How to Implement a MOSFET with a Gate Driver
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UCC27531 35-V Gate Driver for Sic MOSFET Applications (Rev. A)
(1) Application Report SLUA770A–March 2016–Revised May 2018 UCC27531 35-V Gate Driver for SiC MOSFET Applications Richard Herring........................................................................................... High Power Driver Solutions ABSTRACT SiC MOSFETs are gaining popularity in many high-power applications due to their significant switching performance advantages. SiC MOSFETs are also available with attractive voltage ratings and current capabilities. However, the characteristics of SiC MOSFETs require consideration of the gate-driver circuit to optimize the switching performance of the SiC device. Although SiC MOSFETs are not difficult to drive properly, many typical MOSFET drivers may result in compromised switching speed performance. The UCC27531 gate driver includes features and has operating parameters that allow for driving SiC power MOSFETs within the recommended optimum drive configuration. This application note reviews the characteristics of SiC MOSFETs and how to drive them to achieve the performance improvement that SiC can bring at the system level. The features of UCC27531 to achieve optimal performance of SiC are explained and results from a demonstration circuit are provided. 1 Introduction In the past, the majority of applications such as uninterruptible power supplies (UPS), photovoltaic (PV) inverters, and motor drive have utilized IGBTs for the power devices due to the combination of high- voltage ratings exceeding 1 kV and high current capability. Usable switching frequency of IGBTs has typically been limited to 20–30 kHz, due to the high turnoff losses caused by the long turnoff current tail. Design comparisons have shown that SiC MOSFET designs can operate at considerably higher switching frequency and achieve the same or better efficiency. Although the device cost of the SiC MOSFETs are higher than the equivalent IGBTs, the significant savings in transformer, capacitor, and enclosure size results in a lower system cost. -
Egan® Ics for Low Voltage DC-DC Applications Egan® Ics for Low Voltage DC-DC Applications EFFICIENT POWER CONVERSION
APPLICATION NOTE: AN025 eGaN® ICs for Low Voltage DC-DC Applications eGaN® ICs for Low Voltage DC-DC Applications EFFICIENT POWER CONVERSION Michael de Rooij, Ph.D., Vice President of Applications Engineering , Yuanzhe Zhang, Ph.D., Director of Applications Engineering eGaN® FETs from EPC have repeatedly demonstrated higher performance over Monolithic integration of the gate driver to the MOSFET counterparts in many applications [1]. The lateral structure and material FET offers the lowest possible common source properties of eGaN FETs make it possible to monolithically integrate a number of FETs inductance (CSI) as it is moved to within the as demonstrated by products such as the EPC2107 [2]. The next phase in the eGaN IC structure. Furthermore the gate driver has been optimized for the FET being driven to offer FET and IC evolution includes gate driver integration. Integrating the gate driver with maximum performance under any operating the FET offers a number of additional advantages over discrete gate driver and FET condition. These benefits are on top of the well- solutions such as extremely low common source inductance, matched gate driver established low capacitance and inductance, and to FET, and ease of design. All the traditional eGaN FET benefits such as significantly zero reverse recovery charge (QRR) that enable lower capacitance and inductance with zero reverse recovery charge (QRR) in a smaller efficient operation at high switching frequencies even under hard switching conditions. The key footprint for a given on-resistance (RDS(on)) than comparable MOSFETs are retained. However, the combined effect of the new characteristics and benefits ensures an ever characteristics of the EPC2112 are given in table 1. -
Resonant Gate-Drive Circuits for High-Frequency Power Converters
Resonant Gate-Drive Circuits for High-Frequency Power Converters A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy By Hur Jedi B. S., University of Baghdad, Baghdad, Iraq, 2003 M. S., University Putra Malaysia, Selangor, Malaysia, 2010 2018 Wright State University WRIGHT STATE UNIVERSITY GRADUATE SCHOOL November 16, 2018 I HEREBY RECOMMEND THAT THE DISSERTATION PREPARED UNDER MY SUPERVISION BY Hur Jedi ENTITLED Resonant Gate-Drive Circuits for High-Frequency Power Converters BE ACCEPTED IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF Doctor of Philosophy. Marian K. Kazimierczuk, Ph.D. Dissertation Director Arnab Shaw, Ph.D. Director, Electrical Engineering Ph.D. Program Barry Milligan, Ph.D. Interim Dean of the Graduate School Committee on Final Examination Marian K. Kazimierczuk, Ph.D. Ray Siferd, Ph.D. Henry Chen, Ph.D. Saiyu Ren, Ph.D. Yan Zhuang, Ph.D. Abstract Jedi, Hur. Ph.D., Electrical Engineering Ph.D. Program, Department of Electrical Engineering, Wright State University, 2018. Resonant Gate-Drive Circuits for High- Frequency Power Converters. The development trend of power converters motivates the pursuit with high den- sity, high efficiency, and low cost. Increasing the frequency can improve the power density and lead to small passive elements and a fast dynamic response. Each one of these power converters must be driven by a gate-drive circuit to operate efficiently. Conventional gate-drivers are used up to frequencies of about 5 MHz and suffer from switching losses. Therefore, the development of switch-mode power supplies (SMPS) operating at high frequencies requires high-speed gate drivers. -
