2013 Selection Guide
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Lista Sockets.Xlsx
Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de -
VDX2-6526 DM&P Vortex86dx2 800Mhz 3.5” CPU Module with 4S/4USB/VGA/LCD/LVDS/AUDIO/ 3LAN/GPIO/Pwmx16 512MB/1GB DDR2 Onboard
VDX2-6526 DM&P Vortex86DX2 800MHz 3.5” CPU Module with 4S/4USB/VGA/LCD/LVDS/AUDIO/ 3LAN/GPIO/PWMx16 512MB/1GB DDR2 Onboard User’s Manual (Revision 1.3A) Copyright The information in this manual is subject to change without notice for continuous improvement in the product. All rights are reserved. The manufacturer assumes no responsibility for any inaccuracies that may be contained in this document and makes no commitment to update or to keep current the information contained in this manual. No part of this manual may be reproduced, copied, translated or transmitted, in whole or in part, in any form or by any means without the prior written permission of the ICOP Technology Inc. Copyright 2014 ICOP Technology Inc. Manual No. IUM6526000-01 Ver.1.0A January, 2014 Manual No. IUM6526000-01 Ver.1.1A February, 2014 Manual No. IUM6526000-01 Ver.1.2A July, 2014 Manual No. IUM6526000-01 Ver.1.3A April, 2015 Trademarks Acknowledgment Vortex86DX2 is the registered trademark of DM&P Electronics Inc. Other brand names and product names that appear in this document are the properties and registered trademarks of their respective owners. All names mentioned herewith are served for identification purpose only. T a b l e o f C o n t e n t s T a b l e o f C o n t e n t s ............................................................. iii C h a p t e r 1 Introduction……………………………………………1 1.1 Packing List ............................................................ 1 1.2 Ordering Information .............................................. 1 1.3 Product Description ................................................ 2 1.4 Specifications ........................................................ -
IMB-170-V Mini-ITX Motherboard Spotlight Features
Industrial Motherboards IMB-170-V Mini-ITX Motherboard Spotlight Features ‧Socket G2 (rPGA988B) for Intel Core i7/i5/i3/Celeron (Ivy Bridge and Sandy Bridge) ‧Intel® QM77 Chipset ‧Integrated Intel® HD Graphics Built-in Visuals ‧Supports DDR3 1600MHz, 2 x SO-DIMM, up to 16GB system memory ‧2 x COM (RS-232/422/485), 4 x COM (RS-232) ‧D-Sub, 1 x HDMI, 1 x DisplayPort, 1 x Dual Channel 24-bit LVDS ‧4 x USB 3.0, 8 x USB 2.0, 2 x SATA3, 2 x SATA2 ‧1 x PCIe 2.0 x16, 1 x mini-PCIe ‧Gigabit LAN : 1 x Intel 82579LM, 1 x Intel 82583V Specifications Processor System Rear I/O Dimension Mini-ITX (6.7-in x 6.7-in) VGA 1 Socket G2 (rPGA988B) for Intel Core i7/i5/i3/Celeron CPU HDMI 1 (Sandy Bridge and Ivy Bridge) DVI-I/D 0 Core Number (By CPU, Max 4) Display Port 1 Max Speed (By CPU) Ethernet 2 L3 Cache (By CPU) USB 6 (4 x USB 2.0 compliant, 2 x USB 3.0 compliant) Chipset QM77 Audio 3 (Mic-in, Line-out, Line-in) BIOS UEFI Serial 2 (RS-232/422/485) Expansion Slot PS/2 1 (Combo) PCI 0 Internal Connector Mini-PCIe 1 (Full size) USB 6 (4 x USB 2.0 compliant, 2 x USB 3.0 compliant) mSATA 0 LVDS/Inverter 1/1 PCIe 1 (IVY Bridge: Gen3; Sandy Bridge: Gen2) VGA 0 CFast Card Socket 0 Serial 4 (RS-232) Memory SATA 2 x SATA2 (3.0Gb/s) + 2 x SATA3 (6.0Gb/s), Support Technology Dual Channel DDR3 1066/1333/1600 MHz SDRAM RAID 0/1/5/10 m-SATA Max. -
Embedded Board Product Selection Guide
Embedded Board Product Selection Guide ECX SBCs Pico-ITX SBCs Mini-ITX Motherboards ATX Motherboards COM Express Modules Qseven Modules Embedded Boards | Contents Table of Contents About Quanmax .............................................................. 02 Overview Product Overview (Embedded Boards) .......................... 04 Qseven™ Module Product Matrix .................................... 06 KEEX-200T .................................................................................. 07 COM Express® Mini Module Product Matrix .................... 08 Computer-on-Modules COMM-E380 Series ................................................................. 09 COM Express® Compact Module Product Matrix ............ 10 COMC-E380 Series .................................................................. 11 Pico-ITX SBC Product Matrix .................................... 