Thermoelectric Materials Thermoelectric devices are based on a phenomenon known as the thermoelectric effect which is the direct conversion of a temperature gradient across two dissimilar materials into electricity. The materials used are known as thermoelectric materials. The thermoelectric effect is reversible i.e. it directly conver ng electricity into a temperature gradient. The thermoelectric effect is based on a combina on of two different effects, namely, the Seebeck effect and the Pel er effect.
Water/Beer Cooler What is thermoelectricity? Thermoelectricity is the conversion of heat differen als into electricity and viceversa. Thermoelectric energy conversion is one of the direct energy conversion technologies that rely on the electronic proper es of the material (semiconductor) for its efficiency. It is based on the Seebeck (Power Genera on) and Pel er effects (Heat Pumping). Seebeck Effect In 1821, Thomas Seebeck a German Estonian physicist found that an electric current would flow con nuously in a closed circuit made up of two dissimilar metals, if the junc ons of the metals were maintained at two different temperatures. If the temperature gradient is reversed, the direc on of the current is reversed. Where S is the Seebeck coefficient. It is defined as the voltage generated per degree of temperature difference between the two points. S is posi ve when the direc on of the current is the same as the direc on of the voltage The basis of the Seebeck effect is electron mobility in conductors and semiconductors, which is a func on of temperature When two different metals are joined, the rela ve difference in electron mobility in each of the metals will make that the electrons from the more “mobile” metal jump to the less mobile metal. A poten al difference is created between the two conductors. In the absence of a circuit, this causes charge to accumulate in one conductor, and charge to be depleted in the other conductor. Example: Type K thermocouple
Measure ? The Seebeck Effect The Seebeck effect is the conversion of heat differences directly into electricity. When two dissimilar materials with different carrier densi es are connected to each other by an electrical conductor and heat is applied to one side of the connectors, some of the heat input is converted to electrical current, as the higher energy ma er releases energy and cools to a lower energy state. The net work is propor onal to the temperature difference and Seebeck coefficient. The simplest thermoelectric generator consists of a thermocouple, comprising a p‐type and n‐type thermo‐element connected electrically in series and thermally in parallel. Heat is pumped into one side of the couple and rejected from the opposite side. An electrical current is produced, propor onal to the temperature gradient between the hot and cold junc ons Explana on of Seebeck Effect In a thermoelectric material there are free carriers which carry both charge and heat. If a material is placed in a temperature gradient, where one side is cold and the other is hot, the carriers at the hot end will move faster than those at the cold end. The faster hot carriers will diffuse further than the cold carriers and so there will be a net build up of carriers (higher density) at the cold end. In the steady state, the effect of the density gradient will exactly counteract the effect of the temperature gradient so there is no net flow of carriers. The buildup of charge at the cold end will also produce a repulsive electrosta c force (and therefore electric poten al) to push the charges back to the hot end. The electric poten al produced by a temperature difference is known as the Seebeck effect and the propor onality constant is called the Seebeck coefficient (α or S). If the free charges are posi ve (the material is p‐type), posi ve charge will build up on the cold which will have a posi ve poten al. Similarly, nega ve free charges (n‐type material) will produce a nega ve poten al at the cold end. If the hot ends of the n‐type and p‐type material are electrically connected, and a load connected across the cold ends, the voltage produced by the Seebeck effect will cause current to flow through the load, genera ng electrical power. α2σ is the materials property known as the thermoelectric power factor. For efficient opera on, high power must be produced with a minimum of heat (Q). κ= Thermal conduc vity. The thermal conduc vity acts as a thermal short and reduces efficiency.
Pel er Effect In 1834, a French scien st Jean Pel er found that a thermal difference can be obtained at the junc on of two metals, if an electric current is made to flow in them.
Opposite of the Seebeck Effect. The heat current (q) is propor onal to the charge current (I) and the propor onality constant is the Pel er Coefficient (Π). When two materials are joined together, there will be an excess or deficiency in the energy at the junc on because the two materials have different Pel er coefficients. The excess energy is released to the la ce at the junc on, causing hea ng, and the deficiency in energy is supplied by the la ce, crea ng cooling. The Seebeck and the Pel er coefficients are related to each other through the Kelvin rela onship – T is the absolute temperature.
Π >0 ; Posi ve Pel er coefficient. High energy holes move from le to right. Thermal current and electric current flow in same direc on. Π < 0 ; Nega ve Pel er coefficient High energy electrons move from right to le . Thermal current and electric current flow in opposite direc ons.