Igbts (Insulated Gate Bipolar Transistor) Application Note
IGBTs (Insulated Gate Bipolar Transistor) Application Note IGBTs (Insulated Gate Bipolar Transistor) Description This document describes the basic structures, ratings, and electrical characteristics of IGBTs. It also provides usage considerations for IGBTs. © 2018 1 2018-09-01 Toshiba Electronic Devices & Storage Corporation IGBTs (Insulated Gate Bipolar Transistor) Application Note Table of Contents Description ............................................................................................................................................ 1 Table of Contents ................................................................................................................................. 2 1. Device structure and characteristics of IGBTs ............................................................................. 6 1.1. Basic structure of the IGBT ................................................................................................................ 6 1.2. Comparison of different types of transistors (bipolar transistors, MOSFETs, and IGBTs) ....... 8 2. Different types of IGBTs and their structures ............................................................................ 11 2.1. Gating structures ................................................................................................................................11 2.2. IGBT classification based on the vertical structure ...................................................................... 12 2.2.1. Punch-through (PT) IGBTs ................................................................................................................12 -
Failure Precursors for Insulated Gate Bipolar Transistors (Igbts) Nishad Patil1, Diganta Das1, Kai Goebel2 and Michael Pecht1
Failure Precursors for Insulated Gate Bipolar Transistors (IGBTs) 1 1 2 1 Nishad Patil , Diganta Das , Kai Goebel and Michael Pecht 1Center for Advanced Life Cycle Engineering (CALCE) University of Maryland College Park, MD 20742, USA 2NASA Ames Research Center Moffett Field, CA 94035, USA Abstract Failure precursors indicate changes in a measured variable that can be associated with impending failure. By identifying precursors to failure and by monitoring them, system failures can be predicted and actions can be taken to mitigate their effects. In this study, three potential failure precursor candidates, threshold voltage, transconductance, and collector-emitter ON voltage, are evaluated for insulated gate bipolar transistors (IGBTs). Based on the failure causes determined by the failure modes, mechanisms and effects analysis (FMMEA), IGBTs are aged using electrical-thermal stresses. The three failure precursor candidates of aged IGBTs are compared with new IGBTs under a temperature range of 25-200oC. The trends in the three electrical parameters with changes in temperature are correlated to device degradation. A methodology is presented for validating these precursors for IGBT prognostics using a hybrid approach. Keywords: Failure precursors, IGBTs, prognostics Failure precursors indicate changes in a measured variable structure of an IGBT is similar to that of a vertical that can be associated with impending failure [1]. A diffusion power MOSFET (VDMOS) [3] except for an systematic method for failure precursor selection is additional p+ layer above the collector as seen in Figure 1. through the use of the failure modes, mechanisms, and The main characteristic of the vertical configuration is that effects analysis (FMMEA) [2]. -
VCSEL Pulse Driver Designs for Tof Applications
Vixar Application Note VCSEL Pulse Driver Designs for ToF Applications 1 Introduction ............................................................................................................................. 2 2 Design Theory ......................................................................................................................... 2 2.1 Schematic Components .................................................................................................... 2 2.2 Design Inductance ............................................................................................................ 3 2.3 Rise and Fall Time ........................................................................................................... 5 2.4 Timing Delay.................................................................................................................... 5 3 Low Power Driver Design ...................................................................................................... 5 4 High Power Driver Design...................................................................................................... 7 4.1 GaN FETs ......................................................................................................................... 7 4.2 Gate Drivers ..................................................................................................................... 7 5 VCSEL Performance .............................................................................................................. 8 6 Conclusions -