12 PITX-MX60 Series ..................................................................... 13 ECX SBC Intel® CPU Support Matrix ............................... 14 ECX SBC Product Matrix .................................................. 16 KEEX-5100 Series ..................................................................... 18 KEEX-8100 Series ..................................................................... 19 Single Board Computers KEEX-7101 Series ..................................................................... 20 KEEX-6100 Series ..................................................................... 21 KEEX-6150 Series .................................................................... -
PC/104 Selection Guide Selection PC/104
PC/104 selection guide CoreModule® (or SUMIT-ISM) I/O expansion modules. The stack requires a The CoreModule® family excels in Extreme Rugged™ applications small footprint and can be mounted directly inside the system and is frequently used in compact stacks where all the functions of PCI/104, PC/104 and PC/104-Plus enclosure for a durable, dependable PC-compatible assembly. the application are contained within the PC/104-ISM footprint. Stacks consist of a CoreModule® CPU and one or more off-the-shelf PC/104 PCI/104-Express PC/104-Plus PC/104 CoreModule® 920 CoreModule® 745 CoreModule® 720 CoreModule® 435 CPU Intel® Core™ i7-3517UE 1.7GHz Intel® Atom™ N455 Intel® Atom™ E680T 1.6 GHz Vortex86DX 800MHz Intel® Celeron® 807UE 1.0GHz (single core) 1.66GHz Intel® Atom™ E660T 1.3 GHz Vortex86SX 300MHz Intel® Atom™ D525 (dual core) 1.8GHz Intel® Atom™ E620T 0.6 GHz Cache 4MB/1MB Level 3 512KB / 1MB 512KB Level 2 16kB I-cache 16kB D-cache DRAM Up to 4GB soldered ECC DDR3 Up to 2GB DDR3 Up to 2GB soldered DDR2 256MB soldered DDR2 Bus Interface PCI/104 Express PC/104-Plus PC/104-Plus PC/104 PATA/ SATA 2x SATA 6 Gb/s 2x SATA 1x SATA EIDE Solid State Disk 8GB Onboard 4GB Onboard 8GB Onboard CompactFlash Serial Port 2x RS-232 2x RS-232 1x RS-232 2x RS-232 1x RS-232/422/485 3x RS-232 (Tx and Rx only) 2x RS-232/422/485 Parallel Port No No No No Floppy No No No No USB 4x USB 2.0 4x USB 2.0 6x USB 2.0 2x USB 2.0 Keyboard / Mouse No PS/2 No PS/2 GPIO No 8 8 8 Audio available on HDMI port No No No Network 1x GbE Gigabit Ethernet Gigabit Ethernet 1x 10/100 -
NF9G-QM77 Intel Mobile Core I3/I5/I7 Mini-ITX Features2gigabit LAN / Daughter Board Gen2
NF9G-QM77 Intel Mobile Core i3/i5/i7 Mini-ITX Features2Gigabit LAN / Daughter Board Gen2 1. Intel QM77 Express Chipset 2. Supports 3rd Generation Intel Core i3, i5, i7 Mobile Processors, Socket G2, Ivy Bridge and Sandy Bridge 3. Integrated Intel HD Graphics in CPU 4. Supports up to 3 independent Displays 5. DisplayPort, HDMI, VGA, 24bit LVDS Video Outputs 6. 2 * DDR3-1333 SO-DIMM up to 16GB 7. 2 * SATA3 6Gb/s, 4 * SATA2 3Gb/s RAID 0, 1, 5, 10 8. Dual Intel Gigabit LAN, iAMT 8.0, HD Audio, 4 * Serial Ports 9. PCI Express 3.0 x16, Watchdog Timer, GPIO, USB 3.0 10. 1 * PCI Express Mini Card Slot (mSATA/mini-PCIE selectable) 11. 1 * PCI Express Mini Card Slot (half-size) 12. Supports Jetway Daughter Boards Gen2 13. Mini-ITX Form Factor (170mm x 170mm) DAUGHTER BOARD JADE4RTLANGEN2G 4-port Realtek Gigabit LAN JADE4INLANG 4-port Intel Gigabit LAN JADE4COMCB 2 * Internal RS232 2 * external RS232/422/485 TPM 1.2 Header Sold Separately rd CPU Supports 3 -Generation Intel Core i3, i5, i7 Mobile Processors, Socket G2 (Ivy Bridge & Sandy Bridge) Chipset Intel QM77 Express Chipset Video Integrated Intel HD Graphics in CPU (See CPU specs for details) Memory 2 * 204-pin DDR3-1333 Dual Channel SO-DIMM up to 16GB rd Expansion Slots 1 * PCI Express 3.0 x16 Slot (requires 3 -Gen CPU to run at 3.0) 1 * PCI Express Mini Card Slot (mSATA/mini-PCIE function selectable) 1 * PCI Express Mini Card Slot (half-size) Storage 4 * SATA2 3Gb/s ports supporting RAID 0, 1, 5. -
Tidningen Patent Patent
