Wishbone Bus Architecture – a Survey and Comparison
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IOTA: Detecting Erroneous I/O Behavior Via I/O Transaction Auditing
Appears in the First Workshop on Compiler and Architectural Techniques for Application Reliability and Security (CATARS) In Conjunction with the 2008 International Conference on Dependable Systems and Networks (DSN 2008) Anchorage, Alaska, June 2008 IOTA: Detecting Erroneous I/O Behavior via I/O Transaction Auditing Albert Meixner and Daniel J. Sorin Duke University [email protected], [email protected] Abstract nosed, the system could suggest that the user or system The correctness of the I/O system—and thus the administrator replace this device. If a driver bug is diag- nosed, the bug can be reported and the driver can be correctness of the computer—can be compromised by restarted (which is often sufficient). If a security breach hardware faults, driver bugs, and security breaches in is diagnosed, the system can shutdown the driver under downloaded device drivers. To detect erroneous I/O suspicion and alert the user. In this work, we focus on behavior, we have developed I/O Transaction Auditing error detection, rather than diagnosis and recovery. (IOTA), which checks the high-level behavior of I/O Our error detection mechanism, I/O Transaction transactions. In an IOTA-protected system, the operat- Auditing (IOTA), uses end-to-end checking [13] of I/O ing system creates a signature of the I/O transactions it transactions. We define a transaction as a high-level, expects to occur and every I/O device computes a signa- semantically atomic I/O operation, such as sending an ture of the transactions it actually performs. By compar- Ethernet frame. A transaction represents the basic I/O ing these signatures, IOTA can discover erroneous operation for higher level OS services such as the file behavior in both the hardware and the software respon- system or network stack. -
An Architecture and Compiler for Scalable On-Chip Communication
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. XX, NO. Y, MONTH 2004 1 An Architecture and Compiler for Scalable On-Chip Communication Jian Liang, Student Member, IEEE, Andrew Laffely, Sriram Srinivasan, and Russell Tessier, Member, IEEE Abstract— tion of communication resources. Significant amounts of arbi- A dramatic increase in single chip capacity has led to a tration across even a small number of components can quickly revolution in on-chip integration. Design reuse and ease-of- form a performance bottleneck, especially for data-intensive, implementation have became important aspects of the design pro- cess. This paper describes a new scalable single-chip communi- stream-based computation. This issue is made more complex cation architecture for heterogeneous resources, adaptive System- by the need to compile high-level representations of applica- On-a-Chip (aSOC), and supporting software for application map- tions to SoC environments. The heterogeneous nature of cores ping. This architecture exhibits hardware simplicity and opti- in terms of clock speed, resources, and processing capability mized support for compile-time scheduled communication. To il- makes cost modeling difficult. Additionally, communication lustrate the benefits of the architecture, four high-bandwidth sig- nal processing applications including an MPEG-2 video encoder modeling for interconnection with long wires and variable arbi- and a Doppler radar processor have been mapped to a prototype tration protocols limits performance predictability required by aSOC device using our design mapping technology. Through ex- computation scheduling. perimentation it is shown that aSOC communication outperforms Our platform for on-chip interconnect, adaptive System-On- a hierarchical bus-based system-on-chip (SoC) approach by up to a-Chip (aSOC), is a modular communications architecture. -
DESIGN of WISHBONE INTERFACED I2CMASTER CORE CONTROLLER USING VERILOG Ramesh Babu Dasara1, Y
