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How to Hack a Turned-Off Computer Or Running Unsigned
HOW TO HACK A TURNED-OFF COMPUTER, OR RUNNING UNSIGNED CODE IN INTEL ME Contents Contents ................................................................................................................................ 2 1. Introduction ...................................................................................................................... 3 1.1. Intel Management Engine 11 overview ............................................................................. 4 1.2. Published vulnerabilities in Intel ME .................................................................................. 5 1.2.1. Ring-3 rootkits.......................................................................................................... 5 1.2.2. Zero-Touch Provisioning ........................................................................................... 5 1.2.3. Silent Bob is Silent .................................................................................................... 5 2. Potential attack vectors ...................................................................................................... 6 2.1. HECI ............................................................................................................................... 6 2.2. Network (vPro only)......................................................................................................... 6 2.3. Hardware attack on SPI interface ..................................................................................... 6 2.4. Internal file system ......................................................................................................... -
Developing Solutions for the Internet of Things
Cloud Data Gateways Analytics Things WHITE PAPER Internet of Things Developing Solutions for the Internet of Things Intel® products, solutions, and services are enabling secure and seamless solutions for the Internet of Things (IoT). Introduction The world is undergoing a dramatic transformation, rapidly transitioning from isolated systems to ubiquitous Internet-enabled ‘things’ capable of generating data that can be analyzed to extract valuable information. Commonly referred to as the Internet of Things (IoT), this new reality will enrich everyday life, increase business productivity, improve government efficiency, and the list goes on. Intel is working with a large community of solution providers to develop IoT solutions for a wide range of organizations and businesses, including industrial, retail, automotive, energy, and healthcare industries. The solutions generate actionable information by running analytic Powering software and services on data that moves between devices and the cloud in a manner that is Business always secure, manageable, and user-friendly. Transformation Whether connecting a consumer wearable device, vehicle, or factory controller to the Internet, everyone wants it to be quick and seamless. This paper describes how Intel® products and technologies are helping make this a reality by providing fundamental building blocks for a robust ecosystem that is developing end-to-end IoT solutions. Building Blocks for Thing to Cloud Innovation The IoT vision is to create opportunities to transform businesses, people’s lives, and the world in countless ways by enabling billions of systems across the globe to share and analyze data over the cloud. With these capabilities, IoT solutions can improve medical outcomes, create better products faster, lower development cost, make shopping more enjoyable, or optimize energy generation and consumption. -
2Nd Generation Intel Core Processor Family with Intel 6 Series Chipset Development Kit User Guide
2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit User Guide March 2011 Document Number: 325208 About This Document INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. -
The New Intel® Xeon® Processor Scalable Family
Akhilesh Kumar Intel Corporation, 2017 Authors: Don Soltis, Irma Esmer, Adi Yoaz, Sailesh Kottapalli Notices and Disclaimers This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance. Optimization Notice: Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. -
Im Divar Ip 6000 2U
DIVAR IP 6000 2U DIP-6080-00N, DIP-6082-8HD, DIP-6083-8HD en Installation Manual DIVAR IP 6000 2U Table of Contents | en 3 Table of contents 1 Safety precautions 5 1.1 General safety precautions 5 1.2 Electrical safety precautions 6 1.3 ESD precautions 7 1.4 Operating precautions 7 1.5 Important notices 8 1.6 FCC and ICES compliance 8 2 System overview 9 2.1 Chassis features 9 2.2 Chassis components 9 2.2.1 Chassis 10 2.2.2 Backplane 10 2.2.3 Fans 10 2.2.4 Mounting rails 10 2.2.5 Power supply 10 2.2.6 Air shroud 10 2.3 System interface 10 2.3.1 Control panel buttons 11 2.3.2 Control panel LEDs 12 2.3.3 Drive carrier LEDs 12 3 Chassis setup and maintenance 13 3.1 Removing the chassis cover 13 3.2 Installing hard drives 14 3.2.1 Removing hard drive trays 14 3.2.2 Installing a hard drive 15 3.3 Installing an optional floppy or fixed hard drive 16 3.4 Installing or replacing a DVD-ROM drive 17 3.5 Replacing the internal transcoder device 17 3.6 Replacing or installing the front port panel 17 3.7 Installing the motherboard 18 3.8 Installing the air shroud 18 3.9 System fans 19 3.10 Power supply 20 3.10.1 Replacing the power supply 21 3.10.2 Replacing the power distributor 22 4 Rack installation 23 4.1 Unpacking the system 23 4.2 Preparing for setup 23 4.2.1 Choosing a setup location 23 4.2.2 Rack precautions 23 4.2.3 General system precautions 24 4.2.4 Rack mounting considerations 24 4.3 Rack mounting instructions 24 4.3.1 Separating the sections of the rack rails 25 4.3.2 Installing the inner rails 26 4.3.3 Installing the outer rails to the -