ELEKTRONIK SVeRiGeS eNDa NR 2 eLeKTRONIk- febRuaRi maGaSiN 2015 TIDNINGEN fÖR PROFFS Prenumerera PATENT kostnadsfritt! etn.se/pren PATENT PATENT PATENT IEEE:S Nya LicensregleR bRaNschen RasaR Och jubLaR Standardorganisationen IEEE-SA bryter med ordningen och vill att licensavgifter ska beräknas från priset på chipet PATENT och inte på slutprodukten. Vi reder ut argumenten för och emot. /18–19 ingrid nordmark: packetarc: Flest Switchar Gigabit/m2 för dina och watt behov /10–12 /14–16 MAGA SIN – WEBB – NYHETSBREV 150130_COVG_ELEKTID_SE.indd 1 1/22/15 4:34 PM innehåll etn 2/15 Saferange söker seriös samarbetspart Snö, regn och dimma är inget som stoppar Saferanges laser baserade övervakningsteknik. Efter flera års utvecklingsarbete 4 letar företaget efter någon som kan kommersialisera tekniken. IN avlyssnar utan att tjuvlyssna Det har aldrig varit så enkelt att starta ett hård LEDAREN varuföretag som idag. Ett paradexempel är 5 Form Devices vars smarta husvakt utvecklats på Uppköp med blandade känslor plats i Kina och dragit in kapital via Kickstarter. det är kLart att huvudägarna har svårt att säga nej när IntervjuN: ingrid nordmark, F&U-chef på transmode det kommer ett bud som ligger 50 procent över börs Tryck in så mycket data som möjligt kursen och som gör dem till mångmiljardärer inte bara i fibern samtidigt som effekt på papperet utan i riktiga pengar. Men för Sverige, Lund 10 förbrukningen hålls nere och utan och alla anställda är det blandade känslor när Axis – en att det tar någon plats. Det är av landets verkliga framgångssagor – ser ut att hamna i uppgiften för Ingrid Nordmark och japanska händer. -
Computer Organization and Assembly Language CSC-210 Laboratory
Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Computer Organization and Assembly Language CSC-210 Laboratory Manual 3rd Edition 2017/2018 Name: Number: ٍ :Section Department: 1 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Table of Contents Lab (1): Computer Anatomy ....................................................................................................... 4 Objectives ............................................................................................................................... 4 What is a Computer? ............................................................................................................... 4 System ..................................................................................................................................... 4 1. Motherboard ............................................................................................................. 5 2. Central Processing Unit (CPU) ...................................................................................... 6 3. Memory .................................................................................................................... 6 4. Video Adapter ............................................................................................................ 7 5. Operating System ...................................................................................................... -
Estudio De Arquitecturas En Soft-Proccesors Y Comparativa De Rendimiento Y Consumo Con Procesadores Comerciales
Universidad Carlos III de Madrid Escuela Politécnica Superior Ingeniería Informática Proyecto Fin de Carrera Madrid, Octubre 2012 Estudio de arquitecturas en soft-proccesors y comparativa de rendimiento y consumo con procesadores comerciales Autor: Víctor Nieto Talaván Tutores: David Expósito Singh Oscar Pérez Alonso Estudio de arquitecturas en soft-proccesors y comparativa de rendimiento y consumo con procesadores comerciales Víctor Nieto Talaván 2 Estudio de arquitecturas en soft-proccesors y comparativa de rendimiento y consumo con procesadores comerciales Agradecimientos Este proyecto se lo quiero agradecer de la mejor manera posible a toda la gente que me ha apoyado a lo largo de mi vida, en especial a toda mi familia. Mi hermano Marcos, mis padres Julio y Mari Carmen, y mi novia Bea forman parte de mi día a día, y sin ellos no habría conseguido seguir adelante. Siempre han estado ahí para todo, para lo bueno y lo malo, y eso es lo mejor que me ha podido pasar. En segundo lugar se lo quiero agradecer a mis amigos, David, Castre, Fombe, Honorio, Marta y Rocío, por ser capaces de aguantarme y animarme todo este tiempo. Tampoco puedo olvidar los buenos momentos que he pasado con mis compañeros de clase, Champi, Cristian, Sohrab, Alberto, Juanto y un largo etc. de personas que han conseguido hacerme sacar una carcajada y una sonrisa. Finalmente, me gustaría agradecer enormemente toda la ayuda que he recibido por parte de mis tutores, David y Oscar, por su gran apoyo en este proyecto, sus conocimientos y su paciencia. No olvidaré los buenos momentos pasados con la gente del laboratorio, por todas las risas que he podido compartir con ellos y por conseguir hacer que finalice este proyecto. -
