Unregistered 6 ADMOS Advanced Monolithic Systems
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
List of Marginable OTC Stocks
List of Marginable OTC Stocks @ENTERTAINMENT, INC. ABACAN RESOURCE CORPORATION ACE CASH EXPRESS, INC. $.01 par common No par common $.01 par common 1ST BANCORP (Indiana) ABACUS DIRECT CORPORATION ACE*COMM CORPORATION $1.00 par common $.001 par common $.01 par common 1ST BERGEN BANCORP ABAXIS, INC. ACETO CORPORATION No par common No par common $.01 par common 1ST SOURCE CORPORATION ABC BANCORP (Georgia) ACMAT CORPORATION $1.00 par common $1.00 par common Class A, no par common Fixed rate cumulative trust preferred securities of 1st Source Capital ABC DISPENSING TECHNOLOGIES, INC. ACORN PRODUCTS, INC. Floating rate cumulative trust preferred $.01 par common $.001 par common securities of 1st Source ABC RAIL PRODUCTS CORPORATION ACRES GAMING INCORPORATED 3-D GEOPHYSICAL, INC. $.01 par common $.01 par common $.01 par common ABER RESOURCES LTD. ACRODYNE COMMUNICATIONS, INC. 3-D SYSTEMS CORPORATION No par common $.01 par common $.001 par common ABIGAIL ADAMS NATIONAL BANCORP, INC. †ACSYS, INC. 3COM CORPORATION $.01 par common No par common No par common ABINGTON BANCORP, INC. (Massachusetts) ACT MANUFACTURING, INC. 3D LABS INC. LIMITED $.10 par common $.01 par common $.01 par common ABIOMED, INC. ACT NETWORKS, INC. 3DFX INTERACTIVE, INC. $.01 par common $.01 par common No par common ABLE TELCOM HOLDING CORPORATION ACT TELECONFERENCING, INC. 3DO COMPANY, THE $.001 par common No par common $.01 par common ABR INFORMATION SERVICES INC. ACTEL CORPORATION 3DX TECHNOLOGIES, INC. $.01 par common $.001 par common $.01 par common ABRAMS INDUSTRIES, INC. ACTION PERFORMANCE COMPANIES, INC. 4 KIDS ENTERTAINMENT, INC. $1.00 par common $.01 par common $.01 par common 4FRONT TECHNOLOGIES, INC. -
ED-7311-20.Pdf
EIAJ ED-7311-20 - 1 - EIAJ ED-7311-20 - 2 - EIAJ ED-7311-20 - 3 - EIAJ ED-7311-20 - 4 - EIAJ ED-7311-20 - 5 - EIAJ ED-7311-20 - 6 - EIAJ ED-7311-20 - 7 - EIAJ ED-7311-20 - 8 - EIAJ ED-7311-20 - 9 - EIAJ ED-7311-20 - 10 - EIAJ ED-7311-20 - 11 - EIAJ ED-7311-20 - 12 - EIAJ ED-7311-20 - 13 - EIAJ ED-7311-20 - 14 - EIAJ ED-7311-20 - 15 - EIAJ ED-7311-20 - 16 - EIAJ ED-7311-20 - 17 - EIAJ ED-7311-20 - 18 - EIAJ ED-7311-20 - 19 - EIAJ ED-7311-20 - 20 - EIAJ ED-7311-20 - 21 - EIAJ ED-7311-20 - 22 - EIAJ ED-7311-20 - 23 - EIAJ ED-7311-20 - 24 - EIAJ ED-7311-20 - 25 - EIAJ ED-7311-20 - 26 - EIAJ ED-7311-20 - 27 - EIAJ ED-7311-20 - 28 - EIAJ ED-7311-20 - 29 - EIAJ ED-7311-20 - 30 - EIAJ ED-7311-20 - 31 - EIAJ ED-7311-20 - 32 - EIAJ ED-7311-20 - 33 - EIAJ ED-7311-20 - 34 - EIAJ ED-7311-20 - 35 - EIAJ ED-7311-20 - 36 - EIAJ ED-7311-20 - 37 - EIAJ ED-7311-20 - 38 - EIAJ ED-7311-20 - 39 - EIAJ ED-7311-20 - 40 - EIAJ ED-7311-20 - 41 - EIAJ ED-7311-20 - 42 - EIAJ ED-7311-20 - 43 - EIAJ ED-7311-20 - 44 - EIAJ ED-7311-20 - 45 - EIAJ ED-7311-20 - 46 - EIAJ ED-7311-20 - 47 - EIAJ ED-7311-20 - 48 - EIAJ ED-7311-20 - 49 - EIAJ ED-7311-20 - 50 - EIAJ ED-7311-20 - 51 - EIAJ ED-7311-20 - 52 - EIAJ ED-7311-20 - 53 - EIAJ ED-7311-20 - 54 - EIAJ ED-7311-20 - 55 - EIAJ ED-7311-20 - 56 - EIAJ ED-7311-20 - 57 - EIAJ ED-7311-20 - 58 - EIAJ ED-7311-20 - 59 - EIAJ ED-7311-20 - 60 - EIAJ ED-7311-20 - 61 - EIAJ ED-7311-20 - 62 - EIAJ ED-7311-20 - 63 - EIAJ ED-7311-20 - 64 - EIAJ ED-7311-20 - 65 - EIAJ ED-7311-20 - 66 - EIAJ ED-7311-20 - 67 - EIAJ ED-7311-20 - 68 - EIAJ -
Uwlink Interface / Development Platform
UWLink Interface / Development platform UWLink Mainboard User Guide Hardware / Tool description User Guide 1.0, 2010-06-01 Wireless Control Edition 2010-07-16 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain -
FY2008 Results Meeting
FY200FY20088 ResultsResults MeetingMeeting FY2008 : Year ended March 31, 2009 May 14, 2009 Ryosan Company, Limited Code : 8140 / Stock listings: Tokyo Stock Exchange (First Section) URL : http://www.ryosan.co.jp/eng/ Notice This presentation contains forward-looking statements regarding business performance, which may differ substantially from actual results, depending on certain risks and uncertainties, the most significant of which are listed below. z Economic conditions in key markets (Japan and the rest of Asia), rapid changes in consumption patterns and supply-demand balance for products z Sharp fluctuations in the ¥/$ exchange rate z Substantial fluctuation in prices in capital markets Consolidated results for FY 2008 FY2007 FY2008 FY2009(Forecasts) Of Total Of Total % Chg. YoY Of Total % Chg. YoY ¥ 100 million% ¥ 100 million%% ¥ 100 million %% Net sales 2,860 2,208 (22.8) 1,700 (23.0) Gross margin 251 8.8 196 8.9 (22.1) 149 8.8 (24.1) SG&A expenses 144 5.0 134 6.1 (6.8) 115 6.8 (14.7) Operating income 107 3.8 61 2.8 (42.8) 34 2.0 (44.7) Ordinary income 112 3.9 72 3.3 (35.6) 38 2.2 (47.7) Net income 67 2.4 39 1.8 (41.8) 22 1.3 (43.9) Earnings per share ¥187.15 ¥111.83 (¥75) ¥63.83 (¥48) 1 Segment results for FY2008 Unit : ¥ 100 million FY2007 FY2008 FY2009(Forecasts) OP OP OP Margin Margin % Chg. YoYMargin % Chg. YoY % % Sales 1,489 1,169 (21.5) 808 (30.9) Semiconductors Operating income 724.9% 48 4.2%(32.7) 28 3.5% (42.7) Electronic Sales 1,031 759 (26.4) 584 (23.1) Components Operating income 444.3 28 3.7 (35.9) 22 3.8 (22.1) -
1332:Xtks Nippon Suisan Kaisha Ltd 3 4 1 1334:Xtks Maruha Nichiro Holdings Inc. 3 4 1 1377:Xtks Sakata Seed Corp. 3 5 2 1414:Xtks SHO-BOND Holdings Co
Symbol Code Description Current Rating New rating Diff 1332:xtks Nippon Suisan Kaisha Ltd 3 4 1 1334:xtks Maruha Nichiro Holdings Inc. 3 4 1 1377:xtks Sakata Seed Corp. 3 5 2 1414:xtks SHO-BOND Holdings Co. Ltd 3 6 3 1766:xtks TOKEN Corp. 3 6 3 1801:xtks Taisei Corp. 3 5 2 1803:xtks Shimizu Corp. 3 4 1 1808:xtks Haseko Corp. 3 4 1 1812:xtks Kajima Corp. 3 5 2 1820:xtks Nishimatsu Construction Co. Ltd 3 6 3 1824:xtks Maeda Corp. 3 6 3 1833:xtks Okumura Corp. 3 6 3 1860:xtks Toda Corp. 3 5 2 1861:xtks Kumagai Gumi Co. Ltd 3 8 5 1865:xtks Asunaro Aoki Construction Co. Ltd 3 6 3 1870:xtks Yahagi Construction Co. Ltd 3 4 1 1881:xtks NIPPO Corp. 3 6 3 1883:xtks Maeda Road Construction Co. Ltd 3 6 3 1911:xtks Sumitomo Forestry Co Ltd 3 4 1 1924:xtks PanaHome Corp. 3 4 1 1925:xtks Daiwa House Industry Co. Ltd 3 4 1 1928:xtks Sekisui House Ltd 3 4 1 1934:xtks YURTEC Corp. 3 6 3 1945:xtks Tokyo Energy & Systems Inc. 3 4 1 1961:xtks Sanki Engineering Co. Ltd 3 4 1 1963:xtks JGC Corporation 3 4 1 1968:xtks Taihei Dengyo Kaisha Ltd 3 4 1 1969:xtks Takasago Thermal Engineering Co. Ltd 3 4 1 1973:xtks NEC Networks & System Integration Corp. 3 5 2 1979:xtks Taikisha Ltd 3 4 1 1983:xtks TOSHIBA PLANT SYSTEMS & SERVICES Corp. -
2019 Corporate Sustainability Report
2019 CORPORATE SUSTAINABILITY REPORT RELEASE DATE: MAY 2020 2019 Corporate Sustainability Report 1 A MESSAGE FROM OUR CEO Opening Letter During 2019, we proudly celebrated KEMET’s centennial as a integration of our supply chain and visionary, worldwide organization dedicated to making the world become one of the first companies a better, safer, more connected place to live. But the scale of to claim a “conflict-free” distinction our achievement didn’t happen overnight. From our humble by the U.S. Securities and Exchange Commission (SEC). origins in the simple workshop of a young, entrepreneurial inventor in