Introduction Chapter 1 Understanding Component Specifications Chapter
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VIA RAID Configurations
VIA RAID configurations The motherboard includes a high performance IDE RAID controller integrated in the VIA VT8237R southbridge chipset. It supports RAID 0, RAID 1 and JBOD with two independent Serial ATA channels. RAID 0 (called Data striping) optimizes two identical hard disk drives to read and write data in parallel, interleaved stacks. Two hard disks perform the same work as a single drive but at a sustained data transfer rate, double that of a single disk alone, thus improving data access and storage. Use of two new identical hard disk drives is required for this setup. RAID 1 (called Data mirroring) copies and maintains an identical image of data from one drive to a second drive. If one drive fails, the disk array management software directs all applications to the surviving drive as it contains a complete copy of the data in the other drive. This RAID configuration provides data protection and increases fault tolerance to the entire system. Use two new drives or use an existing drive and a new drive for this setup. The new drive must be of the same size or larger than the existing drive. JBOD (Spanning) stands for Just a Bunch of Disks and refers to hard disk drives that are not yet configured as a RAID set. This configuration stores the same data redundantly on multiple disks that appear as a single disk on the operating system. Spanning does not deliver any advantage over using separate disks independently and does not provide fault tolerance or other RAID performance benefits. If you use either Windows® XP or Windows® 2000 operating system (OS), copy first the RAID driver from the support CD to a floppy disk before creating RAID configurations. -
Creative Webcam Vf-0060 Driver Download Win7 DRIVER CREATIVE LABS VF-0060 USB for WINDOWS 8 X64
creative webcam vf-0060 driver download win7 DRIVER CREATIVE LABS VF-0060 USB FOR WINDOWS 8 X64. If you have creafive questions, please comment below. Host interfaces produced by a new & 2. Webcam Live is headphones for the Endpoints EP800 image controller chip. It worked on my old computer but I never had a disc for it, downloaded software at the time but I don't remember where from. Manufacturer, creative labs Model, vf-0060 Interface, USB. 3 External Sound Card & USB DAC Amp featuring Upgrade Motherboard Audio, 24-Bit/96 kHz Audio Output, 24-Bit/48 kHz Microphone Input, 93 dB Signal-to-Noise Ratio SNR , Drives a Wide Range of Headphones, Plug-and-Play via USB 3.0 & 2.0, Single or Split Stereo/Mic Connectors, Sound Blaster PLAY! Get technical help for your Creative products through Knowledgebase Solutions, firmware updates, driver downloads and more. Kernel 4 kernels, I cannot do much then. Cam Chat HD USB webcam for instant video chats. Support for such products is limited to online materials, such as Knowledgebase Solutions, drivers, application updates and product documentations available on the Creative Customer Support website. Support people indicated a conflict with Haupauge WinTV. This file can worked on WinXP, win7 creative vf 0060 xp driver EXE Looking for a windows xp driver for my creative labs vf-0060 usb pc 2. Fixed compatibility issues with Intel and AMD based USB 3.0 system It is highly recommended to always use the most recent driver version available. Here is a step by step written tutorial for those who. -
ATX-945G Industrial Motherboard in ATX Form Factor with Intel® 945G Chipset