DESIGN OF WISHBONE INTERFACED I2CMASTER CORE CONTROLLER USING VERILOG Ramesh Babu Dasara1, Y. Chandra Sekhar Reddy2 1Pursuing M.tech, 2Assistant Professor, from Nalanda Institute of Engineering and Technology (NIET), Siddharth Nagar, Kantepudi village, Sattenepalli Mandal, Guntur Dist.,A.P. (India) ABSTRACT In this paper we are implementing one of the serial communication protocol called Inter integrated circuit (I2C) master controller. The protocol is made of set of standards with the master and slave configuration to allow data transfer. The I2C master with wishbone controller is implemented in Verilog HDL. The modules are synthesized in Xilinx 13.2i. Then simulated to observe the operation of the Master controller and wishbone controller which performs high speed data transfer in presence of master or slave. This yields higher speed data transfer over the network. Keywords: Master,Wishbone, SDA,SCK,SLAVE I. INTRODUCTION In electronic world to make communication between any two digital hardware devices needs serial communication standards. There are several communication standards are RS232, RS435, and SPI to make high speed and low speed data transfer. To implement protocols actually we require more number of pin connections, whereas the size of IC gradually decreasing so we need a protocol that can have minimum number of pin connections. The protocols existed earlier are SPI, MOCROWIRE and USB needs point to point connection such that needs multiplexing of data and address. The proposed protocol requires only two lines two communicate with nay number of devices while other needs more number of pin connections. The I2c is best suited for medium range communication between the circuit boards within the equipment. -
On-Chip Interconnect Schemes for Reconfigurable System-On-Chip
On-chip Interconnect Schemes for Reconfigurable System-on-Chip Andy S. Lee, Neil W. Bergmann. School of ITEE, The University of Queensland, Brisbane Australia {andy, n.bergmann} @itee.uq.edu.au ABSTRACT On-chip communication architectures can have a great influence on the speed and area of System-on-Chip designs, and this influence is expected to be even more pronounced on reconfigurable System-on-Chip (rSoC) designs. To date, little research has been conducted on the performance implications of different on-chip communication architectures for rSoC designs. This paper motivates the need for such research and analyses current and proposed interconnect technologies for rSoC design. The paper also describes work in progress on implementation of a simple serial bus and a packet-switched network, as well as a methodology for quantitatively evaluating the performance of these interconnection structures in comparison to conventional buses. Keywords: FPGAs, Reconfigurable Logic, System-on-Chip 1. INTRODUCTION System-on-chip (SoC) technology has evolved as the predominant circuit design methodology for custom ASICs. SoC technology moves design from the circuit level to the system level, concentrating on the selection of appropriate pre-designed IP Blocks, and their interconnection into a complete system. However, modern ASIC design and fabrication are expensive. Design tools may cost many hundreds of thousands of dollars, while tooling and mask costs for large SoC designs now approach $1million. For low volume applications, and especially for research and development projects in universities, reconfigurable System-on-Chip (rSoC) technology is more cost effective. Like conventional SoC design, rSoC involves the assembly of predefined IP blocks (such as processors and peripherals) and their interconnection. -
Open Borders for System-On-A-Chip Buses: a Wire Format for Connecting Large Physics Controls
PHYSICAL REVIEW SPECIAL TOPICS - ACCELERATORS AND BEAMS 15, 082801 (2012) Open borders for system-on-a-chip buses: A wire format for connecting large physics controls M. Kreider,1,2 R. Ba¨r,1 D. Beck,1 W. Terpstra,1 J. Davies,2 V. Grout,2 J. Lewis,3 J. Serrano,3 and T. Wlostowski3 1GSI Helmholtz Centre for Heavy Ion Research, Darmstadt, Germany 2Glyndwˆ r University, Wrexham, United Kingdom 3CERN, Geneva, Switzerland (Received 27 January 2012; published 23 August 2012) System-on-a-chip (SoC) bus systems are typically confined on-chip and rely on higher level compo- nents to communicate with the outside world. The idea behind the EtherBone (EB) protocol is to extend the reach of the SoC bus to remote field-programmable gate arrays or processors. The EtherBone core implementation connects a Wishbone (WB) Ver. 4 Bus via a Gigabit Ethernet based network link to remote peripheral devices. EB acts as a transparent interconnect module towards attached WB Bus devices. EB was developed in the scope of the WhiteRabbit Timing Project at CERN and GSI/FAIR. WhiteRabbit will make use of EB as a means to issue commands to its timing nodes and control connected accelerator hardware. DOI: 10.1103/PhysRevSTAB.15.082801 PACS numbers: 84.40.Ua, 29.20.