Fast14 Technology: Design Technology for the Automation of Multi-Gigahertz Digital Logic
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Efficient Checker Processor Design
Efficient Checker Processor Design Saugata Chatterjee, Chris Weaver, and Todd Austin Electrical Engineering and Computer Science Department University of Michigan {saugatac,chriswea,austin}@eecs.umich.edu Abstract system works to increase test space coverage by proving a design is correct, either through model equivalence or assertion. The approach is significantly more efficient The design and implementation of a modern micro- than simulation-based testing as a single proof can ver- processor creates many reliability challenges. Design- ify correctness over large portions of a design’s state ers must verify the correctness of large complex systems space. However, complex modern pipelines with impre- and construct implementations that work reliably in var- cise state management, out-of-order execution, and ied (and occasionally adverse) operating conditions. In aggressive speculation are too stateful or incomprehen- our previous work, we proposed a solution to these sible to permit complete formal verification. problems by adding a simple, easily verifiable checker To further complicate verification, new reliability processor at pipeline retirement. Performance analyses challenges are materializing in deep submicron fabrica- of our initial design were promising, overall slowdowns tion technologies (i.e. process technologies with mini- due to checker processor hazards were less than 3%. mum feature sizes below 0.25um). Finer feature sizes However, slowdowns for some outlier programs were are generally characterized by increased complexity, larger. more exposure to noise-related faults, and interference In this paper, we examine closely the operation of the from single event radiation (SER). It appears the current checker processor. We identify the specific reasons why advances in verification (e.g., formal verification, the initial design works well for some programs, but model-based test generation) are not keeping pace with slows others. -
Outline ECE473 Computer Architecture and Organization • Technology Trends • Introduction to Computer Technology Trends Architecture
Outline ECE473 Computer Architecture and Organization • Technology Trends • Introduction to Computer Technology Trends Architecture Lecturer: Prof. Yifeng Zhu Fall, 2009 Portions of these slides are derived from: ECE473 Lec 1.1 ECE473 Lec 1.2 Dave Patterson © UCB Birth of the Revolution -- What If Your Salary? The Intel 4004 • Parameters – $16 base First Microprocessor in 1971 – 59% growth/year – 40 years • Intel 4004 • 2300 transistors • Initially $16 Æ buy book • Barely a processor • 3rd year’s $64 Æ buy computer game • Could access 300 bytes • 16th year’s $27 ,000 Æ buy cacar of memory • 22nd year’s $430,000 Æ buy house th @intel • 40 year’s > billion dollars Æ buy a lot Introduced November 15, 1971 You have to find fundamental new ways to spend money! 108 KHz, 50 KIPs, 2300 10μ transistors ECE473 Lec 1.3 ECE473 Lec 1.4 2002 - Intel Itanium 2 Processor for Servers 2002 – Pentium® 4 Processor • 64-bit processors Branch Unit Floating Point Unit • .18μm bulk, 6 layer Al process IA32 Pipeline Control November 14, 2002 L1I • 8 stage, fully stalled in- cache ALAT Integer Multi- Int order pipeline L1D Medi Datapath RF @3.06 GHz, 533 MT/s bus cache a • Symmetric six integer- CLK unit issue design HPW DTLB 1099 SPECint_base2000* • IA32 execution engine 1077 SPECfp_base2000* integrated 21.6 mm L2D Array and Control L3 Tag • 3 levels of cache on-die totaling 3.3MB 55 Million 130 nm process • 221 Million transistors Bus Logic • 130W @1GHz, 1.5V • 421 mm2 die @intel • 142 mm2 CPU core L3 Cache ECE473 Lec 1.5 ECE473 19.5mm Lec 1.6 Source: http://www.specbench.org/cpu2000/results/ @intel 2006 - Intel Core Duo Processors for Desktop 2008 - Intel Core i7 64-bit x86-64 PERFORMANCE • Successor to the Intel Core 2 family 40% • Max CPU clock: 2.66 GHz to 3.33 GHz • Cores :4(: 4 (physical)8(), 8 (logical) • 45 nm CMOS process • Adding GPU into the processor POWER 40% …relative to Intel® Pentium® D 960 When compared to the Intel® Pentium® D processor 960. -
The Advantages of FRAM-Based Smart Ics for Next Generation Government Electronic Ids