Cleveland, Ohio to our rise as a global leader in Controlling our supply chain was as much an ethical choice the electronics industry, KEMET’s technological advances as a business decision. Globally, the major source of tantalum have made possible communication satellites, cellphones, is in the Democratic Republic of Congo (DRC), and media supersonic jets, space stations, personal computers, and reports disturbing conditions in mining operations there, and electric cars — innovations that touch every household, helping often a disregard for human rights. We took an early leadership improve our lives. position in the industry on the issue of obtaining certified conflict-free minerals. In doing so, we established an initiative In very real ways, the story of how we got here is the story of in 2012 that would provide oversight in tantalum operations the creation of the modern world. It is a story about technology and ensure that standards of production would not falter. and dedicated people, whose ingenuity and perseverance KEMET also helped to establish the Kisengo Foundation, which shaped our success. -
UNO Template
01 July 2013 Global Securities Research & Analytics Yen and You Connections Series The competitive edge Figure 1: Yen 'normalisation'—only halfway there 160 USDJPY Average 1990-2008 Forecast 150 140 130 120 110 100 The Credit Suisse Connections Series 90 leverages our exceptional breadth of 80 macro and micro research to deliver 70 incisive cross-sector and cross-border 1990 1992 1994 1997 1999 2001 2004 2006 2008 2011 2013 thematic insights for our clients. Source: Credit Suisse Commodities research, the BLOOMBERG PROFESSIONAL™ service The impact on competitiveness: Our global Yen and You series has been SECURITIES RESEARCH & ANALYTICS examining themes stemming from the 'shock therapy' the Bank of Japan Please see inside for contributors to each section initiated earlier this year. In a parallel report published today (Global Equity Strategy - Japan: The sun is still rising), our Global Equity Strategy team revisit their overweight stance on Japanese equities. Here we focus on a key component of that view—a structurally weak yen (our FX team has a 12-month target of JPY120/USD1) and the resulting competitiveness issues. The significance of this theme is underlined by Japan's wide range of high value-add industry segments—starkly highlighted by Fukushima and the 2011 tsunami. Alongside the work of our analysts and strategists, we leverage our proprietary PEERs supply chain framework to highlight company-specific competition. The added topical relevance of this is the number of 'head-to- heads' with the current embattled emerging markets. This report analyses the relative sensitivity within key tradeable sectors such as technology, autos, steel and capital goods. -
Division of Investment Department of the Treasury State of New Jersey Pension Fund June 30, 2009 and 2008 (With Independent Auditors’ Report Thereon)
F INANCIAL S TATEMENTS, M ANAGEMENT’ S D ISCUSSION AND A NALYSIS AND S UPPLEMENTAL S CHEDULES Division of Investment Department of the Treasury State of New Jersey Pension Fund June 30, 2009 and 2008 (With Independent Auditors’ Report Thereon) Division of Investment Department of the Treasury State of New Jersey Pension Fund Financial Statements June 30, 2009 and 2008 Contents Independent Auditors’ Report ..........................................................................................................1 Management’s Discussion and Analysis .........................................................................................3 Basic Financial Statements: Statements of Net Assets .................................................................................................................7 Statements of Changes in Net Assets...............................................................................................8 Notes to Financial Statements ..........................................................................................................9 Supplemental Schedules: Schedule 1 – Combining Schedule of Net Assets ..........................................................................31 Schedule 2 – Combining Schedule of Changes in Net Assets .......................................................32 Schedule 3 – Portfolio of Investments – Common Fund A ...........................................................33 Schedule 4 – Portfolio of Investments – Common Fund B ...........................................................57 -
Delaware, 1:11-Cv-00770
IN THE UNITED STATES DISTRICT COURT FOR THE DISTRICT OF DELAWARE HSM PORTFOLIO LLC AND § TECHNOLOGY PROPERTIES § LIMITED LLC, § § Plaintiffs, § § v. § C.A. No. 1:11-cv-00770-RGA § FUJITSU LIMITED, § JURY TRIAL DEMANDED FUJITSU AMERICA, INC., § FUJITSU SEMICONDUCTOR § AMERICA, INC., § § ADVANCED MICRO DEVICES, INC., § § QUALCOMM INCORPORATED, § § ELPIDA MEMORY, INC., § ELPIDA MEMORY (USA) INC., § § SK HYNIX INC., § SK HYNIX AMERICA INC., § HYNIX SEMICONDUCTOR § MANUFACTURING AMERICA INC., § § MICRON TECHNOLOGY, INC., § § PROMOS TECHNOLOGIES INC., § § SANDISK CORPORATION, § § SONY CORPORATION, § SONY CORPORATION OF AMERICA, § SONY ELECTRONICS INC., § SONY COMPUTER § ENTERTAINMENT INC., § SONY COMPUTER § ENTERTAINMENT AMERICA LLC, § § STMICROELECTRONICS N.V., § STMICROELECTRONICS, INC., § § PAGE 1 TOSHIBA CORPORATION, § TOSHIBA AMERICA, INC., § TOSHIBA AMERICA ELECTRONIC § COMPONENTS, INC., § § ON SEMICONDUCTOR § CORPORATION, § § ZORAN CORPORATION, § § Defendants. § PLAINTIFFS’ THIRD AMENDED COMPLAINT Plaintiffs HSM Portfolio LLC and Technology Properties Limited LLC (collectively “Plaintiffs”) by and through their undersigned counsel, file this Third Amended Complaint against Defendants Fujitsu Limited, Fujitsu America, Inc., Fujitsu Semiconductor America, Inc. (collectively “Fujitsu”), Advanced Micro Devices, Inc. (“AMD”), Qualcomm Incorporated (“Qualcomm”), Elpida Memory, Inc., Elpida Memory (USA) Inc. (collectively “Elpida”),1 SK Hynix Inc., SK Hynix America Inc., Hynix Semiconductor Manufacturing America Inc. (collectively “SK Hynix”), -
Multilayer Ceramic Capacitors One World. One KEMET
Multilayer Ceramic Capacitors High Temperature celamic thermometer Electronic Components One world. One KEMET. Multilayer Ceramic Capacitors High Temperature Table of Contents Page Why Choose KEMET ........................................................................................................................................................ 3 Surface Mount Devices .................................................................................................................................................... 5 Standard Products High Temperature 150ºC, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade) ........................................................5 High Temperature 150ºC, Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade) ................................18 High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) ...............................................................................30 High Temperature 200ºC, C0G Dielectric, 10 – 200 VDC (Industrial Grade) ..............................................................................42 HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) ..........................55 KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade) ............................71 Pulse Discharge, High Voltage, High Temperature 200ºC, C0G Dielectric, 1,000 – 3,500 VDC (Industrial Grade) ...................79 Flex Mitigation Solutions KPS HT Series, High -
