Accelerated Processing Unit (APU) Architectures and Its Benefits
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Bootstomp: on the Security of Bootloaders in Mobile Devices
BootStomp: On the Security of Bootloaders in Mobile Devices Nilo Redini, Aravind Machiry, Dipanjan Das, Yanick Fratantonio, Antonio Bianchi, Eric Gustafson, Yan Shoshitaishvili, Christopher Kruegel, and Giovanni Vigna, UC Santa Barbara https://www.usenix.org/conference/usenixsecurity17/technical-sessions/presentation/redini This paper is included in the Proceedings of the 26th USENIX Security Symposium August 16–18, 2017 • Vancouver, BC, Canada ISBN 978-1-931971-40-9 Open access to the Proceedings of the 26th USENIX Security Symposium is sponsored by USENIX BootStomp: On the Security of Bootloaders in Mobile Devices Nilo Redini, Aravind Machiry, Dipanjan Das, Yanick Fratantonio, Antonio Bianchi, Eric Gustafson, Yan Shoshitaishvili, Christopher Kruegel, and Giovanni Vigna fnredini, machiry, dipanjan, yanick, antoniob, edg, yans, chris, [email protected] University of California, Santa Barbara Abstract by proposing simple mitigation steps that can be im- plemented by manufacturers to safeguard the bootloader Modern mobile bootloaders play an important role in and OS from all of the discovered attacks, using already- both the function and the security of the device. They deployed hardware features. help ensure the Chain of Trust (CoT), where each stage of the boot process verifies the integrity and origin of 1 Introduction the following stage before executing it. This process, in theory, should be immune even to attackers gaining With the critical importance of the integrity of today’s full control over the operating system, and should pre- mobile and embedded devices, vendors have imple- vent persistent compromise of a device’s CoT. However, mented a string of inter-dependent mechanisms aimed at not only do these bootloaders necessarily need to take removing the possibility of persistent compromise from untrusted input from an attacker in control of the OS in the device. -
ATX-945G Industrial Motherboard in ATX Form Factor with Intel® 945G Chipset
ATX-945G Industrial Motherboard in ATX form factor with Intel® 945G chipset Supports Intel® Core™2 Duo, Pentium® D CPU on LGA775 socket 1066/800/533MHz Front Side Bus Intel® Graphics Media Accelerator 950 Dual Channel DDR2 DIMM, maximum 4GB Integrated PCI Express LAN, USB 2.0 and SATA 3Gb/s ATX-945G Product Overview The ATX-945G is an ATX form factor single-processor (x8) and SATA round out the package for a powerful industrial motherboard that is based on the Intel® 945G industrial PC. I/O features of the ATX-945G include a chipset with ICH7 I/O Controller Hub. It supports the Intel® 32-bit/33MHz PCI Bus, 16-bit/8MHz ISA bus, 1x PCI Express Core™2 Duo, Pentium® D, Pentium® 4 with Hyper-Threading x16 slot, 2x PCI Express x1 slots, 3x PCI slots, 1x ISA slot Technology, or Celeron® D Processor on the LGA775 socket, (shared w/ PCI), onboard Gigabit Ethernet, LPC, EIDE Ultra 1066/800/533MHz Front Side Bus, Dual Channel DDR2 DIMM ATA/100, 4 channels SATA 3Gb/s, Mini PCI card slot, UART 667/533/400MHz, up to 4 DIMMs and a maximum of 4GB. The compatible serial ports, parallel port, floppy drive port, HD Intel® Graphic Media Accelerator 950 technology with Audio, and PS/2 Keyboard and Mouse ports. 2048x1536x8bit at 75Hz resolution, PCI Express LAN, USB 2.0 Block Diagram CPU Core™2 Duo Pentium® D LGA775 package 533/800/1066MHz FSB Dual-Core Hyper-Threading 533/800/1066 MHz FSB D I M Northbridge DDR Channel A M ® x Intel 945G GMCH 2 DDRII 400/533/667 MHz D I CRT M M DB-15 DDR Channel B x 2 Discrete PCIe x16 Graphics DMI Interface 2 GB/s IDE Device -
2.5 Classification of Parallel Computers
52 // Architectures 2.5 Classification of Parallel Computers 2.5 Classification of Parallel Computers 2.5.1 Granularity In parallel computing, granularity means the amount of computation in relation to communication or synchronisation Periods of computation are typically separated from periods of communication by synchronization events. • fine level (same operations with different data) ◦ vector processors ◦ instruction level parallelism ◦ fine-grain parallelism: – Relatively small amounts of computational work are done between communication events – Low computation to communication ratio – Facilitates load balancing 53 // Architectures 2.5 Classification of Parallel Computers – Implies high communication overhead and less opportunity for per- formance enhancement – If granularity is too fine it is possible that the overhead required for communications and synchronization between tasks takes longer than the computation. • operation level (different operations simultaneously) • problem level (independent subtasks) ◦ coarse-grain parallelism: – Relatively large amounts of computational work are