HPC Software Cluster Solution
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How to Hack a Turned-Off Computer Or Running Unsigned
HOW TO HACK A TURNED-OFF COMPUTER, OR RUNNING UNSIGNED CODE IN INTEL ME Contents Contents ................................................................................................................................ 2 1. Introduction ...................................................................................................................... 3 1.1. Intel Management Engine 11 overview ............................................................................. 4 1.2. Published vulnerabilities in Intel ME .................................................................................. 5 1.2.1. Ring-3 rootkits.......................................................................................................... 5 1.2.2. Zero-Touch Provisioning ........................................................................................... 5 1.2.3. Silent Bob is Silent .................................................................................................... 5 2. Potential attack vectors ...................................................................................................... 6 2.1. HECI ............................................................................................................................... 6 2.2. Network (vPro only)......................................................................................................... 6 2.3. Hardware attack on SPI interface ..................................................................................... 6 2.4. Internal file system ......................................................................................................... -
Developing Solutions for the Internet of Things
Cloud Data Gateways Analytics Things WHITE PAPER Internet of Things Developing Solutions for the Internet of Things Intel® products, solutions, and services are enabling secure and seamless solutions for the Internet of Things (IoT). Introduction The world is undergoing a dramatic transformation, rapidly transitioning from isolated systems to ubiquitous Internet-enabled ‘things’ capable of generating data that can be analyzed to extract valuable information. Commonly referred to as the Internet of Things (IoT), this new reality will enrich everyday life, increase business productivity, improve government efficiency, and the list goes on. Intel is working with a large community of solution providers to develop IoT solutions for a wide range of organizations and businesses, including industrial, retail, automotive, energy, and healthcare industries. The solutions generate actionable information by running analytic Powering software and services on data that moves between devices and the cloud in a manner that is Business always secure, manageable, and user-friendly. Transformation Whether connecting a consumer wearable device, vehicle, or factory controller to the Internet, everyone wants it to be quick and seamless. This paper describes how Intel® products and technologies are helping make this a reality by providing fundamental building blocks for a robust ecosystem that is developing end-to-end IoT solutions. Building Blocks for Thing to Cloud Innovation The IoT vision is to create opportunities to transform businesses, people’s lives, and the world in countless ways by enabling billions of systems across the globe to share and analyze data over the cloud. With these capabilities, IoT solutions can improve medical outcomes, create better products faster, lower development cost, make shopping more enjoyable, or optimize energy generation and consumption. -
インテル® Parallel Studio XE 2020 リリースノート
インテル® Parallel Studio XE 2020 2019 年 12 月 5 日 内容 1 概要 ..................................................................................................................................................... 2 2 製品の内容 ........................................................................................................................................ 3 2.1 インテルが提供するデバッグ・ソリューションの追加情報 ..................................................... 5 2.2 Microsoft* Visual Studio* Shell の提供終了 ........................................................................ 5 2.3 インテル® Software Manager .................................................................................................... 5 2.4 サポートするバージョンとサポートしないバージョン ............................................................ 5 3 新機能 ................................................................................................................................................ 6 3.1 インテル® Xeon Phi™ 製品ファミリーのアップデート ......................................................... 12 4 動作環境 .......................................................................................................................................... 13 4.1 プロセッサーの要件 ...................................................................................................................... 13 4.2 ディスク空き容量の要件 .............................................................................................................. 13 4.3 オペレーティング・システムの要件 ............................................................................................. 13 -
Introduction to High Performance Computing
