresssystem.Upthreecards The PCAN-PCI/104-Expresscardenablestheconnectionofoneor PCAN-PCI/104-Express www.peak-system.com +49 (0)6151-8173-20•[email protected] Otto-Roehm-Str. 69•Darmstadt,64293Germany PEAK-System Technik GmbH For moreinformation,contact:
For moreinformation, contact: Windows The packageisalsosuppliedwiththeCANmonitorPCAN-View for to 500VbetweenthePCandCANsides. opto-decoupled versionsalsoguaranteegalvanicisolationof up The cardisavailableasasingleordualchannelversion. connected usinga9-pinD-Subplugontheslotbracketsupplied. be operated,witheachpiggy-backingoffthenext.TheCANbusis two CANnetworkstoaPC/104- The PCAN-PC/104- PCAN-PC/104- www.peak-system.com +49 (0)6151-8173-20•[email protected] Otto-Roehm-Str. 69•Darmstadt,64293Germany PEAK-System Technik GmbH ❙
2011 Resource Guide ® ® andtheprogramminginterfacePCAN-Basic. andtheprogramminginterfacePCAN-Basic. Plus
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PC/104 and SmallFormFactors cardenablestheconnectionofoneor [email protected] [email protected] Plus system.Uptofourcardscan i i i i i i i i i i i FEATURES i i i i i i i i i i i FEATURES
5 VsupplytotheCANconnectionthroughasolderjumper NXP PCA82C251CANtransceiver NXP SJA1000CANcontroller, 16MHzclockfrequency CAN busconnectionviaD-Subslotbracket,9-pin Compliant withCANspecifications2.0Aand2.0B Bit ratesupto1Mbit/s Up to3cardscanbeusedinonesystem PCI/104-Express card,1lane(x1) Device driversforWindows Optionally available:PCI-104stack-throughconnector Extended operatingtemperaturerange(-40°Cto85°C) Device driversfor Windows PC/104-ISA stack-throughconnector Extended operatingtemperaturerange (-40°Cto85°C) 5 VsupplytotheCANconnectionthrough asolderjumper NXP PCA82C251CANtransceiver NXP SJA1000CANcontroller, 16MHzclockfrequency CAN busconnectionviaD-Subslotbracket,9-pin Compliant withCANspecifications2.0Aand2.0B Bit ratesupto1Mbit/s Up tofourcardscanbeusedinonesystem Use ofthe120-pinconnectionforPCIbus ® ® 7/Vista/XP/Linux(32/64-bit) 7/Vista/XP/Linux(32/64-bit) www.smallformfactors.com/p47804 www.smallformfactors.com/p32971 PC/104 and Small Form Factors Resource Guide 31 ❙
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www.smallformfactors.com/p30218 www.smallformfactors.com/p45654 ; round and hexagon profiles " PC/104 and Small Form Factors ; diameter 3/16 " long, 4-40 male thread on one end " deep, 4-40 internal thread depth " Isolation: 1500V Galvanic Isolation DC Surge, Spike, Transient, Voltage Input Protection: Reverse Polarity, Over Current Output configurations: 40W or 80W 90%+ Efficient at Full Load Vehicle Applications: Aerospace/Avionics/Military/Ground embedded systems Precision manufactured for perfect fit immediate – in stock Availability MIL-461F Designed to Meet MIL-810G, MIL-1275D, MIL-704F, +12VDC +5V, Output: +3.3V, Voltage for 250V spike and Input: Nominal 28.0VDC (with support Voltage 100V surge per MIL-STD-1275) Nylon or aluminum (mating screw and hex nut available for Nylon or aluminum (mating screw and hex nut available either material) Length: 0.600 3/16 1/4
FEATURES FEATURES i i i i i i i i i i i i i i embedded Plus isolated power supply (PCI) bus, or onboard screw Plus Plus [email protected] [email protected] bus drives are installed. With this approach, stand- bus drives are installed. Plus capable of supplying up to 80W of power output over extended capable of supplying up to 80W of power For more information, contact: power conditioning/EMI filtering devices integrated into military embedded systems. transient protection for the 250V spike and 100V surge require- ments of MIL-STD-1275, the card can replace the typical in-line The ACS-5180 is a rugged PC/104- temperature ranges to embedded computing devices in demand- ing military/civil ground vehicle, shipboard, and aircraft applica- tions. Designed for extended temperature operation (-40°C to +85°C per MIL-STD-810G) and demanding power conditions dealt onboard military ground vehicles (MIL-STD-1275D) and aircraft (MIL-STD-704F) installations, this highly efficient (90%+), filtered +12V) +5V, DC/DC converter supplies DC voltage outputs (+3.3V, over the PC/104 (ISA) bus, PC/104- www.parvus.com DC/DC MIL-704/1275 Power Supply ACS-5180 – PC104+ 80 Watt Parvus Corporation Utah 84115 USA St. • Salt Lake City, 3222 S. Washington 800-483-3152 • 801-483-1533 clamp terminal. Featuring an onboard MIL-STD-461 EMI filter and For more information, contact: today. system designers to employ application-specific module stacks employ application-specific module stacks system designers to assembled. The for their products that are easily and securely 100 different PC/104 RAF hardware can be used with more than by manufacturers ultra-compact bus board modules produced RAF stacking spacers allow PC/104 and PC/104- RAF stacking spacers spaced exactly 0.6" apart using RAF precision-made nylon or apart using RAF precision-made nylon spaced exactly 0.6" spacers, to build structurally secure aluminum male-female standalone module stacks. alone module stacks are used like ultra-compact bus boards, but are used like ultra-compact bus boards, but alone module stacks or bird cages. Module boards are without needing backplanes Male-female stacking spacers from RAF Electronic Hardware from RAF Electronic stacking spacers Male-female or limitations that may occur when PC/104 help overcome space PC/104- www.rafhdwe.com Stacking Male-Female RAF Electronic Hardware Electronic RAF 06483 USA CT • Seymour, Road 95 Silvermine 203-888-2133 • Fax: 203-888-9860 Tel: Packaging: Power supplies Packaging: Connectors Packaging: PC/104 and Small Form Factors Resource Guide 32 Processor boards/SBCs:COMExpress Processor boards/SBCs:COMExpress
solution. single boardcomputerindependenceandeaseofuseinacompact In addition,theGENE-TC05offersanabundantfeaturesetwith ity ofa4"x5.75"singleboardcomputerasseeninourGENE-TC05. NanoCOM-TC andAQ7-TCoffertherobustnessversatil- For moreproductinformation,pleasevisit: out ofourAAEONboardswithIntel Module Serviceswithacustomizedcarrierboardandgetthemost Take advantageofAAEON’s Design-to-DeliveryComputerOn latest Intel in asmallformfactor, looknofurtherthanAAEON. We offer the If youarelookingformaximumperformancefusedwithefficiency Intel www.AAEON.com 732-203-9300 3 CrownPlaza•Hazlet,NJ07730USA AAEON Electronics,Inc. your applications. ❙ For moreinformation, contact: demands, andmulti-displayapplications. is themostsuitablesolutionforhighprocessing,graphicsintensive interfaces. Withgreatperformanceandrichgraphicinterfaces, it PCI Expressx16Gen2,andintegratedHDMI/DVI/DisplayPortdisplay supports memorywithECC/non-ECCversions,uptoSATA 6Gb/s, newly releasedPICMGCOM.0R2.0type6specification.SOM-5890 basic module–SOM-5890(95x125mm)thatiscompliantwiththe QM67 Expresschipset,AdvantechintroducesaCOM Based onthe2ndGenerationIntelCorei7processorand SOM-5890 www.advantech.com/embcore/ Toll Free:(800)866-6008 38 Tesla, Suite100•Irvine,CA92618 Advantech Corp.,USA
2011 Resource Guide ® Atom ® Atom ™ E6xxPlatforms ™
modularsolutionsinallplatforms.TheCOM-TC, ❙
PC/104 and SmallFormFactors [email protected] ® Atom www.AAEON.com ™ processorsforallof ®
i i i i i FEATURES FEATURES i i i i i i
Supports AdvantechiManagerandsoftware APIs Supports 7PCIex1,2SATA II,2SATA III,8USB2.0,GbE Supports DualChannelDDR3-1333SO-DIMMsocketsupto16GB Intel GPUsupports18/24-bit2-chLVDS, HDMI,DisplayPort,VGA Embedded Intel PCI Express Gigabit Ethernet 24-bit LVDS support Low powerconsumption High performance MPEG-4 decoder ® Core ™ i7/i5/i3processor+QM67 www.smallformfactors.com/p47791 www.smallformfactors.com/p52153 PC/104 and Small Form Factors Resource Guide 33 ❙
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www.smallformfactors.com/p52154 www.smallformfactors.com/p46213 Processor N455 1.66 GHz + ICH8M Processor N455 1.66 GHz ™ Atom ® PC/104 and Small Form Factors Supports embedded software APIs and utilities Embedded Intel supports Intel Gen 3.5 DX9, MPEG2 Decodes in HW, VGA 18-bit LVDS, Flash Supports 1 GB on-board memory and 1/2 GB on-board 2.0, GbE II, 8 USB Supports 5 PCIe x1, LPC, 3 SATA Supports two channels of 2 GB DDR3-1333 ECC SO-UDIMM (4 GB max.) 95 mm x 125 mm compact footprint 12 configurable SERDES lanes available for maximum flexibility Suitable for a range of applications including enterprise and service provider routers, switches, base-station controllers, radio network and general-purpose controllers (RNCs), long-term evolution (LTE) embedded computing systems in the networking, telecom/datacom, wireless infrastructure, military and aerospace markets Freescale QorIQ P4080 processor Eight e500mc Power Architecture cores running at 1.5 GHz