done between communication/synchronization events – High computation to communication ratio – Implies more opportunity for performance increase – Harder to load balance efficiently 54 // Architectures 2.5 Classification of Parallel Computers 2.5.2 Hardware: Pipelining (was used in supercomputers, e.g. Cray-1) In N elements in pipeline and for 8 element L clock cycles =) for calculation it would take L + N cycles; without pipeline L ∗ N cycles Example of good code for pipelineing: §doi =1 ,k ¤ z ( i ) =x ( i ) +y ( i ) end do ¦ 55 // Architectures 2.5 Classification of Parallel Computers Vector processors, fast vector operations (operations on arrays). Previous example good also for vector processor (vector addition) , but, e.g. recursion – hard to optimise for vector processors Example: IntelMMX – simple vector processor. -
FAN53525 3.0A, 2.4Mhz, Digitally Programmable Tinybuck® Regulator
FAN53525 — 3.0 A, 2.4 MHz, June 2014 FAN53525 3.0A, 2.4MHz, Digitally Programmable TinyBuck® Regulator Digitally Programmable TinyBuck Digitally Features Description . Fixed-Frequency Operation: 2.4 MHz The FAN53525 is a step-down switching voltage regulator that delivers a digitally programmable output from an input . Best-in-Class Load Transient voltage supply of 2.5 V to 5.5 V. The output voltage is 2 . Continuous Output Current Capability: 3.0 A programmed through an I C interface capable of operating up to 3.4 MHz. 2.5 V to 5.5 V Input Voltage Range Using a proprietary architecture with synchronous . Digitally Programmable Output Voltage: rectification, the FAN53525 is capable of delivering 3.0 A - 0.600 V to 1.39375 V in 6.25 mV Steps continuous at over 80% efficiency, maintaining that efficiency at load currents as low as 10 mA. The regulator operates at Programmable Slew Rate for Voltage Transitions . a nominal fixed frequency of 2.4 MHz, which reduces the . I2C-Compatible Interface Up to 3.4 Mbps value of the external components to 330 nH for the output inductor and as low as 20 µF for the output capacitor. PFM Mode for High Efficiency in Light Load . Additional output capacitance can be added to improve . Quiescent Current in PFM Mode: 50 µA (Typical) regulation during load transients without affecting stability, allowing inductance up to 1.2 µH to be used. Input Under-Voltage Lockout (UVLO) ® At moderate and light loads, Pulse Frequency Modulation Regulator Thermal Shutdown and Overload Protection . (PFM) is used to operate in Power-Save Mode with a typical . -
Embedded Computer Solutions for Advanced Automation Control «
» Embedded Computer Solutions for Advanced Automation Control « » Innovative Scalable Hardware » Qualifi ed for Industrial Software » Open Industrial Communication The pulse of innovation » We enable Automation! « Open Industrial Automation Platforms Kontron, one of the leaders of embedded computing technol- ogy has established dedicated global business units to provide application-ready OEM platforms for specifi c markets, includ- ing Industrial Automation. With our global corporate headquarters located in Germany, Visualization & Control Data Storage Internet-of-Things and regional headquarters in the United States and Asia-Pa- PanelPC Industrial Server cifi c, Kontron has established a strong presence worldwide. More than 1000 highly qualifi ed engineers in R&D, technical Industrie 4.0 support, and project management work with our experienced sales teams and sales partners to devise a solution that meets M2M SYMKLOUD your individual application’s demands. When it comes to embedded computing, you can focus on your core capabilities and rely on Kontron as your global OEM part- ner for a successful long-term business relationship. In addition to COTS standards based products, Kontron also of- fers semi- and full-custom ODM services for a full product port- folio that ranges from Computer-on-Modules and SBCs, up to embedded integrated systems and application ready platforms. Open for new technologies Kontron provides an exceptional range of hardware for any kind of control solution. Open for individual application Kontron systems are available either as readily integrated control solutions, or as open platforms for customers who build their own control applications with their own look and feel. Open for real-time Kontron’s Industrial Automation platforms are open for Real- Industrial Ethernet Time operating systems like VxWorks and Linux with real time extension. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
The Von Neumann Computer Model 5/30/17, 10:03 PM