If an electric current is applied to the thermocouple as shown, heat is pumped from the cold junc on to the hot junc on. The cold junc on will rapidly drop below ambient temperature provided heat is removed from the hot side. The temperature gradient will vary according to the magnitude of current applied. The Pel er Effect
When two dissimilar materials with different carrier densi es are connected to each other by an electrical conductor, electrical current (work input), forces the ma er to approach a higher energy state and heat is absorbed (cooling). The energy is released (hea ng) as the ma er approaches a lower energy state. The net cooling effect is propor onal to the electric current and Pel er Effect coefficient. Thompson Effect William Thompson (1824‐1907) also known as Lord Kelvin. He observed that when an electric current flows through a conductor, the ends of which are maintained at different temperatures (gradient temperature), heat is evolved at a rate approximately propor onal to the product of the current and the temperature gradient.
is the Thomson coefficient in Volts/Kelvin
Thompson Effect = Seebeck Effect + Pel er Effect
The rela onships between the different effects are called the Kelvin rela onships. First Kelvin rela onship:
Second Kelvin rela onship: Thermoelectric Figure of Merit (ZT) Coefficient of Performance
where
Seebeck coefficient
Electrical conductivity TH = 300 K TC = 250 K Freon Temperature Bi2Te 3
Thermal conductivity Requirements for a Good Thermoelectric Material • General considera ons for the selec on of materials for thermoelectric applica ons involve: – High figure of merit – large Seebeck coefficient α (or S) – high electrical conduc vity σ
– low thermal conduc vity κLa ce+κelectrons – Possibility of obtaining both n‐type and p‐type thermoelements. – No viable superconduc ng passive legs developed yet • Good mechanical, metallurgical and thermal characteris cs – Capable of opera ng over a wide temperature range. Especially true for high temperature applica ons. – To allow their use in prac cal thermoelectric devices – Materials cost can be an important issue!
Minimizing thermal conduc vity Thermal conduc vity consists of two parts: la ce conduc vity (la ce vibra ons = phonons), κLa ce, and thermal conduc vity of charges (electrons and holes), κelectrons:
Currently, most of the research efforts are devoted to minimizing the la ce conduc vity of new phases.
Some ways to reduce the la ce conduc vity: (1) use of heavy elements, e.g. Bi2Te3, Sb2Te3 and PbTe; (2) a large number N of atoms in the unit cell: the frac on of vibra onal modes (phonons) that carry heat efficiently to 1/N; (3) ra ling of the atoms, e.g. filled sku erudite CeFe4Sb12; disorder in atomic structure: random atomic distribu on and deficiencies. The last approach is nicely realized in "Zn4Sb3", which can be called an "electron‐crystal and phonon‐glass" according to Slack. This material has electrical conduc vity typical for heavily doped semiconductors and thermal conduc vity typical for amorphous solids. In fact, its thermal conduc vity is the lowest among state‐of‐ the art thermoelectric materials: Minimize thermal conduc vity and maximize electrical conduc vity has been the biggest dilemma for the last 40 years.! Bismuth telluride is the standard with ZT=1 to match a refrigerator you need ZT= 4 ‐ 5 to recover waste heat from car ZT = 2
Can the conflic ng requirements be met by nano‐scale material design? Reduce the la ce thermal conduc vity by: •Complex crystal structure of high atomic number materials. •Ra lers in the structure (Atomic Displacement Parameter – ADP). •Nanostructured Thermoelectrics Complex Crystal Structures Ra lers: These are weakly bound atoms that fill cages. They have unusually large values of Atomic Displacement Parameters Proper es of many clathrate‐like compounds can be understood by trea ng “ra ler” atoms as Einstein oscillators and framework atoms as a Debye solid. Sku erudites, LaB6, Tl2SnTe5 A Characteris c Einstein temperature (or frequency) can be assigned to each ra ler
Eu8‐eGa16Ge30 Phase With the Ba8Ga16Sn30 Clathrate Structure Type: a = 10.62 Å X8Ga16Ge30 (X= Ba, Sr, Eu)
Ba Nuclear Density Map at Sr Nuclear Density Center of Large Cage ( 6d site of clathrate structure) Map at Center of Large Cage Tunneling States?
