Copyright 2017 Intel Corporation Notices and Disclaimers Intel technologies may require enabled hardware, specific software, or services activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer. For more complete information about performance and benchmark results, visit www.intel.com/benchmarks. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance. Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction. § For more information go to http://www.intel.com/performance. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. No computer system can be absolutely secure. Intel, the Intel logo, Xeon, Intel vPro, Intel Xeon Phi, Look Inside., are trademarks of Intel Corporation in the U.S. and/or other countries. © 2017 Intel Corporation. *Other names and brands may be claimed as the property of others. Copyright 2017 Intel Corporation 2 CLOUD ECONOMICS INTELLIGENT DATA PRACTICES NETWORK TRANSFORMATION Intel® Xeon® Scalable Platform The industry’s Biggest platform advancement In a decade INTEL® XEON® SCALABLE processors The Foundation for Agile, Secure, Workload-Optimized Hybrid Cloud UP TO UP TO SCALABLE PERFORMANCE SCALABLE PERFORMANCE 28 CORES 22 CORES AT LOW POWER ENTRY HARDWARE-ENHANCED SECURITY Good STANDARD RAS STANDARD RAS UP SOCKET WITH UPI SOCKET TO 2, 4 & 8 SUPPORT UP TO 3 LINKS 2 & 4 SUPPORT MODERATE TASKS Light TASKS M TOPLINE MEMORY DDR4 H WITH UP TO UPI LINKS 2666 Z UP TO 1.5 TB CHANNEL BANDWIDTH 3 INTEL® TURBO BOOST TECHNOLOGY AND ENTRY PERFORMANCE, Price Sensitive INTEL® HYPER-THREADING TECHNOLOGY ACCELERATOR RELIABILITY, AVAILABILITY FOR LIGHT WORKLOADS HIGHEST THROUGHPUT ADVANCED AND SERVICEABILITY FOR MODERATE WORKLOADS MAINSTREAM Efficient ENTRY 7 The Intel® Xeon® Scalable Processors: Intel® Xeon® PLATINUM PROCESSOR 81XX Series Platinum (2, 4, and 8 An Agile Solution Stack for Data Center Workloads Socket) Intel® Xeon® GOLD PROCESSOR + Up to 28 Cores + 2,4, or 8 socket configurations for 5 61XX Series Gold (2 and 4 Socket) best performance and scalability + Up to 22 Cores + Topline memory channel + Added 3rd UPI link for increased performance (1.5 TB memory dataflow across cores bandwidth on select SKUs) Intel® Xeon® SILVER PROCESSOR + Increased performance across + 3 UPI links option across 2S,4S,8S memory channels6 for improved scalability and inter- 41XX Series Silver (2 Socket) + Intel® AVX-512 with additional FMA core data flow + Up to 12 cores + Added Node Controller Support to Intel® Xeon® BRONZE PROCESSOR + 2S configuration with Improved assist in scaled node management Memory channel performance 51XX Series Gold (2 and 4 Socket) 31XX Series Bronze (2 Socket) + Intel® Turbo Boost Technology + Up to 14 cores • Up to 8 cores for higher frequency capability + Supports 2S and 4S configuration • 2S configuration + Intel® HT Technology for hyper for increased scalability • Improved core interconnect (UPI) threaded workloads + Increased core interconnect speed to over past gen boost data flow in multi-processor • 48 PCIe 3.0 lanes workloads • Intel® AVX-512 feature enabled + Advanced RAS features The Best Performance, • Standard RAS features Scalability, Core options, Efficient Performance at Low Mainstream Performance, Fast and all Hardware-Enhanced Entry Performance and security Power. Provides more horsepower Memory, More Interconnect Security features for the for price sensitive deployments for single purpose workloads Engines, Advanced Reliability most robust capability Better performance, interconnectivity, scalability, and memory 8 Unified Intel® Xeon® Scalable Platform 2016 2017 2018 Intel® Xeon® Processor E7 Brickland Platform Intel® Xeon® Scalable Targeted at mission-critical Platform (codename Purley) applications that value a scale-up Skylake CPUs E7 v3 E7 v4 system with leadership18 cores memory capacity and advanced RAS Intel® Xeon® PLATINUM Intel® Xeon® GOLD Intel® Xeon® Processor E5 Grantley-EP Platform Targeted at a wide variety of Intel® Xeon® SILVER applications that value a balanced E5 v3 E5-4600 v4 (4S) system with leadership Intel® Xeon® BRONZE E5 v3 E5-2600 v4 performance/watt/$ Copyright 2017 Intel Corporation 9 Intel® Xeon® Scalable Processor Re-architected from the Ground Up • Skylake core microarchitecture, with data • New mesh interconnect architecture • Intel® Speed Shift Technology center specific enhancements • Enhanced memory subsystem • Security & Virtualization enhancements • Intel® AVX-512 with 32 DP flops per core (MBE, PPK, MPX) • Modular IO with integrated devices • Data center optimized cache hierarchy – • Optional Integrated Intel® Omni-Path • New Intel® Ultra Path Interconnect 1MB L2 per core, non-inclusive L3 Fabric (Intel® OPA) (Intel® UPI) Features Intel® Xeon® Processor E5-2600 v4 Intel® Xeon® Scalable Processor 6 Channels DDR4 Cores Per Socket Up to 22 Up to 28 DDR4 Core Core 2 or 3 UPI Threads Per Socket Up to 44 threads Up to 56 threads DDR4 Core Core UPI Last-level Cache (LLC) Up to 55 MB Up to 38.5 MB (non-inclusive) DDR4 QPI/UPI Speed (GT/s) 2x QPI channels @ 9.6 GT/s Up to 3x UPI @ 10.4 GT/s UPI DDR4 Core Core PCIe* Lanes/ 40 / 10 / PCIe* 3.0 (2.5, 5, 8 GT/s) UPI Controllers/Speed(GT/s) 48 / 12 / PCIe 3.0 (2.5, 5, 8 GT/s) DDR4 Shared L3 4 channels of up to 3 RDIMMs, 6 channels of up to 2 RDIMMs, Omni-Path Memory Population Omni-Path HFI LRDIMMs, or 3DS LRDIMMs LRDIMMs, or 3DS LRDIMMs DDR4 Max Memory Speed Up to 2400 Up to 2666 48 Lanes DMI3 PCIe* 3.0 TDP (W) 55W-145W 70W-205W 10 Platform Overview 3x16 PCIe* 3x16 PCIe 2 or 3 Intel® UPI Gen3 Gen3 Capabilities Details Socket Socket P Skylake-SP Skylake-SP DDR4 Scalability 2S, 4S, 8S, and >8S (with node controller support) CPU 2666 CPU CPU TDP 70W – 205W OPA OPA 1x 100Gb OPA 1x 100Gb OPA Chipset Intel® C620 Series (code name Lewisburg PCH) Fabric Fabric Networking Intel® Omni-Path Fabric (integrated w/ CPU + discrete) 4x10GbE (integrated w/ chipset) DMI CPU VRs 100G/40G/25G discrete options OPA VRs Intel® C620 Series Compression and Intel® QuickAssist Technology option in chipset to Mem VRs Crypto Acceleration support 100Gb/s comp/decomp/crypto Intel® ME High USB3 100K RSA2K public key QAT IE Speed IO PCIe3 4x10GbE NIC SATA3 BMC Storage CPU integrated QuickData Technology, VMD, and NTB GPIO Firmware Intel® Optane™ SSD, Intel® 3D-NAND NVMe* & SATA SSD eSPI/LPC 10GbE SPI Security CPU Instruction Set enhancements (MBE, PPK, MPX) Manageability Engine with multiple secure boot options TPM Firmware Intel® Platform Trust Technology Intel® Key Protection Technology BMC: Baseboard Management Controller PCH: Intel® Platform Controller Hub IE: Innovation Engine Manageability Intel® Node Manager Intel® OPA: Intel® Omni-Path Architecture Intel QAT: Intel® QuickAssist Technology ME: Manageability Engine Intel® Datacenter Manager NIC: Network Interface Controller VMD: Volume Management Device NTB: Non-Transparent Bridge Innovation Engine (IE) Copyright 2017 Intel Corporation 11 Platform Topologies 2S Configurations General Purpose/Storage/ 4S Configurations 8S Configuration HPC/Comms SP Enterprise and Cloud Enterprise LBG LBG SKL SKL SKL SKL SKL SKL Intel® UPI DMI * x4 * LBG LBG LBG 3x16 3x16 PCIe* 1x100G PCIe 1x100G SKL SKL Intel® OP Fabric Intel OP Fabric SKL SKL (2S-2UPI & 2S-3UPI shown) DMI SKL SKL LBG LBG 3x16 PCIe (4S-2UPI & 4S-3UPI shown) SKL SKL Intel® Xeon® Scalable Platform supports DMI 3x16 PCIe configurations ranging from 2S-2UPI to 8S LBG LBG Copyright 2017 Intel Corporation 12 Copyright 2017 Intel Corporation 13 Overview . Skylake core microarchitecture, with . New mesh interconnect architecture . Intel® Speed Shift Technology data center specific enhancements . Enhanced memory subsystem . Security & Virtualization enhancements . Intel® AVX-512 with 32 DP Flops per . Modular IO subsystem with integrated . Optional Integrated Intel® Omni-Path core devices Fabric (Intel® OPA) . Data center optimized cache hierarchy – . New Intel® Ultra Path Interconnect 1MB L2 per core, non-inclusive L3 (Intel® UPI Intel® Xeon® Scalable Processor Features Intel® Xeon® Processor E5-2600 v4 6 Channels DDR4 (Skylake-SP) DDR4 Core Core Cores Per Socket Up to 22 Up to 28 2 or 3 UPI DDR4 Threads Per Socket Up to 44 threads Up to 56 threads Core Core UPI Last-level Cache (LLC) Up to 55 MB Up to 38.5 MB (non-inclusive) DDR4 UPI QPI/UPI Speed (GT/s) 2x QPI channels @ 9.6 GT/s Up to 3x UPI @ 10.4 GT/s DDR4 Core Core PCIe* Lanes/ UPI 40 / 10 / PCIe 3.0 (2.5, 5, 8 GT/s) DDR4 Shared L3 Controllers/Speed(GT/s) 48 / 12 / PCIe 3.0 (2.5, 5, 8 GT/s) Omni Path 4 channels of up to 3 RDIMMs, 6 channels of up to 2 RDIMMs, DDR4 Omni Path HFI Memory Population LRDIMMs, or 3DS LRDIMMs LRDIMMs, or 3DS LRDIMMs 48 Lanes DMI3 Max Memory Speed