Computing Platforms Chapter 4
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ECESATUSB1 This Expresscard Power Esata Port Controller Card
1 Port ExpressCard Power eSATA Controller Adapter Card StarTech ID: ECESATUSB1 This ExpressCard Power eSATA port controller card can be installed in an available ExpressCard 34/54 mm slot to provide a powered eSATA connection, and also alternatively provide either external SATA (data only) or USB 2.0 connectivity from one uniquely designed port if using with standard eSATA or USB devices. An ideal solution for using an eSATA SSD Flash drive on your laptop, the power eSATA card delivers both a high speed eSATA connection and power from the combined USB port. A versatile connectivity solution, the card features built-in port multiplier support, allowing multi-drive eSATA storage enclosures to be connected to the host computer using a single eSATA cable. Taking advantage of the transfer speed of eSATA connection and the 5V power output of the USB 2.0 port, the ExpressCard Power eSATA adapter is the perfect answer for connecting compatible mobile drive enclosures, similar to the built-in power eSATA port provided by the following laptop computers: Toshiba: Satellite E105, A350, Satellite Pro P300; Qosmio G50, X305, Portege A600, M750, R500, R600; and Tecra M10, R10, A10. Dell: Studio 15, 17; Latitude E6400, E6500; Precision M2400, M4400, M6400, M6400 Covet. Applications Connects to eSATA SSD Flash drives, such as OCZ Throttle, Kangaru e-Flash drives and Ridata Racer series flash drives Provides connectivity between Notebooks and PCs with ExpressCard slots to external drive enclosures with Power eSATA (eSATA+USB) port, or with regular eSATA -
The Road Ahead for Computing Systems
56 JANUARY 2019 HiPEAC conference 2019 The road ahead for Valencia computing systems Monica Lam on keeping the web open Alberto Sangiovanni Vincentelli on building tech businesses Koen Bertels on quantum computing Tech talk 2030 contents 7 14 16 Benvinguts a València Monica Lam on open-source Starting and scaling a successful voice assistants tech business 3 Welcome 30 SME snapshot Koen De Bosschere UltraSoC: Smarter systems thanks to self-aware chips 4 Policy corner Rupert Baines The future of technology – looking into the crystal ball 33 Innovation Europe Sandro D’Elia M2DC: The future of modular microserver technology 6 News João Pita Costa, Ariel Oleksiak, Micha vor dem Berge and Mario Porrmann 14 HiPEAC voices 34 Innovation Europe ‘We are witnessing the creation of closed, proprietary TULIPP: High-performance image processing for linguistic webs’ embedded computers Monica Lam Philippe Millet, Diana Göhringer, Michael Grinberg, 16 HiPEAC voices Igor Tchouchenkov, Magnus Jahre, Magnus Peterson, ‘Do not think that SME status is the final game’ Ben Rodriguez, Flemming Christensen and Fabien Marty Alberto Sangiovanni Vincentelli 35 Innovation Europe 18 Technology 2030 Software for the big data era with E2Data Computing for the future? The way forward for Juan Fumero computing systems 36 Innovation Europe Marc Duranton, Madeleine Gray and Marcin Ostasz A RECIPE for HPC success 23 Technology 2030 William Fornaciari Tech talk 2030 37 Innovation Europe Solving heterogeneous challenges with the 24 Future compute special Heterogeneity Alliance -
Computer Bus Characteristics
Upendra Sharma (upsharma.in) Computer Bus A bus, in computing, is a set of physical connections (cables, printed circuits, etc.) which can be shared by multiple hardware components in order to communicate with one another. The purpose of buses is to reduce the number of "pathways" needed for communication between the components, by carrying out all communications over a single data channel. This is why the metaphor of a "data highway" is sometimes used. If only two hardware components communicate over the line, it is called a hardware port (such as a serial port or parallel port). Characteristics A bus is characterised by the amount of information that can be transmitted at once. This amount, expressed in bits, corresponds to the number of physical lines over which data is sent simultaneously. A 32-wire ribbon cable can transmit 32 bits in parallel. The term "width" is used to refer to the number of bits that a bus can transmit at once. Additionally, the bus speed is also defined by its frequency (expressed in Hertz), the number of data packets sent or received per second. Each time that data is sent or received is called a cycle. This way, it is possible to find the maximum transfer speed of the bus, the amount of data which it can transport per unit of time, by multiplying its width by its frequency. A bus with a width of 16 bits and a frequency of 133 MHz, therefore, has a transfer speed equal to: Upendra Sharma (upsharma.in) Types of Buses In reality, each bus is generally constituted of 50 to 100 distinct physical lines, divided into three subassemblies: The address bus (sometimes called the memory bus) transports memory addresses which the processor wants to access in order to read or write data. -
Fog Computing: a Platform for Internet of Things and Analytics