FEATURES i i i i i FEATURES i i i i i i P4080 ™ specification, the COMX-P4080 ® [email protected] [email protected] For more information, contact: SOM-7562 B1 is especially suited for portable device applications SOM-7562 B1 is especially suited for portable board (84 mm x since the N455 platform is integrated in a compact for performance with 55 mm). Power consumption is fully utilized is super compact for great power saving, while the whole design space-limited applications. conditions of 3.5 Grms with a frequency 5-500 Hz, which makes with a frequency 5-500 Hz, which makes conditions of 3.5 Grms of demanding applications. it ideally suited for a variety SOM-7562 B1 proves its ability under extended temperature its ability under extended temperature SOM-7562 B1 proves -40 °C ~ 85 °C, and under high vibration environments between supports upgraded memory technology from DDR2 to DDR3, and an technology from DDR2 to DDR3, and supports upgraded memory competitive power consumption. version with more optional 5 V-only SOM-7562 B1 COM-Ultra Module is based on the Intel N455 is based on the B1 COM-Ultra Module SOM-7562 solution with N455 The new B1 version is an all-in-one processor. system memory and flash disk onboard processor from Intel, www.advantech.com/embcore/ B1 SOM-7562 Advantech Corp., USA Corp., Advantech Irvine, CA 92618 Suite 100 • 38 Tesla, Free: (800) 866-6008 Toll The QorIQ P4080 processor is effectively a System-on-Chip device exhibits all the best attributes of the COM Express open standard enabling shorter development schedules and faster time-to-market. For more information, contact: including 10G-XAUI, SRIO, GPIO, USB 2.0, PCI Express, Gigabit Ethernet, and real-time debug. application layer processing. Underpinning the high-compute capability of COMXP4080 are the eight Power Architecture e500mc cores which are complemented by highly flexible I/O with a range of features including high-performance datapath acceleration and network processing in a low-power envelope, making COMX-P4080 suitable for combined control, datapath, and module. By incorporating and leveraging the mechanical features and dimensions of the COM Express The COMX-P4080 module from Emerson Network Power provides The COMX-P4080 module from Emerson Network QorIQ the performance and features of the Freescale Emerson.com/EmbeddedComputing COMX-P4080 Module Emerson Network Power AZ 85282 USA Suite 190 • Tempe, 2900 S. Diablo Way, 1 800 759 1107 or +1 602 438 5720 eight-core processor on a ready-to-go pluggable mezzanine Processor boards/SBCs: COM Express COM boards/SBCs: Processor Processor boards/SBCs: COM Express PC/104 and Small Form Factors Resource Guide 34 Processor boards/SBCs:COMExpress Processor boards/SBCs:COMExpress
For moreinformation,contact: visit www.kontron.com/ETXexpress. For moreinformationonalloftheKontronCOMExpresssolutions, featuring secondgenerationIntelCorei7processors. processor seriesallthewayuptotop-performingETXexpress-SC efficient nanoETXexpress-TTwiththenewestIntelAtomExxx and powerconsumptionfromtheultrasmall,extremely compliant andcompatiblemodules.Modulesrangeinperformance Kontron offersthemostexpansiveportfolioofCOMExpress Kontron COMExpressModules www.kontron.com 888-294-4558 14118 StoweDrive•Poway, CA92064-7147USA Kontron ❙ For moreinformation, contact: ported bytheCOMExpressModule. platform withphysicalportsfor virtuallyalloftheI/Otypessup- COM ExpressCarrierBoard(COMX-CB) providesaplug-and-go Sempron progression ofperformancelevelsfromtheultralow-powerAMD x86-based SocketS1processors,itenables64-bitcomputingat a to driveabroadrangeofOEMapplications.BuiltaroundAMD’s cost, compact,embeddablecomputingcorewiththecapability PDSi’s AMDSocketS1COMExpressModule(COMX-S1)isalow AMD SocketS1COMExpressModule www.pinnacle.com Tel: (614)748-1150•Fax:748-1209 6600 PortRoad•Groveport,OH43125USA Pinnacle DataSystems,Inc. muscle oftheAMDTurion data, audio,high-resolutiongraphicsandmore.PDSi’s companion SB600 chipsetprovidesI/Oversatility, withinterfacesforhighspeed to covertheneedsofmostembeddedapplications.TheAMDM690/ Express Type 2specifications,offeringalargevarietyofinterfaces The Computer-on-Module designisfullycompliantwithPICMGCOM
2011 Resource Guide ™ 2100+(perfectforfanlessapplications)tothedual-core
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PC/104 and SmallFormFactors ™ X2TL62. [email protected] [email protected] FEATURES i i i i i i i i i i i i i i i i i i FEATURES
memory support Up to16MBsystemmemoryonCOMswithdualchannelandECC Other lowpowerCPUbasedmodulesalsoavailable APUs andtheFusionControllerHub Integrated advancedgraphicscapabilitywiththeAMDG-Series Processing performanceupto2.53GHzIntel COM ExpressType 1,Type 2,Type 6andType 10solutions Request asampletodayandstartevaluatingimmediately following theCOMExpressstandardpin-outs ETXexpress, microETXexpress,nanoETXexpress–sizeoptionsall Extended availability assured,3rdpartyintegrationwelcomed MicroATX CarrierBoard availableforrapidstartup PICMG COMExpressType 2compatiblepinout 1 Ethernetport(10/100/1000) 4 SATA IIports 8 USBports 4 PCIExpressinterfaces(x8,x1,x1) AC ’97audiointerface,optionalHDAudio Video –DualChLVDS, VGA,optionalTVOut Up to4GBDDR2SDRAM Supports AMDSocketS1processorfamilyincluding:Turion 64 X2dual-coremobile/MobileAMDSempron www.smallformfactors.com/p42374 www.smallformfactors.com/p35178 ® Core ™ ™ i7processors ™
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C and 2 SPI ports 2 www.smallformfactors.com/p44298 www.smallformfactors.com/p52368 PC/104 and Small Form Factors S audio port 2 4 serial ports with handshake and 1 I 1 USB 2.0 Host and 1 Host/Device (USB OTG) High-Speed ports Up to 1 GB of NAND Flash, 8 MB of Dataflash, and 256 MB of RAM On-module microSD card socket and 2nd external SD card interface 1 I Graphic LCD interface with up to 1280 x 860 resolution and touch screen Hardware CODECs: H.264, MPEG-4, MPEG-2, VC-1, H.263 power requirement less than 1 Watt Typical Small, 200-pin SODIMM form factor (2.66" x 2.375") or 9M10 400 MHz processor Atmel ARM9 Jazelle AT91SAM9G45 10/100BASE-T Ethernet with onboard PHY
FEATURES i i i i i i i i i i i S audio, 2 [email protected] [email protected] coastlines. The baseboard can contain a series of standard coastlines. The baseboard can contain a series mouse, keyboard, interfaces, such as USB 2.0, Gigabit Ethernet, VGA, LVDS COM, Compact Flash, IDE, SATA, Em-ITX embedded SBCs requirements documentation and SDKs applications readiness Reliable 160-pin high density and ruggedized Em-IO interface Scalability in Em-IO interface Dimensions: 17 cm x 12 cm Self-reliant embedded board that accommodates two full I/O lifecycle support Up to 7 year product Express Module, Qseven Module and Product offering: COM Cost) Power and (Space, Weight, SWaP-C Optimized to address of RTOS and GPOS Comprehensive support tools, technical of starter kits, embedded APIs, Availability and to specific requirements that can be tailored COTS designs range including multi-core Full breadth of CPU performance
Em-ITX Form Factor For more information, contact: Using the same small 200-pin SODIMM form factor utilized by other EMAC SoMs, the SoM-9G45/9M10 is the ideal processor engine for your next design. All of the ARM processor core is included on this serial ports, Ethernet, I tiny board featuring: flash, memory, 1 GB of NAND Flash, and includes an MMU that allows it to run Linux and Windows CE operating systems. A SoM is a small embedded module that contains the core of a microprocessor system. The SoM-9G45/9M10 is a System-on-Module (SoM) based on the The SoM-9G45/9M10 is a System-on-Module This processor. or AT91SAM9M10 Atmel ARM9 AT91SAM9G20 fanless ARM9, 400 MHz SoM has an Ethernet PHY included with 4 serial ports. It utilizes up to 256 MB of external DDR2/SDRAM, www.emacinc.com SoM-9G45/9M10 EMAC, Inc. • Carbondale, IL 62902 USA 2390 EMAC Way 618-529-4525 • For more information, contact: • • • • • • • • • • www.viaembedded.com Solutions VIA System-on-Module VIA Technologies CA 94539 USA • Fremont, Court 940 Mission 510-683-3300 www.emacinc.com/som/som9g45.htm PWMs, timer/counters, A/D, digital I/O lines, video, clock/calendar, PWMs, timer/counters, A/D, digital I/O lines, video, clock/calendar, and more. Price is $190 Quantity 1. Processor boards/SBCs: COM/SOM Processor boards/SBCs: COM Express COM boards/SBCs: Processor PC/104 and Small Form Factors Resource Guide 36 Processor boards/SBCs:COM/SOM
For moreinformation, contact: and aninexpensiveDINmountable plasticenclosureoption. TS-7553 USB ports,andWi-Fioption. TS-7552 information onXNANDtechnology. guaranteed successfulbootup.Pleasevisitourwebsiteformore TS-7550 facing headerbringsoutI USB hostportsarebroughtoutdirectly. The44-pindownward SD cardinunder3seconds.10/100Ethernet,USBslave,anddual ded solution.TheTS-7500bootsLinux2.6fromonboardflashor programmable FPGA,theTS-7500isapowerfulandflexibleembed- 4 MBbootableonboardflash,amicroSDcardslot,and5KLUT on a250MHzARM9CPUfromCaviumNetworks.With64MBRAM, The TS-7500isanultra-compactembeddedcomputermodulebased TS-7500 Ultra-Compact250MHzARM9ComputerModule www.embeddedARM.com 480-837-5200 16525 EastLaserDrive•FountainHills,AZ85268USA Technologic Systems Similar BoardsAlsoAvailable: for Windows. complete GNUC/C++developmentenvironment,andEclipseIDE a microSDcardpre-loadedwithDebianLinuxfortheTS-7500, over-Ethernet, andDIOsignalprotection.Thekitalsoincludes the TS-7500,implementingrelays,RS-232,RS-485,CAN,Power- TS-752 baseboard.Theboarddemonstratesthepowerof The developmentkitincludestheTS-ENC750enclosurewith The TS-7500DevelopmentKit that implementsCANandSPIisalsoavailable. has madeavailableaTS-7500open-coreVerilog project.Abitstream ers whoprefertodotheirowndevelopment,Technologic Systems configuration foranelegantandaffordablesolution.Forourcustom- Systems canintegratethatfunctionalityintoacustomTS-7500FPGA quadrature decoding,pulsetiming,ordigitalcounters?Technologic time logicsuchasnon-standardbusinterfaces,PWMoutputs, programmed bitstream.Doesyourapplicationrequirecustomreal- FPGA caneasilybereloadedautomaticallyatstartupwithauser- access, GPIO,SPI,and8XUARThigh-performanceUARTs, the by defaultwithastandardbitstreamthatimplementsSDcard The TS-7500featuresa5KLUTLatticeXP2FPGA.Althoughloaded User-Programmable FPGA and aWindowscrosstool-chainutilizingEclipseIDE. TS-7500, acompleteself-hostedGNUC/C also includesamicroSDcardpre-loadedwithDebianLinuxforthe it easytointerfacewithabaseboardofyourowndesign.Thekit ❙
2011 Resource Guide featuresa256MBultra-reliable XNAND drive,Wi-Fioption, featuresa256MBultra-reliableXNANDdrive,additional featuresa256MBultra-reliableXNANDdrivefor
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PC/104 and SmallFormFactors 2 C and31FPGA-controlledlines,making [email protected] ++ developmenttoolchain, FEATURES i i i i i i i i i i i i i i i i i i i
AppKit includesbaseboardandenclosure Boots Linux2.6inlessthan3seconds Unbrickable, bootsfromSDorFlash Fanless operationfrom-20°Cto+70 Low power(400mA@5V) Small size(67mmx75mm) Power-over-Ethernet ready Optional batterybackedRTC Watchdog timer 33 DIO,SPI,andI 8 TTLUARTs or3UARTs &CAN 1 10/100Ethernet USB 2.0480Mbpsslave(1) USB 2.0480Mbpshost(2) 1 microSDHCcardslot 5K LUTuser-programmable FPGA 4 MBNORFlash 64 MBDDR-RAM 250 MHzARM9CPU 2 C interfaces www.smallformfactors.com/p42440 PC/104 and Small Form Factors Resource Guide 37 ❙
