INTEL Xeon Processor Scalable Family

Total Page:16

File Type:pdf, Size:1020Kb

INTEL Xeon Processor Scalable Family Copyright 2017 Intel Corporation Notices and Disclaimers Intel technologies may require enabled hardware, specific software, or services activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer. For more complete information about performance and benchmark results, visit www.intel.com/benchmarks. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance. Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction. § For more information go to http://www.intel.com/performance. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. No computer system can be absolutely secure. Intel, the Intel logo, Xeon, Intel vPro, Intel Xeon Phi, Look Inside., are trademarks of Intel Corporation in the U.S. and/or other countries. © 2017 Intel Corporation. *Other names and brands may be claimed as the property of others. Copyright 2017 Intel Corporation 2 CLOUD ECONOMICS INTELLIGENT DATA PRACTICES NETWORK TRANSFORMATION Intel® Xeon® Scalable Platform The industry’s Biggest platform advancement In a decade INTEL® XEON® SCALABLE processors The Foundation for Agile, Secure, Workload-Optimized Hybrid Cloud UP TO UP TO SCALABLE PERFORMANCE SCALABLE PERFORMANCE 28 CORES 22 CORES AT LOW POWER ENTRY HARDWARE-ENHANCED SECURITY Good STANDARD RAS STANDARD RAS UP SOCKET WITH UPI SOCKET TO 2, 4 & 8 SUPPORT UP TO 3 LINKS 2 & 4 SUPPORT MODERATE TASKS Light TASKS M TOPLINE MEMORY DDR4 H WITH UP TO UPI LINKS 2666 Z UP TO 1.5 TB CHANNEL BANDWIDTH 3 INTEL® TURBO BOOST TECHNOLOGY AND ENTRY PERFORMANCE, Price Sensitive INTEL® HYPER-THREADING TECHNOLOGY ACCELERATOR RELIABILITY, AVAILABILITY FOR LIGHT WORKLOADS HIGHEST THROUGHPUT ADVANCED AND SERVICEABILITY FOR MODERATE WORKLOADS MAINSTREAM Efficient ENTRY 7 The Intel® Xeon® Scalable Processors: Intel® Xeon® PLATINUM PROCESSOR 81XX Series Platinum (2, 4, and 8 An Agile Solution Stack for Data Center Workloads Socket) Intel® Xeon® GOLD PROCESSOR + Up to 28 Cores + 2,4, or 8 socket configurations for 5 61XX Series Gold (2 and 4 Socket) best performance and scalability + Up to 22 Cores + Topline memory channel + Added 3rd UPI link for increased performance (1.5 TB memory dataflow across cores bandwidth on select SKUs) Intel® Xeon® SILVER PROCESSOR + Increased performance across + 3 UPI links option across 2S,4S,8S memory channels6 for improved scalability and inter- 41XX Series Silver (2 Socket) + Intel® AVX-512 with additional FMA core data flow + Up to 12 cores + Added Node Controller Support to Intel® Xeon® BRONZE PROCESSOR + 2S configuration with Improved assist in scaled node management Memory channel performance 51XX Series Gold (2 and 4 Socket) 31XX Series Bronze (2 Socket) + Intel® Turbo Boost Technology + Up to 14 cores • Up to 8 cores for higher frequency capability + Supports 2S and 4S configuration • 2S configuration + Intel® HT Technology for hyper for increased scalability • Improved core interconnect (UPI) threaded workloads + Increased core interconnect speed to over past gen boost data flow in multi-processor • 48 PCIe 3.0 lanes workloads • Intel® AVX-512 feature enabled + Advanced RAS features The Best Performance, • Standard RAS features Scalability, Core options, Efficient Performance at Low Mainstream Performance, Fast and all Hardware-Enhanced Entry Performance and security Power. Provides more horsepower Memory, More Interconnect Security features for the for price sensitive deployments for single purpose