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Single Board Computers Single Board Computers General Overview After merging with Ampro, ADLINK is the leading developer of industry standards for the most widely used off-the-shelf embedded system boards, such as PC/104, EBX and EPIC. We offer a form factor for every need: the ReadyBoard™ (EPIC) family of products is designed for high-volume commercial applications, and the Ampro by ADLINK™ Extreme Rugged™ LittleBoard™ (EBX) line is for applications exposed to harsh environments. PC/104 Ampro by ADLINKTM CoreModule® products provide unmatched fanless operation over temperature extremes, resistance to shock and vibration, conformal coating, embedded BIOS, and a long product life reputation. The CoreModule® continues to distinguish itself as an Extreme Rugged™ product for a multitude of applications. CoreModule® EBX The high-performance, feature-rich LittleBoard™ SBCs are based on the industry standard EBX form factor, co-invented by Ampro. Since 1984, LittleBoard™ SBCs have been used stand-alone or as a base with stacked electronics for long lifecycle embedded applications, requiring extreme ruggedness, reliability, high-performance processing, networking and video. Using identical mechanical format, connector placement and pinout, for 25 years, these Extreme Rugged™ SBCs are unique in offering only low-power processors for high-reliability applications. LittleBoard™ EPIC Featuring high performance and a standard interface, EPIC ReadyBoard™ SBC products are very cost-effective for common applications. The ReadyBoard™ family is a great platform for applications such as user interface terminals for medical equipment, networked systems, building automation, kiosks, gaming, industrial applied computing and control devices. The ReadyBoard™ would benefit any high-volume embedded application that requires high performance and low cost. ReadyBoard™ 1-25 http://www.adlinktech.com/ampro/ What are ISM™ & SUMIT™ What is ISM™? What is SUMIT™? ISM™, short for Industry Standard Module™, is a pure SUMIT™ is one of many board-to-board expansion 90mm x 96mm form factor (compatible with PC/104) interfaces that are permitted with ISM™. SUMIT™, that addresses shortcomings of existing small form short for Stackable Unified Module Interconnect factors: Technology, offers PCI Express®, USB, SPI, I2C, and • Fitting circuitry without extending beyond the board LPC Bus expansion using, footprint-efficient, 52-pin, outline. high-bandwidth rugged Samtec Q2-series connectors. • Meeting top-and bottom-side component height This mix of high-speed and low-speed buses simplifies restrictions. the task of attaching many types of I/O without • Decoupling form factors from expansion interfaces. complex bridges and software. • Enabling flexible expansion bus and I/O connectorization. • Allowing bus combinations that were previously 46.*5" 46.*5# undefined and unnamed. 1$*FY LittleBoard™ 64#Y 1$*FY EBX • 203 mm x 146 mm -1$ 41* 8JSF 4.#VT* $#VT 1$*FY &YQSFTT$BSE%FUFDU ReadyBoard™ "$1*8BLFVQ EPIC • 165 mm x 115 mm .JTD What is SUMIT-ISM™? CoreModule® An ISM-size SBC with SUMIT™ expansion is called a “SUMIT-ISM™ SBC”. An ISM-size I/O card is similarly called a “SUMIT-ISM™ I/O PC/104 - ISM™ • 90 mm x 96 mm module”. A more general naming scheme handles SBCs that accepts smaller boards as I/O cards, or SBCs with multiple buses, in a descriptive manner by mentioning the form factor first, followed by a SBC manufacturers have struggled to fit modern list of expansion interfaces. For example, “ISM™ SBC with SUMIT™ legacy-free platforms onto small form factors without and PC/104 expansion”, and “EPIC SBC with SUMIT™ and PC/104 expansion” are some of the possibilities. The notations “SUMIT-ISM™” protruding beyond the allowed board outlines with or “SUMIT™ on ISM™” are contracted forms for a special case, while “wings”. With the ISA bus, serial ports, and even the boards with multiple interfaces could be more confusing to label with PCI bus no longer integrated into low power chipsets, contracted names. it takes extra circuitry to meet the needs of many embedded applications. Who manages these standards? A new, independent standards organization called the Small Form What is included in the specification? Factor Special Interest Group, or SFF-SIG, creates, adopts, and The ISM™ Specification defines the board size, four fixed mounting maintains a number of emerging standards for the low power, small holes, component height limits, and flexible “expansion zones” for I/O form factor market. As consumer technology is often inappropriate and/or bus connectors. The fixed corner mounting holes allow re-use for the embedded market, the standards feature re-usable modular of enclosures without modifications in the future. building blocks, developed by embedded vendors for