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www.smallformfactors.com/p44297 PC/104 and Small Form Factors TS-4200, TS-4500, TS-4700, and TS-4800 are available now. Several TS-4200, TS-4500, TS-4700, and TS-4800 are available now. COTS development base boards are available and TS-TPC-8390 is available as a complete touch panel computer product using either TS-4700 or TS-4800 Macrocontroller CPUs. Prices start at $92 at quantity 100. 75 mm x 55 mm (credit card sized) Dual 100-pin connectors Secure connection with mounting holes Common pin-out interface Low profile with 6 mm spacing Simplifies custom embedded systems Rapid design process gets products to market faster Several COTS base boards for evaluation and development Design your own base board or use our design services Macrocontrollers are interchangeable for future upgrades TS-4200: Atmel ARM9 with super low power TS-4500: Cavium ARM9 at extremely low cost TS-4700: Marvell PXA168 with video and 1.0 GHz CPU TS-4800: FreeScale iMX515 with video and 800 MHz CPU
FEATURES BENEFITS TS-SOCKET MACROCONTROLLER PROJECTS PRICE AND AVAILABILITY i i i i i i i i i i i i i i i i [email protected] C, CAN, GPDIO, external bus, video, touchscreen, C, CAN, GPDIO, external bus, video, touchscreen, 2 A TS-SOCKET base board can be any piece of hardware, supplied A TS-SOCKET base board can be any piece audio, SPI, and UART. All parts are soldered on and no moving parts audio, SPI, and UART. and reliability. are not used, ensuring embedded ruggedness For more information, contact: Inexpensive Custom Designs, Fast Time-To-Market All TS-SOCKET Macrocontrollers will be designed with a com- mon pin-out, which means that they are interchangeable. This will give our customers more options and flexibility when selecting an embedded system, since a base board can be used with multiple macrocontrollers. As an application example, a base board designed to provide video and touchscreen functionality can have its CPU easily upgraded to improve video playback performance or later as a second generation upgrade. Lower design costs and faster time- to-market directly result from the TS-SOCKET board interchange- ability feature because the standardization significantly reduces design complexity. by the customer or Technologic Systems, that interfaces with a Systems, that interfaces by the customer or Technologic standard connectors. macrocontroller through the dual TS-SOCKET A TS-SOCKET Macrocontroller is an embedded CPU board that A TS-SOCKET Macrocontroller is an embedded form-factor is 75 mm implements the TS-SOCKET specification. The addition to two 100-pin x 55 mm, about the size of a credit card. In features off-board male connectors, a TS-SOCKET Macrocontroller Ethernet MAC/PHY and CPU, RAM, NAND Flash, SD Card socket, can include USB requires a single 5 V power source. Peripherals host and device, I TS-SOCKET Macrocontroller Standard TS-SOCKET Macrocontroller computer standard designed and con- TS-SOCKET is an embedded defines both a form-factor Systems, Inc. It trolled by Technologic two 100-pin low-profile and a connection pin-out and is based on a macrocontroller connectors, allowing secure connection between and a base board. computers based on the TS-SOCKET connector standard. These the TS-SOCKET connector standard. These computers based on connect to your custom base board, CPU core modules securely Start your design time and complexity. enabling drastically reduced around one of our TS-SOCKET Macro- embedded system design your overall project risk and accelerate time- controllers to reduce to-market. Jump Start Your Embedded System Design Embedded Your Jump Start are a series of embedded The TS-SOCKET Macrocontrollers www.embeddedARM.com Macrocontrollers TS-SOCKET Technologic Systems Technologic 85268 USA Hills, AZ • Fountain East Laser Drive 16525 480-837-5200 Processor boards/SBCs: COM/SOM boards/SBCs: Processor PC/104 and Small Form Factors Resource Guide 38 Processor boards/SBCs:EPIC
x86-compatible RTOSs. The boardsupportsWindows ment modes,PXEboot,andmulti-languagesupport. advanced featuressuchascustomsplashscreen,powermanage- special I/Orequirementsandwirelessnetworking.Italsosupports PC/104- two SATA channelsfordiskdrives. supports upto2GBofSDRAM,Type IandIICompactFlash,plus four serialCOMports,HD(7.1)audio,and48-linesofdigitalI/O.It display ofbothXVGAandLVDS flatpanelvideo,eightUSB2.0ports, The EPX-C380featurestwoGigabitEthernetports,simultaneous technology. Intel’s longlifeembeddedroadmaptoensurelongevityofthecore measurement, andtransportation.WinSystemsuseschipsetsfrom tion, security, medical/diagnosticequipment,MIL/COTS,testand fan andisdesignedforapplicationsincludingindustrialautoma- It operatesoveratemperaturerangeof-40°Cto+70°Cwithout computer designedforrugged,performance-drivenapplications. The EPX-C380isahighlyintegrated,singleordualcoreboard Single orDualcoreIntel www.WinSystems.com 817-274-7553 715 StadiumDrive•Arlington,TX76011USA WinSystems, Inc. For moreinformation, contact: ❙
2011 Resource Guide Plus andminiPCIeexpansionissupportedforadditional
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PC/104 and SmallFormFactors ® ATOM [email protected] ® XPembedded,Linux,andother ™ 1.66GHzEPICSBC i i i i i i i i i i i i i i i i i i i FEATURES
Quick StartKitsforsoftwaredevelopment Long-term productavailability Responsive andknowledgeabletechnicalsupport Extended temperatureoperation EBX sizedSBCalsoavailable EPIC sized:4.5"x6.5"andRoHScompliant +5V onlyoperation High definitionaudiosupported(7.1) Mini PCIeandPC/104- CompactFlash (CF)cardsupported 48 bi-directionaldigitalI/Olines Four serialRS-232/422/485channels Eight USB2.0ports Two SATA channels Two GigabitEthernetports Optional 1MBofbattery-backedSRAM Custom splashscreenonstartup panels simultaneously Embedded Gen3.5+GFXvideocoresupportsCRTandLVDS flat 1.66GHz Intel core available ® Atom ™ processorN450singlecoreorD510dual Plus expansionconnectors www.smallformfactors.com/p47868 PC/104 and Small Form Factors Resource Guide 39 ❙
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www.smallformfactors.com/p52152 www.smallformfactors.com/p52151 processor N455 and D525 dual core processor N455 and D525 i7/i5/i3 mobile processor (PGA) with ™ ™ Core Atom PC/104 and Small Form Factors ® ® Supports dual display of DVI, HDMI, LVDS, VGA Supports dual display of DVI, HDMI, LVDS, Supports PCIe x16 (Gen 2) and mini PCIe Supports Inel vPro, AMT 7.0, PECI 3.0, Software RAID 0,1,5,10, TPM 1.2 (optional) Supports embedded software APIs and utilities Supports embedded software APIs and Utilities Supports Intel Supports Intel up to 2 GB/4 GB DDR3 800 MHz SDRAM 204-pin SODIMM Two ports, 8 USB, Supports 1 PCI and 1 Mini-PCIe expansion, 6 serial and CF and 18/24-bit Lower total cost of ownership with DC12V support support LVDS Onboard TPM 1.2 support (optional) Intel QM67 chipset
FEATURES FEATURES i i i i i i i i i i i N455/D525 processor. ™ Atom ® [email protected] [email protected] For more information, contact: Advantech introduces a new industrial motherboard called Advantech introduces a new industrial RAID 0, 1, 5 & 10 to ensure reliable AIMB-272, capable of SATA storage and system protection for network-intensive applications, features to the which brings top performance with power-saving Mini-ITX motherboard class. AIMB-272 Advantech Corp., USA Suite 100 • Irvine, CA 92618 38 Tesla, Free: (800) 866-6008 Toll www.advantech.com/embcore/ For more information, contact: the AIMB-213 can be easily integrated into Mini-ITX platforms, easily integrated into Mini-ITX platforms, the AIMB-213 can be ideal soultion for fast-emerging markets making AIMB-213 the efficiency are required. where size and power Advantech introduces a new industrial motherboard called industrial motherboard introduces a new Advantech the Intel AIMB-213, featuring www.advantech.com/embcore/ AIMB-213 Advantech Corp., USA Corp., Advantech Irvine, CA 92618 Suite 100 • 38 Tesla, Free: (800) 866-6008 Toll Designed with rich functionality and reliable performance, functionality and reliable performance, Designed with rich Processor boards/SBCs: Mini-ITX Processor boards/SBCs: Mini-ITX boards/SBCs: Processor PC/104 and Small Form Factors Resource Guide 40 Processor boards/SBCs:Mini-ITX Processor boards/SBCs:Mini-ITX
For moreinformation, contact: the bestchoiceforlargescaleHD digitalsignageapplications. a VGAportanddualchannel24-bit LVDS port.EPIA-M850isobviously up to8GBofDDR3systemmemory. Display portsincludeanHDMIport, 1080p withoutincurringaheavyCPU load,TDParound20W. Itsupports latest VC1,H.264,MPEG-2andWMV9 HDformatsatresolutionsofupto The EPIA-M850boastscomprehensive hardwareaccelerationforthe performance processingplatformsthatconsumemoreenergy. is idealforembeddedmediaplaybackandbetterthanusingultrahigh to itspowerefficient,fullyintegratedandrichmultimediasupport,which is acompleteplatformsolutiondeliveringthebest“SynergyEffect”due commercial embeddedmultimediaandmediacenterdevices.EPIA-M850 the VIAVX900singlechip,creatingmostcompleteplatform for EPIA-M850 pairsalowpower64-bitVIANanoE-Seriesprocessorwith sort ofmultimediaplaybackdevice. that canmeetthegreatdemandsofdigitalsignage,POI,gamingandany is basedonthisidea,andthefirstfullHDMini-ITXembeddedboard performance perwattandfeature-richfunctionality. TheVIAEPIA-M850 VIA Embeddedisquicklyevolvingitsproductlinefocusedonleading EPIA-M850 The FirstHighPerformanceFullHDMini-ITXEmbeddedBoard– www.viaembedded.com 510-683-3300 940 MissionCourt•Fremont,CA94539USA VIA Technologies ❙ storage deviceresourceconnection(6xSATA) plussecondgen. chipset. Notonlydoesthissmallmotherboarddeliverthedesirable For moreinformation,contact: thin clients. of information,pointsale,datacommunicationsandhigh-end applications suchas:gaming,medicaltechnology, multimedia,point Each boardisdesignedforprocessorandgraphicsintensive easy maintenance. PCI Expressx16and14xUSB2.0,italsosupportsIntel and i3dualquadcoreprocessorspairedwiththeIntel is theKTQM67/mITXbasedon2ndGenerationIntel Kontron’s latestadditiontothemotherboardsportfolioofproducts well ascriticalprogrammingandtime-to-marketobjectives. lead customerstothesolutionthatmeetstheirtechnicalneedsas must beoptimized,Kontron'sexperienceinavarietyofmarketscan very confusing.Inapplicationswherelongevityandriskavoidance identifying therightchoicebecomesmorecomplicatedandcanbe tions. Astheoptionsforembeddedcomputingcontinuetoexpand, Kontron motherboardsaretheidealsolutionforembeddedapplica- Kontron mini-ITXMotherboards www.kontron.com 888-294-4558 14118 StoweDrive•Poway, CA92064-7147USA Kontron Management Technology (AMT)7.0forremotemanagementand