Àc, 07.05.Àt systems hosted inside a field-programmable gate array I. PURPOSE AND ENVIRONMENT (FPGA). EtherBone was named after these underlying This article builds on the paper by the title ‘‘EtherBone—A technologies, Ethernet and Wishbone. However, EB re- network Layer for the Wishbone SoC Bus’’ in the sides in the Open Systems Interconnection session layer ICALEPCS 2011 conference proceedings and aims to pro- (OSI layer 5) and does not depend on a specific choice of vide details on design choices and performance analysis for lower layer protocols in implementation. -
AXI Reference Guide
AXI Reference Guide [Guide Subtitle] [optional] UG761 (v13.4) January 18, 2012 [optional] Xilinx is providing this product documentation, hereinafter “Information,” to you “AS IS” with no warranty of any kind, express or implied. Xilinx makes no representation that the Information, or any particular implementation thereof, is free from any claims of infringement. You are responsible for obtaining any rights you may require for any implementation based on the Information. All specifications are subject to change without notice. XILINX EXPRESSLY DISCLAIMS ANY WARRANTY WHATSOEVER WITH RESPECT TO THE ADEQUACY OF THE INFORMATION OR ANY IMPLEMENTATION BASED THEREON, INCLUDING BUT NOT LIMITED TO ANY WARRANTIES OR REPRESENTATIONS THAT THIS IMPLEMENTATION IS FREE FROM CLAIMS OF INFRINGEMENT AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Except as stated herein, none of the Information may be copied, reproduced, distributed, republished, downloaded, displayed, posted, or transmitted in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise, without the prior written consent of Xilinx. © Copyright 2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, Kintex, Artix, ISE, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. ARM® and AMBA® are registered trademarks of ARM in the EU and other countries. All other trademarks are the property of their respective owners. Revision History The following table shows the revision history for this document: . Date Version Description of Revisions 03/01/2011 13.1 Second Xilinx release. -
PCI20EX PCI Express (Pcie)
PCI20EX PCI Express (PCIe) Bus ARCNET® Network Interface Modules INSTALLATION GUIDE INTRODUCTION The PCI20EX series of ARCNET network interface modules (NIMs) links PCI Express (PCIe) bus compatible computers with the ARCNET local area network (LAN). Since most PC motherboards have migrated from the legacy PCI and PCI-X Bus, a PCI Express style NIM is required. The PCI20EX series is compliant to the PCI Express Card Electromechanical Specification Revision 2.0 and both standard height and low-profile brackets are provided. The PCI Express interface allows for jumperless configuration and Plug and Play operation. The module operates with either an NDIS driver or a null stack driver in a Windows® environment. The PCI20EX incorporates the COM20022 ARCNET controller chip with enhanced features over the earlier generation ARCNET chips. New features include command chaining, sequential access to internal RAM, duplicate node ID detection and variable data rates up to 10 Mbps. Bus contention problems are minimized since the module’s interrupt and I/O base address are assigned through Plug and Play. The PCI20EX exploits the new features of the COM20022 which includes 10 Mbps communications utilizing the various EIA-485 transceiver options. Each PCI20EX module has two LEDs on the board for monitoring network operation and bus access to the module. It is equipped with an 8 position, general purpose DIP switch typically used to assign the ARCNET node address. Ultimately, the node address is configured via software so the DIP switch can also indicate user-defined functions such as data rate, cable interface, or master/slave status of the system. -
Datasheet for Onenand Power Ramp and Stabilization Times and for Onenand Boot Copy Times