workloads Engines, Advanced Reliability most robust capability Better performance, interconnectivity, scalability, and memory 8 Unified Intel® Xeon® Scalable Platform 2016 2017 2018 Intel® Xeon® Processor E7 Brickland Platform Intel® Xeon® Scalable Targeted at mission-critical Platform (codename Purley) applications that value a scale-up Skylake CPUs E7 v3 E7 v4 system with leadership18 cores memory capacity and advanced RAS Intel® Xeon® PLATINUM Intel® Xeon® GOLD Intel® Xeon® Processor E5 Grantley-EP Platform Targeted at a wide variety of Intel® Xeon® SILVER applications that value a balanced E5 v3 E5-4600 v4 (4S) system with leadership Intel® Xeon® BRONZE E5 v3 E5-2600 v4 performance/watt/$ Copyright 2017 Intel Corporation 9 Intel® Xeon® Scalable Processor Re-architected from the Ground Up • Skylake core microarchitecture, with data • New mesh interconnect architecture • Intel® Speed Shift Technology center specific enhancements • Enhanced memory subsystem • Security & Virtualization enhancements • Intel® AVX-512 with 32 DP flops per core (MBE, PPK, MPX) • Modular IO with integrated devices • Data center optimized cache hierarchy – • Optional Integrated Intel® Omni-Path • New Intel® Ultra Path Interconnect 1MB L2 per core, non-inclusive L3 Fabric (Intel® OPA) (Intel® UPI) Features Intel® Xeon® Processor E5-2600 v4 Intel® Xeon® Scalable Processor 6 Channels DDR4 Cores Per Socket Up to 22 Up to 28 DDR4 Core Core 2 or 3 UPI Threads Per Socket Up to 44 threads Up to 56 threads DDR4 Core Core UPI Last-level Cache (LLC) Up to 55 MB Up to 38.5 MB (non-inclusive) DDR4 QPI/UPI Speed (GT/s) 2x QPI channels @ 9.6 GT/s Up to 3x UPI @ 10.4 GT/s UPI DDR4 Core Core PCIe* Lanes/ 40 / 10 / PCIe* 3.0 (2.5, 5, 8 GT/s) UPI Controllers/Speed(GT/s) 48 / 12 / PCIe 3.0 (2.5, 5, 8 GT/s) DDR4 Shared L3 4 channels of up to 3 RDIMMs, 6 channels of up to 2 RDIMMs, Omni-Path Memory Population Omni-Path HFI LRDIMMs, or 3DS LRDIMMs LRDIMMs, or 3DS LRDIMMs DDR4 Max Memory Speed Up to 2400 Up to 2666 48 Lanes DMI3 PCIe* 3.0 TDP (W) 55W-145W 70W-205W 10 Platform Overview 3x16 PCIe* 3x16 PCIe 2 or 3 Intel® UPI Gen3 Gen3 Capabilities Details Socket Socket P Skylake-SP Skylake-SP DDR4 Scalability 2S, 4S, 8S, and >8S (with node controller support) CPU 2666 CPU CPU TDP 70W – 205W OPA OPA 1x 100Gb OPA 1x 100Gb OPA Chipset Intel® C620 Series (code name Lewisburg PCH) Fabric Fabric Networking Intel® Omni-Path Fabric (integrated w/ CPU + discrete) 4x10GbE (integrated w/ chipset) DMI CPU VRs 100G/40G/25G discrete options OPA VRs Intel® C620 Series Compression and Intel® QuickAssist Technology option in chipset to Mem VRs Crypto Acceleration support 100Gb/s comp/decomp/crypto Intel® ME High USB3 100K RSA2K public key QAT IE Speed IO PCIe3 4x10GbE NIC SATA3 BMC Storage CPU integrated QuickData Technology, VMD, and NTB GPIO Firmware Intel® Optane™ SSD, Intel® 3D-NAND NVMe* & SATA SSD eSPI/LPC 10GbE SPI Security CPU Instruction Set enhancements (MBE, PPK, MPX) Manageability Engine with multiple secure boot options TPM Firmware Intel® Platform Trust Technology Intel® Key Protection Technology BMC: Baseboard Management Controller PCH: Intel® Platform Controller Hub IE: Innovation Engine Manageability Intel® Node Manager Intel® OPA: Intel® Omni-Path Architecture Intel QAT: Intel® QuickAssist Technology ME: Manageability Engine Intel® Datacenter Manager NIC: Network Interface Controller VMD: Volume Management Device NTB: Non-Transparent Bridge Innovation Engine (IE) Copyright 2017 Intel Corporation 