Analysis and Optimization of Dynamic Voltage and Frequency Scaling for AVX Workloads Using a Software-Based Reimplementation
Analysis and Optimization of Dynamic Voltage and Frequency Scaling for AVX Workloads Using a Software-Based Reimplementation Bachelor’s Thesis submitted by cand. inform. Yussuf Khalil to the KIT Department of Informatics Reviewer: Prof. Dr. Frank Bellosa Second Reviewer: Prof. Dr. Wolfgang Karl Advisor: Mathias Gottschlag, M.Sc. May 03 – September 02, 2019 KIT – The Research University in the Helmholtz Association www.kit.edu I hereby declare that the work presented in this thesis is entirely my own and that I did not use any source or auxiliary means other than these referenced. This thesis was carried out in accordance with the Rules for Safeguarding Good Scientic Practice at Karlsruhe Institute of Technology (KIT). Karlsruhe, September 2, 2019 Abstract While using the Advanced Vector Extensions (AVX) on current Intel x86 pro- cessors allows for great performance improvements in programs that can be parallelized by using vectorization, many heterogeneous workloads that use both vector and scalar instructions expose degraded throughput when mak- ing use of AVX2 or AVX-512. This eect is caused by processor frequency reductions that are required to maintain system stability while executing AVX code. Due to the delays incurred by frequency switches, reduced clock speeds are attained for some additional time after the last demanding instruction has retired, causing code in scalar phases directly following AVX phases to be executed at a slower rate than theoretically possible. We present an analysis of the precise frequency switching behavior of an Intel Syklake (Server) CPU when AVX instructions are used. Based on the obtained results, we propose avxfreq, a software reimplementation of the AVX frequency selection mechanism. -
MOSFET - Wikipedia, the Free Encyclopedia
MOSFET - Wikipedia, the free encyclopedia http://en.wikipedia.org/wiki/MOSFET MOSFET From Wikipedia, the free encyclopedia The metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET), is by far the most common field-effect transistor in both digital and analog circuits. The MOSFET is composed of a channel of n-type or p-type semiconductor material (see article on semiconductor devices), and is accordingly called an NMOSFET or a PMOSFET (also commonly nMOSFET, pMOSFET, NMOS FET, PMOS FET, nMOS FET, pMOS FET). The 'metal' in the name (for transistors upto the 65 nanometer technology node) is an anachronism from early chips in which the gates were metal; They use polysilicon gates. IGFET is a related, more general term meaning insulated-gate field-effect transistor, and is almost synonymous with "MOSFET", though it can refer to FETs with a gate insulator that is not oxide. Some prefer to use "IGFET" when referring to devices with polysilicon gates, but most still call them MOSFETs. With the new generation of high-k technology that Intel and IBM have announced [1] (http://www.intel.com/technology/silicon/45nm_technology.htm) , metal gates in conjunction with the a high-k dielectric material replacing the silicon dioxide are making a comeback replacing the polysilicon. Usually the semiconductor of choice is silicon, but some chip manufacturers, most notably IBM, have begun to use a mixture of silicon and germanium (SiGe) in MOSFET channels. Unfortunately, many semiconductors with better electrical properties than silicon, such as gallium arsenide, do not form good gate oxides and thus are not suitable for MOSFETs. -
AN5252 Low-Voltage Power MOSFET Switching Behavior And
AN5252 Application note Low-voltage Power MOSFET switching behavior and performance evaluation in motor control application topologies Introduction During the last years, some applications based on electrical power conversion are gaining more and more space in the civil and industrial fields. The constant development of microprocessors and the improvement of modulation techniques, which are useful for the control of power devices, have led to a more accurate control of the converted power as well as of the power dissipation, thus increasing the efficiency of the motor control applications. Nowdays, frequency modulation techniques are used to control the torque and the speed of brushless motors in several high- and low-voltage applications and in different circuit topologies using power switches in different technologies such as MOSFETs and IGBTs. Therefore, the devices have to guarantee the best electrical efficiency and the least possible impact in terms of emissions. The aim of this application note is to provide a description of the most important parameters which are useful for choosing a low- voltage Power MOSFET device for a motor control application. Three different motor control applications and topology cases are deeply analyzed to offer to motor drive designers the guidelines required for an efficient and reliable design when using the MOSFET technology in hard-switch applications: • BLDC motor in a 3-phase inverter topology • DC motor in H-bridge configuration • DC motor in single-switch configuration AN5252 - Rev 1 - November 2018 - By C. Mistretta and F. Scrimizzi www.st.com For further information contact your local STMicroelectronics sales office. AN5252 Control techniques and brushless DC (BLDC) motors 1 Control techniques and brushless DC (BLDC) motors During the last years, servomotors have evolved from mostly brush to brushless type. -