2Nd Generation Intel Core Processor Family with Intel 6 Series Chipset
2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit User Guide March 2011 Document Number: 325208 About This Document INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. -
Resource Guide 2007 / ©2007 Opensystems Publishing
y nl t O rin e P gl in r S Fo ©2007 OpenSystems Publishing. Not for distribution. y nl t O rin e P gl in r S Fo ©2007 OpenSystems Publishing. Not for distribution. RSC# 2 @ www.smallformfactors.com/rsc y nl t O rin e P gl in r S Fo RSC# 2 @ www.smallformfactors.com/rsc ©2007 OpenSystems Publishing. Not for distribution. RSC# 3 @ www.smallformfactors.com/rsc www.smallformfactors.com www.pc104online.com Volume 11 • Number 2 Audio/Video ................. 35 COLUMNS Frame grabber Image processing 8 Focus on Form Factors MPEG4 COM Express: standardized embedded modules By Bob Pebly Board level .................. 38 10 European Technology DSP resource boards: PCI-104 Sticks, graphics, and automation innovation PCMCIA/PC card By Hermann Strass System boards 110 Editor’s Insight ly Packages: protecting what’s inside Carrier boards................n 42 By Chris A. Ciufo ETX O FEATURES t Cnommunications .............. 43 SPECIAL: Consortium viewpoint iDatacom: Ethernet Datacom: Serial controller 12 Choosing the appropriate PC/104 format r Datacom: Serial I/O Datacom: USB controller By Kristin Allen, Kristin Allen Marketing & Design P GPS Modem TECHNOLOGY: Desktop trends shrink to small form factors Modem/Fax modem Wireless 16 Integrated CPU cryptography acceleration secures smalll computerse By J. Scott Gardner, Advantage Engineering g Industrial automation .......... 51 20 Gigahertz CPU module is cool, yet tough n Fieldbus: CAN Motion control By Colin McCracken, Ampro ComputersSi 24 Sizing up flash options for mobile devices Mezzanines .................. 53 By Harry Pon, Charles Lee,r and Charles Anyimi, Intel PrAMC 28 Getting off the buso to expand I/O By EarleF Foster, Sealevel Systems Packaging .................. -
Single Board Computers
Single Board Computers General Overview After merging with Ampro, ADLINK is the leading developer of industry standards for the most widely used off-the-shelf embedded system boards, such as PC/104, EBX and EPIC. We offer a form factor for every need: the ReadyBoard™ (EPIC) family of products is designed for high-volume commercial applications, and the Ampro by ADLINK™ Extreme Rugged™ LittleBoard™ (EBX) line is for applications exposed to harsh environments. PC/104 Ampro by ADLINKTM CoreModule® products provide unmatched fanless operation over temperature extremes, resistance to shock and vibration, conformal coating, embedded BIOS, and a long product life reputation. The CoreModule® continues to distinguish itself as an Extreme Rugged™ product for a multitude of applications. CoreModule® EBX The high-performance, feature-rich LittleBoard™ SBCs are based on the industry standard EBX form factor, co-invented by Ampro. Since 1984, LittleBoard™ SBCs have been used stand-alone or as a base with stacked electronics for long lifecycle embedded applications, requiring extreme ruggedness, reliability, high-performance processing, networking and video. Using identical mechanical format, connector placement and pinout, for 25 years, these Extreme Rugged™ SBCs are unique in offering only low-power processors for high-reliability applications. LittleBoard™ EPIC Featuring high performance and a standard interface, EPIC ReadyBoard™ SBC products are very cost-effective for common applications. The ReadyBoard™ family is a great platform for applications such as user interface terminals for medical equipment, networked systems, building automation, kiosks, gaming, industrial applied computing and control devices. The ReadyBoard™ would benefit any high-volume embedded application that requires high performance and low cost.