The Advantages of FRAM-Based Smart ICs for Next Generation Government Electronic IDs By Joseph Pearson and Dr. Ted Moise Texas Instruments, Inc. September 27, 2007 Executive Summary Electronic versions of passports and other government-issued identification documents use an Integrated Circuit (IC) or chip to establish a digital link between the holder and personal biometric information, such as a digitized photo, fingerprint or iris image. Designed to enhance border, physical and IT security, electronic chips ensure that the person holding a passport or government document is the one to whom it was legitimately issued. The next generation ICs will employ an advanced embedded memory technology, called FRAM (Ferroelectric Random Access Memory), which considerably improves the speed and reliability of future smart, secure e-passports and government ID documents. More than 50 countries have electronic passport (e-passport) programs, and many countries are also putting in place more secure forms of electronic citizen, visitor and government employee identification. As the volume of document issuance increases and new security threats occur, there is an increased need for industry-standard, next-generation contactless smart IC solutions that securely store, process and communicate data. These new smart ICs will have increased writing speeds to produce and process documents faster and more efficiently, as well as enhanced memory for future security requirements. When FRAM is manufactured at the 130 nanometer semiconductor process node, and embedded in a smart IC, it surpasses the limitations of current Electrically Erasable Programmable Read-Only Memory (EEPROM) and other memory technologies used in government ID applications. The imminent introduction of this innovative memory technology for smart ICs signals a shift in performance in smart card applications deployed in government electronic ID documents. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
Nano-Cmos Scaling Problems and Implications
CHAPTER 1 NANO-CMOS SCALING PROBLEMS AND IMPLICATIONS 1.1 DESIGN METHODOLOGY IN THE NANO-CMOS ERA As process technology scales beyond 100-nm feature sizes, for functional and high-yielding silicon the traditional design approach needs to be modified to cope with the increased process variation, interconnect processing difficulties, and other newly exacerbated physical effects. The scaling of gate oxide (Figure 1.1) in the nano-CMOS regime results in a significant increase in gate direct tunnel- ing current. Subthreshold leakage and gate direct tunneling current (Figure 1.2) are no longer second-order effects [1,15]. The effect of gate-induced drain leak- age (GIDL) will be felt in designs, such as DRAM (Chapter 7) and low-power SRAM (Chapter 9), where the gate voltage is driven negative with respect to the source [15]. If these effects are not taken care of, the result will be a nonfunctional SRAM, DRAM, or any other circuit that uses this technique to reduce subthresh- old leakage. In some cases even wide muxes and flip-flops may be affected. Subthreshold leakage and gate current are not the only issues that we have to deal with at a functional level, but also the power management of chips for high-performance circuits such as microprocessors, digital signal processors, and graphics processing units. Power management is also a challenge in mobile applications. Furthermore, optical lithography will be stretched to the limit even when en- hanced resolution extension technologies (RETs) are employed. These techniques Nano-CMOS Circuit and Physical Design, by Ban P. Wong, Anurag Mittal, Yu Cao, and Greg Starr ISBN 0-471-46610-7 Copyright © 2005 John Wiley & Sons, Inc. -
3D Massively Parallel Processor with Stacked Memory)
112 IEEE TRANSACTIONS ON COMPUTERS, VOL. 64, NO. 1, JANUARY 2015 Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, and Sung Kyu Lim Abstract—This paper describes the architecture, design, analysis, and simulation and measurement results of the 3D-MAPS (3D massively parallel processor with stacked memory) chip built with a 1.5 V, 130 nm process technology and a two-tier 3D stacking technology using 1.2 μ -diameter, 6 μ -height through-silicon vias (TSVs) and μ -diameter face-to-face bond pads. 3D-MAPS consists of a core tier containing 64 cores and a memory tier containing 64 memory blocks. Each core communicates with its dedicated 4KB SRAM block using face-to-face bond pads, which provide negligible data transfer delay between the core and the memory tiers. The maximum operating frequency is 277 MHz and the maximum memory bandwidth is 70.9 GB/s at 277 MHz. The peak measured memory bandwidth usage is 63.8 GB/s and the peak measured power is approximately 4 W based on eight parallel benchmarks. Index Terms—3D Multiprocessor-memory stacked systems, 3D integrated circuits, Computer-aided design, RTL implementation and simulation 1INTRODUCTION HREE-DIMENSIONAL integrated circuits (3D ICs) are ex- circuit components built with different technologies can be Tpected to provide numerous benefits. -
Understanding Performance Numbers in Integrated Circuit Design Oprecomp Summer School 2019, Perugia Italy 5 September 2019