Introduction to High Performance Computing Shaohao Chen Research Computing Services (RCS) Boston University Outline • What is HPC? Why computer cluster? • Basic structure of a computer cluster • Computer performance and the top 500 list • HPC for scientific research and parallel computing • National-wide HPC resources: XSEDE • BU SCC and RCS tutorials What is HPC? • High Performance Computing (HPC) refers to the practice of aggregating computing power in order to solve large problems in science, engineering, or business. • Purpose of HPC: accelerates computer programs, and thus accelerates work process. • Computer cluster: A set of connected computers that work together. They can be viewed as a single system. • Similar terminologies: supercomputing, parallel computing. • Parallel computing: many computations are carried out simultaneously, typically computed on a computer cluster. • Related terminologies: grid computing, cloud computing. Computing power of a single CPU chip • Moore‘s law is the observation that the computing power of CPU doubles approximately every two years. • Nowadays the multi-core technique is the key to keep up with Moore's law. Why computer cluster? • Drawbacks of increasing CPU clock frequency: --- Electric power consumption is proportional to the cubic of CPU clock frequency (ν3). --- Generates more heat. • A drawback of increasing the number of cores within one CPU chip: --- Difficult for heat dissipation. • Computer cluster: connect many computers with high- speed networks. • Currently computer cluster is the best solution to scale up computer power. • Consequently software/programs need to be designed in the manner of parallel computing. Basic structure of a computer cluster • Cluster – a collection of many computers/nodes. • Rack – a closet to hold a bunch of nodes. -
Applying the Roofline Performance Model to the Intel Xeon Phi Knights Landing Processor
Applying the Roofline Performance Model to the Intel Xeon Phi Knights Landing Processor Douglas Doerfler, Jack Deslippe, Samuel Williams, Leonid Oliker, Brandon Cook, Thorsten Kurth, Mathieu Lobet, Tareq Malas, Jean-Luc Vay, and Henri Vincenti Lawrence Berkeley National Laboratory {dwdoerf, jrdeslippe, swwilliams, loliker, bgcook, tkurth, mlobet, tmalas, jlvay, hvincenti}@lbl.gov Abstract The Roofline Performance Model is a visually intuitive method used to bound the sustained peak floating-point performance of any given arithmetic kernel on any given processor architecture. In the Roofline, performance is nominally measured in floating-point operations per second as a function of arithmetic intensity (operations per byte of data). In this study we determine the Roofline for the Intel Knights Landing (KNL) processor, determining the sustained peak memory bandwidth and floating-point performance for all levels of the memory hierarchy, in all the different KNL cluster modes. We then determine arithmetic intensity and performance for a suite of application kernels being targeted for the KNL based supercomputer Cori, and make comparisons to current Intel Xeon processors. Cori is the National Energy Research Scientific Computing Center’s (NERSC) next generation supercomputer. Scheduled for deployment mid-2016, it will be one of the earliest and largest KNL deployments in the world. 1 Introduction Moving an application to a new architecture is a challenge, not only in porting of the code, but in tuning and extracting maximum performance. This is especially true with the introduction of the latest manycore and GPU-accelerated architec- tures, as they expose much finer levels of parallelism that can be a challenge for applications to exploit in their current form. -
BRKINI-2390.Pdf
BRKINI-2390 Data Center security within modern compute and attached fabrics - servers, IO, management Dan Hanson Director UCS Architectures and Technical Marketing Cisco Spark Questions? Use Cisco Spark to communicate with the speaker after the session How 1. Find this session in the Cisco Live Mobile App 2. Click “Join the Discussion” 3. Install Spark or go directly to the space 4. Enter messages/questions in the space cs.co/ciscolivebot#BRKINI-2390 © 2018 Cisco and/or its affiliates. All rights reserved. Cisco Public Recent Press Items © 2018 Cisco and/or its affiliates. All rights reserved. Cisco Public Agenda • x86 Architecture Review • BIOS and Kernel Manipulation • Device Firmware Manipulation • On Server Data Storage Manipulation • Segmentation and Device access • Root of Trust Flow • Policy Control vs. Component Configuration (Cisco UCS and ACI) • Example of Security Offloading: Skyport Systems • Conclusion x86 Architecture Review Many Points of possible attack X86 Reference Legacy Elements • You may see many terms in various articles shown here • Over time, items moving on the CPU itself • Memory • PCIe • Processors/Servers differentiation in some areas • Front Side Bus speeds • Direct Media Interface • Southbridge Configurations BRKINI-2390 © 2018 Cisco and/or its affiliates. All rights reserved. Cisco Public 7 X86 Reference Fundamental Architecture • Not shown: Quick Path Interconnect/UltraPath Interconnect for CPU to CPU communications • Varied counts and speeds for multi-socket systems • Current Designs have On-Die PCIe and Memory controllers • Varied numbers and DIMMs in memory channels by CPU • Platform Controller Hub varies and can even offer server acceleration and security functions BRKINI-2390 © 2018 Cisco and/or its affiliates. -
Dell EMC Poweredge C4140 Technical Guide
Dell EMC PowerEdge C4140 Technical Guide Regulatory Model: E53S Series Regulatory Type: E53S001 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2017 - 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 2019 - 09 Rev. A00 Contents 1 System overview ......................................................................................................................... 5 Introduction............................................................................................................................................................................ 5 New technologies.................................................................................................................................................................. 5 2 System features...........................................................................................................................7 Specifications......................................................................................................................................................................... 7 Product comparison............................................................................................................................................................. -