11 Platform Topologies 2S Configurations General Purpose/Storage/ 4S Configurations 8S Configuration HPC/Comms SP Enterprise and Cloud Enterprise LBG LBG SKL SKL SKL SKL SKL SKL Intel® UPI DMI * x4 * LBG LBG LBG 3x16 3x16 PCIe* 1x100G PCIe 1x100G SKL SKL Intel® OP Fabric Intel OP Fabric SKL SKL (2S-2UPI & 2S-3UPI shown) DMI SKL SKL LBG LBG 3x16 PCIe (4S-2UPI & 4S-3UPI shown) SKL SKL Intel® Xeon® Scalable Platform supports DMI 3x16 PCIe configurations ranging from 2S-2UPI to 8S LBG LBG Copyright 2017 Intel Corporation 12 Copyright 2017 Intel Corporation 13 Overview . Skylake core microarchitecture, with . New mesh interconnect architecture . Intel® Speed Shift Technology data center specific enhancements . Enhanced memory subsystem . Security & Virtualization enhancements . Intel® AVX-512 with 32 DP Flops per . Modular IO subsystem with integrated . Optional Integrated Intel® Omni-Path core devices Fabric (Intel® OPA) . Data center optimized cache hierarchy – . New Intel® Ultra Path Interconnect 1MB L2 per core, non-inclusive L3 (Intel® UPI Intel® Xeon® Scalable Processor Features Intel® Xeon® Processor E5-2600 v4 6 Channels DDR4 (Skylake-SP) DDR4 Core Core Cores Per Socket Up to 22 Up to 28 2 or 3 UPI DDR4 Threads Per Socket Up to 44 threads Up to 56 threads Core Core UPI Last-level Cache (LLC) Up to 55 MB Up to 38.5 MB (non-inclusive) DDR4 UPI QPI/UPI Speed (GT/s) 2x QPI channels @ 9.6 GT/s Up to 3x UPI @ 10.4 GT/s DDR4 Core Core PCIe* Lanes/ UPI 40 / 10 / PCIe 3.0 (2.5, 5, 8 GT/s) DDR4 Shared L3 Controllers/Speed(GT/s) 48 / 12 / PCIe 3.0 (2.5, 5, 8 GT/s) Omni Path 4 channels of up to 3 RDIMMs, 6 channels of up to 2 RDIMMs, DDR4 Omni Path HFI Memory Population LRDIMMs, or 3DS LRDIMMs LRDIMMs, or 3DS LRDIMMs 48 Lanes DMI3 Max Memory Speed
Recommended publications
  • How to Hack a Turned-Off Computer Or Running Unsigned
    HOW TO HACK A TURNED-OFF COMPUTER, OR RUNNING UNSIGNED CODE IN INTEL ME Contents Contents ................................................................................................................................ 2 1. Introduction ...................................................................................................................... 3 1.1. Intel Management Engine 11 overview ............................................................................. 4 1.2. Published vulnerabilities in Intel ME .................................................................................. 5 1.2.1. Ring-3 rootkits.......................................................................................................... 5 1.2.2. Zero-Touch Provisioning ........................................................................................... 5 1.2.3. Silent Bob is Silent .................................................................................................... 5 2. Potential attack vectors ...................................................................................................... 6 2.1. HECI ............................................................................................................................... 6 2.2. Network (vPro only)......................................................................................................... 6 2.3. Hardware attack on SPI interface ..................................................................................... 6 2.4. Internal file system .........................................................................................................