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PC/104 and SmallFormFactors [email protected] [email protected] ® Corei7,i5 ® ® Active QM67 i i i i i FEATURES i i i i i FEATURES
CE andLinux Supports Windows7,Embedded Standard7,XP, XPe, four COMports,one4-lanePCIeslot andoneGigaLANport Supports twoSATA ports,eightUSBonedeviceport, LVDS port Supports oneHDMIport,VGAport andonedualchannel24-bit Supports upto8GBofDDR3memory Supports VC1,MPEG-2,H.264andWMV9at1080p processors cost needs Solutions thatmeetperformance,criticalprogrammingand Offering theidealperformance-per-watt ratio Long lifesupport Up to2ndGenerationIntel Longevity andriskavoidanceareoptimized Dual coresolutionisavailableinQ32011. ® i7,i5,andi3dualquadcore www.smallformfactors.com/p46182 www.smallformfactors.com/p52373 PC/104 and Small Form Factors Resource Guide 41 ❙
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www.smallformfactors.com/p46615 www.smallformfactors.com/p39091 PC/104 and Small Form Factors , PCI/104-Express, and PC/104-Plus ™ Support for onboard and expandable system memory Drop-in replacements within the Kontron SBC product family PCIe/104 Request a sample today and start evaluating immediately True PC/104 dimensions and interface True CRT and 18/24-bit LCD capability Scalable solutions offering power efficiency and performance including the latest Intel dual core Atom processor and FPGA technology as well as the new AMD G-Series APU AMD Geode low-power LX800 500 MHz processor AMD Geode low-power +140°F) operation Fanless, 0 ~ +60°C (+32 ~ +85°C Wide temp version -40 ~ Dual Ethernet option 4 USB 2.0 ports and up to 4 serial ports operation 5 Volt Low-power, Up to 1 GB DDR SDRAM capacity
FEATURES FEATURES i i i i i i i i i i i i i i ™ ® Atom ® [email protected] [email protected] Duo processor offerings within the MICROSPACE ™ For more information, contact: for by-design solutions that can withstand harsh conditions. 100 percent extended temperature-tested solutions Additionally, are available to ensure the solution meets the application-specific temperature requirements. and Core family that do just that. Kontron uses industrial-grade components The demands placed on appliances used in the field range from The demands placed on appliances used and much more. extreme temperature exposure to constant vibration The solutions need to be designed to be reliable and survive under such conditions. Kontron offers PC/104 SBCs including Intel www.kontron.com Kontron Small Form Factor PC/104 SBCs Kontron CA 92064-7147 USA 14118 Stowe Drive • Poway, 888-294-4558 For more information, contact: www.emacinc.com/sbc_pc_compatible/pfm_540i.htm The PFM-540i supports Linux, Real-Time Linux, Windows XP/XPE, Linux, Windows Linux, Real-Time The PFM-540i supports 6.22 running from either a CompactFlash Windows CE, and DOS hard drive. It gives developers a low-power, disk or a conventional that can fit into the tightest places. high-performance platform added using any of PC/104 expansion allows features to be quickly 1. many PC/104 expansion modules. Price is $232 Quantity EMAC’s SDRAM. The PFM-540i is a single board computer based on the AMD Geode based on the is a single board computer The PFM-540i module is a This low-power PC/104 LX800, 500 MHz processor. Dual Ethernet, 4 USB 2.0 ports, and versatile product featuring supports CRT and 18/24-bit TTL LCD 4 serial ports. The PFM-540i and can utilize up to 1 GB of DDR panels and PC/104 expansion, www.emacinc.com PFM-540i EMAC, Inc. EMAC, USA IL 62902 • Carbondale, Way 2390 EMAC 618-529-4525 Processor boards/SBCs: PC/104 Processor boards/SBCs: PC/104 boards/SBCs: Processor PC/104 and Small Form Factors Resource Guide 42 Processor boards/SBCs:PCI/104-Express Processor boards/SBCs:PC/104
❙ has 16isolatedanalog(±10Vor0-2.0V)inputsanddigitalI/O charger willensurethatthebatteryisfullycharged.SBC-2800 supply canbebackedupbyanexternalLi-Ionbattery. Abuilt-in UART, andfullycompatiblewiththeAT commandset.Thepower modem iscontrolledbyAT commands,supportedbyanonboard For moreproduct information,pleasevisit: mation, factoryautomationandinstrumentation. Suitable applicationsincludetransportation,kiosk,buildingauto- both PCI-104andfullfunctionPCI-ExpressMiniCardexpansion. (1) RS-232/422/485serialportand(4)USB2.0.ThePFM-LNPoffers (1) SATA 3.0Gb/s, (1)CompactFlash The PFM-LNPprovidesrichI/Oports:(1)10/100/1000Ethernet, Intel full functionPCI-104module.AAEON’s PFM-LNPcomeswithan AAEON ispleasedtoannouncethelaunchofPFM-LNP, asmall PFM-LNP www.AAEON.com 732-203-9300 3 CrownPlaza•Hazlet,NJ07730USA AAEON Electronics,Inc. For moreinformation,contact: channels. cellular engineandaSiRFstarIII Telit’s GE863-GPSwithaquad-band(900/950/1,800/1,900MHz) very usefulinmanystand-aloneapplications.SBC-2800uses a GPSreceiver, andanalogdigitalI/Omakesthismodule supply/charger foranexternalLi-Ionbattery, aGSM/GPRSmodem, Atmel’s AT91SAM9260 microcontroller. Acombinationofapower Micronix SBC-2800isasingleboardCPUmodulebasedon SBC-2800 www.micro-technic.com +45 66153000 Smedevænget 5•5560,AarupDenmark Micro Technic
2011 Resource Guide ® Atom ™ N450processorand1GBDDR2667onboardmemory.
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PC/104 and SmallFormFactors [email protected] ™ single-chipGPSreceiver. The ™ , (3)RS-232serialports, www.AAEON.com i i i i i i i FEATURES i i i i i i FEATURES
USB connectivity:2xhostanddevice 16 isolateddigitalI/O Data acquisitionandcontrolI/O,16isolated24-bitA/Dch., for Li-Ion 8-50V integratedpowersupply, UPScircuitry, batterycharger GPS dataviaAUXport Communication: GSM/GPRSmodem(quad-band),GPSreceiver, bootloader, supportformicroSDFlash Multipurpose SBCmoduleincluding:ARM9CPU,180MHz,Linux everything thatmoves Applications: vehiculardatalogging;track,control,andmonitor Wide temperaturerange:-20°Cto+70°C 4 USB,4xserialports,1xGbE 1x SATAII, CompactFlash VGA, 18-bitsinglechannelLVDS PCI-104, miniPCIExpresscard(USB +PCIe[x1]) 1GB DDR2667onboardmemory Intel ® Atom ™ N450+ICH8M ™ www.smallformfactors.com/p35875 www.smallformfactors.com/p47790 PC/104 and Small Form Factors Resource Guide 43 ❙
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www.smallformfactors.com/p52377 PC/104 and Small Form Factors Fanless, low power 1GHz Vortex86DX processor Fanless, low power 1GHz Vortex86DX PC/104 bus compliant form factor (90 x 96 mm) 512MB of soldered-down onboard DRAM 1MB of battery-backed SRAM CompactFlash socket Optional 512MB onboard SSD flashdisk 10/100 Mbps Ethernet ports Two Four USB 2.0 ports Four serial RS-232/422/485 ports ESD protection on LAN, USB, and serial ports 16 lines of general purpose I/O PS/2 keyboard and mouse controller LPT, PATA, Mini PCI and PC/104 expansion connectors RTC, status LEDs, and beeper WDT, Extended temperature -40°C to +85°C operation Runs Linux, DOS, and other x86-compatible operating systems Downloadable drivers available Responsive and knowledgeable technical support Long-term product availability
FEATURES i i i i i i i i i i i i i i i i i i i [email protected] For more information, contact: Its low power dissipation permits fanless operation over a Its low power dissipation permits fanless board is well suited temperature range from -40°C to +85°C. This processor performance for rugged applications requiring excellent in an embedded PC design. The PCM-VDX has x86 PC software-compatibility, which assures The PCM-VDX has x86 PC software-compatibility, program application a wide range of tools to aid in the designer’s the Linux operating development and checkout. It supports both system and other real-time operating systems. There is also a depopulated version of this SBC called the There is also a depopulated version of 386, 486, and early PCM-VDX-1 that is designed to replace legacy generation PC/104-compatible Pentium SBCs. There are 16 bits of TTL-compatible digital I/O, with each line indi- There are 16 bits of TTL-compatible output with readback vidually programmable for input, output, or digital I/O controller is operation. The major feature of the onboard or falling digital edge its ability to monitor the 16 lines for either rising host processor notify- transitions, latch them, and then interrupt the ing it that a change-of-input status has occurred. standard PC controllers for IDE hard disks, CompactFlash devices, for IDE hard disks, CompactFlash devices, standard PC controllers PC/104 expansion and LPT, controller, PS/2 mouse and keyboard 90mm x 96mm module. connectors all on a single ports, four USB 2.0 ports with overcurrent protection on each ports with overcurrent protection on each ports, four USB 2.0 channels. The PCM-VDX-2 includes the channel, and four COM The PCM-VDX-2 is a highly integrated PC/104 single board integrated PC/104 is a highly The PCM-VDX-2 for space-limited and low-power appli- computer (SBC) designed SBC that includes a 1GHz Vortex86DX cations. It is a full-featured I/O support includes two 10/100 Ethernet CPU with 512KB of DRAM. www.WinSystems.com Dual Ethernet PC/104 SBC with -40°C to +85°C WinSystems, Inc. WinSystems, USA TX 76011 • Arlington, Drive 715 Stadium 817-274-7553 Processor boards/SBCs: PC/104 boards/SBCs: Processor PC/104 and Small Form Factors Resource Guide 44 Processor boards/SBCs:PC/104- Processor boards/SBCs:PCI/104-Express