Drmos King of Power-Saving
Insist on DrMOS King of Power-saving Confidential Eric van Beurden / Feb 2009 /Page v1.0 1 EU MSI King of Power-saving What are the power-saving components and technologies from MSI? 1. DrMOS 2. APS 3. GreenPower design 4. Hi-c CAP Why should I care about power-saving? 1. Better earth (Think about it! You can be a hero saving it !) 2. Save $$ on the electricity bill 3. Cool running boards 4. Better overclocking Confidential Page 2 MSI King of Power-saving Is DrMOS the name of a MSI heatpipe? No! DrMOS is the cool secret below the heatpipe, not the heatpipe itself. Part of the heatpipe covers the PWM where the DrMOS chips are located. (PWM? That is technical stuff, right ? Now you really lost me ) Tell me, should I write DRMOS, Dr. MOS or Doctor Mos? The name comes from Driver MOSFET. There is only one correct way to write it; “DrMOS”. Confidential Page 3 MSI King of Power-saving So DrMOS is a chip below the heatpipe? Yes, DrMOS is the 2nd generation 3-in-1 integrated Driver MOSFET. It combines 3 PWM components in one. (Like triple core…) 1. Driver IC 2. Bottom-MOSFET 3. Top-MOSFET Confidential Page 4 MSI King of Power-saving Is MSI the first to use DrMOS on it’s products? DrMOS is an integrated MOSFET design proposed by Intel in 2004. The first to use a 1st generation Driver Mosfet on a 8-Phase was Asus Blitz Extreme. This 1st generation had some problems and disadvantages. These are all solved in the 2nd generation DrMOS which we use exclusive on MSI products. -
Design, Implementation, Modeling, and Optimization of Next Generation Low-Voltage Power Mosfets
Design, Implementation, Modeling, and Optimization of Next Generation Low-Voltage Power MOSFETs by Abraham Yoo A thesis submitted in conformity with the requirements for the degree of Doctor of Philosophy Department of Materials Science and Engineering University of Toronto © Copyright by Abraham Yoo 2010 Design, Implementation, Modeling, and Optimization of Next Generation Low-Voltage Power MOSFETs Abraham Yoo Doctor of Philosophy Department of Materials Science and Engineering University of Toronto 2010 Abstract In this thesis, next generation low-voltage integrated power semiconductor devices are proposed and analyzed in terms of device structure and layout optimization techniques. Both approaches strive to minimize the power consumption of the output stage in DC-DC converters. In the first part of this thesis, we present a low-voltage CMOS power transistor layout technique, implemented in a 0.25µm, 5 metal layer standard CMOS process. The hybrid waffle (HW) layout was designed to provide an effective trade-off between the width of diagonal source/drain metal and the active device area, allowing more effective optimization between switching and conduction losses. In comparison with conventional layout schemes, the HW layout exhibited a 30% reduction in overall on-resistance with 3.6 times smaller total gate charge for CMOS devices with a current rating of 1A. Integrated DC-DC buck converters using HW output stages were found to have higher efficiencies at switching frequencies beyond multi-MHz. ii In the second part of the thesis, we present a CMOS-compatible lateral superjunction FINFET (SJ-FINFET) on a SOI platform. One drawback associated with low-voltage SJ devices is that the on-resistance is not only strongly dependent on the drift doping concentration but also on the channel resistance as well. -
LM3445 Triac Dimmable Offline LED Driver
LM3445 Triac Dimmable Offline LED Driver February 19, 2010 LM3445 Triac Dimmable Offline LED Driver General Description Features The LM3445 is an adaptive constant off-time AC/DC buck ■ Triac dim decoder circuit for LED dimming (step-down) constant current controller designed to be com- ■ Application voltage range 80VAC – 277VAC patible with triac dimmers. The LM3445 provides a constant Capable of controlling LED currents greater than 1A current for illuminating high power LEDs and includes a triac ■ dim decoder. The dim decoder allows wide range LED dim- ■ Adjustable switching frequency ming using standard triac dimmers. The high frequency ca- ■ Low quiescent current pable architecture allows the use of small external passive ■ Adaptive programmable off-time allows for constant ripple components. The LM3445 includes a bleeder circuit to ensure current proper triac operation by allowing current flow while the line ■ Thermal shutdown voltage is low to enable proper firing of the triac. A passive No 120Hz flicker PFC circuit ensures good power factor by drawing current di- ■ rectly from the line for most of the cycle, and provides a ■ Low profile 10 pin MSOP Package or 14 pin SOIC constant positive voltage to the buck regulator. Additional ■ Patent pending drive architecture features include thermal shutdown, current limit and VCC un- der-voltage lockout. Applications ■ Retro Fit Triac Dimming ■ Solid State Lighting ■ Industrial and Commercial Lighting ■ Residential Lighting Typical LM3445 LED Driver Application Circuit 30060305 30060301 © 2010 National Semiconductor Corporation 300603 www.national.com Connection Diagrams LM3445 Top View Top View 30060303 10-Pin MSOP NS Package Number MUB10A 30060373 14-Pin SOIC NS Package Number M14A Ordering Information Order Number Spec.