    [Show full text]
  • Developing Solutions for the Internet of Things
    Cloud Data Gateways Analytics Things WHITE PAPER Internet of Things Developing Solutions for the Internet of Things Intel® products, solutions, and services are enabling secure and seamless solutions for the Internet of Things (IoT). Introduction The world is undergoing a dramatic transformation, rapidly transitioning from isolated systems to ubiquitous Internet-enabled ‘things’ capable of generating data that can be analyzed to extract valuable information. Commonly referred to as the Internet of Things (IoT), this new reality will enrich everyday life, increase business productivity, improve government efficiency, and the list goes on. Intel is working with a large community of solution providers to develop IoT solutions for a wide range of organizations and businesses, including industrial, retail, automotive, energy, and healthcare industries. The solutions generate actionable information by running analytic Powering software and services on data that moves between devices and the cloud in a manner that is Business always secure, manageable, and user-friendly. Transformation Whether connecting a consumer wearable device, vehicle, or factory controller to the Internet, everyone wants it to be quick and seamless. This paper describes how Intel® products and technologies are helping make this a reality by providing fundamental building blocks for a robust ecosystem that is developing end-to-end IoT solutions. Building Blocks for Thing to Cloud Innovation The IoT vision is to create opportunities to transform businesses, people’s lives, and the world in countless ways by enabling billions of systems across the globe to share and analyze data over the cloud. With these capabilities, IoT solutions can improve medical outcomes, create better products faster, lower development cost, make shopping more enjoyable, or optimize energy generation and consumption.
    [Show full text]
  • Intel® AMT Configuration Utility User Guide
    Intel® AMT Configuration Utility User Guide Version 11.0 Document Release Date: December 17, 2015 License Intel®Setup and Configuration Software (Intel® SCS) is furnished under license and may only be used or copied in accordance with the terms of that license. For more information, refer to the “Exhibit A” section of the “Intel(R) SCS License Agreement.rtf”, located in the Licenses folder. Legal Information No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel technologies' features and benefits depend on system configuration and may require enabled hardware, specific software, or services activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. Intel® AMT should be used by a knowledgeable IT administrator and requires enabled systems, software, activation, and connection to a corporate network. Intel AMT functionality on mobile systems may be limited in some situations. Your results will depend on your specific implementation. Learn more by visiting Intel® Active Management Technology.
    [Show full text]
  • BRKINI-2390.Pdf
    BRKINI-2390 Data Center security within modern compute and attached fabrics - servers, IO, management Dan Hanson Director UCS Architectures and Technical Marketing Cisco Spark Questions? Use Cisco Spark to communicate with the speaker after the session How 1. Find this session in the Cisco Live Mobile App 2. Click “Join the Discussion” 3. Install Spark or go directly to the space 4. Enter messages/questions in the space cs.co/ciscolivebot#BRKINI-2390 © 2018 Cisco and/or its affiliates. All rights reserved. Cisco Public Recent Press Items © 2018 Cisco and/or its affiliates. All rights reserved. Cisco Public Agenda • x86 Architecture Review • BIOS and Kernel Manipulation • Device Firmware Manipulation • On Server Data Storage Manipulation • Segmentation and Device access • Root of Trust Flow • Policy Control vs. Component Configuration (Cisco UCS and ACI) • Example of Security Offloading: Skyport Systems • Conclusion x86 Architecture Review Many Points of possible attack X86 Reference Legacy Elements • You may see many terms in various articles shown here • Over time, items moving on the CPU itself • Memory • PCIe • Processors/Servers differentiation in some areas • Front Side Bus speeds • Direct Media Interface • Southbridge Configurations BRKINI-2390 © 2018 Cisco and/or its affiliates. All rights reserved. Cisco Public 7 X86 Reference Fundamental Architecture • Not shown: Quick Path Interconnect/UltraPath Interconnect for CPU to CPU communications • Varied counts and speeds for multi-socket systems • Current Designs have On-Die PCIe and Memory controllers • Varied numbers and DIMMs in memory channels by CPU • Platform Controller Hub varies and can even offer server acceleration and security functions BRKINI-2390 © 2018 Cisco and/or its affiliates.