❙ system applications.ItcanbestackedwithADLINKMiniModules temperature range,quality, andreliabilitydemandsofembedded or portableapplicationsandmeetsthesize,powerconsumption, I/O support. CAN bus,SATA interfaces,andabroad rangeofperipheral For moreinformation, contact: as apowerfulcomputingengine. and otherPC/104-compliantexpansionmodules,oritcanbeused The CoreModule Atom The AmprobyADLINK CoreModule www.adlinktech.com Tel: 408-360-0200•Toll Free:866-4ADLINK 5215 HellyerAvenue, #110•SanJose,CA95138USA Ampro ADLINKTechnology, Inc. For moreinformation,contact: that oftenusebattery-typepowersources. mapping, nightvisionapplications,railwayandotherapplications applications suchastransceiversfortacticalcommunication,GIS enclosures forindustrialapplications,aswellruggedportable power consumptioniscritical.Thesejobsincludedeeplyembedded The ADLD25PCisidealforruggedandmobileapplicationswhere TDP of4to4.8Watts. Design Power(TDP)maximumof10to13Watts, and anIntelidle constrained applications.TheD525hasanIntelratedThermal to enableperformance-basedrugged,portableandthermally and providessimilarPCI/104-ExpressI/Obandwidthnecessary interfaces totheICH9M-E,whichisalsousedonADLGS45PC, memory controllerfunctionsofatraditionalGMCH.Theprocessor processor accomplishesthisbylocallyintegratingthegraphicsand chip platformsrequiringaCPU,GMCHandICH.TheAtomD525 designed foratwo-chipplatformasopposedtothetraditionalthree- The ADLD25PCfeaturestheIntelAtomD525processor, whichis Intel AtomD525DualCore,1.80GHzPCI/104-ExpressSBC www.adl-usa.com 858-490-0597 4411 MorenaBlvd.,Suite101•SanDiego,CA92117USA Advanced DigitalLogic(ADL) CoreModule Single BoardComputerwithPCIandISAbusconnectivity, the space constrained,extremeruggedenvironments.APC/104-
2011 Resource Guide ™ ProcessorE600seriesforlowpowerconsumptionin ® ® 720 720 providesanintegrated4GBSolidStateDrive, ® 720 isparticularlywellsuitedtoeitherembedded
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PC/104 and SmallFormFactors ™ CoreModule [email protected] [email protected] Plus ® 720 isbasedontheIntel Plus ® ™
i i i i i i i i i i i i i i i i FEATURES FEATURES
CAN busandSATA (-40ºC to+85ºCavailable–callsalesfordetails) Operating Range-25ºCto+70ºC Optional PCIeMiniSocket 4x COMPorts–2xRS232Ports,RS232/422/485 1x 10/100/1000MbitEthernetLANPort 2x SATA 300Ports,8xUSB2.0Ports Bottom-Stacking PCI/104-Express–4x1Lanes Up to4GBDDR3-800DRAMSODIMM204 50% thickerPCBforhighvibrationenvironments Extended Temperature: -40°C to +85°C PC/104- Optional SolidStateDriveonboard Intel 24-bit LVDS andDVIsupport Up to2GBsolderedDDR2SDRAMat800MHz Intel Serving thePC/104industryforover15years! ® ® Platform ControllerHubEG20TforUSB, LAN,SDIO,Serial, Atom Plus ™ (ISA andPCI) ProcessorE600seriesfrom600MHzupto1.6GHz www.smallformfactors.com/p47862 www.smallformfactors.com/p47471 PC/104 and Small Form Factors Resource Guide 45 ❙
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www.smallformfactors.com/p47213 www.smallformfactors.com/p52216 PC/104 and Small Form Factors Processor N450/D510 1.66 GHz (D410 optional) Processor N450/D510 1.66 expansion ™ Plus Atom onboard 82574IT Gigabit Ethernet, 3 COMs, 4 USB, 4 GB SSD ® ® Gigabit Ethernet DDR2 RAM (up to 2GB) PCI & ISA expansion Fanless operation USB 2.0 (7 ports) Serial I/O (4 ports) IDE interface Disk on Module flash socket MIL-STD-202G shock/vibe Single Channel 18-bit LVDS and analog VGA Single Channel 18-bit LVDS Intel Atom Z5xx processor (up to 1.6GHz) 6W (typical) Low power, industrial temp. version (-40ºC to +85ºC) True High-performance video and HD audio Intel Up to 2 GB Single Channel DDR2 SDRAM PC/104- Intel Integrated graphics DirectX 9 controller at 200 MHz
FEATURES FEATURES i i i i i i i i i i i i i i i i i i i
™ form factor Plus Plus Plus form factor. Featuring the low- form factor. standard. This rugged and high standard. This rugged Plus Plus [email protected] [email protected] N450/D510 processor based system N450/D510 processor ™ single board computer is compact and “ Atom Z5xx (Menlow-XL) processor, the Tiger packs the Tiger Z5xx (Menlow-XL) processor, Tiger ® ™ ” 745 is particularly well suited to either embedded 745 is particularly well 745 SBC is an exceptionally high integration, high an exceptionally high 745 SBC is for more information! ® ® 745 Atom ® ® 800-824-3163 quality single-board system contains all the component subsystems contains all the component subsystems quality single-board system of several PCI expansion motherboard plus the equivalent of an ATX boards. The CoreModule and other PC/104-compliant expansion modules, or it can be used and other PC/104-compliant expansion modules, as a powerful computing engine. For more information, contact: Call support and on-time delivery, VersaLogic has perfected the art VersaLogic support and on-time delivery, of service, one customer at a time. Experience it for yourself. Add VersaLogic’s long-term (5+ year) product availability guarantee Add VersaLogic’s and customization options and feel the power of the Tiger! With more than 30 years experience delivering extraordinary quality. It’s available in both commercial (0ºC to +60ºC) and industrial It’s quality. (-40ºC to +85ºC) temperature versions! rugged on a 3.6" x 4.5" PC/104- powerful 1.6GHz performance backed by legendary VersaLogic Low-power Intel Atom Z5xx processor on a PC/104- Low-power Intel Atom Z5xx processor on a new VersaLogic’s www.VersaLogic.com/tiger is as solid as a rock! This Tiger VersaLogic Corp. VersaLogic • Eugene, OR 97402 USA 11th Ave. 4211 W. 800-824-3163 For more information, contact: compatible with the PC/104- compatible with the The CoreModule performance, Intel www.adlinktech.com CoreModule Ampro ADLINK Technology, Inc. Technology, ADLINK Ampro 95138 USA San Jose, CA #110 • Avenue, 5215 Hellyer Free: 866-4ADLINK 408-360-0200 • Toll Tel: or portable applications and meets the size, power consumption, and meets the size, power consumption, or portable applications and reliability demands of embedded temperature range, quality, can be stacked with ADLINK MiniModules system applications. It power Intel Processor boards/SBCs: PC/104- Processor boards/SBCs: PC/104- boards/SBCs: Processor PC/104 and Small Form Factors Resource Guide Processor boards/SBCs:Pico-ITX 46 Processor Boards/SBCs:PC/104-
For moreinformation, contact: incurring aheavyCPUload. demanding multimediaformats at resolutionsupto1080pwithout MPEG-2, VC-1andWMV9,providing smoothplaybackofthemost edge post-processingtoperform ultrasmoothdecodingofH.264, The VIAChromotionHD2.0providesadvancedfilteringandcutting- VIA ChromotionHD2.0videoengine. performance hardwareHDvideodecoderintheshapeoflatest audio, HDMI,VGAandLVDS displayconnectivityaswellahigh The latestVIAVX900MSPaddssupportforDDR3memory, HD a wellconnectedportabledeviceplatform. through Wi-FiandGSM/3GtechnologiesmakingtheVIAEPIA-P830 form factorboard.TheseMini-PCIeslotsprovideconnectivity that providestwoMini-PCIeslots,thefirstofitskindonaPico-ITX variety ofconnectivityandnetworkoptionsviaanexpansionboard media systemprocessor. TheEPIA-P830alsosupportsabroad of a1.2GHz64-bitVIANanoprocessorandthelatestVX900 10cm x7.2cm,theVIAEPIA-P830Pico-ITXboardtakesadvantage Based ontheincrediblycompactPico-ITXformfactor, measuring World www.viaembedded.com 510-683-3300 940 MissionCourt•Fremont,CA94539USA VIA Technologies ment andcheckout.ItsupportsbothWindows a widerangeoftoolstoaidinyourapplication’s programdevelop- The PPM-LX800-Ghasx86PCsoftwarecompatibility, whichassures performance inanembeddedPCdesign. is wellsuitedforruggedapplicationsrequiringexcellentprocessor For moreinformation,contact: in theirdesigns. customers withsystemintegrationofourSBCsandI/Omodules WinSystems providesfreetechnicalphonesupporttoassist operation overatemperaturerangefrom-40°Cto+85°C.This x86-compatible CPU.Itslowpowerdissipationpermitsfanless applications. Itisafull-featuredSBCthatincludestheAMDLX800 Computer (SBC)designedforspace-limitedandlow-power The PPM-LX800-GisahighlyintegratedPC/104- -40°C to+85°CPC/104- www.WinSystems.com 817-274-7553 715 StadiumDrive•Arlington,Texas 76011USA WinSystems, Inc. Linux operatingsystemsandotherreal-timesystems. ❙
2011 Resource Guide ’ s SmallestFullHDPico-ITXBoard–EPIA-P830
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PC/104 and SmallFormFactors Plus SBCwithVideoandEthernet [email protected] [email protected] Plus
® XPEmbeddedand Plus SingleBoard board i i i i i i i i i i FEATURES i i i i i i i i i i i FEATURES
Legacy I/Osupport includingGPIO,SMBus Support fortwo1xPCIeexpansionconnectors Flawless HDvideoperformanceincluding 1080p Supports onesingle-channel24-bitLVDS panel Supports oneVGAandHDMIport Supports digitalI/O Supports sevenUSB2.0ports(fiveaspinheaders) Supports twoSATA Supports high-bandwidthDDR3memory, upto4GB WMV9 andH.264decodingacceleration Integrated VIAChrome9HCDX93D/2DgraphicswithVC1,MPEG-2, 16 digitalI/Olineswitheventsensesupported Four serialRS-232/422/485channelswithFIFOs Two USB2.0portswithovercurrentprotection 10/100Mbps Ethernetcontroller Custom splashscreenonstart-up to 1600x1200 Video withCRTresolutionsto1920x1440andflatpanel Small size:90mmx96mm AMD LX800CPU;x86-compatible Long-term PC/104- -40°C to+85°Coperatingtemperature AC’97 audio,LPT, mouse,and keyboardcontrollers Plus productavailability www.smallformfactors.com/p44387 www.smallformfactors.com/p46015 Q3 2011. available in solution is Dual core PC/104 and Small Form Factors Resource Guide 47 ❙
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www.smallformfactors.com/p52185 www.smallformfactors.com/p52226 PC/104 and Small Form Factors Processor E600 Series EG20T PCH ™ ™ Atom N450 1.66 GHz Single Core/D525 Dual Core ® Atom Atom ® ® 1.8 GHz Processor Supports extended temperature -40 °C ~ 85 °C support 24-bit LVDS On board 1 GB DDR3 memory Supports embedded software APIs and utilities Intel
HD audio ACPI S0, S3, S4, S5 Intel Intel Onboard DDR2-667/800 max. up to 1GB Onboard SSD max. up to 32GB display interface LVDS 1 client port 4 x USB 2.0 + 2 x COM port, 1 x SATA, i i i i i
