Intel C2000 Atom Microserver Power Efficient Processing for the Data Center
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Wind River Vxworks Platforms 3.8
Wind River VxWorks Platforms 3.8 The market for secure, intelligent, Table of Contents Build System ................................ 24 connected devices is constantly expand- Command-Line Project Platforms Available in ing. Embedded devices are becoming and Build System .......................... 24 VxWorks Edition .................................2 more complex to meet market demands. Workbench Debugger .................. 24 New in VxWorks Platforms 3.8 ............2 Internet connectivity allows new levels of VxWorks Simulator ....................... 24 remote management but also calls for VxWorks Platforms Features ...............3 Workbench VxWorks Source increased levels of security. VxWorks Real-Time Operating Build Configuration ...................... 25 System ...........................................3 More powerful processors are being VxWorks 6.x Kernel Compatibility .............................3 considered to drive intelligence and Configurator ................................. 25 higher functionality into devices. Because State-of-the-Art Memory Host Shell ..................................... 25 Protection ..................................3 real-time and performance requirements Kernel Shell .................................. 25 are nonnegotiable, manufacturers are VxBus Framework ......................4 Run-Time Analysis Tools ............... 26 cautious about incorporating new Core Dump File Generation technologies into proven systems. To and Analysis ...............................4 System Viewer ........................ -
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-037 MAY 2019 Intel technologies features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifica- tions. Current characterized errata are available on request. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Intel does not guarantee the availability of these interfaces in any future product. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1- 800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Intel, the Intel logo, Intel Deep Learning Boost, Intel DL Boost, Intel Atom, Intel Core, Intel SpeedStep, MMX, Pentium, VTune, and Xeon are trademarks of Intel Corporation in the U.S. -
Intel® Atom™ Processor E6x5c Series-Based Platform for Embedded Computing
PlAtfOrm brief Intel® Atom™ Processor E6x5C Series Embedded Computing Intel® Atom™ Processor E6x5C Series-Based Platform for Embedded Computing Platform Overview Available with industrial and commercial The Intel® Atom™ processor E6x5C series temperature ranges, this processor series delivers, in a single package, the benefits of provides embedded lifecycle support and the Intel® Atom™ processor E6xx combined is supported by the broad Intel® archi- with a Field-Programmable Gate Array tecture ecosystem as well as standard (FPGA) from Altera. This series offers Altera development tools. Additionally, a exceptional flexibility to incorporate a compatible, dedicated Power Management wide range of standard and user-defined Integrated Circuit (PMIC) solution may be I/O interfaces, high-speed connectivity, obtained from leading PMIC suppliers to memory interfaces, and process accelera- help minimize platform part count and tion to meet the requirements of a variety reduce bill of material costs and design of embedded applications in industrial, medi- complexity. Options include separate PMIC cal, communication, vision systems, voice and clock generator chips (available from over Internet protocol (VoIP), military, high- ROHM Co., Ltd.) or a single-chip solution performance programmable logic control- that integrates the voltage regulator and lers (PLCs) and embedded computers. clock generator (available from Dialog Semiconductor). The Intel Atom processor E6x5C series is a multi-chip, single-package device that Product Highlights reduces board footprint, lowers compo- • Single-package: A compact 37.5 x nent count, and simplifies inventory 37.5 mm, 0.8 mm ball pitch, multi-chip control and manufacturing. This compact device internally connects the Intel Atom design offers single-vendor support while processor E6xx with a user-programma- providing Intel Atom processors for ble FPGA. -
Intel Atom® Processor C2000 Product Family for Microservers
Intel® Atom™ Processor C2000 Product Family for Microservers PRODUCT BRIEF Maximize Efficiency for Your Lightweight Scale-Out Workloads Extreme Density and Energy-Efficiency for Low-End, Scale-Out Workloads With a need to rapidly deliver new services, cope with massive data growth, and contain costs, cloud service providers and hosters seek increasingly efficient ways to handle the demands on their infrastructure. Today’s servers based on Intel® Xeon® processors provide leadership performance and performance per watt with the flexibility to handle a wide range of workloads and peak demands. 