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IBM Z14 Technical Introduction Front cover IBM z14 Technical Introduction Bill White Hervey Kamga Michal Kordyzon Octavian Lascu Frank Packheiser John Troy Esra Ufacik Bo Xu Redbooks International Technical Support Organization IBM z14 Technical Introduction October 2018 SG24-8450-01 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. Second Edition (October 2018) This edition applies to the following IBM Z platform: IBM z14™. © Copyright International Business Machines Corporation 2018. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix Authors. ix Now you can become a published author, too . .x Comments welcome. xi Stay connected to IBM Redbooks . xi Chapter 1. The base of a trust economy . 1 1.1 The z14: A secure platform integrated and open by design . 2 1.1.1 Securing data with pervasive encryption. 3 1.1.2 Transforming a transactional platform into a data powerhouse . 3 1.1.3 Getting more out of the platform with IT Operational Analytics. 4 1.1.4 Providing resilience with key to zero downtime. 4 1.1.5 Accelerating digital transformation with agile service delivery . 5 1.1.6 Revolutionizing business processes . 6 1.1.7 Blending open source and Z technologies . 6 1.2 z14 technical description. 7 1.2.1 Technical highlights . 7 1.2.2 Storage connectivity . 9 1.2.3 Network connectivity . 10 1.2.4 Cryptography . 11 1.2.5 Clustering connectivity . 12 1.2.6 Special-purpose features and functions . 12 1.2.7 Capacity on demand and performance. 13 1.2.8 Reliability, availability, and serviceability. 14 1.3 Software support . 14 1.3.1 IBM compilers . 15 Chapter 2. IBM z14 hardware overview . 17 2.1 Models and upgrade paths . 18 2.2 Frames and cabling. 19 2.3 CPC drawers. 21 2.3.1 Single chip modules . 22 2.3.2 Processor unit . 23 2.3.3 Memory . 25 2.3.4 Hardware system area . 26 2.4 I/O system structure . 27 2.5 Power and cooling. 29 2.5.1 Radiator (air) cooling option . 29 2.5.2 Water cooling option . 30 2.5.3 High Voltage Direct Current power feature . 30 2.5.4 Power considerations . 30 Chapter 3. Supported features and functions . 31 3.1 I/O features at a glance. 32 3.2 Native PCIe features and integrated firmware processor . 35 3.3 Storage connectivity . 36 © Copyright IBM Corp. 2018. All rights reserved. iii 3.3.1 zHyperLink Express . 36 3.3.2 FICON functions . 36 3.3.3 FCP functions . 38 3.3.4 FICON Express16S+ . 39 3.3.5 FICON Express16S (carry forward only). 39 3.3.6 FICON Express8S (carry forward only). 40 3.4 Network connectivity . 40 3.4.1 OSA-Express functions. 40 3.4.2 OSA-Express7S . 42 3.4.3 OSA-Express6S . 42 3.4.4 OSA-Express5S (carry forward only) . 43 3.4.5 OSA-Express4S (carry forward only) . 44 3.4.6 HiperSockets functions . 44 3.4.7 Shared Memory Communications functions . 46 3.4.8 RoCE Express features . 47 3.5 Compression options . 48 3.5.1 Compression Coprocessor . 48 3.5.2 zEnterprise Data Compression . 48 3.6 Cryptographic features . 48 3.6.1 CP Assist for Cryptographic Function . 48 3.6.2 Crypto Express6S . 49 3.6.3 Crypto Express5S (carry forward only) . 50 3.6.4 Web deliverables . 50 3.7 Coupling and clustering. 50 3.7.1 Coupling Express Long Reach . 51 3.7.2 Integrated Coupling Adapter: Short Reach . 51 3.7.3 Host Channel Adapter3: Optical Long Reach . 51 3.7.4 Host Channel Adapter3: Optical . ..
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