FEATURES FEATURES i i i i i i i i N455/D525 ™ Atom ® TopCliff IOH combine to IOH combine TopCliff ® [email protected] [email protected] Tunnel Creek CPU & Intel Creek CPU & Tunnel ® For more information, contact: This all-in-one solution enables higher performance, even more and is resistant to heat or dust in power savings and high reliability, extreme application environments. PCA-6782 provides a rich array of I/O interfaces: three SATA ports PCA-6782 provides a rich array of I/O interfaces: three SATA (300 MB/sec) for mainstream SSD (Solid State Disks), HDD and ODD connections, and legacy I/O connection: one IDE, one PS/2, one FDD, one parallel port, and also has a CF socket capable of PC/104 expansion. make it suitable for dual display or digital panel display capabilities. additional graphics card. VGA and LVDS dual video outputs also additional graphics card. VGA and LVDS PCA-6782 half-size ISA SBC features Intel graphics core based processors. PCA-6782 has an integrated Embedded Gen 3.5+ graphics technology with 224 MB on Intel’s handling This feature makes PCA-6782 capable of shared memory. complex and intense 2D/3D graphics processing tasks without an www.advantech.com/embcore/ PCM-3363 Advantech Corp., USA Suite 100 • Irvine, CA 92618 38 Tesla, Free: (800) 866-6008 Toll deliver excellent computing performance with low power with low computing performance deliver excellent consumption For more information, contact: 32GB of integrated SSD (optional), it’s hard to beat the cost per (optional), it’s 32GB of integrated SSD by the PICO822. This board is ideally suited performance offered devices, in-vehicle and in-flight computing for portable and medical The board ships with a specially designed or entertainment systems. restrict access to the full featured doesn’t low profile heatsink that on A proprietary expansion interface I/O (see features section). additional expansion the bottom of the board interface allows for Tx/Rx, SMBus, DC input, SDVO). (USB, UART, embedded computer targeted at system developers and OEMs targeted at system developers and OEMs embedded computer performance for very little power who need excellent computing to of integrated DDR2 memory and up consumption. With 1GB The PICO822 is a highly integrated, small form factor x86 highly integrated, small form factor x86 The PICO822 is a www.axiomtek.com Intel AXIOMTEK USA CA 91748 • City of Industry, Rowland St. 18138 626-581-3232 Processor boards/SBCs: More SBCs Processor Boards/SBCs: Pico-ITXe Boards/SBCs: Processor PC/104 and Small Form Factors Resource Guide 48 Processor boards/SBCs:Qseven
and NVIDIATegra, whichareeasilyupgradabletoaccommo- For moreinformation, contact: • CANControllers • Cellular/SatelliteM2M • QsevenCarrierBoards • DigitalI/O • FPGAs • SingleBoardComputers(SBCs) design efficiencyandcosteffectiveness.Ourproductsinclude: technical supportanddevelopinginnovativeproductsthatimprove in providingprofessionaldesignservices,deliveringunsurpassed For 25years,ConnectTech hasbuiltasolidreputationforexpertise Connect Tech’s Product Portfolio systems, mobileentertainment,kiosks,digitalsignage,andgaming. are idealforcompactcomputingapplicationsinsoldier-wearable Connect Tech’s singleboardcomputersandQsevencarrierboards as possiblewhileensuringaperfectfit. ments. Thisensuresthattheproductionbuildisaseconomical and shapeoftheboardtoeasilymeetspecificapplicationrequire- carrier boardscanpin-pointspecificfeaturesand/oralterthesize applications, customizationoftheexistingoff-the-shelfPC/104 feature-rich solutionsprovideinstantproofofconcept.Forlarger and VGAVideo,2xRS-232RS-422/485serialports.These providing accessto2xSATA, 1xGigabitEthernet,4xUSB2.0,LVDS PCI-104 andPCIe/104solutionsofferon-boardconnectors industry standardI/OfromthePC/104ecosystem. computers arecompletelyscalableandcanbeusedwithany form factor, ConnectTech’s PCI-104andPCIe/104singleboard For applicationsthatrequiredeepI/Ofunctionalityandarugged peripherals suchasWiFi,GPS,Bluetooth,orstorageareoptional. offer Mini-PCIeandSIMcardexpansioncapability. Mini-PCIe date futuregenerations.Thesebus-independentcarrierboards cessor optionsincludingIntel Connect Tech Qsevencarrierboardsofferseveralembedded pro- the corecomponentsofacommonPC. an off-the-shelf,multi-vendor, computer-on-module thatintegrates PCI-104 andPCIe/104embeddedcomputingsolutions.Qsevenis with optionsthatrangefromlightandlow-costtofull-featured Connect Tech’s newlineofQsevencarrierboardsprovideusers Qseven CarrierBoards PCIe/104 &PCI-104SingleBoardComputersand www.connecttech.com 519-836-1291 •Toll Free(NA):800-426-8979•Fax:519-836-4878 42 ArrowRoad•Guelph,ONN1K1S6Canada Connect Tech Inc. ❙
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PC/104 and SmallFormFactors [email protected] ® Atom • ModifiedSolutions • Adapters&DevelopmentTools • WirelessRadioModems • Ethernet-to-Serial • Multi-portSerial • SolidStateDrives ™ , Freescalei.MX51,TIOMAP, FEATURES i i i i i
Custom CarrierBoardandSingleComputerSolutions • • • • • Board Features: Mini-PCIe &SIMCardExpansion PCIe/104 andPCI-104 • • • • Embedded ProcessorOptions: RS-232 andRS-422/485SerialPorts LVDS andVGAVideo Gigabit Ethernet USB 2.0 SATA NVIDIA Tegra TI OMAP Freescale i.MX51 Intel ® Atom ™ www.smallformfactors.com/p52147 PC/104 and Small Form Factors Resource Guide 49 ❙
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www.smallformfactors.com/p52156 www.smallformfactors.com/p47500 N455 Single Core/ D525 Dual Core N455 Single Core/ D525 ™ Atom ® PC/104 and Small Form Factors form factor: 146mm x 102mm (LxW) " processor + ICH8M, DDR3 memory support processor + ICH8M, DDR3 128MB SDRAM and 128MB NAND Flash Supports 1280 x 860 LCD and touch screen Supports VGA output, and audio in/out 1 x Ethernet port and 4 x USB hosts 4 x RS-232/485 ports (port 1 supports RS-422) 16 x GPIOs and 1 x Micro SD socket Standard 3.5 Supports embedded software APIs and utilities XP Embedded, Supports embedded OS: Windows CE 6.0 , Windows WES 7, Linux, QNX, VxWorks 400MHz ARM9 CPU AT91SAM9G45 Low power ATMEL Ready-to-use Linux kernel 2.6.29 with file system Embedded Intel multiple display: 18/24-bit Intel Gen 3.5 DX9, MPEG2 Decode in HW, VGA, or HDMI LVDS, for power integration easy Supports 12 V +/- 10% input power, 6 USB 2 SATA, 2 Intel GbE support, rich I/O interface with 3 COM, and GPIO, full size Mini-PCIe, and 1 CF
FEATURES FEATURES i i i i i i i i i i i i i i i N455 and the dual core N455 and ™ Atom ® [email protected] [email protected] SBC with Intel SBC with " For more information, contact: PCM-9363 is suitable for multiple applications such as: POS/kiosk, PCM-9363 is suitable for multiple applications entry-level gaming medical, factory automation, transportation, machines, and security and surveillance. 1920 x 1080p pixel resolution, and VGA is also supported for embed- 1920 x 1080p pixel resolution, and VGA is also ded applications. PCM-9363 features 18/24-bit LVDS and HDMI display capability. and HDMI display capability. LVDS PCM-9363 features 18/24-bit to supports an HD upscaling function up HDMI on PCM-9363 DDR3 memory supporting up to 4 GB capacity for D525 and 2 GB up to 4 GB capacity for D525 and 2 DDR3 memory supporting graphic controller supporting Intel Gen 3.5, capacity for N455, and The Thermal Design hardware decoder. DirectX 9.0c, and an MPEG2 processor and ICH8M chipset is only Power (TDP) rating including 13 W for the D525, further enabling power 9 W for the N455, and and performance improvements. reductions, smaller systems, PCM-9363 is a 3.5 PCM-9363 ICH8M chipset. The processors integrate D525 processors with www.advantech.com/embcore/ PCM-9363 Advantech Corp., USA Corp., Advantech Irvine, CA 92618 Suite 100 • 38 Tesla, Free: (800) 866-6008 Toll For more information, contact: scenario control systems. M-505 is a reliable single board computer to be used in various embedded systems. It is ideal for all kinds of industrial applications, including Point of Sale (POS), building automation, kiosk and M-505 is powered by ATMEL AT91SAM9G45 ARM9 CPU, and AT91SAM9G45 M-505 is powered by ATMEL pre-installed with Linux kernel 2.6.29 with file system. M-505 has 128MB SDRAM and 128MB NAND Flash. M-505 also comes with 1 Ethernet port, 4 serial ports, 16 GPIOs, 4 USB hosts, and 1 Micro SD socket. choice for mission-critical industrial applications where an HMI (human-machine interface) is necessary. The M-505 ARM9-based single board computer is a compact Linux- The M-505 ARM9-based single board computer a 1280 x 860 LCD ready industrial computing platform. It supports interface and a VGA interface, which makes the M-505 an ideal www.artila.com Computer M-505 Linux-ready ARM9-based Single Board Artila Electronics Co., Ltd. 231 R.O.C. Taiwan Taipei, No. 6, Lane 130, MinQuan Rd. • XinDian City, 4F, 8862-8667-2340 Processor boards/SBCs: More SBCs More boards/SBCs: Processor Processor boards/SBCs: More SBCs PC/104 and Small Form Factors Resource Guide 50 Processor boards/SBCs:MoreSBCs Processor boards/SBCs:MoreSBCs
For moreinformation, contact: visit www.kontron.com. To learnmoreabouttheKontronfamilyofsingleboardcomputers, advanced integratedgraphics. range ofsolutionsservingtheneedslowpoweraswell as the Kontronofferingof2.5-inchSBCstoincludeamoreextensive the KTLX800/pITXandKTA55/pITX. Bothnewdesignsextend The newestadditionstoKontron’s familiesofembeddedSBCsare Kontron PICO-ITXEmbeddedSBCs www.kontron.com 888-294-4558 14118 StoweDrive•Poway, CA92064-7147USA Kontron For moreinformation,contact: Microsoft software optionsincludingWindRiverVxWorks, FedoraLinuxand capabilities. TheCPCI7203supportsarangeofoperatingsystemand Platform Module(TPM)enhancesdatasecurityandencryption Conduction cooledvariantsalsoproviderearVGA.TheTrusted serial port,twoSATA portsandfourPCIinterfacestotherear. 2.0 ports,andoneVGAonthefrontpanel.RearIOincludes The aircooledvariantshavetwoGigabitEthernetports,USB (SBC) usestheIntel The EmersonNetworkPowerCPCI7203single-boardcomputer CPCI7203 3UAir&ConductionCooledProcessorBoard Emerson.com/EmbeddedComputing 1 8007591107or+16024385720 2900 S.DiabloWay, Suite190•Tempe, AZ85282USA Emerson NetworkPower throughput andflexibility. and 4GBMicroSDflash.Connectivityisoptimizedformaximum and theaircooledvariantsalsosupport256KBnon-volatileF-RAM On-board memoryincludesupto8GBsolderedECCDDR3 rugged solutionmakestheCPCI7203idealforharshenvironments. constrained applications.Emerson’s leadingedgethermaland the 3Uformfactorforhighperformanceapplicationsinspace- ❙