2nd generation 64-bit However, certain lightweight, scale-out workloads—such as basic dedicated hosting, low-end static Intel® Atom™ Processor web serving, and simple content delivery can sometimes be hosted more efficiently on larger C2000 Product Family numbers of smaller servers built for extreme power efficiency. for microservers To address this need, Intel worked with a broad giving you the flexibility to right-size your infra- • Up to 7x higher7 perfor- ecosystem of leading server manufacturers to structure without limiting software mobility and mance, up to 6x better8 develop and deliver a variety of extreme low-power interoperability as your applications evolve. systems to support an emerging server category— performance/watt Optimized Platform Support microservers. With up to a 1,000 nodes1 per Intel provides complete microserver platform 9 rack and shared power, cooling, and networking • 6-20 watt TDP solutions that simplify implementation, improve resources, microservers can help you improve data overall efficiency and enable higher node density. • Up to 1000+ server center efficiency by right-sizing infrastructure for New innovations include: 10 relatively light processing requirements. -
A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
Memory Centric Characterization and Analysis of SPEC CPU2017 Suite
Session 11: Performance Analysis and Simulation ICPE ’19, April 7–11, 2019, Mumbai, India Memory Centric Characterization and Analysis of SPEC CPU2017 Suite Sarabjeet Singh Manu Awasthi [email protected] [email protected] Ashoka University Ashoka University ABSTRACT These benchmarks have become the standard for any researcher or In this paper, we provide a comprehensive, memory-centric charac- commercial entity wishing to benchmark their architecture or for terization of the SPEC CPU2017 benchmark suite, using a number of exploring new designs. mechanisms including dynamic binary instrumentation, measure- The latest offering of SPEC CPU suite, SPEC CPU2017, was re- ments on native hardware using hardware performance counters leased in June 2017 [8]. SPEC CPU2017 retains a number of bench- and operating system based tools. marks from previous iterations but has also added many new ones We present a number of results including working set sizes, mem- to reflect the changing nature of applications. Some recent stud- ory capacity consumption and memory bandwidth utilization of ies [21, 24] have already started characterizing the behavior of various workloads. Our experiments reveal that, on the x86_64 ISA, SPEC CPU2017 applications, looking for potential optimizations to SPEC CPU2017 workloads execute a significant number of mem- system architectures. ory related instructions, with approximately 50% of all dynamic In recent years the memory hierarchy, from the caches, all the instructions requiring memory accesses. We also show that there is way to main memory, has become a first class citizen of computer a large variation in the memory footprint and bandwidth utilization system design. -
Overview of the SPEC Benchmarks
9 Overview of the SPEC Benchmarks Kaivalya M. Dixit IBM Corporation “The reputation of current benchmarketing claims regarding system performance is on par with the promises made by politicians during elections.” Standard Performance Evaluation Corporation (SPEC) was founded in October, 1988, by Apollo, Hewlett-Packard,MIPS Computer Systems and SUN Microsystems in cooperation with E. E. Times. SPEC is a nonprofit consortium of 22 major computer vendors whose common goals are “to provide the industry with a realistic yardstick to measure the performance of advanced computer systems” and to educate consumers about the performance of vendors’ products. SPEC creates, maintains, distributes, and endorses a standardized set of application-oriented programs to be used as benchmarks. 489 490 CHAPTER 9 Overview of the SPEC Benchmarks 9.1 Historical Perspective Traditional benchmarks have failed to characterize the system performance of modern computer systems. Some of those benchmarks measure component-level performance, and some of the measurements are routinely published as system performance. Historically, vendors have characterized the performances of their systems in a variety of confusing metrics. In part, the confusion is due to a lack of credible performance information, agreement, and leadership among competing vendors. Many vendors characterize system performance in millions of instructions per second (MIPS) and millions of floating-point operations per second (MFLOPS). All instructions, however, are not equal. Since CISC machine instructions usually accomplish a lot more than those of RISC machines, comparing the instructions of a CISC machine and a RISC machine is similar to comparing Latin and Greek. 9.1.1 Simple CPU Benchmarks Truth in benchmarking is an oxymoron because vendors use benchmarks for marketing purposes. -
Debuggers, Programmers and Erasers Products May Be Rohs Compliant
