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Resource Guide 2007 /  ©2007 Opensystems Publishing y nl t O rin e P gl in r S Fo ©2007 OpenSystems Publishing. Not for distribution. y nl t O rin e P gl in r S Fo ©2007 OpenSystems Publishing. Not for distribution. RSC# 2 @ www.smallformfactors.com/rsc y nl t O rin e P gl in r S Fo RSC# 2 @ www.smallformfactors.com/rsc ©2007 OpenSystems Publishing. Not for distribution. RSC# 3 @ www.smallformfactors.com/rsc www.smallformfactors.com www.pc104online.com Volume 11 • Number 2 Audio/Video ................. 35 COLUMNS Frame grabber Image processing 8 Focus on Form Factors MPEG4 COM Express: standardized embedded modules By Bob Pebly Board level .................. 38 10 European Technology DSP resource boards: PCI-104 Sticks, graphics, and automation innovation PCMCIA/PC card By Hermann Strass System boards 110 Editor’s Insight ly Packages: protecting what’s inside Carrier boards................n 42 By Chris A. Ciufo ETX O FEATURES t Cnommunications .............. 43 SPECIAL: Consortium viewpoint iDatacom: Ethernet Datacom: Serial controller 12 Choosing the appropriate PC/104 format r Datacom: Serial I/O Datacom: USB controller By Kristin Allen, Kristin Allen Marketing & Design P GPS Modem TECHNOLOGY: Desktop trends shrink to small form factors Modem/Fax modem Wireless 16 Integrated CPU cryptography acceleration secures smalll computerse By J. Scott Gardner, Advantage Engineering g Industrial automation .......... 51 20 Gigahertz CPU module is cool, yet tough n Fieldbus: CAN Motion control By Colin McCracken, Ampro ComputersSi 24 Sizing up flash options for mobile devices Mezzanines .................. 53 By Harry Pon, Charles Lee,r and Charles Anyimi, Intel PrAMC 28 Getting off the buso to expand I/O By EarleF Foster, Sealevel Systems Packaging ................... 54 IN THE SYSTEM: Software-configured radios Connectors Enclosures 30 Combining DSPs and FPGAs in next-generation multimode wireless Power supplies handset designs By Louis Bélanger, Lyrtech Processor boards/SBCs......... 60 COM Express EBX DEPARTMENTS EPIC ETX 103 Editor’s Choice Products ETX/XTX Mini-ITX PC/104 PC/104-Plus By Don Dingee PCI-104 StackableUSB 93, 104 New Products Standalone board STD Bus By Chad Lumsden XTX On the cover: Ruggedized/Mil-Spec . 92 I’m calling these small rugged chassis shoe boxes because they’re the ideal place to stash rugged small form factor boards such as EPIC and PC/104. Moreover, shoe boxes themselves fit into Ruggedized tight spaces, such as in military ground vehicles, on soldiers’ backs, and under the operator’s panel on a CNC machine. Shown clockwise from the upper left: Tri-M’s CanTainer, Ampro’s ReadySystem, Octagon’s XMB Server, and Tri-M’s brand new VersaTainer (with VersaLogic boards inside). Note Software and development ..... 93 the rubber mounts, front-panel handles, and fins for convection cooling. These shoe boxes fit Development platform Linux electronics more comfortably than an old pair of slippers. – Chris Ciufo Test and Analysis.............. 96 Published by: OpenSystems Data acquisition I/O: Analog Publishing™ I/O: Digital I/O: FPGA © 2007 OpenSystems Publishing © 2007 PC/104 and Small Form Factors I/O: Industrial All registered brands and trademarks in PC/104 and Small Form Factors are property of their respective owners. resource guide 4 / 2007 PC/104 and Small Form Factors Resource Guide ©2007 OpenSystems Publishing. Not for distribution. y nl t O rin e P gl in r S Fo resource guide ©2007 OpenSystems Publishing. Not for distribution. ADVERTISER INFORMATION Page/RSC# Advertiser/Product description 13 ACCES I/O Products, Inc. – I/O Solutions 25 Advantech – Stackable SBCs A N O PEN S Y S TEM S P UBLIC A TI O N 112 Ampro Computers – Embedded Solutions Military & Aerospace Group 7001 APROTEK, Inc. – PC/104 Modems n DSP-FPGA Product Resource Guide 7 Arcom – Industrial Network Gateway n DSP-FPGA.com n DSP-FPGA.com E-letter 107 Connect Tech, Inc. – I/O Solutions n Military Embedded Systems n 2 Diamond Systems – Single Board Computers Military Embedded Systems E-letter n PC/104 and Small Form Factors 15 Douglas Electronics, Inc. – Interface Boards n PC/104 and Small Form Factors E-letter n PC/104 and Small Form Factors Resource Guide 22 Embedded Planet – Rugged Systems n VME and Critical Systems 53 ept, Inc. – Embedded Connectors n VME and Critical Systems E-letter Group Editorial Director Chris Ciufo 11 Excalibur – Avionics Communications [email protected] 111 Jacyl Technology – XG-5000K Contributing Editor Don Dingee [email protected] 33 Kontron – ETXexpress Modules l Associate Editor Jennifer Hesse 31 LiPPERT Embedded Computers – Embedded PCs [email protected] Senior Editor (columns) Terri Thorson 42 Measurement Computing – DAQ Solutions O [email protected] 5 Micro/sys – CPU Boards Assistantt Editor Sharon Schnakenburg nCopy Editor Robin DiPerna 7002 Radicom – PC/104 Modem Europeani Representative Hermann Strass r [email protected] 1901 RAF Electronic Hardware – Electronic Hardware P Art Director Steph Sweet 56 RTD Embedded Technologies, Inc. – PC/104 Modules Senior