2011 Resource Guide ® Windows
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® ® PC/104 and SmallFormFactors Core . ™ [email protected] [email protected] i7 integrateddual-coreprocessorin i i i i i i i i i i i i i i FEATURES FEATURES
USB 2.0ports(twofrontaircooled&fourrear) VGA interface;twoon-boardGbEinterfaces Extended temperaturerange(-40°Cto+85°C) Air andconductioncooled Mobile Intel 256KB non-volatileF-RAM(onaircooledvariants) Up to8GBECC-protectedDDR3-800/1066(soldered) Intel Corei7integrateddual-coreprocessor(upto2.0GHz) Request asampletodayandstartevaluating immediately family Drop-in replacementswithintheKontronPICO-ITXSBCproduct Support foronboardandexpandablesystemmemory including thelatestAMDG-SeriesAPUandFusionControllerHub Scalable solutionsofferingpowerefficiencyandperformance variants High density, 1.8 Four PCIExpressinterfaces;twoSATA interfaces;oneUART ® 5Serieschipset:IbexPeak-MPCH " solidstatedriveavailableonconductioncooled www.smallformfactors.com/p45456 www.smallformfactors.com/p52376 PC/104 and Small Form Factors Resource Guide 51 ❙
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www.smallformfactors.com/p47857 www.smallformfactors.com/p52217 Slots for Expansion Cards in Size " Plus x 8.7 " PC/104 and Small Form Factors x 4.6 " Approx. 3.9 Flanges Sealed Metal Chassis w/Hardened Finish & Mounting Circular MIL-DTL-38999 Connectors Designed to MIL-STD-810G, 461E, 704F, 1275D 461E, 704F, Designed to MIL-STD-810G, Temp -40 ºC to +71 ºC Fanless Operating 1.6 GHz Clockspeed Intel Atom Z530 Processor, 1x Gigabit Ethernet, 3x USB 2.0, 2x RS-232 Serial 2x DDC MIL-STD-1553 Controllers (Optional) Dual Solid State Disks (SSDs), Removable CF Up to 2x Open PC/104- Lightweight Metal Chassis: <4 lbs. (1.82 kg) In-depth stress testing under load Sold, tested, and serviced in the US Best specs in the industry Driver CDs with latest drivers and manuals Motherboards, SBCs, Chassis, Modules CPUs Power Supplies, Memory, Complete Systems Panel PC, Workstations, All components from one source with one warranty
FEATURES i i i i i i i i i i i FEATURES i i i i i i i i tall, " architecture with up to architecture with up Plus to get 10% off your first order [email protected] www.globalamericaninc.com/contacts PC104SFF 830 is a rugged tactical mission processor based on tactical mission 830 is a rugged ® For more information, contact: two (2) open card slots and over 100 spare connector pins for and over 100 spare connector pins two (2) open card slots unit is based on a modular PC/104- unit is based on a modular it possible to special order with customer- I/O expansion, making specific I/O configurations. The DuraCOR www.parvus.com Subsystem Mission Computer – Rugged Intel Atom DuraCOR 830 Parvus Corporation Parvus USA 84115 Utah Lake City, St. • Salt Washington 3222 S. • 801-483-1533 800-483-3152 <4 lbs. heavy), this small form factor computer subsystem integrates form factor computer subsystem integrates <4 lbs. heavy), this small dual MIL-STD-1553 connectivity (optional), Gigabit Ethernet and and standard PC interfaces, including analog along with digital I/O 2x RS-232 serial, keyboard, and mouse. The video, audio, 3x USB, the ultra low-power 1.6 GHz Intel Atom CPU, optimally designed for GHz Intel Atom CPU, optimally designed the ultra low-power 1.6 constrained military/aerospace and Power (SWaP) Size, Weight, Mechanically compact (<4 vehicle and aircraft installations. For more information, contact: Use the promo code Global American will work with you from planning to production and every step along the way to ensure your product or project meets both your deadline AND your budget. In a time when everyone is watching the bottom line, doesn't it make sense to work with someone who can save you both time AND money? All components from one source with one warranty At Global American we are aware that you have many choices At Global American we are aware that you So what sepa- when it comes to the hardware you can purchase. rates our company from the rest? www.globalamericaninc.com Integrated Solutions for an Embedded World Global American, Inc. 17 Hampshire Drive • Hudson, NH 03051 USA 603-886-3900 or 800-833-8999 (toll free in US) MIL-SPEC: Rugged computers Rugged MIL-SPEC: Services: Embedded Systems Integrator C E PC/104 and Small Form Factors Resource Guide www.smallformfactors.com/p52341 PCI-Systems Inc. • www.pcisystems.com little Geckoisreadytostandfirmintheharshestenvironments. available in1/2 ATR andhorizontalradiotypemounts. This severe weather. The MIL-STD-810F-certifiedchassisis voltage protectioncircuitry, and evenlightningprotectionin thermostat-controlled fans, replaceabledustfilters, over- cold. Itprovidesfullpowerconditioning, fullEMIshielding, cooled, itsperformanceisnotaffectedbyextremeheator says LiPPERT. Operatingat-20°Cto+70andconduction damage duringwhichitisprotectedfromfireandexplosions, too muchenergy, overchargeupto40 abletosurvive V without supplies arefickleatbest. This steadytroupercanalsodealwith the company. This meanshighavailabilitywherelocalpower more than2,000chargesand650 W ofpower, accordingto technology, isguaranteedtodeliverwithalonglifecycleof The armoredUPS, engineeredwithlithiumironphosphate from thissmall-footprintchassis. power. Mobileanddeployedsystemsparticularlybenefit through hellandbackwhilestillprovidingportable, constant PCI SystemsDesertGeckoUPS1000isruggedenoughtogo needed, andinsomeplacesthat’s hardtocomeby. The not “no power.” With anypowerrequirement, asource is Even withthemovetoincreasinglylower-power devices, it’s “Rugged” isthisUPS’s middlename DITOR HOICE 52 Storage: CompactFLASH
For moreinformation,contact: with differentoperatingsystemssuchasLinux,Windows they areTrue IDEModeandATA-3 compliant,theyarecompatible computer, SBC,orinstrumentwithaCompactFlashsocket.Since are availableinstoragedensitiesfrom128MBto16GB,andfi t any Fully operationalfrom-40°Cto+85°C,theseCompactFlashcards of upto66MB/sinburstmode. cycles andunlimitedreadswhilemaintainingfasttransferspeeds CompactFlash cardshavegreaterthan2millionprogram/erase hard diskdriveemulationforfastprogramanddatastorage.Our industrial-grade reliability, industry-standardcompatibility, andIDE These CompactFlashcardsaretargetedforapplicationsthatneed Extended Temperature CompactFlash www.WinSystems.com 817-274-7553 715 StadiumDrive•Arlington,TX76011USA WinSystems, Inc. support withafactoryapplicationsengineer. We offerin-stockproductavailability, plusfreetechnicaltelephone other RTOSswithoutrequiringspecialdrivers. ❙
2011 Resource Guide ’ S
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PC/104 and SmallFormFactors [email protected] http://submit.opensystemsmedia.com. OSM reserves therighttopublishproducts basedoneditors’discretion alone,http://submit.opensystemsmedia.com. OSMreserves anddoesnot Editor’s ChoiceProducts are drawn from OSM’s product databaseandpress releases. Vendors mayaddtheirnewproducts andsubmi ® , and i i i i i i FEATURES
In-stock availabilityandRoHScompliant -40°C to+85°COperatingtemperature Withstands 2000Gshockand16.3Gofvibration Sophisticated errorcheckingandwearlevelingalgorithms Up to66MB/sburstwith37MB/sReadand16MB/sWrite sustained 128MB to16GBstoragecapacity Mission- andsafety-criticalapplicationsleavenoroomforerrorwhen one softwarebugcanprovedisastrous, hastoberight. soeverything Keeping softwaredevsuptostandard Coverity’s IntegrityControlhelpscheck allthosesources’software And, withsoftwaresourcesdivergingfromin-housetooutsourced of cracksandcrevicesinthecode. Havingasinglemanagement tool streamlinesthecodereviewprocesstopreventdefectsand and otherthird-partysuppliers, bugscanbehidinginallsorts substandard codefromcausingdelaysandexpensiverecalls. www.smallformfactors.com/p35888 quality, security, efficiencypolicy, andSLAcompliance; contributions againstthesamecriteriatoprovideearly ware developmentprocessonthesamepage, organi- around intheircode. inthesoft- Bykeepingeveryone ware testingandqualityverification. Through Integrity pinpoint whereviolationsinthosepoliciesoccur;and with Coverity’s Static Analysis toaddvisibilitysoft- Control, developerscansettherulesofthresholdsin www.smallformfactors.com/p52343 alert thedevelopmentteamwithaCoveritySoftware zations canbesurethatbugshavenowheretohide. The codegovernanceplatformworksinconjunction Integrity Reportsummarizingthedefectssneaking warnings torisksandprepareforextermination. Coverity •www.coverity.comCoverity guarantee publicationofanyproduct entries. t press releases at EDITOR’S By Monique DeVoe, CHOICE Assistant Managing Editor
Making Android development less rigid Handling graphics-intensive systems
Getting Android applications to communicate with a wide variety of devices with ease can feel like forcing a square peg into a round hole. They can even be ill- The infotainment bandwagon is taking off, and it’s as good a time as any fitting with other Android applications due to the platform’s fragmentation. to look at options and get ready to hop on. Kontron is making the leap a But Objective Interface Systems’ ORBexpress for Android middleware bit shorter with its KTA55/pITX, available in Q3 this year. This small, fast can shape applications to fit any platform or device, regardless of the 2.5" Pico-ITX embedded single board computer is primed and ready for destination’s operating system, programming language, or architecture. graphics-intensive development in digital signage and sales kiosks.
