Report General Assembly 2019

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Report General Assembly 2019 Report General Assembly 2019 Electronic Components and Systems Division PCB and Electronic Systems Division GENERAL MEETING OF THE ECS AND PCB-ES DIVISIONS EXECUTIVE BOARD OF ECS DIVISION EXECUTIVE BOARD OF PCB-ES DIVISION CHAIRMAN DIVISIONAL GROUPS TECHNICAL AND MARKET CHAIRMAN DIVISIONAL GROUPS GROUPS Weber Schönherr Harting Bronold Weyer Enser Moser Scheer zur Verth Garcia Velmeden Weitzel ADVISORY COUNCIL MANAGEMENT MANAGEMENT Stoppok Stoppok Dr Weiß GROUP GROUP GROUP GROUP TECHNICAL GROUP GROUP GROUP GROUP SEMI- PASSIVE ELECTROME- MICROSYSTEMS WITH WORKING GROUPS ELECTRONIC PRINTED CIRCUIT CERAMIC CONDUCTORS COMPONENTS CHANICAL TECHNOLOGY SUBASSEMBLIES BOARDS MICROCIRCUITS COMPONENTS – SenSORS/ ACTUATORS zur Verth Bronold Scheer Weitzel Enser Velmeden Moser Schönherr T echnical Market Group Connectors Projects/Topics Quality Working Groups Steering Commitee T echnical Group Committee Group Integrated Sauer Trojok Moser Beneke Packaging and T echnology and Test Engi- Bechtold Circuits Technical Assembly Technol- Technology Platform neering Market Group Hilbig Group Technical ogy C Dr Lock Dr Stark Market Group ommittee Wachtel Paulwitz Group Schönherr Market Group N. N. Environment, Health and Safety in Market Group Beneke German Semiconductor Manufacturing Garcia Significance Feiner Working Groups Market Group of Sensor Dr Jantschak Production Steckling Technology Ad-hoc Working Groups Cross-Association Environment and Packaging Repair/Rework Technology Additive Initiative Kelm Schmucker Promotion of New Lauer Manufacturing WG Weitzel Talents Design Chain Quality Dr Nolte Services in EMS Schmidt-Rudloff Biener, M. Velmeden Bönitz Core Group RoHS Working Groups Design/ Exemption 6c Component Cleanliness Market Analysis Development Medical Sensors Benchmark N. N. Nikolussi Süß Automotive Weitzel Input and Supply Chain Management Environment Klose Protective Elements Foundries for MEMS Ehm Linz Committee Schwarz Körber Environmental Protection Robustness Kimpfel Technical Validation for MEMS Group Wagner/Dzubiella Material Data Körber Core Team Edelbluth Reliability of Printed Circuit Boards Atak UL Soldering Parameters Deutschmann MARKET GROUP Garcia TRACEABILITY Weber 2 3 Report Mitgliederversammlung 2019 Herausgeber: ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e. V. German Electrical and Electronic Manufacturers‘ Association Lyoner Strasse 9 60528 Frankfurt am Main, Germany Electronic Components and Systems Devision Phone: +49 69 6302-276 Fax: +49 69 6302-407 E-mail: [email protected] PCB and Electronic Systems Devision Phone: +49 69 6302-276 Fax: +49 69 6302-438 E-mail: [email protected] www.zvei.org Responsible: Christoph Stoppok September 2019 Portrait photo credits: persons shown The work including all its parts is protected by copyright. Any use outside of the narrow limits of the copyright law is inadmis- sible without the consent of the publisher. This applies in particular to duplications and translations, micro- filming and storage, and processing in electronic systems. Contents Organisation Chart Organisational structure of the divisions 2 Foreword Joint foreword from the chairmen 8 ECS Electronic Components and Systems Management’s Report 10 Semiconductor Components Group 12 Passive Components Group 16 Electromechanical Components Group 21 Microsystems Technology Group – Sensors/Actuators 25 European Semiconductor Industry Association (ESIA) 29 European Passive Components Industry Association 31 PCB-ES PCB and Electronic Systems Management’s Report 36 Electronic Subassemblies Group 38 Printed Circuit Boards Group 41 Ceramic Microcircuits Group 49 ECS/PCB-ES Cross-sectional topics of the ECS and PCB-ES Divisions Technical Group 54 Market Group 64 Market charts 67 Identification and traceability in the electrical engineering and 70 electronics industry Comprehensive Bodies of the ECS Division 71 Organisation Chart Chairpersons of the divisional groups, committees and working groups 72 Delegates and deputy delegates of the ECS Division 74 ECS Division’s personnel 75 Bodies of the PCB-ES Division 78 Delegates and deputy delegates of the PCB-ES Division 80 PCB-ES Division’s personnel 80 Members Member Companies of the ECS Division 81 Member Companies of the PCB-ES Division 85 Publications Publications list of the divisions 88 Joint foreword from the chairmen Dear members and friends of our 1) We are an attractive industry and shape divisions, the future. An eventful and rather turbulent past year has Ultimately, it is innovations that take us and our featured a whole series of exciting topics: the society into an exciting future. As an electronic question of Brexit or no Brexit, sanctions in the components industry, we are committed to these US-Chinese trade