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Session 4 Chair: M. Goosey Speakers: 1. Clare: Damage mechanics model for power module structures 2. Tabasnikov: Integration of sensors and microsystems with silicon carbide based IC technology 3. Seager: Wearable Antenna Research 4. Williams: 3D photolitography 5. Foster: Capability and possible projects 6. Samie: Highly Reliable FPGA Array for Safety Critical Application R2i – Connecting Research to Industry

Damage mechanics model for power module structures J.P. Clare PhD Student [email protected]

• Power Electronics Component Reliability • Physics of Failure Reliability & Prognostics • Damage Mechanics R2i – Connecting Research to Industry Research Challenges • Power Electronics – Use of semiconductors for energy control and transformation (Si, SiC, GaN) – Key enabler of low carbon economy • Reliability – Packaging is critical for reliability – Need for new reliability models – Mostly based on empirical models • Research Challenges – Develop accurate physics of failure models – Based on damage mechanics – Enable design for reliability and robustness – Include within a prognostics and health management framework R2i – Connecting Research to Industry Business Case • £70bn direct global market – growing at a rate of over 11% per annum – UK a major player • Future packaging requires better failure models – Transport, Oil & Gas, Renewable Energy, etc R2i – Connecting Research to Industry Current Status of Research • RODENT Project – In collaboration with + Industry partners (funded by IeMRC) • Physics of failure models – Failure models for wire bonds, SnAg solder, sintered Ag interconnects – Based on damage mechanics • Include microstructural effects • Transient crack propagation models based on measured loads

3.492 1.023 0.05 p N fp1.18 D 1e N f 178L p  R2i – Connecting Research to Industry Future Work • Complete PhD studies (2nd year) – Continue development of Physics-of-failure models – Validate with experiments from University Nottingham and Industry Partners • Embed models into a prognostics framework (year 3) • Outreach to industry partners and new EPSRC project “Underpinning Power Electronics”

R2i – Connecting Research to Industry

Integration of sensors and microsystems with silicon carbide based IC technology

Aleksandr Tabasnikov School of Engineering, The E-mail: [email protected]

• Microsystems, materials and processes compatible with SiC CMOS technology. • Enabling sensors for extreme conditions, such as high temperatures R2i – Connecting Research to Industry Overview of Research Aims

• Develop post-IC processes that can be used to integrate sensors with silicon carbide based CMOS electronics • Processes should be compatible with the temperature budget of underlying circuits • Ensure that sensor has sustained performance in harsh environments: radiation, corrosion, vibration etc.

2 R2i – Connecting Research to Industry Target Markets • Aerospace, automotive and energy industries have a pronounced interest in the technology • May enter high-value market of High Pressure High Temperature (HPHT) sensors

3 R2i – Connecting Research to Industry Current Status of Research • Structure ready to be integrated with SiC electronics

• Produces a linear response to temperature

4 R2i – Connecting Research to Industry Future Work and Collaboration

• In the process of completing the design and demonstrating a sensor capable of SiC integration • Looking for the next sensor type: – Piezoelectric – Nanowire

• Seeking collaboration to develop the sensor technology further

5 R2i – Connecting Research to Industry

Wearable Antenna Research

Rob Seager Wireless Communications Research (WiCR) [email protected]

• Research Programme on Fabric Antennas • Research Expertise in wearable antennas R2i – Connecting Research to Industry

Wireless Communications Research (WiCR) • World leading centre on wearable antennas • Large group of antenna researchers with in- depth experience of developing fabric based antennas and wearable systems • Multidisciplinary group involving – Wireless Communications Research (WiCR) Embroidering a Frequency Selective – Advanced Textiles Group (Nottingham Trent Surface (FSS) conductor pattern University) – School of the Arts (Loughborough) – Design School (Loughborough) – Cash’s (Coventry) – Antrum Ltd – Advanced Therapeutic Materials • Long track record of published research in area

Screen printed Frequency Selective Surface (FSS) conductor pattern R2i – Connecting Research to Industry

Capabilities • Fabric samples produced by – embroidery Transmit horn measuring – weaving embroidered FSS – screen printing • Range of antenna test chambers and test equipment for evaluation of samples • Simulation and production facilities in house • Comfortable working with industry • Extending our techniques for producing High Frequency Circuits R2i – Connecting Research to Industry

Woven patch antenna Embroidered planar dipole in measure- ment chamber

• IeMRC project (High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communications.) in final year: – Fully fabric embroidered antennas produced • Microstrip patch and planar dipoles – Performance indicates antennas may be moved towards production – Techniques to reduce the cost without compromising performance addressed R2i – Connecting Research to Industry

Where Now? • Extend areas in research programmes • Require input for focussing product based R&D. • We need investors to fund innovative research • We need collaboration with industry to align our work with UK and international requirements. • We can work with partners for our mutual benefit. R2i – Connecting Research to Industry 3D Photolithography Gavin Williams [email protected]