TMS320DM365 www.ti.com SPRS457E–MARCH 2009–REVISED JUNE 2011 TMS320DM365 Digital Media System-on-Chip (DMSoC) Check for Samples: TMS320DM365 1 TMS320DM365 Digital Media System-on-Chip (DMSoC) 1.1 Features 12 • Highlights – Support for 32-Bit and 16-Bit – High-Performance Digital Media (Thumb® Mode) Instruction Sets System-on-Chip (DMSoC) – DSP Instruction Extensions and Single Cycle – Up to 300-MHz ARM926EJ-S Clock Rate MAC – Two Video Image Co-processors – ARM® Jazelle® Technology (HDVICP, MJCP) Engines – Embedded ICE-RT Logic for Real-Time – Supports a Range of Encode, Decode, and Debug Video Quality Operations • ARM9 Memory Architecture – Video Processing Subsystem – 16K-Byte Instruction Cache • HW Face Detect Engine – 8K-Byte Data Cache • Resize Engine from 1/16x to 8x – 32K-Byte RAM • 16-Bit Parallel AFE (Analog Front-End) – 16K-Byte ROM Interface Up to 120 MHz – Little Endian • 4:2:2 (8-/16-bit) Interface • Two Video Image Co-processors • 8-/16-bit YCC and Up to 24-Bit RGB888 (HDVICP, MJCP) Engines Digital Output – Support a Range of Encode and Decode • 3 DACs for HD Analog Video Output Operations, up to D1 on 216-MHz device and • Hardware On-Screen Display (OSD) up to 720p on the 270- and 300-MHz parts – Capable of 720p 30fps H.264 video – H.264, MPEG4, MPEG2, MJPEG, JPEG, processing WMV9/VC1 Note: 216-MHz is only capable of D1 • Video Processing Subsystem processing – Front End Provides: – Peripherals include EMAC, USB 2.0 OTG, • HW Face Detect Engine DDR2/NAND, 5 SPIs, 2 UARTs, 2 • Hardware IPIPE for Real-Time Image MMC/SD/SDIO, -
UVM Based Reusable Verification IP for Wishbone Compliant SPI Master
UVM Based Reusable Verification IP for Wishbone Compliant SPI Master Core Lakhan Shiva Kamireddy∗, Lakhan Saiteja Ky ∗VLSI CAD Research Group, Department of Electrical and Computer Engineering, University of Colorado Boulder, CO 80303, USA, Email: [email protected] yDepartment of Electronics and Electrical Communication Engineering, Indian Institute of Technology Kharagpur West Bengal 721302, India, Email: [email protected] Abstract—The System on Chip design industry relies heavily ming, coverage analysis, constrained randomization and as- on functional verification to ensure that the designs are bug- sertion based VIP. A methodological approach for verification free. As design engineers are coming up with increasingly dense increases the efficiency and reduces the verification effort. In chips with much functionality, the functional verification field has advanced to provide modern verification techniques. In this paper, we use UVM, a System Verilog based methodology this paper, we present verification of a wishbone compliant for testing an SPI master core that is wishbone compliant. Serial Peripheral Interface (SPI) Master core using a System The paper is organized into the following sections: Section Verilog based standard verification methodology, the Universal II introduces the key features of SV and UVM environment. Verification Methodology (UVM). By making use of UVM factory In Section-III, we introduce the SPI Master IP core for pattern with parameterized classes, we have developed a robust and reusable verification IP. SPI is a full duplex communication which the UVM framework is developed. Section-IV presents protocol used to interface components most likely in embedded our approach towards the development of UVM based VIP. systems. We have verified an SPI Master IP core design that Simulation results with snapshots and a critical discussion of is wishbone compliant and compatible with SPI protocol and the limitations of the design are presented in Section-V. -
An Overview of Soc Buses
Vojin Oklobdzija/Digital Systems and Applications 6195_C007 Page Proof page 1 11.7.2007 2:16am Compositor Name: JGanesan 7 An Overview of SoC Buses 7.1 Introduction....................................................................... 7-1 7.2 On-Chip Communication Architectures ........................ 7-2 Background . Topologies . On-Chip Communication Protocols . Other Interconnect Issues . Advantages and M. Mitic´ Disadvantages of On-Chip Buses M. Stojcˇev 7.3 System-On-Chip Buses ..................................................... 7-4 AMBA Bus . Avalon . CoreConnect . STBus . Wishbone . University of Nisˇ CoreFrame . Manchester Asynchronous Bus for Low Energy . Z. Stamenkovic´ PI Bus . Open Core Protocol . Virtual Component Interface . m IHP GmbH—Innovations for High SiliconBackplane Network Performance Microelectronics 7.4 Summary.......................................................................... 