Debuggers, Programmers and Erasers Products may be RoHS compliant. Check mouser.com for RoHS status. USB2Wiggler Features: DEVELOPMENT PROGRAMMERS • Universal Serial Bus interface for JTAG and BDM debugging TopMaxII Programmer • Faster than the classic parallel port Wiggler • Fully compatible with all Macraigor Systems software Features: • Operates up to Hi-Speed USB rates (480Mb/s) • High speed device programmer and TTL/LOGIC/DRAM tester • One side interfaces to USB port of host IBM compatible PC, other • PC driven: USB 2.0 interface side connects to OCD (On-Chip Debug) port of target system • Device libraries > 18000 • Port may be JTAG, E-JTAG, OnCE, COP, BDM, or any of several • Standard 48-pin DIL ZIF socket other types of connections • Supported devices: EPROM, EEPROM, FLASH (NOR/NAND) Programmers memory, PLD, FPGA, Serial PROM, Parallel PROM, CMOS USB2Demon Features: PROM, PIC and microcontrollers • Interfaces to USB 1.1 or USB 2.0 port of host PC on one side, other • B/P/V takes 65 sec. for 64Mbit flash memory • External start key for auto programming mode side connects to OCD (On-Chip Debug) port on target system • All socket adapters are available in stock (USA): PLCC, SOP, • Win 95/98/NT/2000/XP/Vista/Windows 7 • Simultaneously debugs up to 255 devices on a single scan chain SOIC, QFP, TSOP, SON, BGA, TSSOP, and TSOPII • Approved by CE • Supports configurable JTAG/BDM clock rates up to 20MHz • Supported low-voltages: 1.8/2.0/2.7/3.0/3.3/5.0 volt • Made in USA • Compatible with Windows and Linux hosts • Built-in AC (110-240) power supply • Free software update for lifetime • Supported versions of Linux: Red Hat 7.2-9 and Fedora Core 2 For quantities greater than listed, call for quote. -
Oracle Corporation: SPARC T7-1
SPEC CINT2006 Result spec Copyright 2006-2015 Standard Performance Evaluation Corporation Oracle Corporation SPECint_rate2006 = 1200 SPARC T7-1 SPECint_rate_base2006 = 1120 CPU2006 license: 6 Test date: Oct-2015 Test sponsor: Oracle Corporation Hardware Availability: Oct-2015 Tested by: Oracle Corporation Software Availability: Oct-2015 Copies 0 300 600 900 1200 1600 2000 2400 2800 3200 3600 4000 4400 4800 5200 5600 6000 6400 6800 7600 1100 400.perlbench 192 224 1040 675 401.bzip2 256 224 666 875 403.gcc 160 224 720 1380 429.mcf 128 224 1160 1190 445.gobmk 256 224 1120 854 456.hmmer 96 224 813 1020 458.sjeng 192 224 988 7550 462.libquantum 416 224 7330 1190 464.h264ref 256 224 1150 956 471.omnetpp 255 224 885 986 473.astar 416 224 862 1180 483.xalancbmk 256 224 1140 SPECint_rate_base2006 = 1120 SPECint_rate2006 = 1200 Hardware Software CPU Name: SPARC M7 Operating System: Oracle Solaris 11.3 CPU Characteristics: Compiler: C/C++/Fortran: Version 12.4 of Oracle Solaris CPU MHz: 4133 Studio, FPU: Integrated 4/15 Patch Set CPU(s) enabled: 32 cores, 1 chip, 32 cores/chip, 8 threads/core Auto Parallel: No CPU(s) orderable: 1 chip File System: zfs Primary Cache: 16 KB I + 16 KB D on chip per core System State: Default Secondary Cache: 2 MB I on chip per chip (256 KB / 4 cores); Base Pointers: 32-bit 4 MB D on chip per chip (256 KB / 2 cores) Peak Pointers: 32-bit L3 Cache: 64 MB I+D on chip per chip (8 MB / 4 cores) Other Software: None Other Cache: None Memory: 512 GB (16 x 32 GB 4Rx4 PC4-2133P-L) Disk Subsystem: 732 GB, 4 x 400 GB SAS SSD -
Intel® Industrial Iot Workshop Security for Industrial Platforms
Intel® Industrial IoT workshop Security for industrial platforms Gopi K. Agrawal Security Architect IOTG Technical Sales & Marketing Intel Corporation Legal © 2018 Intel Corporation No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Intel technologies' features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com. Intel, the Intel logo, are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. -
Poweredge R940 (Intel Xeon Gold 5122, 3.60 Ghz) Specint Rate Base2006 = 1080 CPU2006 License: 55 Test Date: Jun-2017 Test Sponsor: Dell Inc
SPEC CINT2006 Result spec Copyright 2006-2017 Standard Performance Evaluation Corporation Dell Inc. SPECint_rate2006 = 1150 PowerEdge R940 (Intel Xeon Gold 5122, 3.60 GHz) SPECint_rate_base2006 = 1080 CPU2006 license: 55 Test date: Jun-2017 Test sponsor: Dell Inc. Hardware Availability: Jul-2017 Tested by: Dell Inc. Software Availability: Nov-2016 Copies 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 11000 12000 13000 14000 15000 16000 18000 917 400.perlbench 32 32 762 521 401.bzip2 32 32 487 808 403.gcc 32 32 802 1480 429.mcf 32 624 445.gobmk 32 2010 456.hmmer 32 32 1530 710 458.sjeng 32 32 658 17700 462.libquantum 32 1170 464.h264ref 32 32 1130 554 471.omnetpp 32 32 509 614 473.astar 32 1430 483.xalancbmk 32 SPECint_rate_base2006 = 1080 SPECint_rate2006 = 1150 Hardware Software CPU Name: Intel Xeon Gold 5122 Operating System: SUSE Linux Enterprise Server 12 SP2 CPU Characteristics: Intel Turbo Boost Technology up to 3.70 GHz 4.4.21-69-default CPU MHz: 3600 Compiler: C/C++: Version 17.0.3.191 of Intel C/C++ FPU: Integrated Compiler for Linux CPU(s) enabled: 16 cores, 4 chips, 4 cores/chip, 2 threads/core Auto Parallel: Yes CPU(s) orderable: 2,4 chip File System: xfs Primary Cache: 32 KB I + 32 KB D on chip per core System State: Run level 3 (multi-user) Secondary Cache: 1 MB I+D on chip per core Base Pointers: 32-bit L3 Cache: 16.5 MB I+D on chip per chip Peak Pointers: 32/64-bit Other Cache: None Other Software: Microquill SmartHeap V10.2 Memory: 768 GB (48 x 16 GB 2Rx8 PC4-2666V-R) Disk Subsystem: 1 x 960 GB SATA SSD Other Hardware: None Standard Performance Evaluation Corporation [email protected] Page 1 http://www.spec.org/ SPEC CINT2006 Result spec Copyright 2006-2017 Standard Performance Evaluation Corporation Dell Inc. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................