dispute, and a young genera- innovations and drive them forward by identify- tion calling for answers to urgently needed cli- ing future issues in research and development mate protection with the “Fridays for Future” and implementing them. A spirit of innovation movement. As a company in the electronic com- at the cutting edge creates future-oriented and ponents industry, our products, our solutions, sustainable jobs, which enables us to attract spe- and our employees are not just sideline spec- cialists and talented employees as well as train- tators, but deliver solutions for the future that ees and students to our fascinating industry and constitute the very backbone of the Internet of offer them a professional home. Chairman of the Electronic Things and Services. Networked worlds are based Components and on our technologies. We manufacture them 2) We are the platform for market and Systems Division worldwide, and invest a great deal in research to technology expertise. Philip F. W. Harting develop and improve them. Our divisions offer opportunity for active exchange and collaboration. We focus on the Success doesn’t happen by itself — and ours is fields of education, research, and science, areas based on experience, exchange, and the joint in which the common interests of our industry creation of framework conditions. To this end, lie. Our results and experiences are recorded we play an active role in the German Electri- in position papers and recommendations for cal and Electronic Manufacturers’ Association action, which are of course also available to third (ZVEI), which provides us with a political home parties. All members consider our reliable mar- at association level. In our divisions, we are the ket statistics to be our special asset. They provide first to learn about upcoming new laws and regu- a valuable overview of important developments lations, which enables us to use this information — services that only an association can offer, in our companies to formulate recommenda- especially from the point of view of small and tions for action. Together we develop guidelines, medium-sized enterprises. form opinions, and advocate them to third par- ties. Essential aspects that ensure our important 3) We are the network. Chairman of the industry has a voice and is recognised. Working and discussing topics together creates a Printed Circuit Boards sense of identity for all members. Everyone con- and Electronics We make the T in IoT! tributes to increasing the visibility of our indus- Systems Division The focus and objectives of our divisions’ work, try through his or her actions and activities. As Johann Weber however, also repeatedly require us to conduct an electronic components industry, we team up a review — as is the case with any good man- and form partnerships with other associations, agement system. And we have reflected on what politicians, and stakeholders. In particular, this we manufacturers of electronic components and includes the development and implementation systems as building blocks for industry stand for. of rules, norms and standards that have a sig- We not only form the backbone of the electrical nificant impact on our everyday lives. and electronics industry — hardly any product or process is conceivable without our products – but Economic trends our innovative spirit also drives new develop- Innovation and the constant quest for improve- ments and promotes social progress. The Inter- ment are the best ingredients for the success of net of Things and Services is becoming a reality the electronics industry. The penetration of artifi- through our technologies: We make the T in IoT! cial intelligence solutions in an increasing num- ber of production processes, as well as in areas We express our will and aspirations to shape of our lives, has resulted in a growing demand things through three guiding maxims: for microchips, printed circuit boards, and other components. As the backbone of the Internet of Things and Services, the electronic components industry is the focus of trade restrictions like no other industry. When we look back on the past year, therefore, it is not all positive. 6 7 In 2018, the global market for electronic compo- Trade fairs also provide important stimuli for Last but not least, our technology roadmap is also nents grew by almost 13 per cent to USD 653 bil- innovation and exchange. As divisions, we there- fully geared to the next technological genera- lion. Semiconductors, which account for around fore participate in two important trade fairs tion. From megatrends and regulatory influences 72 per cent of the total market, are driving this in particular. In the lively hustle and bustle of to networked systems, the “Next Generation” development. In regional terms, China has the electronica,
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