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Core™ I7-900 Desktop Processor Extreme Edition Series and Intel® Core™ I7-900 Desktop Processor Series

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Core™ I7-900 Desktop Processor Extreme Edition Series and Intel® Core™ I7-900 Desktop Processor Series Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Datasheet, Volume 1 February 2010 Document # 320834-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel Core™ i7-900 desktop processor Extreme Edition series and Intel Core™ i7-900 desktop processor series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details. Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology- enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see http://www.intel.com/products/ht/hyperthreading_more.htm Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software configurations. See www.intel.com/info/em64t for more information including details on which processors support Intel® 64 or consult with your system vendor for more information. ± Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and for some uses, certain platform software, enabled for it. Functionality, performance or other benefit will vary depending on hardware and software configurations. Intel Virtualization Technology-enabled VMM applications are currently in development. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality. Enhanced Intel® SpeedStep Technology. See the Processor Spec Finder or contact your Intel representative for more information. Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Intel SpeedStep, Intel Core, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2008–2010 Intel Corporation. 2 Datasheet Contents 1Introduction..............................................................................................................9 1.1 Terminology ..................................................................................................... 10 1.2 References ....................................................................................................... 11 2 Electrical Specifications ........................................................................................... 13 2.1 Intel® QPI Differential Signaling .......................................................................... 13 2.2 Power and Ground Lands.................................................................................... 13 2.3 Decoupling Guidelines........................................................................................ 13 2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling......................................................... 14 2.4 Processor Clocking (BCLK_DP, BCLK_DN) ............................................................. 14 2.4.1 PLL Power Supply................................................................................... 14 2.5 Voltage Identification (VID) ................................................................................ 14 2.6 Reserved or Unused Signals................................................................................ 17 2.7 Signal Groups ................................................................................................... 18 2.8 Test Access Port (TAP) Connection....................................................................... 19 2.9 Platform Environmental Control Interface (PECI) DC Specifications........................... 20 2.9.1 DC Characteristics .................................................................................. 20 2.9.2 Input Device Hysteresis .......................................................................... 21 2.10 Absolute Maximum and Minimum Ratings ............................................................. 21 2.11 Processor DC Specifications ................................................................................ 22 2.11.1 DC Voltage and Current Specification ........................................................ 23 2.11.2 VCC Overshoot Specification .................................................................... 29 2.11.3 Die Voltage Validation............................................................................. 30 3 Package Mechanical Specifications .......................................................................... 31 3.1 Package Mechanical Drawing............................................................................... 31 3.2 Processor Component Keep-Out Zones................................................................. 34 3.3 Package Loading Specifications ........................................................................... 34 3.4 Package Handling Guidelines............................................................................... 34 3.5 Package Insertion Specifications.......................................................................... 34 3.6 Processor Mass Specification............................................................................... 35 3.7 Processor Materials............................................................................................ 35 3.8 Processor Markings............................................................................................ 35 3.9 Processor Land Coordinates ................................................................................ 36 4Land Listing............................................................................................................. 37 5 Signal Descriptions.................................................................................................. 67 6 Thermal Specifications ............................................................................................ 71 6.1 Package Thermal Specifications........................................................................... 71 6.1.1 Thermal Specifications ............................................................................ 71 6.1.2 Thermal Metrology ................................................................................. 75 6.2 Processor Thermal Features................................................................................ 76 6.2.1 Processor Temperature ........................................................................... 76 6.2.2 Adaptive Thermal Monitor........................................................................ 76 6.2.3 THERMTRIP# Signal ............................................................................... 79 6.3 Platform Environment Control Interface (PECI)...................................................... 79 6.3.1 Introduction .......................................................................................... 79 6.3.2 PECI Specifications ................................................................................. 81 6.4 Storage Conditions Specifications
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