Boston Symphony Orchestra Concert Programs, Summer, 1995
osfon i^j^ny wksW Tangtew@» 5 NOW AT FILENE'S... FROM TOMMY H i The tommy collection i Cologne spray, 3.4-oz.,$42 Cologne spray, 1.7-oz.,$28 After-shave balmB mm 3.4-oz., $32 m After-shave, 3.4-oz., $32 Seiji Ozawa, Music Director One Hundred and Fourteenth Season, 1994-95 Trustees of the Boston Symphony Orchestra, Inc. J. P. Barger, Chairman Nicholas T. Zervas, President Mrs. Edith L. Dabney, Vice-Chairman William J. Poorvu, Vice-Chairman and Treasurer Mrs. John H. Fitzpatrick, Vice-Chairman Harlan E. Anderson Nader F. Darehshori Edna S. Kalman Mrs. August R. Meyer Peter A. Brooke Deborah B. Davis Allen Z. Kluchman Mrs. Robert B. Newman James F. Cleary Nina L. Doggett Harvey Chet Peter C. Read John F. Cogan, Jr. Dean W. Freed Krentzman Carol Scheifele-Holmes Julian Cohen AvramJ. Goldberg George Krupp Richard A. Smith William F. Connell Thelma E. Goldberg R. Willis Leith, Jr. Ray Stata William M. Crozier, Jr. Julian T. Houston Trustees Emeriti Vernon R. Alden Archie C. Epps Mrs. George I. Mrs. George Lee Philip K. Allen Mrs. Harris Kaplan Sargent David B. Arnold, Jr. Fahnestock George H. Kidder Sidney Stoneman Leo L. Beranek Mrs. John L. Thomas D. Perry, Jr. John Hoyt Stookey Abram T. Collier Grandin Irving W. Rabb John L. Thorndike Nelson J. Darling, Jr. Other Officers of the Corporation John Ex Rodgers, Assistant Treasurer Michael G. McDonough, Assistant Treasurer Daniel R. Gustin, Clerk Board of Overseers of the Boston Symphony Orchestra, Inc. Thelma E. Goldberg, Chairman Robert P. O'Block, Vice-Chairman Jordan L. -
2008 International Symposium on Semiconductor Manufacturing
2008 International Symposium on Semiconductor Manufacturing (ISSM 2008) Tokyo, Japan 27 – 29 October 2008 IEEE Catalog Number: CFP08SSM-PRT ISBN: 978-1-61284-948-5 ISSM 2008 Program Schedule The 1st day (Monday, October 27) Tutorial Session Room: Century A/B 9:30 Tutorial Session AEC/APC Introduction of AEC/APC's history Mr. Toshihiko Osada, Senior Manager, Fujitsu Microelectronics Limited Manufacturing engineering and AEC/APC Mr. Kensuke Uriga, CEO/President, Dura Systems Corporation Application of control theory for AEC/APC in semiconductor fabrication Mr. Hiroshi Shimizu, Director/Advanced Solution Department, Advance Automation Company, Yamatake Corporation 9:00 Tutorial Session ESH SUSTAINABILITY AND ESH ASPECTS OF ADVANCED SEMICONDUCTOR MANUFACTURING Prof. Farhang Shadman, Regents Professor of Chemical and Environmental Engineering, the University of Arizona Opening Remarks Room: Century 13:00 Keynote Speech Session Room: Century 13:20 Challenges in The DRAM Business Mr.Yukio Sakamoto, President&CEO, Elpida Memory,Inc. 14:10 The New Dynamics of Semiconductor Industry Dr. Tien Wu, Chief Operating Officer, Board of Directors, Advanced Semiconductor Engineering Inc.(ASE) 15:00 Break Oral Session Room: Century A Highlight Session <Advanced Lithography Session> 15:10 PE-O-097 Phenomenology of ArF Photoresist Shrinkage Trends ..........................................................3 Benjamin Bunday, ISMI 15:30 PE-O-044 Lithography Hotspot Discovery at 70nm DRAM 300mm Fab : Process Window Qualification Using Design Based Binning...............................................................................7