Android’s current software development kit makes connecting apps Based on the AMD Embedded G-Series with Fusion technology, the SBC easy on the same device, but off the device is out of the question. The can handle DirectX 11 and pump out 1080i/p full-HD video to dual- ORBexpress framework, on the other hand, drills down on Android to screen displays, while still in a low-power mode of 9 W TDP with a 5 V put applications onto PCs, other mobile devices, enterprise networks, power supply. The board integrates up to two 64-bit processor cores, a and pretty much anything else. The lightweight middleware, based on programmable graphics unit, plus PCI Express Gen 2.0 and DDR3 RAM industry-standard CORBA technology, provides many mechanisms for controllers. Processor options include 1.2 GHz Single-Core processor communicating between devices including Web servers and direct AMD T44R or the 1.0 GHz Dual-Core processor AMD T44N for peer-to-peer communications. The background communication and data multithreading oomph. With all the graphics capabilities, there’s a exchange between the different devices aims for lightning-fast UI response load of add-on storage options with two 6.0 Gbps SATA connections times. And, it’s reliable enough to use in mission-critical systems, the capable of handling current SSD transfer rates and a microSD company says. Voila: Rigid becomes flexible. slot that’s also bootable. This Pico-ITX SBC is looking pretty good for the future of graphics-based infotainment development. Objective Interface Systems, Inc. • www.ois.com www.smallformfactors.com/p52172 Kontron • www.kontron.com www.smallformfactors.com/p52339
Tough but flexible chassis kit Summer school for embedded Linux Getting started can be the hardest part of the design process. But VIA Technologies has made prototyping hardware and software designs Open source software is increasingly used in the embedded world; easier with the VIA AMOS-5001 chassis kit. Whether or not the final design in addition to having the right products and tools to implement uses VIA’s x86 CPUs or the Em-ITX form factor, it’s still a useful platform to it, you need the right knowledge. Timesys has taken on an open begin with and makes that whole getting started thing much more doable. source attitude by giving developers free access to the Timesys University, an embedded Linux training program set up in tracks of The plethora of I/O options through interchangeable front and rear panels four 60-minute biweekly sessions. Coursework utilizes Timesys’ makes the kit a flexible aid to medical, industrial, digital signage, and LinuxLink software development framework to make going back to surveillance systems. The -20 °C to +55 °C operating temperature, fanless school a little more fun with hands-on Linux tasks for embedded kit also has a rugged side, capable of handling anti-shock up to 50 g and is applications and popular processors. vibration-resistant for extra reliability. The compact, 35.2 mm x 231.44 mm x 124.8 mm design is crunched down for maximum space efficiency for Students of the “University” are taken through a curriculum of electromagnetic compatibility. The tiny kit allows for an optional 2.5" HDD the whole development process including an inspection of the storage subsystem chassis, letting all the squeezed-in bits stretch underlying hardware; basic requirements of designing and out. Common I/O ports have external cutouts for easy external access, deploying Linux; creating BSPs and SDKs on popular processors and and it uses a modular design and just four mechanical parts for easy boards; and optimizing, testing, and integrating the design. Raise a assembly and maintenance. This flexible kit measures up to be virtual hand and ask expert instructors questions about the unique tough enough to withstand harsh conditions but is moldable to components to embedded Linux development. Upcoming tracks many different applications. include building a user interface for a medical device and building a connected home automation device. “Students” can also go back VIA Technologies • www.via.com.tw and view recordings of old sessions they missed. Get ready to ace practical Linux development “tests” out in the real world. www.smallformfactors.com/p52342 Timesys Corporation • www.timesys.com www.smallformfactors.com/p52344 Packing a bigger rugged graphics processing punch Modernizing legacy systems Embedded systems’ graphics need to look like what the latest gaming rigs can put out, making the hardware that sorts through it all require made simple better processors and more memory to tackle the added strain. LiPPERT Embedded Computers’ Toucan-QM57 COM Express module Legacy software is an inescapable part in the development of some aims for the high score list with an Intel Core i7 first-gen processor embedded systems, and bits of legacy software tag along in most and the RS-DIMM rugged memory module, standardized by the systems. But developers need not fear. To the rescue is Eurotech’s SFF-SIG in February 2011. CPU-1440 PC/104-Plus board, which eases legacy support with x86 capacity from DOS applications all the way up to current Linux and To balance all the processing power of this tough little COM Express Windows CE applications. PC/104 and PC/104-Plus bus expansion module, the company pairs its hardware with LiPPERT Enhanced paired with ISA support in an easy-to-use, efficient platform nods Management Technology (LEMT) to measure its supply current and to new designs or legacy hardware upgrades. therefore the CPU’s power consumption in real time. In addition to Fanless up to 4 W, the low-power, rugged board is fitting for industrial, its up to 8 GB DDR3 ECC RAM, the RS-DIMM module allows for point-of-sale, and transportation applications that require durable memory expansion, which is a great match for systems dealing with construction and high reliability. With 128 MB of soldered down RAM and image processing, video encoding, and other demanding applications. a 2 MB onboard flash disk with -40 °C to +70 °C extended temperature It packs an arsenal of external port options including 8 USB 2.0 range options, it can withstand some pretty tough environments. But host ports, 4 SATA ports with RAID support, 1 PATA interface, working with it doesn’t have to be tough: The development kit includes dual-channel LVDS, 2 DisplayPort connectors, and Gigabit LAN. a variety of preinstalled OSs and drivers for a quick start to application Its powerful graphics functionality, complemented with Intel HD development. This board is like a good trainer for an old cranky legacy audio, is a rugged knock-out. dog needing to keep up with a new pack of puppies. LiPPERT Embedded Computers GmbH Eurotech • www.eurotech.com www.lippertembedded.com www.smallformfactors.com/p47866 www.smallformfactors.com/p52340
PC/104 and Small Form Factors ❙ 2011 Resource Guide ❙ 53 EDITOR’S INSIGHT
By Chris A. Ciufo, Editor
Oh, Microsoft…what haven’t you done?
was prepared to tell you good people all about the exciting the tech industry’s largest repositories of press releases. Searching things I spied at May’s Embedded Systems Conference in the last 60 days I found 41 references to “Microsoft embedded,” San Jose, California. I even had a list, topped with soft pro- but only a handful applied. Of these, I learned that Broadcom is cessors for FPGAs from Altera (FP32) and Xilinx (Zynq), working with Microsoft to make “wireless TV a reality,” that Kia cool AMD graphics accelerators (Fusion APU), rugged is looking to do SYNC, FPGA dev platform provider BEECube is Imemory modules (SFF-SIG), and all of this followed by excerpts used by Microsoft, and that some guy from Microsoft Research from Apple co-founder Steve Wozniak’s on-stage chat with UBM’s was one of the ESC judges who helped select the best people and Brian Fuller. On the latter: Woz implies that geeks are good. products at ESC Silicon Valley. On this last one, clearly Microsoft wasn’t absent from ESC per se, but their embedded strategy sure But that all went out the window when I got home and my isn’t evident to me. precious Core 2 Duo MacBook couldn’t render the HD video interviews I conducted at ESC. So I broke down and bought a Finally, I bit the bullet and headed off to that black hole Library of Windows 7 Dell machine from Costco for a mere $650. Although Congress-style website known as Microsoft.com. LOTS of stuff it’s last year’s Nehalem Core i5 model, it puts my Mac to shame there about embedded. Yet, scratching below the surface, I couldn’t on CPU horsepower – and Windows 7 ain’t half bad, either. After discern how it’s much different than Microsoft’s previous products a week reacquainting myself with Windows, I am very impressed. of Windows, Windows Embedded, Windows CE, and the phone Gone are the glitches of XP SP3, and the UI is positively OS du jour that some Finnish cell phone company just bet the farm Apple-like in many subtle ways. But this got me thinking on. Now it’s all called Windows 7, Windows Embedded Compact, about the news from ESC that wasn’t news at all: Where was Windows Embedded Compact 7, and Windows Phone 7. I’m not Microsoft? I didn’t see them, and the Conference book confirmed making this up, I swear it. Embedded Compact is the latest flavor that they weren’t there like years past. Is Microsoft pulling away of CE, while the “7” makes it the modularized version with low from embedded because, let’s face it, they’ve gained little traction footprint due to mix-and-match add-ins. It’s all nicely described in the consumer, military, medical, and overall embedded market? on myriad web pages, but nowhere could I easily find anything that Look around your workspace right now. Besides the PC, do you made it seem easy. The underlying themes are: 1. Hey, this stuff for see Microsoft running anywhere? embedded is all based upon Windows 7 somehow (which, as I said above, is pretty impressive); and 2. Embedded serves as a bunch of We define “embedded” loosely as anything that isn’t a PC or a endpoints to connect with things in the Internet Cloud. server1. This includes game consoles, smartphones, PC/104 and VME boards, printers, Google TV, static analysis tools, FPGAs, I guess it all makes sense, since Microsoft’s Steve Ballmer decreed avionics on military C-17 Globemaster cargo aircraft, handheld in March 2010 that “For the cloud, we’re all in.” He stated that doodads, POS terminals, and so on. Yet except for the vendors with the company’s 40,000 people building software, 70 percent showcasing embedded systems replacing desktop PCs running were doing something “exclusively for the cloud” – by 2011 it some flavor of Windows, I just didn’t feel Microsoft’s presence was expected to be 90 percent. Experts envision tens of billions of at this year’s ESC. So I checked the OpenSystems Media news connected devices by 2015 (Intel, VDC, ARTEMIS). Given that server for recent Microsoft PR to see if I’d missed something. Our fact, the Microsoft embedded website does list vertical markets database aggregates RSS feeds from six different online and print such as Enterprise, POSReady, Server, Handheld, Thin Client, publications. Out of nearly 10,000 press releases from hundreds of Automotive, and so on. Apparently “embedded” isn’t the goal, it’s companies, I didn’t find many noteworthy items from the folks in a means to an end and I’m guessing that Microsoft’s value-add Redmond. A couple of .NET announcements, a few references to will be bits and pieces that facilitate management, connectivity, Windows 7, and server environments. There was something about cross-platform exchange, and the ever-familiar Windows SDK Silverlight for Windows Embedded, having to do with streaming environment. Guess they don’t really want to do the OS on an DMCA-controlled video content to things like Tablets. Success! embedded thingy. They just want to help it connect to the Web. This was bona fide “embedded” press release, even if it wasn’t quite the smoking gun I was looking for. Still, ya think they could send a message out to the 10,000 or so attendees of America’s biggest conference focusing on all things I was hoping to find product announcements from Microsoft embedded? Maybe some attendees need to hear what Microsoft’s or hardware vendors committing to using the latest flavors of strategy is. Really, Redmond could’ve done so much more. Windows CE, Windows Phone 7, or something to do with making a notable dent in the embedded beachhead enjoyed by Linux, the RTOS vendors, or even Java of all things. Nada. So I loaded the big guns, and headed over to PR Newswire, one of Chris A. Ciufo, Group Editorial Director 1 And automobiles, Ford’s SYNC by Microsoft notwithstanding. [email protected]
54 ❙ 2011 Resource Guide ❙ PC/104 and Small Form Factors
1GHz PC/104 SBC Supports Networking and Communications
Hardened for harsh, industrial environments, the low power PCM-VDX-2 PC/104 single board computer is designed for medical, transportation, communication, and control applications. It is packed with serial, USB, and Ethernet ports, plus GPIO; and offers -40°C to 85°C extended temperature operation. • Fanless, low power 1GHz Vortex86DX processor • PC/104 Bus compliant form factor (90 x 96 mm) • 512MB of soldered-down onboard DRAM • 1MB of battery-backed SRAM • CompactFlash socket • Optional 512MB onboard SSD flashdisk • Full-featured I/O includes: • Two 10/100 Mbps Ethernet ports • Four USB 2.0 ports • Four serial RS-232/422/485 ports • ESD protection on LAN, USB, and serial ports • 16 lines of general purpose I/O • PATA, LPT, PS/2 KYBD and Mouse controller • Mini PCI and PC/104 expansion connectors • WDT, RTC, status LEDs, and beeper • Extended temperature -40°C to +85°C operation • Runs Linux, DOS, and other x86-compatible operating systems • Downloadable drivers available • Responsive and knowledgeable technical support • Long-term product availability The PCM-VDX-2 can be customized by depopulating certain features or adding soldered-down flash memory, CompactFlash card retention clip, and/or a Mini PCI video card. Understanding long-term product availability is a critical issue for our customers, the PCM-VDX-2 is offered beyond 2017. Call 817-274-7553orVisit Contact us for additional product information and pricing. Our www.winsystems.com/PCM-VDX factory application engineers look forward to working with you. Ask about our 30-day product evaluation.
TM 715 Stadium Drive • Arlington, Texas 76011 Phone 817-274-7553 • FAX 817-548-1358 E-mail: [email protected]