Fog Computing: A Platform for Internet of Things and Analytics Flavio Bonomi, Rodolfo Milito, Preethi Natarajan and Jiang Zhu Abstract Internet of Things (IoT) brings more than an explosive proliferation of endpoints. It is disruptive in several ways. In this chapter we examine those disrup- tions, and propose a hierarchical distributed architecture that extends from the edge of the network to the core nicknamed Fog Computing. In particular, we pay attention to a new dimension that IoT adds to Big Data and Analytics: a massively distributed number of sources at the edge. 1 Introduction The “pay-as-you-go” Cloud Computing model is an efficient alternative to owning and managing private data centers (DCs) for customers facing Web applications and batch processing. Several factors contribute to the economy of scale of mega DCs: higher predictability of massive aggregation, which allows higher utilization with- out degrading performance; convenient location that takes advantage of inexpensive power; and lower OPEX achieved through the deployment of homogeneous compute, storage, and networking components. Cloud computing frees the enterprise and the end user from the specification of many details. This bliss becomes a problem for latency-sensitive applications, which require nodes in the vicinity to meet their delay requirements. An emerging wave of Internet deployments, most notably the Internet of Things (IoTs), requires mobility support and geo-distribution in addition to location awareness and low latency. We argue that a new platform is needed to meet these requirements; a platform we call Fog Computing [1]. We also claim that rather than cannibalizing Cloud Computing, F. Bonomi R. -
An Architecture and Compiler for Scalable On-Chip Communication
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. XX, NO. Y, MONTH 2004 1 An Architecture and Compiler for Scalable On-Chip Communication Jian Liang, Student Member, IEEE, Andrew Laffely, Sriram Srinivasan, and Russell Tessier, Member, IEEE Abstract— tion of communication resources. Significant amounts of arbi- A dramatic increase in single chip capacity has led to a tration across even a small number of components can quickly revolution in on-chip integration. Design reuse and ease-of- form a performance bottleneck, especially for data-intensive, implementation have became important aspects of the design pro- cess. This paper describes a new scalable single-chip communi- stream-based computation. This issue is made more complex cation architecture for heterogeneous resources, adaptive System- by the need to compile high-level representations of applica- On-a-Chip (aSOC), and supporting software for application map- tions to SoC environments. The heterogeneous nature of cores ping. This architecture exhibits hardware simplicity and opti- in terms of clock speed, resources, and processing capability mized support for compile-time scheduled communication. To il- makes cost modeling difficult. Additionally, communication lustrate the benefits of the architecture, four high-bandwidth sig- nal processing applications including an MPEG-2 video encoder modeling for interconnection with long wires and variable arbi- and a Doppler radar processor have been mapped to a prototype tration protocols limits performance predictability required by aSOC device using our design mapping technology. Through ex- computation scheduling. perimentation it is shown that aSOC communication outperforms Our platform for on-chip interconnect, adaptive System-On- a hierarchical bus-based system-on-chip (SoC) approach by up to a-Chip (aSOC), is a modular communications architecture. -
2 Port Flush Mount Expresscard 54Mm Superspeed USB 3.0 Card Adapter Startech ID: ECUSB3S254F
2 Port Flush Mount ExpressCard 54mm SuperSpeed USB 3.0 Card Adapter StarTech ID: ECUSB3S254F The ECUSB3S254F 2-Port Flush Mount USB 3.0 ExpressCard Adapter uses a unique form factor design that allows it to sit fully in a standard 54mm laptop ExpressCard slot without sticking out. When inserted, the USB 3.0 ports provided by the ExpressCard adapter sit flush with the sides of the laptop, creating a seamless add-on that can be left installed even while on the move, without having to worry about impact damage to either the card or the ExpressCard slot. The SuperSpeed USB 3.0 Card supports data transfer rates of up to 5Gbps, and is backward compatible with USB 2.0 (at up to 480Mbps), or USB 1.1/1.0 at up to 12/1.5 Mbps respectively - the perfect laptop accessory for users to connect USB devices, both new and old. Applications Users who need USB connectivity, but do not need to swap between other ExpressCard adapters, so will leave the card installed in the card slot Mobile users who want to leave ExpressCard adapters installed, without worry about damaging the card or slot while on the move Connect high performance USB 3.0 external storage devices to a laptop Upgrade an older laptop with USB 3.0 connectivity Expand on your laptop expansion capabilities with additional USB ports Features Unique flush-mount form factor design Two SuperSpeed USB 3.0 compliant ports with support for transfer rates up to 5 Gbps Backward compatible with USB 2.0/1.x devices Compliant with USB 3.0 base specification 1.0 and xHCI specification 0.95 Compliant with -
On-Chip Interconnect Schemes for Reconfigurable System-On-Chip