ATX-945G Industrial Motherboard in ATX form factor with Intel® 945G chipset Supports Intel® Core™2 Duo, Pentium® D CPU on LGA775 socket 1066/800/533MHz Front Side Bus Intel® Graphics Media Accelerator 950 Dual Channel DDR2 DIMM, maximum 4GB Integrated PCI Express LAN, USB 2.0 and SATA 3Gb/s ATX-945G Product Overview The ATX-945G is an ATX form factor single-processor (x8) and SATA round out the package for a powerful industrial motherboard that is based on the Intel® 945G industrial PC. I/O features of the ATX-945G include a chipset with ICH7 I/O Controller Hub. It supports the Intel® 32-bit/33MHz PCI Bus, 16-bit/8MHz ISA bus, 1x PCI Express Core™2 Duo, Pentium® D, Pentium® 4 with Hyper-Threading x16 slot, 2x PCI Express x1 slots, 3x PCI slots, 1x ISA slot Technology, or Celeron® D Processor on the LGA775 socket, (shared w/ PCI), onboard Gigabit Ethernet, LPC, EIDE Ultra 1066/800/533MHz Front Side Bus, Dual Channel DDR2 DIMM ATA/100, 4 channels SATA 3Gb/s, Mini PCI card slot, UART 667/533/400MHz, up to 4 DIMMs and a maximum of 4GB. The compatible serial ports, parallel port, floppy drive port, HD Intel® Graphic Media Accelerator 950 technology with Audio, and PS/2 Keyboard and Mouse ports. 2048x1536x8bit at 75Hz resolution, PCI Express LAN, USB 2.0 Block Diagram CPU Core™2 Duo Pentium® D LGA775 package 533/800/1066MHz FSB Dual-Core Hyper-Threading 533/800/1066 MHz FSB D I M Northbridge DDR Channel A M ® x Intel 945G GMCH 2 DDRII 400/533/667 MHz D I CRT M M DB-15 DDR Channel B x 2 Discrete PCIe x16 Graphics DMI Interface 2 GB/s IDE Device -
Intel® Server Board S3420GP
Intel® Server Board S3420GP Technical Product Specification Intel order number E65697-010 Revision 2.4 January, 2011 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server Board S3420GP TPS Revision History Date Revision Modifications Number Feb. 2009 0.3 Initial release. May 2009 0.5 Update block diagram. July. 2009 0.9 Updated POST error code and diagram. Aug. 2009 1.0 Updated MTBF. Nov. 2009 1.1 Additional details for memory configuration. Dec. 2009 1.2 Added Intel® Server Board S3420GPV details. Dec. 2009 2.0 Updated processor name. Jan. 2010 2.1 Corrected the typo. Apr. 2010 2.2 Corrected the typo, updated processor name and remove CCC certification marking information. July. 2010 2.3 Corrected the typo. Jan.2011 2.4 Corrected the typo. Added RDIMM support on S3420GPV. Updated Table 45. Add USB device readiness beep code information. ii Revision 2.4 Intel order number E65697-010 Intel® Server Board S3420GP TPS Disclaimers Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. -
2Nd Generation Intel Core Processor Family with Intel 6 Series Chipset Development Kit User Guide
2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit User Guide March 2011 Document Number: 325208 About This Document INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. -
Intel ® Xeon ® Processor 3500 Series
Intel® Xeon® Processor 3500 Series Datasheet, Volume 1 July 2009 Document Number: 321332-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® Processor 3500 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. -
The New Intel® Xeon® Processor Scalable Family
Akhilesh Kumar Intel Corporation, 2017 Authors: Don Soltis, Irma Esmer, Adi Yoaz, Sailesh Kottapalli Notices and Disclaimers This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance. Optimization Notice: Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. -
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs. -
Extended Lifecycle Series
MAINBOARD D2778-D Issue April 2010 ATX Extended Lifecycle Series Pages 2 ® Intel X58 Express Chipset for DDR3 - 1333 SDRAM Memory (ECC Support) ® TM and Intel Xeon® (“Nehalem” and “Westmere”) and Core i7 Processors Chipset: Memory: Intel® X58 Express Chipset DDR3 800 SDRAM (Tylersburg-36S / ICH10-R) DDR3 1066 SDRAM DDR3 1333 SDRAM Processors: with ECC Support (depends on processor) ® ® Intel Xeon Processor 5500 / 5600 series ® ® Product Features: Intel Xeon Processor 3500 / 3600 series Intel® CoreTM i7 Processor series Dual PCIe x16 (Gen2) onboard 5.1 multichannel audio onboard Compatible with Intel® processors LGA1366 (up to ® LSI FW322 FireWire™ onboard 130W TDP) supporting Intel QuickPath USB 2.0 onboard Interconnect GbE LAN onboard supporting ASF 2.0 Serial ATA II RAID onboard Trusted Platform Modul V1.2 onboard Intel® QuickPath technology Data Sheet Issue: April 2010 Datasheet D2778-D Page 2 / 2 Audio Realtek ALC663, 5.1 Multichannel, High Definition Audio Board Size ATX: 12“ x 9.6“ (304.8 x 243.8 mm) ® LAN Chipset Intel “Tylersburg” X58 Express Chipset / ICH10-R Realtek 8111DP Ethernet Controller with 10/100/1000 MBit/s, DASH 1.1, Memory Wake-on-LAN (WoL) by interesting Packets, Link Status Change and Magic 6 DIMM Sockets DDR3, max. 24GB, Single / Dual / Triple Channel Packet™, PXE Support, BIOS MAC Address Display 800/1066/1333MHz, single rank / dual rank unbuffered, ECC / no n-ECC Drives support (depends on processor) - 6 Serial ATA II 300 Interfaces (up to 3GBit/s, NCQ); RAID 0, 1, 10, 5 Processors Intel® Xeon® Processor 5500 / 5600 series (Nehalem-EP / Westmere) Features D2778-D Intel® Xeon® Processor 3500 /3600 series (Nehalem-WS / Westmere) Chipset Intel X58 / ICH10R Intel® Core™ i7 Processor series Board Size ATX Socket B (LGA1366), max. -