embedded OEMs. Many of these are optimized for ultra low power processors What interfaces are allowed? and controllers, yet scale up to multi-core processor environments. ISM™ allows many combinations of bus and I/O connectors as long For more information about the specifications, visit www.sff-sig.org. as those interfaces reside within the defined “expansion zones”. ISM™ also offers a choice of using right-angle connectors that overhang the board edges, or extending the circuit board if vertical / non-overhang connectors are used. What architectures are allowed? ISM™ boards can be SBCs, stackable CPU and I/O cards, and even computer-on-modules (COMs). This flexibility allows easy migration from SBCs to COMs and vice-versa, or from processor to processor, while preserving investments in mechanical designs. 1-26 Ampro by ADLINK™ PC/104 selection guide CoreModule® Ampro by ADLINK™ Extreme Rugged™ The CoreModule® family excels in Extreme Rugged™ (or SUMIT-ISM) I/O expansion modules. The stack applications and is frequently used in compact stacks requires a small footprint and can be mounted where all the functions of the application are contained directly inside the system enclosure for a durable, within the PC/104-ISM footprint. Stacks consist of a dependable PC-compatible assembly. CoreModule® CPU and one or more off-the-shelf PC/104 CoreModule® 720 745 740 730 435 CPU 1.6 GHz Atom™ 1.66GHz Atom™ 1.6GHz Atom™ 1.6GHz Atom™ or 800MHz Vortex86DX E680T N455 (single core) 1.1GHz Atom™ 300MHz Vortex86SX 1.3 GHz Atom™ 1.8GHz Atom™ D425 E660T (single core) 0.6 GHz Atom™ 1.8GHz Atom™ D525 E620T (dual core) Cache 512KB Level 2 512KB / 1MB 512KB Level 2 512KB Level 2 16kB I-cache 16kB D-cache DRAM Up to 2GB soldered Up to 2GB DDR3 512MB soldered Up to 2GB DDR2 256MB soldered DDR2 DDR2 RA DDR2 Bus Interface PC/104-Plus PC/104-Plus PC/104-Plus SUMIT-AB PC/104 PATA/ SATA (1) SATA (2) SATA (1) EIDE (1) EIDE (1) EIDE Solid State Disk 8GB Onboard 4GB Onboard No CompactFlash CompactFlash Serial Port (1) RS232, (2) RS232, (2) RS-232 No 2x RS-232 (3) RS232 (Tx and RX only) (1)RS232/422/485) 2x RS-232/422/485 Parallel Port No No Yes No No Floppy No No Yes No No USB (6) USB 2.0 (4) USB 2.0 (2) USB 2.0 (4) USB 2.0 (2) USB 2.0 (plus 3 on SUMIT) Keyboard / Mouse No PS/2 PS/2 No PS/2 GPIO 8 8 2 8 8 Audio No No No No No Network Gigabit Ethernet Gigabit Ethernet Ethernet not Gigabit Ethernet on 1 10/100 supported PCIe x1 1 Gigabit Ethernet Video Optional VGA Intel® GMA 3150, VGA Intel® GMA 3150, VGA Intel® GMA 500, VGA VGA Flat Panel Single Channel 24-bit LVDS Single Channel LVDS Single Channel LVDS Single Channel LVDS TTL/TFT Standard Operating -20°C to +70°C -20°C to +70°C -20°C to +70°C -20°C to +70°C -20°C to +70°C Temperature Optional Extended -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C Temperature Page Number 1-29 1-30 1-31 1-32 1-33 1-27 http://www.adlinktech.com/ampro/ Ampro by ADLINK™ EBX and EPIC selection guide LittleBoard™ ReadyBoard™ The high-performance, highly integrated LittleBoard™ The ReadyBoard™ line of SBCs follow the EPIC SBCs are based on the industry-standard EBX form standard form factor and are very cost-effective for factor. A LittleBoard™ SBC can be used as a standard applications providing a great platform for standalone product or as a base with stacked applications such as user interface terminals electronics for long lifecycle embedded applications, networked systems, building automation, requiring ruggedness, high performance processing, kiosk/point-of-information, gaming, industrial applied networking and video. computing and medical devices. Truly any application would benefit from a fully-featured, low-cost embedded solution. LittleBoard™ ReadyBoard™ 735 910 740 850 CPU 1.6GHz Atom™ 2.1GHz Core™ i7-2710QE 1.6GHz Atom™ N450 (single core) 2.26GHz Core™2 Duo 2.5GHz Core™ i5-2510E 1.6GHz Atom™ D410 (single core) (Socket P) 2.2GHz Core™ i3-2330E 1.6GHz Atom™ D510 (dual core) Cache 512KB Level 2 6MB / 3MB / 3MB LLC 512KB / 1MB 3MB Level 2 DRAM Up to 2GB DDR Up to 8GB DDR3 Up to 2GB DDR Up to 4GB DDR3 Bus Interface PC/104-Plus PCI-104 PCI-104 PCI-104, SUMIT (PCI and ISA) PATA/ SATA (1) EIDE (2) SATA (2) SATA No (2) SATA Solid State Disk Compact Flash 4GB Onboard 4GB Onboard Compact Flash Serial Port (2) RS-232, (2) RS-232/422/485 (4) RS232 (2) RS-232/422/485 (2) RS-232/422/485 Parallel Port Floppy shared No No No Floppy Shared with parallel No No No USB (7) USB 2.0 (2) USB 3.0 (6) USB 2.0 (4) USB 2.0 (2) USB 2.0 (plus 4 on SUMIT-A) Keyboard / Mouse PS/2 PS/2 PS/2 PS/2 GPIO 8 8 8 8 Audio AC97 High Denition Audio, High Definition Audio High Definition Audio S/PDIF Network Dual Gigabit Ethernet Dual Gigabit Ethernet Gigabit Ethernet Dual Gigabit Ethernet Video Intel® GMA 950 core Intel® HD Graphics 3000
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