On-chip Interconnect Schemes for Reconfigurable System-on-Chip Andy S. Lee, Neil W. Bergmann. School of ITEE, The University of Queensland, Brisbane Australia {andy, n.bergmann} @itee.uq.edu.au ABSTRACT On-chip communication architectures can have a great influence on the speed and area of System-on-Chip designs, and this influence is expected to be even more pronounced on reconfigurable System-on-Chip (rSoC) designs. To date, little research has been conducted on the performance implications of different on-chip communication architectures for rSoC designs. This paper motivates the need for such research and analyses current and proposed interconnect technologies for rSoC design. The paper also describes work in progress on implementation of a simple serial bus and a packet-switched network, as well as a methodology for quantitatively evaluating the performance of these interconnection structures in comparison to conventional buses. Keywords: FPGAs, Reconfigurable Logic, System-on-Chip 1. INTRODUCTION System-on-chip (SoC) technology has evolved as the predominant circuit design methodology for custom ASICs. SoC technology moves design from the circuit level to the system level, concentrating on the selection of appropriate pre-designed IP Blocks, and their interconnection into a complete system. However, modern ASIC design and fabrication are expensive. Design tools may cost many hundreds of thousands of dollars, while tooling and mask costs for large SoC designs now approach $1million. For low volume applications, and especially for research and development projects in universities, reconfigurable System-on-Chip (rSoC) technology is more cost effective. Like conventional SoC design, rSoC involves the assembly of predefined IP blocks (such as processors and peripherals) and their interconnection. -
AXI Reference Guide
AXI Reference Guide [Guide Subtitle] [optional] UG761 (v13.4) January 18, 2012 [optional] Xilinx is providing this product documentation, hereinafter “Information,” to you “AS IS” with no warranty of any kind, express or implied. Xilinx makes no representation that the Information, or any particular implementation thereof, is free from any claims of infringement. You are responsible for obtaining any rights you may require for any implementation based on the Information. All specifications are subject to change without notice. XILINX EXPRESSLY DISCLAIMS ANY WARRANTY WHATSOEVER WITH RESPECT TO THE ADEQUACY OF THE INFORMATION OR ANY IMPLEMENTATION BASED THEREON, INCLUDING BUT NOT LIMITED TO ANY WARRANTIES OR REPRESENTATIONS THAT THIS IMPLEMENTATION IS FREE FROM CLAIMS OF INFRINGEMENT AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Except as stated herein, none of the Information may be copied, reproduced, distributed, republished, downloaded, displayed, posted, or transmitted in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise, without the prior written consent of Xilinx. © Copyright 2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, Kintex, Artix, ISE, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. ARM® and AMBA® are registered trademarks of ARM in the EU and other countries. All other trademarks are the property of their respective owners. Revision History The following table shows the revision history for this document: . Date Version Description of Revisions 03/01/2011 13.1 Second Xilinx release. -
PDP-11 Bus Handbook (1979)
The material in this document is for informational purposes only and is subject to change without notice. Digital Equipment Corpo ration assumes no liability or responsibility for any errors which appear in, this document or for any use made as a result thereof. By publication of this document, no licenses or other rights are granted by Digital Equipment Corporation by implication, estoppel or otherwise, under any patent, trademark or copyright. Copyright © 1979, Digital Equipment Corporation The following are trademarks of Digital Equipment Corporation: DIGITAL PDP UNIBUS DEC DECUS MASSBUS DECtape DDT FLIP CHIP DECdataway ii CONTENTS PART 1, UNIBUS SPECIFICATION INTRODUCTION ...................................... 1 Scope ............................................. 1 Content ............................................ 1 UNIBUS DESCRIPTION ................................................................ 1 Architecture ........................................ 2 Unibus Transmission Medium ........................ 2 Bus Terminator ..................................... 2 Bus Segment ....................................... 3 Bus Repeater ....................................... 3 Bus Master ........................................ 3 Bus Slave .......................................... 3 Bus Arbitrator ...................................... 3 Bus Request ....................................... 3 Bus Grant ......................................... 3 Processor .......................................... 4 Interrupt Fielding Processor ......................... -
A Dynamic Cloud Computing Platform for Ehealth Systems