The von Neumann Computer Model 5/30/17, 10:03 PM CIS-77 Home http://www.c-jump.com/CIS77/CIS77syllabus.htm The von Neumann Computer Model 1. The von Neumann Computer Model 2. Components of the Von Neumann Model 3. Communication Between Memory and Processing Unit 4. CPU data-path 5. Memory Operations 6. Understanding the MAR and the MDR 7. Understanding the MAR and the MDR, Cont. 8. ALU, the Processing Unit 9. ALU and the Word Length 10. Control Unit 11. Control Unit, Cont. 12. Input/Output 13. Input/Output Ports 14. Input/Output Address Space 15. Console Input/Output in Protected Memory Mode 16. Instruction Processing 17. Instruction Components 18. Why Learn Intel x86 ISA ? 19. Design of the x86 CPU Instruction Set 20. CPU Instruction Set 21. History of IBM PC 22. Early x86 Processor Family 23. 8086 and 8088 CPU 24. 80186 CPU 25. 80286 CPU 26. 80386 CPU 27. 80386 CPU, Cont. 28. 80486 CPU 29. Pentium (Intel 80586) 30. Pentium Pro 31. Pentium II 32. Itanium processor 1. The von Neumann Computer Model Von Neumann computer systems contain three main building blocks: The following block diagram shows major relationship between CPU components: the central processing unit (CPU), memory, and input/output devices (I/O). These three components are connected together using the system bus. The most prominent items within the CPU are the registers: they can be manipulated directly by a computer program. http://www.c-jump.com/CIS77/CPU/VonNeumann/lecture.html Page 1 of 15 IPR2017-01532 FanDuel, et al. -
Computer Hardware Architecture Lecture 4
Computer Hardware Architecture Lecture 4 Manfred Liebmann Technische Universit¨atM¨unchen Chair of Optimal Control Center for Mathematical Sciences, M17 [email protected] November 10, 2015 Manfred Liebmann November 10, 2015 Reading List • Pacheco - An Introduction to Parallel Programming (Chapter 1 - 2) { Introduction to computer hardware architecture from the parallel programming angle • Hennessy-Patterson - Computer Architecture - A Quantitative Approach { Reference book for computer hardware architecture All books are available on the Moodle platform! Computer Hardware Architecture 1 Manfred Liebmann November 10, 2015 UMA Architecture Figure 1: A uniform memory access (UMA) multicore system Access times to main memory is the same for all cores in the system! Computer Hardware Architecture 2 Manfred Liebmann November 10, 2015 NUMA Architecture Figure 2: A nonuniform memory access (UMA) multicore system Access times to main memory differs form core to core depending on the proximity of the main memory. This architecture is often used in dual and quad socket servers, due to improved memory bandwidth. Computer Hardware Architecture 3 Manfred Liebmann November 10, 2015 Cache Coherence Figure 3: A shared memory system with two cores and two caches What happens if the same data element z1 is manipulated in two different caches? The hardware enforces cache coherence, i.e. consistency between the caches. Expensive! Computer Hardware Architecture 4 Manfred Liebmann November 10, 2015 False Sharing The cache coherence protocol works on the granularity of a cache line. If two threads manipulate different element within a single cache line, the cache coherency protocol is activated to ensure consistency, even if every thread is only manipulating its own data. -
Gpus: the Hype, the Reality, and the Future
Uppsala Programming for Multicore Architectures Research Center GPUs: The Hype, The Reality, and The Future David Black-Schaffer Assistant Professor, Department of Informaon Technology Uppsala University David Black-Schaffer Uppsala University / Department of Informaon Technology 25/11/2011 | 2 Today 1. The hype 2. What makes a GPU a GPU? 3. Why are GPUs scaling so well? 4. What are the problems? 5. What’s the Future? David Black-Schaffer Uppsala University / Department of Informaon Technology 25/11/2011 | 3 THE HYPE David Black-Schaffer Uppsala University / Department of Informaon Technology 25/11/2011 | 4 How Good are GPUs? 100x 3x David Black-Schaffer Uppsala University / Department of Informaon Technology 25/11/2011 | 5 Real World SoVware • Press release 10 Nov 2011: – “NVIDIA today announced that four leading applicaons… have added support for mul<ple GPU acceleraon, enabling them to cut simulaon mes from days to hours.” • GROMACS – 2-3x overall – Implicit solvers 10x, PME simulaons 1x • LAMPS – 2-8x for double precision – Up to 15x for mixed • QMCPACK – 3x 2x is AWESOME! Most research claims 5-10%. David Black-Schaffer Uppsala University / Department of Informaon Technology 25/11/2011 | 6 GPUs for Linear Algebra 5 CPUs = 75% of 1 GPU StarPU for MAGMA David Black-Schaffer Uppsala University / Department of Informaon Technology 25/11/2011 | 7 GPUs by the Numbers (Peak and TDP) 5 791 675 4 192 176 3 Intel 32nm vs. 40nm 36% smaller per transistor 2 244 250 3.0 Normalized to Intel 3960X 130 172 51 3.3 2.3 2.4 1 1.5 0.9 0 WaEs GFLOP Bandwidth -
Lecture Notes