Im Divar Ip 6000 2U
DIVAR IP 6000 2U DIP-6080-00N, DIP-6082-8HD, DIP-6083-8HD en Installation Manual DIVAR IP 6000 2U Table of Contents | en 3 Table of contents 1 Safety precautions 5 1.1 General safety precautions 5 1.2 Electrical safety precautions 6 1.3 ESD precautions 7 1.4 Operating precautions 7 1.5 Important notices 8 1.6 FCC and ICES compliance 8 2 System overview 9 2.1 Chassis features 9 2.2 Chassis components 9 2.2.1 Chassis 10 2.2.2 Backplane 10 2.2.3 Fans 10 2.2.4 Mounting rails 10 2.2.5 Power supply 10 2.2.6 Air shroud 10 2.3 System interface 10 2.3.1 Control panel buttons 11 2.3.2 Control panel LEDs 12 2.3.3 Drive carrier LEDs 12 3 Chassis setup and maintenance 13 3.1 Removing the chassis cover 13 3.2 Installing hard drives 14 3.2.1 Removing hard drive trays 14 3.2.2 Installing a hard drive 15 3.3 Installing an optional floppy or fixed hard drive 16 3.4 Installing or replacing a DVD-ROM drive 17 3.5 Replacing the internal transcoder device 17 3.6 Replacing or installing the front port panel 17 3.7 Installing the motherboard 18 3.8 Installing the air shroud 18 3.9 System fans 19 3.10 Power supply 20 3.10.1 Replacing the power supply 21 3.10.2 Replacing the power distributor 22 4 Rack installation 23 4.1 Unpacking the system 23 4.2 Preparing for setup 23 4.2.1 Choosing a setup location 23 4.2.2 Rack precautions 23 4.2.3 General system precautions 24 4.2.4 Rack mounting considerations 24 4.3 Rack mounting instructions 24 4.3.1 Separating the sections of the rack rails 25 4.3.2 Installing the inner rails 26 4.3.3 Installing the outer rails to the -
Motherboards, Processors, and Memory
220-1001 COPYRIGHTED MATERIAL c01.indd 03/23/2019 Page 1 Chapter Motherboards, Processors, and Memory THE FOLLOWING COMPTIA A+ 220-1001 OBJECTIVES ARE COVERED IN THIS CHAPTER: ✓ 3.3 Given a scenario, install RAM types. ■ RAM types ■ SODIMM ■ DDR2 ■ DDR3 ■ DDR4 ■ Single channel ■ Dual channel ■ Triple channel ■ Error correcting ■ Parity vs. non-parity ✓ 3.5 Given a scenario, install and configure motherboards, CPUs, and add-on cards. ■ Motherboard form factor ■ ATX ■ mATX ■ ITX ■ mITX ■ Motherboard connectors types ■ PCI ■ PCIe ■ Riser card ■ Socket types c01.indd 03/23/2019 Page 3 ■ SATA ■ IDE ■ Front panel connector ■ Internal USB connector ■ BIOS/UEFI settings ■ Boot options ■ Firmware upgrades ■ Security settings ■ Interface configurations ■ Security ■ Passwords ■ Drive encryption ■ TPM ■ LoJack ■ Secure boot ■ CMOS battery ■ CPU features ■ Single-core ■ Multicore ■ Virtual technology ■ Hyperthreading ■ Speeds ■ Overclocking ■ Integrated GPU ■ Compatibility ■ AMD ■ Intel ■ Cooling mechanism ■ Fans ■ Heat sink ■ Liquid ■ Thermal paste c01.indd 03/23/2019 Page 4 A personal computer (PC) is a computing device made up of many distinct electronic components that all function together in order to accomplish some useful task, such as adding up the numbers in a spreadsheet or helping you to write a letter. Note that this defi nition describes a computer as having many distinct parts that work together. Most PCs today are modular. That is, they have components that can be removed and replaced with another component of the same function but with different specifi cations in order to improve performance. Each component has a specifi c function. Much of the computing industry today is focused on smaller devices, such as laptops, tablets, and smartphones. -
P5W64 WS Professional
P5W64 WS Professional Motherboard E2846 Second Edition V2 September 2006 Copyright © 2006 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.