    [Show full text]
  • System Builder's Guide for D-Series
    Matrox® Display Wall Mura™ IPX Series • D-Series™ System Builder’s Guide 20315-101-0110 2021.07.28 www.matrox.com/video Contents Product overview .....................................................................................................................................................4 Hardware summary – Mura IPX Series.....................................................................................................................................................................4 MURAIPXI-E4SF/MURAIPXI-E4SHF ...............................................................................................................................................4 MURAIPXI-E2MF/MURAIPXI-E2MHF ...........................................................................................................................................5 MURAIPXI-D2MF/MURAIPXI-D2MHF..................................................................................................................................................6 MURAIPXI-E4JF/MURAIPXI-E4JHF ................................................................................................................................................7 MURAIPXI-D4JF/MURAIPXI-D4JHF ..............................................................................................................................................8 Hardware summary – Matrox D-Series ....................................................................................................................................................................9
    [Show full text]
  • Dell EMC Poweredge C4140 Technical Guide
    Dell EMC PowerEdge C4140 Technical Guide Regulatory Model: E53S Series Regulatory Type: E53S001 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2017 - 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 2019 - 09 Rev. A00 Contents 1 System overview ......................................................................................................................... 5 Introduction............................................................................................................................................................................ 5 New technologies.................................................................................................................................................................. 5 2 System features...........................................................................................................................7 Specifications......................................................................................................................................................................... 7 Product comparison.............................................................................................................................................................
    [Show full text]
  • Zerohack Zer0pwn Youranonnews Yevgeniy Anikin Yes Men
    Zerohack Zer0Pwn YourAnonNews Yevgeniy Anikin Yes Men YamaTough Xtreme x-Leader xenu xen0nymous www.oem.com.mx www.nytimes.com/pages/world/asia/index.html www.informador.com.mx www.futuregov.asia www.cronica.com.mx www.asiapacificsecuritymagazine.com Worm Wolfy Withdrawal* WillyFoReal Wikileaks IRC 88.80.16.13/9999 IRC Channel WikiLeaks WiiSpellWhy whitekidney Wells Fargo weed WallRoad w0rmware Vulnerability Vladislav Khorokhorin Visa Inc. Virus Virgin Islands "Viewpointe Archive Services, LLC" Versability Verizon Venezuela Vegas Vatican City USB US Trust US Bankcorp Uruguay Uran0n unusedcrayon United Kingdom UnicormCr3w unfittoprint unelected.org UndisclosedAnon Ukraine UGNazi ua_musti_1905 U.S. Bankcorp TYLER Turkey trosec113 Trojan Horse Trojan Trivette TriCk Tribalzer0 Transnistria transaction Traitor traffic court Tradecraft Trade Secrets "Total System Services, Inc." Topiary Top Secret Tom Stracener TibitXimer Thumb Drive Thomson Reuters TheWikiBoat thepeoplescause the_infecti0n The Unknowns The UnderTaker The Syrian electronic army The Jokerhack Thailand ThaCosmo th3j35t3r testeux1 TEST Telecomix TehWongZ Teddy Bigglesworth TeaMp0isoN TeamHav0k Team Ghost Shell Team Digi7al tdl4 taxes TARP tango down Tampa Tammy Shapiro Taiwan Tabu T0x1c t0wN T.A.R.P. Syrian Electronic Army syndiv Symantec Corporation Switzerland Swingers Club SWIFT Sweden Swan SwaggSec Swagg Security "SunGard Data Systems, Inc." Stuxnet Stringer Streamroller Stole* Sterlok SteelAnne st0rm SQLi Spyware Spying Spydevilz Spy Camera Sposed Spook Spoofing Splendide
    [Show full text]
  • C610 Series Chipset and Intel® X99 Chipset Platform Controller Hub (PCH) External Design Specification (EDS) Specification Update
    Intel® C610 Series Chipset and Intel® X99 Chipset Platform Controller Hub (PCH) External Design Specification (EDS) Specification Update June 2016 Reference Number: 330789-004 Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. I2C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation.
    [Show full text]
  • Fit-PC4 Hardware Specification
    fit-PC4 Hardware Specification CompuLab Ltd. Revision 1.2 July 2014 Legal Notice © 2013 CompuLab Ltd. All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written permission of CompuLab Ltd. No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by CompuLab Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document. CompuLab Ltd. reserves the right to change details in this publication without notice. Product and company names herein may be the trademarks of their respective owners. CompuLab Ltd. 17 HaYetsira St., Yokneam Elite 20692, P.O.B 687 ISRAEL Tel: +972-4-8290100 http://www.compulab.co.il http://fit-pc.com/web/ Fax: +972-4-8325251 CompuLab Ltd. fit-PC4 – Hardware Specification Page 2 of 67 Revision History Revision Engineer Revision Changes 1.0 Maxim Birger Initial public release based on fit-PC4 HW Rev1.1 1.1 Maxim Birger Based on fit-PC4 HW Rev1.2: a. Major improvement in power consumption values 1.2 Maxim Birger Installing RAM memory instructions update 1.3 Maxim Birger Added power supply temperature ratings: 10.2 CompuLab Ltd. fit-PC4 – Hardware Specification Page 3 of 67 Table of Contents Legal Notice ................................................................................................................................................... 2 Revision History ............................................................................................................................................ 3 1 Introduction .........................................................................................................................................