• Photolithography normally confined to patterning of flat substrates

• We show how its remit can be extended to grossly non‐planar substrates by using computer‐generated holograms R2i – Connecting Research to Industry The 3D Challenge: Light Standard mask For z > 0, diffraction places limit on the resolution A Solution: Laser light Computer‐generated hologram (CGH) ‐ focussing at any z

(adapted from Zeitner Proc. SPIE 8249 82490Q 2012) R2i – Connecting Research to Industry Computer generated holograms…

Analytical CGH (binary amplitude) Iterative CGH (256 phase levels) …used in conjunction with conformable photoresist R2i – Connecting Research to Industry Examples

10 µm 8 µm

Discrete lines on sloped, vertical and curved surfaces

100 µm

r = 10 mm

Arbitrary patterns on sloped and vertical surfaces R2i – Connecting Research to Industry Summary

Photolithography is cost‐effective for mass production

Our research shows that it can be used for patterning non‐planar substrates

Plenty of opportunities for R & D… R2i – Connecting Research to Industry

Dr Martin Foster

Department of Electronic and Electrical Engineering University of Sheffield [email protected]

Capability and possible projects R2i – Connecting Research to Industry

• Electrical Machines and Drives Research Group undertakes fundamental and applied research on – Machines (motor/generator/actuators) – Power electronic energy conversions (drive systems, power converters, induction heating)

Temperature of Q5 Drain 110 – Power electronic devices (SiC, GaN) 100 90

80

70 – Thermal management 60 50 Temperature (°C) Temperature 40 Measured Temperature 30 Temperature as Predicted 60s previously 20 0 100 200 300 400 500 600 700 – Energy storage time (seconds) R2i – Connecting Research to Industry • Across all market sectors – Aerospace, automotive, marine, renewables, consumer electronics R2i – Connecting Research to Industry

• Capabilities include – Electrical machine & drive design and testing • Rapid prototyping, dynamometers, environmental chambers – Power electronic semiconductor • Cleanrooms, packaging – Energy storage systems • Flywheels, battery cycling and profiling • Health and lifetime prediction for batteries R2i – Connecting Research to Industry

• EV Battery Second Life applications – After approx. 5 years battery considered no longer suitable for EV application • Still some latent capability – Reuse battery in static energy storage applications • Domestic level renewable • EV charge point buffer • Grid reinforcement R2i – Connecting Research to Industry

• Sheffield’s expertise includes – Battery characterisation – State of charge/health – Power electronic conversion – Scenario modelling – Arrangement with battery recycler Impedance (ohms) R2i – Connecting Research to Industry

• Fundamental research has been completed – Technology is here – Business case • Looking for partners in EV world, power conversion, power network to support small- scale prototyping Solar Array Daily Output R2i – Connecting Research to Industry IVHM COE

Highly Reliable FPGA Array for Safety Critical Application

Mohammad Samie University [email protected]

• Radiation & Temperature Tolerant

IVHM©2012IVHM©2012 Cranfield University All All rights rights Reserved Reserved http://www.cranfield.ac.uk/ivhm R2i – Connecting Research to Industry IVHM COE

SEU: Single Event Upset

Solutions:

. Self-Healing . Fault-Tolerant

IVHM©2012IVHM©2012 Cranfield Cranfield University University All All rights rights Reserved Reserved http://www.cranfield.ac.uk/ivhm R2i – Connecting Research to Industry IVHM COE

• Business/Research opportunity & Interests

– Safety Critical Application – Reliability – Aerospace – Space – Medical Industries – Nuclear – ASIC & FPGA

IVHM©2012IVHM©2012 Cranfield Cranfield University University All All rights rights Reserved Reserved http://www.cranfield.ac.uk/ivhm R2i – Connecting Research to Industry IVHM COE

• Where the research project/proposal is being promoted: – EPSRC – Proof of Concept – Simulation, Verification & Demonstration - Multiplier, PID Controller, - Robot Movement controller

• Challenge: Self-Healing & Fault-Tolerant

Matlab

M-File

Hardware Co- XUPV5-5 ePic2 E-Puck simulator

IVHM©2012IVHM©2012 Cranfield Cranfield University University All All rights rights Reserved Reserved http://www.cranfield.ac.uk/ivhm R2i – Connecting Research to Industry

• Next steps? ASIC Design, Design Tools & Fabrication

• What sort of collaboration is needed? Design Flow Tools, Synthesis, Place & Route

• Fund? TSB, FP7, Industries

IVHM©2012 Cranfield University All rights Reserved http://www.cranfield.ac.uk/ivhm Thank you for your attention Any Questions?

Speakers: 1. Clare: Damage mechanics model for power module structures 2. Tabasnikov: Integration of sensors and microsystems with silicon carbide based IC technology 3. Seager: Wearable Antenna Research 4. Williams: 3D photolitography 5. Foster: Capability and possible projects 6. Samie: Highly Reliable FPGA Array for Safety Critical Application