Eu Nuclear Density Map at Center of Large Cage Tunneling States ! ADP Data (
• Consumer Applica ons
• Automobile Applica ons
• Industrial Applica ons
• Military and Space Applica ons Consumer Applica ons
TE Fridge
Beer Cooler
Chocolate Cooler Automobile Applica ons
Can Cooler Seat Cooler/Warmer Industrial Applica ons
Electronic Cooler TE Dehumidifier Military and Space Applica ons
Night Vision Basic Principles • Macroscopic Thermal Transport Theory– Diffusion ‐‐ Fourier’s Law ‐‐ Diffusion Equa on • Microscale Thermal Transport Theory – Par cle Transport ‐‐ Kine c Theory of Gases ‐‐ Electrons in Metals ‐‐ Phonons in Insulators ‐‐ Boltzmann Transport Theory Basic Principles
Heat is a form of energy. The thermal proper es describe how a solid responds to changes in its thermal energy. The heat capacity (C) of a solid quan fies the rela onship between the temperature of the body (T) and the energy (Q) supplied to it. The measured value of the heat capacity is found to depend on whether the measurement is made at constant volume (CV) or at constant pressure (CP). Fourier’s Law for Heat Conduc on
Q (heat flow)
Hot Cold
Th Tc L
Thermal conduc vity Heat Diffusion Equa on 1st law (energy conserva on) Heat conduc on = Rate of change of energy storage
Specific heat
•Condi ons: t >> t ≡ sca ering mean free me of energy carriers L >> l ≡ sca ering mean free path of energy carriers Breaks down for applica ons involving thermal transport in small length/ me scales, e.g. nanoelectronics, nanostructures, NEMS, ultrafast laser materials processing… 1 km Length Scale Aircra Automobile 1 m Human
Computer
Bu erfly 1 mm Fourier’s law Microprocessor Module MEMS
Blood Cells 1 mm Wavelength of Visible Light Par cle MOSFET, NEMS 100 nm l transport Nanotubes, Nanowires Width of DNA 1 nm D D
Total Length Traveled = L
Average Distance between Collisions, = L/(#of collisions) Total Collision Volume Swept = πD2 L mc Number Density of Molecules = n Mean Free Path Total number of molecules encountered in swept collision volume = nπD2L
σ: collision cross‐sec onal area Number Density of kB: Boltzmann constant ‐23 Molecules from Ideal 1.38 x 10 J/K
Gas Law: n = P/kBT
Mean Free Path:
Typical Numbers: Diameter of Molecules, D ≈ 2 Å = 2 x10‐10 m Collision Cross‐sec on: σ ≈ 1.3 x 10‐19 m
Mean Free Path at Atmospheric Pressure:
At 1 Torr pressure, mc ≈ 300 mm; at 1 mTorr, mc ≈ 30 cm Wall
b: boundary separa on
Wall
Effec ve Mean Free Path: u: energy Net Energy Flux / # of Molecules u(z+z) z + z qz θ z through Taylor expansion of u u(z- ) z z - z
Integration over all the solid angles total energy flux
Thermal conductivity:
Specific heat Velocity Mean free path Fermi Energy – highest occupied energy state: Metal
Vacuum F: Work Func on Level Fermi Velocity: EF Energy
Fermi Temp:
Band Edge Fermi‐Dirac equilibrium distribu on for the probability of electron occupa on of energy level E at temperature T f
k TB 1 T = 0 K Vacuum Level Increasing T
Occupa on Probability, 0 E F Electron Energy, E Work Func on, F Number density:
Energy density:
Density of States -- Number of electron states available between energy E and E+dE
in 3D Specific Heat in 3D
Mean free me: Thermal Conduc vity te = le / vF
e Electron Sca ering Mechanisms Bulk Solids • Defect Sca ering • Phonon Sca ering Increasing • Boundary Sca ering (Film Thickness, Defect Concentra on Grain Boundary)
Defect Phonon Sca ering Sca ering
Temperature, T Ma hiessen Rule:
Electrons dominate k in metals Crystalline vs. Glasslike Thermal Conduc vity
P. W. Anderson, B. I. Halperin, C. M. Varma, Phil. Mag. 25, 1 (1972). Interatomic Bonding Equa on of mo on with nearest neighbor interac on
Solu on
1‐D Array of Spring Mass System Frequency, ω 0 Wave vector, K π /a Group Velocity: Speed of Sound: La ce Constant, a
Op cal Vibra onal y x Modes n‐1 xn yn n+1
LO ω TO
Frequency, TA LA
0 Wave vector, K π/a
Total Energy of a Quantum Oscillator in a Parabolic Poten al
n = 0, 1, 2, 3, 4…; w/2: zero point energy
Phonon: A quantum of vibra onal energy, w, which travels through the la ce Phonons follow Bose‐Einstein sta s cs. Equilibrium distribu on:
In 3D, allowable wave vector K: p: polariza on(LA,TA, LO, TO) K: wave vector
Dispersion Rela on:
Energy Density:
Density of States: Number of vibra onal states between w and w+dw
in 3D
La ce Specific Heat: In 3D, when Specific Heat in 3D: of States: Debye Density Debye Approxima on: T << θ D , Debye Temperature [K] Frequency, w 0 Wave vector, K p/a
3ηkBT
Diamond Each atom has ‐K)
3 a thermal energy
of 3KBT
C ∝ T3 Classical Regime Specific Heat (J/m
Temperature (K)
In general, when T << qD,
d =1, 2, 3: dimension of the sample Phonon Sca ering Mechanisms Kine c Theory • Boundary Sca ering • Defect & Disloca on Sca ering Decreasing Boundary • Phonon‐Phonon Sca ering Separa on
l
Increasing Defect Concentra on
Phonon Defect Boundary Sca ering 0.01 0.1 1.0
Temperature, T/qD • Phonons dominate k in insulators