A Dynamic Cloud Computing Platform for eHealth Systems Mehdi Bahrami 1 and Mukesh Singhal 2 Cloud Lab University of California Merced, USA Email: 1 IEEE Senior Member, [email protected]; 2 IEEE Fellow, [email protected] Abstract— Cloud Computing technology offers new Application Programming Interface (API) could have some opportunities for outsourcing data, and outsourcing computation issue when the application transfer to a cloud computing system to individuals, start-up businesses, and corporations in health that needs to redefine or modify the security functions of the API care. Although cloud computing paradigm provides interesting, in order to use the cloud. Each cloud computing system offer and cost effective opportunities to the users, it is not mature, and own services to using the cloud introduces new obstacles to users. For instance, vendor lock-in issue that causes a healthcare system rely on a cloud Security Issue: Data security refers to accessibility of stored vendor infrastructure, and it does not allow the system to easily data to only authorized users, and network security refers to transit from one vendor to another. Cloud data privacy is another accessibility of transfer of data between two authorized users issue and data privacy could be violated due to outsourcing data through a network. Since cloud computing uses the Internet as to a cloud computing system, in particular for a healthcare system part of its infrastructure, stored data on a cloud is vulnerable to that archives and processes sensitive data. In this paper, we both a breach in data and network security. present a novel cloud computing platform based on a Service- Oriented cloud architecture. -
Wishbone Bus Architecture – a Survey and Comparison
International Journal of VLSI design & Communication Systems (VLSICS) Vol.3, No.2, April 2012 WISHBONE BUS ARCHITECTURE – A SURVEY AND COMPARISON Mohandeep Sharma 1 and Dilip Kumar 2 1Department of VLSI Design, Center for Development of Advanced Computing, Mohali, India [email protected] 2ACS - Division, Center for Development of Advanced Computing, Mohali, India [email protected] ABSTRACT The performance of an on-chip interconnection architecture used for communication between IP cores depends on the efficiency of its bus architecture. Any bus architecture having advantages of faster bus clock speed, extra data transfer cycle, improved bus width and throughput is highly desirable for a low cost, reduced time-to-market and efficient System-on-Chip (SoC). This paper presents a survey of WISHBONE bus architecture and its comparison with three other on-chip bus architectures viz. Advanced Microcontroller Bus Architecture (AMBA) by ARM, CoreConnect by IBM and Avalon by Altera. The WISHBONE Bus Architecture by Silicore Corporation appears to be gaining an upper edge over the other three bus architecture types because of its special performance parameters like the use of flexible arbitration scheme and additional data transfer cycle (Read-Modify-Write cycle). Moreover, its IP Cores are available free for use requiring neither any registration nor any agreement or license. KEYWORDS SoC buses, WISHBONE Bus, WISHBONE Interface 1. INTRODUCTION The introduction and advancement of multimillion-gate chips technology with new levels of integration in the form of the system-on-chip (SoC) design has brought a revolution in the modern electronics industry. With the evolution of shrinking process technologies and increasing design sizes [1], manufacturers are integrating increasing numbers of components on a chip. -
An Overview of Soc Buses
Vojin Oklobdzija/Digital Systems and Applications 6195_C007 Page Proof page 1 11.7.2007 2:16am Compositor Name: JGanesan 7 An Overview of SoC Buses 7.1 Introduction....................................................................... 7-1 7.2 On-Chip Communication Architectures ........................ 7-2 Background . Topologies . On-Chip Communication Protocols . Other Interconnect Issues . Advantages and M. Mitic´ Disadvantages of On-Chip Buses M. Stojcˇev 7.3 System-On-Chip Buses ..................................................... 7-4 AMBA Bus . Avalon . CoreConnect . STBus . Wishbone . University of Nisˇ CoreFrame . Manchester Asynchronous Bus for Low Energy . Z. Stamenkovic´ PI Bus . Open Core Protocol . Virtual Component Interface . m IHP GmbH—Innovations for High SiliconBackplane Network Performance Microelectronics 7.4 Summary.......................................................................... 7-15 7.1 Introduction The electronics industry has entered the era of multimillion-gate chips, and there is no turning back. This technology promises new levels of integration on a single chip, called the system-on-a-chip (SoC) design, but also presents significant challenges to the chip designers. Processing cores on a single chip may number well into the high tens within the next decade, given the current rate of advancements [1]. Interconnection networks in such an environment are, therefore, becoming more and more important [2]. Currently, on-chip interconnection networks are mostly implemented using buses. For SoC applications, design reuse becomes easier if standard internal connection buses are used for interconnecting components of the design. Design teams developing modules intended for future reuse can design interfaces for the standard bus around their particular modules. This allows future designers to slot the reuse module into their new design simply, which is also based around the same standard bus [3].