    [Show full text]
  • (PCH) Thermal Mechanical Specifications and Design Guid
    Intel® 6 Series Chipset and Intel® C200 Series Chipset Thermal Mechanical Specifications and Design Guidelines (TMSDG) May 2011 324647-004 INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
    [Show full text]
  • Remote Power Management of Client Pcs
    SOLUTION BLUEPRINT GREEN POWER Remote Power Management of Client PCs Industry IT security management across industries Business Challenge Saving power and costs by remotely managing the power state of client PCs Technology Solution Intel® vPro™ technology and Intel® Active Management Technology Enterprise Hardware Platform Intel® Core® vPro™ processor family Solution Blueprint: BUSINESS CHALLENGE Remote Power There’s much debate over how much an organization can save on power by having an enterprise-wide Management of Client PCs strategy for monitoring the power state of client machines. For example, how much credible savings do technologies such as Enhanced Intel SpeedStep® Technology provide? What about OS-level features such as automatic hibernation and sleep? One thing is certain: a running machine consumes more energy than a sleeping or hibernated machine, and a turned-off machine consumes less. The real issue comes down to the best way to manage client machines if they are unpredictably asleep, hibernated, or even turned off. Intel® vPro™ technology with Intel® Advanced Management Technology (Intel® AMT) has always pro- vided a way to power remote client computers on or off as easily as if their power button were acces- sible to the service technician. This solution blueprint explains how to extend that capability to include graceful shutdowns to power states other than off, and how to create alarm clock events that run on Intel AMT itself, which you can use to ensure machines are powered on in preparation for scheduled maintenance events. It also discusses a tool to automatically schedule alarm clock events using the management console. This helps ensure that idle machines can spend more of their time in an off, hibernated, or sleeping power state without affecting IT’s ability to effectively manage and administer the entire eet of ma- chines.
    [Show full text]
  • Intel® Wireless-AC 9560 Product Brief
    Product brief Intel® Wireless-AC 9560 st 1 1 Generation Integrated Intel wireless 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth® 5.1 Intel® Wireless-AC 9560 Integrated Ultra Wi-Fi. Ultra Features. Optimized Solution for System Design. The Intel® Wireless-AC 9560 adapter is a CRF2 (companion RF module) supporting the first-generation integrated Intel wireless 802.11ac solution, comprised of CNVi3 and a CRF. The solution provides Bluetooth® 5.1 and 2x2 802.11ac Wi-Fi, including wave 2 features such as 160MHz channels, delivering up to 1.73Gbps4 and downlink MU-MIMO. These new features deliver a significant increase in user speeds in dense deployments, supporting fast downloads and long battery life compared to legacy 802.11ac devices. Combined with Intel® Core™ processors and exceptional Intel wireless innovations, the Intel® Wireless-AC 9560 can provide Gigabit wireless speed4 and dramatically improve your connected experience at home, work, or on the go. 1ST GENERATION INTEGRATED INTEL 802.11AC WIRELESS Faster Speed Intel® Wireless-AC 9560 enables smooth streaming of high resolution videos, Better Coverage fewer dropped connections, less congestion, and fast speed farther away from Larger Capacity the router, enabling DL MU-MIMO and 160MHz channel use. 802.11ac, 2x2, Dual Band, When using 160MHz channels, Intel® Wireless-AC 9560 can deliver over 5x faster 160MHz, MU-MIMO Wi-Fi speeds (up to 1.73Gbps) than 802.11n and double the speed of legacy 802.11ac5. Wi-Fi/Bluetooth® and LTE Coexistence Support (Optional) Downlink MU-MIMO allows an Access Point to simultaneously transmit data to multiple clients and can improve overall downlink network capacity potentially by over 3x6.
    [Show full text]