Desktop 4Th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family Datasheet – Volume 1 of 2
Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family Datasheet – Volume 1 of 2 July 2014 Order No.: 328897-008 By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. -
Dell EMC Poweredge C4140 Technical Guide
Dell EMC PowerEdge C4140 Technical Guide Regulatory Model: E53S Series Regulatory Type: E53S001 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2017 - 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 2019 - 09 Rev. A00 Contents 1 System overview ......................................................................................................................... 5 Introduction............................................................................................................................................................................ 5 New technologies.................................................................................................................................................................. 5 2 System features...........................................................................................................................7 Specifications......................................................................................................................................................................... 7 Product comparison............................................................................................................................................................. -
ECE 571 – Advanced Microprocessor-Based Design Lecture 16
ECE 571 { Advanced Microprocessor-Based Design Lecture 16 Vince Weaver http://www.eece.maine.edu/~vweaver [email protected] 31 March 2016 Announcements • Project topics • HW#8 will be similar, about a modern ARM chip 1 Busses • Grey Code, only one bit change when incrementing. Lower energy on busses? (Su and Despain, ISLPED 1995). 2 Reading of the Webpage http://anandtech.com/show/9582/intel-skylake-mobile-desktop-launch-architecture-analysis/ The Intel Skylake Mobile and Desktop Launch, with Architecture Analysis by Ian Cutress 3 Background on where info comes from Intel Developer Forum This one was in August 4 Name tech Year Conroe/Merom 65nm Tock 2006 Penryn 45nm Tick 2007 Nehalem 45nm Tock 2008 Westmere 32nm Tick 2010 Sandy Bridge 32nm Tock 2011 Ivy Bridge 22nm Tick 2012 Haswell 22nm Tock 2013 Broadwell 14nm Tick 2014 Skylake 14nm Tock 2015 Kaby Lake? 14nm Tock 2016 5 Clock: tick-tock. Upgrade the process technology, then revamp the uarch. 14nm technology? Finfets? What technology are Pis at? 40nm? 14nm yields getting better. hard to get, even with electron beam lithography plasma damage to low-k silicon only 0.111nm finfet. Intel has plants Arizona, etc. Delay to 10nm 7nm? EUV? 6 Skylake Processor { Page 1 • 4.5W ultra-mobile to 65W desktop They release desktop first these days. For example just today releasing \Xeon E5-2600 v4" AKA Broadwell-EP Confusing naming i3, i5, i7, Xeon, Pentium, m3, m5, m7, etc. Number of pins important. Low-power stuck with LPDDR3/DDR3L instead of DDR4 possibly due to lack of pins? eDRAM? 7 Intel no longer releasing info on how many transistors/transistor size? 8 Skylake Processor { Page 2 • \mobile first” design. -
C610 Series Chipset and Intel® X99 Chipset Platform Controller Hub (PCH) External Design Specification (EDS) Specification Update
Intel® C610 Series Chipset and Intel® X99 Chipset Platform Controller Hub (PCH) External Design Specification (EDS) Specification Update June 2016 Reference Number: 330789-004 Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. I2C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation. -
(PCH) Thermal Mechanical Specifications and Design Guid
Intel® 6 Series Chipset and Intel® C200 Series Chipset Thermal Mechanical Specifications and Design Guidelines (TMSDG) May 2011 324647-004 INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. -
Intel® Coretm 2 Duo Processor and Mobile Intel® GME965 Express Chipset
Intel® CoreTM 2 Duo processor and Mobile Intel® GME965 Express Chipset Development Kit User Manual June 2007 Document Number: 316704-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. -
Intel® Compute Card CD1M3128MK CD1IV128MK Technical Product Specification
+ Intel® Compute Card CD1M3128MK CD1IV128MK Technical Product Specification August 2017 Order Number: J46734-001 Intel® Compute Card CD1M3128MK or CD1IV128MK may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel® Compute Card CD1M3128MK or CDIV128MK Specification Updates Revision History Revision Revision History Date 001 First release August 2017 Disclaimer This product specification applies to only the standard Intel® Compute Card with BIOS identifier MKKBLY35.86A or MKKBI5V.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Compute Cards are evaluated as Information Technology Equipment (I.T.E.) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.