C610 Series Chipset and Intel® X99 Chipset Platform Controller Hub (PCH) External Design Specification (EDS) Specification Update
Intel® C610 Series Chipset and Intel® X99 Chipset Platform Controller Hub (PCH) External Design Specification (EDS) Specification Update June 2016 Reference Number: 330789-004 Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. I2C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation. -
Introduction to Intel Xeon Phi (“Knights Landing”) on Cori
Introduction to Intel Xeon Phi (“Knights Landing”) on Cori" Brandon Cook! Brian Friesen" 2017 June 9 - 1 - Knights Landing is here!" • KNL nodes installed in Cori in 2016 • “Pre-produc=on” for ~ 1 year – No charge for using KNL nodes – Limited access (un7l now!) – Intermi=ent down7me – Frequent so@ware changes • KNL nodes on Cori will soon enter produc=on – Charging Begins 2017 July 1 - 2 - Knights Landing overview" Knights Landing: Next Intel® Xeon Phi™ Processor Intel® Many-Core Processor targeted for HPC and Supercomputing First self-boot Intel® Xeon Phi™ processor that is binary compatible with main line IA. Boots standard OS. Significant improvement in scalar and vector performance Integration of Memory on package: innovative memory architecture for high bandwidth and high capacity Integration of Fabric on package Three products KNL Self-Boot KNL Self-Boot w/ Fabric KNL Card (Baseline) (Fabric Integrated) (PCIe-Card) Potential future options subject to change without notice. All timeframes, features, products and dates are preliminary forecasts and subject to change without further notification. - 3 - Knights Landing overview TILE CHA 2 VPU 2 VPU Knights Landing Overview 1MB L2 Core Core 2 x16 X4 MCDRAM MCDRAM 1 x4 DMI MCDRAM MCDRAM Chip: 36 Tiles interconnected by 2D Mesh Tile: 2 Cores + 2 VPU/core + 1 MB L2 EDC EDC PCIe D EDC EDC M Gen 3 3 I 3 Memory: MCDRAM: 16 GB on-package; High BW D Tile D D D DDR4: 6 channels @ 2400 up to 384GB R R 4 36 Tiles 4 IO: 36 lanes PCIe Gen3. 4 lanes of DMI for chipset C DDR MC connected by DDR MC C Node: 1-Socket only H H A 2D Mesh A Fabric: Omni-Path on-package (not shown) N Interconnect N N N E E L L Vector Peak Perf: 3+TF DP and 6+TF SP Flops S S Scalar Perf: ~3x over Knights Corner EDC EDC misc EDC EDC Streams Triad (GB/s): MCDRAM : 400+; DDR: 90+ Source Intel: All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. -
(PCH) Thermal Mechanical Specifications and Design Guid
Intel® 6 Series Chipset and Intel® C200 Series Chipset Thermal Mechanical Specifications and Design Guidelines (TMSDG) May 2011 324647-004 INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. -
Intel® Parallel Studio XE 2020 Update 2 Release Notes
Intel® Parallel StudIo Xe 2020 uPdate 2 15 July 2020 Contents 1 Introduction ................................................................................................................................................... 2 2 Product Contents ......................................................................................................................................... 3 2.1 Additional Information for Intel-provided Debug Solutions ..................................................... 4 2.2 Microsoft Visual Studio Shell Deprecation ....................................................................................... 4 2.3 Intel® Software Manager ........................................................................................................................... 5 2.4 Supported and Unsupported Versions .............................................................................................. 5 3 What’s New ..................................................................................................................................................... 5 3.1 Intel® Xeon Phi™ Product Family Updates ...................................................................................... 12 4 System Requirements ............................................................................................................................. 13 4.1 Processor Requirements........................................................................................................................ 13 4.2 Disk Space Requirements ..................................................................................................................... -
Effectively Using NERSC
Effectively Using NERSC Richard Gerber Senior Science Advisor HPC Department Head (Acting) NERSC: the Mission HPC Facility for DOE Office of Science Research Largest funder of physical science research in U.S. Bio Energy, Environment Computing Materials, Chemistry, Geophysics Particle Physics, Astrophysics Nuclear Physics Fusion Energy, Plasma Physics 6,000 users, 48 states, 40 countries, universities & national labs Current Production Systems Edison 5,560 Ivy Bridge Nodes / 24 cores/node 133 K cores, 64 GB memory/node Cray XC30 / Aries Dragonfly interconnect 6 PB Lustre Cray Sonexion scratch FS Cori Phase 1 1,630 Haswell Nodes / 32 cores/node 52 K cores, 128 GB memory/node Cray XC40 / Aries Dragonfly interconnect 24 PB Lustre Cray Sonexion scratch FS 1.5 PB Burst Buffer 3 Cori Phase 2 – Being installed now! Cray XC40 system with 9,300 Intel Data Intensive Science Support Knights Landing compute nodes 10 Haswell processor cabinets (Phase 1) 68 cores / 96 GB DRAM / 16 GB HBM NVRAM Burst Buffer 1.5 PB, 1.5 TB/sec Support the entire Office of Science 30 PB of disk, >700 GB/sec I/O bandwidth research community Integrate with Cori Phase 1 on Aries Begin to transition workload to energy network for data / simulation / analysis on one system efficient architectures 4 NERSC Allocation of Computing Time NERSC hours in 300 millions DOE Mission Science 80% 300 Distributed by DOE SC program managers ALCC 10% Competitive awards run by DOE ASCR 2,400 Directors Discretionary 10% Strategic awards from NERSC 5 NERSC has ~100% utilization Important to get support PI Allocation (Hrs) Program and allocation from DOE program manager (L.