Lecture #4-5: Computer Hardware (Overview and CPUs) CS106E Spring 2018, Young In these lectures, we begin our three-lecture exploration of Computer Hardware. We start by looking at the different types of computer components and how they interact during basic computer operations. Next, we focus specifically on the CPU (Central Processing Unit). We take a look at the Machine Language of the CPU and discover it’s really quite primitive. We explore how Compilers and Interpreters allow us to go from the High-Level Languages we are used to programming to the Low-Level machine language actually used by the CPU. Most modern CPUs are multicore. We take a look at when multicore provides big advantages and when it doesn’t. We also take a short look at Graphics Processing Units (GPUs) and what they might be used for. We end by taking a look at Reduced Instruction Set Computing (RISC) and Complex Instruction Set Computing (CISC). Stanford President John Hennessy won the Turing Award (Computer Science’s equivalent of the Nobel Prize) for his work on RISC computing. Hardware and Software: Hardware refers to the physical components of a computer. Software refers to the programs or instructions that run on the physical computer. - We can entirely change the software on a computer, without changing the hardware and it will transform how the computer works. I can take an Apple MacBook for example, remove the Apple Software and install Microsoft Windows, and I now have a Window’s computer. - In the next two lectures we will focus entirely on Hardware. -
Recommendation to Handle Bare Dies
Recommendation to handle bare dies Rev. 1.3 General description This application note gives recommendations on how to handle bare dies* in Chip On Board (COB), Chip On Glass (COG) and flip chip technologies. Bare dies should not be handled as chips in a package. This document highlights some specific effects which could harm the quality and yield of the production. *separated piece(s) of semiconductor wafer that constitute(s) a discrete semiconductor or whole integrated circuit. International Electrotechnical Commission, IEC 62258-1, ed. 1.0 (2005-08). A dedicated vacuum pick up tool is used to manually move the die. Figure 1: Vacuum pick up tool and wrist-strap for ESD protection Delivery Forms Bare dies are delivered in the following forms: Figure 2: Unsawn wafer Application Note – Ref : APN001HBD1.3 FBC-0002-01 1 Recommendation to handle bare dies Rev. 1.3 Figure 3: Unsawn wafer in open wafer box for multi-wafer or single wafer The wafer is sawn. So please refer to the E-mapping file from wafer test (format: SINF, eg4k …) for good dies information, especially when it is picked from metal Film Frame Carrier (FFC). Figure 4: Wafer on Film Frame Carrier (FFC) Figure 5: Die on tape reel Figure 6: Waffle pack for bare die Application Note – Ref : APN001HBD1.3 FBC-0002-01 2 Recommendation to handle bare dies Rev. 1.3 Die Handling Bare die must be handled always in a class 1000 (ISO 6) clean room environment: unpacking and inspection, die bonding, wire bonding, molding, sealing. Handling must be reduced to the absolute minimum, un-necessary inspections or repacking tasks have to be avoided (assembled devices do not need to be handled in a clean room environment since the product is already well packed) Use of complete packing units (waffle pack, FFC, tape and reel) is recommended and remaining quantities have to be repacked immediately after any process (e.g. -
From Sand to Circuits
From sand to circuits By continually advancing silicon technology and moving the industry forward, we help empower people to do more. To enhance their knowledge. To strengthen their connections. To change the world. How Intel makes integrated circuit chips www.intel.com www.intel.com/museum Copyright © 2005Intel Corporation. All rights reserved. Intel, the Intel logo, Celeron, i386, i486, Intel Xeon, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. 0605/TSM/LAI/HP/XK 308301-001US From sand to circuits Revolutionary They are small, about the size of a fingernail. Yet tiny silicon chips like the Intel® Pentium® 4 processor that you see here are changing the way people live, work, and play. This Intel® Pentium® 4 processor contains more than 50 million transistors. Today, silicon chips are everywhere — powering the Internet, enabling a revolution in mobile computing, automating factories, enhancing cell phones, and enriching home entertainment. Silicon is at the heart of an ever expanding, increasingly connected digital world. The task of making chips like these is no small feat. Intel’s manufacturing technology — the most advanced in the world — builds individual circuit lines 1,000 times thinner than a human hair on these slivers of silicon. The most sophisticated chip, a microprocessor, can contain hundreds of millions or even billions of transistors interconnected by fine wires made of copper. Each transistor acts as an on/off switch, controlling the flow of electricity through the chip to send, receive, and process information in a fraction of a second.