7-15 7.1 Introduction The electronics industry has entered the era of multimillion-gate chips, and there is no turning back. This technology promises new levels of integration on a single chip, called the system-on-a-chip (SoC) design, but also presents significant challenges to the chip designers. Processing cores on a single chip may number well into the high tens within the next decade, given the current rate of advancements [1]. Interconnection networks in such an environment are, therefore, becoming more and more important [2]. Currently, on-chip interconnection networks are mostly implemented using buses. For SoC applications, design reuse becomes easier if standard internal connection buses are used for interconnecting components of the design. Design teams developing modules intended for future reuse can design interfaces for the standard bus around their particular modules. This allows future designers to slot the reuse module into their new design simply, which is also based around the same standard bus [3]. -
VICTORIA UNIVERSITY of WELLINGTON Te Whare W
VICTORIAUNIVERSITYOFWELLINGTON Te Whare Wananga¯ o te UpokooteIkaaM¯ aui¯ School of Engineering and Computer Science Te Kura Matai¯ Pukaha,¯ Purorohiko¯ PO Box 600 Tel: +64 4 463 5341 Wellington Fax: +64 4 463 5045 New Zealand Internet: offi[email protected] Development of an IoT System for Environmental Monitoring Jolon Behrent Supervisor: James Quilty Submitted in partial fulfilment of the requirements for Bachelor of Engineering with Honours. Abstract The Greater Wellington Regional Council currently uses data loggers to mon- itor the environment. These loggers and accompanying software are provided by a single supplier which effectively locks the Council into using them for all monitoring. The Council wants to develop a low-cost, open-source Internet of Things solution with a connection to a cloud platform. This report looks at the development of a successful proof-of-concept device capable of reading from sensors and transmitting the data to Azure. Contents 1 Introduction and Background 1 1.1 Introduction . .1 1.1.1 Objective . .1 1.1.2 Overview . .2 1.2 Background . .2 1.2.1 HyQuest Solutions Data Loggers . .2 1.2.2 SDI-12 . .3 2 Design 5 2.1 Design Constraints . .5 2.1.1 Power Consumption . .5 2.1.2 Size . .6 2.1.3 Cost . .6 2.2 Microcontroller Selection . .6 2.3 Modem Selection . .7 2.4 Capacitor Selection . .8 2.5 Regulator Selection . .9 2.6 PCB Design . .9 2.7 Enabling Local Wireless Connection . 10 2.7.1 Reed Switches . 11 2.7.2 Hall Effect Sensors . 11 2.8 SDI-12 Design . -
GS3 Greenhouse Sensor 2365 NE Hopkins Ct / Pullman, WA 99163 USA Volumetric Water Content, Electrical Conductivity, and Temperature
GS3 Greenhouse Sensor 2365 NE Hopkins Ct / Pullman, WA 99163 USA Volumetric Water Content, Electrical Conductivity, and Temperature APPLICATIONS DESCRIPTION . Greenhouse substrate monitoring. The Decagon GS3 sensor is an accurate tool for . Volumetric water content measurement. monitoring electrical conductivity, volumetric water . Soil/Substrate water balance. content, and temperature in soil and soilless . Irrigation management. substrates. The GS3 determines volumetric water . Electrical Conductivity measurement. content (VWC) by measuring the dielectric constant . Salt management. (εa) of the medium using capacitance / frequency- . Fertilizer movement. domain technology. The sensor uses a 70 MHz . Soil/Substrate temperature measurement. frequency, which minimizes textural and salinity . Modeling processes that are affected by effects, making the GS3 accurate in most soilless temperature. substrates. The GS3 measures temperature using an onboard thermistor, and electrical conductivity using a stainless steel electrode array. ADVANTAGES For a more detailed description of how this sensor . Digital sensor communicates three makes measurements, refer to the User Manual. measurements over a serial interface. 2-probe EC measurement. Robust thermistor for accurate temperature AUDIENCE measurements. Decagon provides the information in this integrators . Low input voltage requirements. guide to help GS3 customers establish . Low power design supports battery-operated communication between these sensors and their data loggers. data acquisition equipment or field data loggers. Robust epoxy encapsulation and stainless Customers using data loggers that support SDI-12 steel needles to resist corrosive environments. sensor communications should consult the user's . Supports SDI-12 or DDI-Serial 1-wire serial manual for their data logger. These sensors are fully communications protocols. integrated into Decagon's system of plug-and-play .