Web Developer Konrad Witte and Systems le Graphic Specialist David Diomede 27 servo-Halbeck GmbH & Co.KG – POSYS Motion Circulation/Office Manager Phyllis Thompson Controllers g [email protected] n OpenSystems 21 Technologic Systems – Tiny WiFi Controller i Publishing™ OpenSystems Publishing 23 Toronto MicroElectronics S– Peripherals, 5831 Editorial/Production office: 1902 Toronto MicroElectronicsr – DVR301,EP301N, EP301V 16872 E. Ave. of the Fountains, Ste 203 Fountain Hills, AZ 85268 41 Toronto MicroElectronicso – PC104-P3 Tel: 480-967-5581 n Fax: 480-837-6466 F Website: www.opensystems-publishing.com 14 Tri-M Engineering – PC/104 FlexTainer Publishers John Black, Michael Hopper, Wayne Kristoff 18 Tri-M Systems – Kontron, Evalue, Aaeon Products Vice President Editorial Rosemary Kristoff 108 VersaLogic Corporation – Embedded Applications Communications Group 9 WDL Systems – Embedded Systems Editorial Director Joe Pavlat 3 WinSystems, Inc. – EPIC Solutions Assistant Managing Editor Anne Fisher Senior Editor (columns) Terri Thorson 34 Zendex – Embedded Boards Technology Editor Curt Schwaderer European Representative Hermann Strass Embedded and Test & Analysis Group E-LETTER Editorial Director Jerry Gipper Editorial Director Don Dingee Spring: www.smallformfactors.com/eletter Technical Editor Chad Lumsden Ultra-Mobile PC on the move in on-the-go business applications Associate Editor Jennifer Hesse By Gail Levy, TabletKiosk Special Projects Editor Bob Stasonis European Representative Hermann Strass An I/O view of small form factor choices By Eric Rossi, EMAC ISSN Print 1096-9764, ISSN Online 1550-0373 Publication Agreement Number: 40048627 Canada return address: WDS, Station A, PO Box 54, Windsor, ON N9A 615 PC/104 and Small Form Factors is published five times a year by OpenSystems Publishing LLC, 30233 Jefferson Ave., St. Clair Shores, MI 48082. Subscriptions are EVENTS free upon request to persons interested in PC/104 and other small form factor single board computer technology. For others inside the US and Canada, subscriptions are Systems & Software Technology Conference $35/year. For 1st class delivery outside the US and Canada, subscriptions are June 18-21 • Tampa Bay, FL $50/year (advance payment in US funds required). www.sstc-online.org POSTMASTER: Send address changes to PC104 and Small Form Factors 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 6 / 2007 PC/104 and Small Form Factors Resource Guide ©2007 OpenSystems Publishing. Not for distribution. y nl t O rin e P gl in r S Fo ©2007 OpenSystems Publishing. Not for distribution. RSC#RSC# 77 @ www.smallformfactors.com/rsc 95.00 91.00 91.00 Primary target applications: Transportation, military, industrial, and medical imaging Consortium: PICMG, www.picmg.org Year of specification release: 2005 Sponsors: Pin D1 RadiSys, Intel, PFU, Kontron Specification: 18.00 Orderable for a fee y 6.00 l Free overview presentation available at 4.00 n http://www.picmg.org/pdf/COM_Express_tutorial.pdf 0.00 Pin A1 O Dimensions: 0.00 4.00 16.50 t 80.00 121.00 125.00 95 mm x 125 mm – basic 110 mm x 155 mm – extended in COM Express: r Mounting: P Two 220-pin connectors to baseboard standardized embedded modules By Bobl Peblye Power input: Principal Systems Engineer, RadiSys Corporation +12 V from baseboard g inThe concept of a Computer-On-Module (COM) is not a new one within the Expansion features: embedded computer industry. While various COM solutions and implementa- n PCI Express S tions have been around for years, most never became a dominant or de facto n SATA or SAS r standard. However, this changed when the PICMG COM Express specification n USB, Audio, Video, PCI, IDE emerged. COM Express was conceived as a COM providing a bridge from legacy o interfaces such as PCI and IDE to new serial differential signaling technologies F such as PCI Express, Serial ATA (SATA), USB 2.0, LVDS, and Serial DVO. This approach provides a standard COM form factor that has brought modularity and standardization to help unite embedded COM designs in the future. In late 2003, RadiSys, Intel, Kontron, and PFU Systems formed a working group to define the next-generation standard for COM modules. This working group then formalized itself within PICMG in 2004. More than 40 companies responded to the call for participation, and a PICMG subcommittee ultimately submitted a draft that resulted in today’s COM Express specification. The COM Express specification defines two module sizes: a basic module at 95 mm x 125 mm and a pin-compatible extended module at 110 mm x 155 mm. The extended module size is intended to support both larger processors and denser memory solutions. Both sizes support internal and external graphics, multiple display devices, audio, networking, storage, and various I/O and expan- sion interfaces. In addition to the usual benefits of standardization and modularity, COM architecture and methodology enable a broader level of reuse and reduced devel- opment expense, further aiding the typical time-to-market and time-to-revenue advantages.
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