Understanding performance numbers in Integrated Circuit Design Oprecomp summer school 2019, Perugia Italy 5 September 2019 Frank K. G¨urkaynak [email protected] Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 2/74 Who Am I? Born in Istanbul, Turkey Studied and worked at: Istanbul Technical University, Istanbul, Turkey EPFL, Lausanne, Switzerland Worcester Polytechnic Institute, Worcester MA, USA Since 2008: Integrated Systems Laboratory, ETH Zurich Director, Microelectronics Design Center Senior Scientist, group of Prof. Luca Benini Interests: Digital Integrated Circuits Cryptographic Hardware Design Design Flows for Digital Design Processor Design Open Source Hardware Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 3/74 What Will We Discuss Today? Introduction Cost Structure of Integrated Circuits (ICs) Measuring performance of ICs Why is it difficult? EDA tools should give us a number Area How do people report area? Is that fair? Speed How fast does my circuit actually work? Power These days much more important, but also much harder to get right Integrated Systems Laboratory The performance establishes the solution space Finally the cost sets a limit to what is possible Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 4/74 System Design Requirements System Requirements Functionality Functionality determines what the system will do Integrated Systems Laboratory Finally the cost sets a limit -
CSE 141L: Design Your Own Processor What You'll
CSE 141L: Design your own processor What you’ll do: - learn Xilinx toolflow - learn Verilog language - propose new ISA - implement it - optimize it (for FPGA) - compete with other teams Grading 15% lab participation – webboard 85% various parts of the labs CSE 141L: Design your own processor Teams - two people - pick someone with similar goals - you keep them to the end of the class - more on the class website: http://www.cse.ucsd.edu/classes/sp08/cse141L/ Course Staff: 141L Instructor: Michael Taylor Email: [email protected] Office Hours: EBU 3b 4110 Tuesday 11:30-12:20 TA: Saturnino Email: [email protected] ebu 3b b260 Lab Hours: TBA (141 TA: Kwangyoon) Æ occasional cameos in 141L http://www-cse.ucsd.edu/classes/sp08/cse141L/ Class Introductions Stand up & tell us: -Name - How long until graduation - What you want to do when you “hit the big time” - What kind of thing you find intellectually interesting What is an FPGA? Next time: (Tuesday) Start working on Xilinx assignment (due next Tuesday) - should be posted Sat will give a tutorial on Verilog today Check the website regularly for updates: http://www.cse.ucsd.edu/classes/sp08/cse141L/ CSE 141: 0 Computer Architecture Professor: Michael Taylor UCSD Department of Computer Science & Engineering RF http://www.cse.ucsd.edu/classes/sp08/cse141/ Computer Architecture from 10,000 feet foo(int x) Class of { .. } application Physics Computer Architecture from 10,000 feet foo(int x) Class of { .. } application An impossibly large gap! In the olden days: “In 1942, just after the United States entered World War II, hundreds of women were employed around the country as Physics computers...” (source: IEEE) The Great Battles in Computer Architecture Are About How to Refine the Abstraction Layers foo(int x) { . -
Processor Architecture Design Using 3D Integration Technology
Processor Architecture Design Using 3D Integration Technology Yuan Xie Pennsylvania State University Computer Science and Engineering Department University Park, PA, 16802, USA [email protected] Abstract (4)Smaller form factor, which results in higher pack- ing density and smaller footprint due to the addition of The emerging three-dimensional (3D) chip architec- a third dimension to the conventional two dimensional tures, with their intrinsic capability of reducing the wire layout, and potentially results in a lower cost design. length, is one of the promising solutions to mitigate This tutorial paper first presents the background on the interconnect problem in modern microprocessor de- 3D integration technology, and then reviews various ap- signs. 3D memory stacking also enables much higher proaches to design future 3D microprocessors, which memory bandwidth for future chip-multiprocessor de- leverage the benefits of fast latency, higher bandwidth, sign, mitigating the “memory wall” problem. In addi- and heterogeneous integration capability that are offered tion, heterogenous integration enabled by 3D technol- by 3D technology. The challenges for future 3D archi- ogy can also result in innovation designs for future mi- tecture design are also discussed in the last section. croprocessors. This paper serves as a survey of various approaches to design future 3D microprocessors, lever- 2. 3D Integration Technology aging the benefits of fast latency, higher bandwidth, and The 3D integration technologies [25,26] can be clas- heterogeneous integration capability that are offered by sified into one of the two following categories. (1) 3D technology. 1 Monolithic approach. This approach involves sequen- tial device process. The frontend processing (to build the 1. -
Processor Design:System-On-Chip Computing For
Processor Design Processor Design System-on-Chip Computing for ASICs and FPGAs Edited by Jari Nurmi Tampere University of Technology Finland A C.I.P. Catalogue record for this book is available from the Library of Congress. ISBN 978-1-4020-5529-4 (HB) ISBN 978-1-4020-5530-0 (e-book) Published by Springer, P.O. Box 17, 3300 AA Dordrecht, The Netherlands. www.springer.com Printed on acid-free paper All Rights Reserved © 2007 Springer No part of this work may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical, photocopying, microfilming, recording or otherwise, without written permission from the Publisher, with the exception of any material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. To Pirjo, Lauri, Eero, and Santeri Preface When I started my computing career by programming a PDP-11 computer as a freshman in the university in early 1980s, I could not have dreamed that one day I’d be able to design a processor. At that time, the freshmen were only allowed to use PDP. Next year I was given the permission to use the famous brand-new VAX-780 computer. Also, my new roommate at the dorm had got one of the first personal computers, a Commodore-64 which we started to explore together. Again, I could not have imagined that hundreds of times the processing power will be available in an everyday embedded device just a quarter of century later. -
Design Software & Development Kit Selector Guide
® Design Software & Development Kit Selector Guide April 2004 Table of Contents Quartus II Design Software Leadership ................................ page 2 Selecting a Design Software Product ................................... page 5 System Design Technology Recommended System Configurations ................................. page 8 Altera’s Quartus II software is the industry’s only design Altera Programming Hardware........................................... page 8 environment that supports Intellectual Property (IP)-based Altera Development Kits................................................... page 10 system design—including complete and automated system definition and implementation—without requiring lower- Third-Party Solutions........................................................ page 10 level hardware description language (HDL) or schematics. This capability enables designers to turn their concepts into working systems in minutes. The Quartus II system design tools include: Quartus II Design Software SOPC Builder: A system development tool that automates Leadership adding, parameterizing, and linking IP cores—including Altera’s Quartus® II software leads the embedded processors, co-processors, peripherals, memories, industry as the most comprehensive and user-defined logic—without requiring lower-level HDL environment available for FPGA, CPLD, or schematics. (See Figure 1.) and structured ASIC designs, delivering DSP Builder: Shortens digital signal processing (DSP) design unmatched performance, efficiency, and ease-of-use. -
Physical Design of a 3D-Stacked Heterogeneous Multi-Core Processor
Physical Design of a 3D-Stacked Heterogeneous Multi-Core Processor Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul Franzon Department of Electrical and Computer Engineering North Carolina State University, Raleigh, NC, USA frhwidial, rbasuro, zzhang18, jcledfo3, slipa, ericro, wdavis, [email protected] Abstract—With the end of Dennard scaling, three dimensional TSV (I/O pads) stacking has emerged as a promising integration technique to Bulk improve microprocessor performance. In this paper we present Active First metal layer a 3D-SIC physical design methodology for a multi-core processor using commercial off-the-shelf tools. We explain the various Metal High-performance core flows involved and present the lessons learned during the design Last metal layer process. The logic dies were fabricated with GlobalFoundries Face-to-face micro-bumps 130 nm process and were stacked using the Ziptronix face-to- Metal Low-power core face (F2F) bonding technology. We also present a comparative analysis which highlights the benefits of 3D integration. Results indicate an order of magnitude decrease in wirelengths for critical Active inter-core components in the 3D implementation compared to 2D Bulk implementations. I. INTRODUCTION Fig. 1. Cross-section of the face-to-face bonded 3D-IC stack. As performance benefits from technology scaling slows The primary advantage of 3D-stacking comes from reduced down, computer architects are looking at various architectural wirelengths leading to an improvement in routability and signal techniques to maintain the trend of performance improvement, delays. On the other hand, going 3D also increases design while meeting the power budget.