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PURPOSE This standard is intended to provide the industrial standards for shrink small outline packages(to be referred to as P-SSOP hereinafter) and the design guidelines in producing the P-SSOP and developing the automatic mounting machines and related parts. kk 2. BACKGROUND This standard was planed as the business plan about IC Package Subcommittee in 2001. It was a data survey in P-SSOP of each company, and It is established in deliberation, in December, 2001. After considering a consistence with EIAJ EDR-7314A [Design guideline of integrated circuits for shrink small outline package(P-SSOP)], and It revised in the package outline drawings to have conformed to the IEC standard. It added new package seated height code V ( VSSOP ( Very thin SSOP ) : Amax=1.00mm, Amin>0.80mm). Also, it is package width ( E ) , and package length ( D ) to think that is increased in by the production in the future about which added a 3.00 mm area. With this the revision preparation plans to be carried forward about EIAJ EDR-7314, too. jj 3. BASIC POINT OF VIEW (1) The registration package It stores up that the registration package data which was presented from each company crosses to a variety. It decided to register after writing a value out of the standard. However, it excluded the presenting data of terminal pitch e =0.75mm, e =0.95mm. (2) Package seated height cord In the package name, It adds to the name which is thin type P-SSOP with low seated height according to the seated height code which was established in IEC standard and EIAJ ED-7303A, Adding VSSOP ( Very thin SSOP ) and WSSOP (Very Very thin SSOP) in addition to LSSOP ( Low profile SSOP ) and TSSOP ( Thin SSOP) Each seated height A, body height A2nom are shown below. LSSOP ( Low profile SSOP ) :Amax =1.70mm, Amin >1.20mm, A2nom =1.40mm TSSOP ( Thin SSOP ) :Amax=1.20mm, Amin >1.00mm, A2nom =1.00mm VSSOP ( Very thin SSOP ) :Amax =1.00mm, Amin>0.80mm, A2nom=0.80mm WSSOP(Very Very thin SSOP) : Amax =0.80mm, Amin>0.65mm, A2nom=0.60mm - 126 - EIAJ ED-7311-20 COMMITTEE MEMBERS The IC Package Subcommittee of the Technical Standardization Committee on Semiconductor Device Packages has mainly deliberated this standard. The subcommittee members are shown below. kk <Technical Standardization Committee on Semiconductor Device Package> Chairman ELPIDA MEMORY,INC. Ichiro Anjo < IC plastic Package Subcommittee> l Chief l SANYO ELECTRIC CORP. l Hideyuki Iwamura Co- chief SHARP CORP. Katuyuki Tarui FUJITSU LTD. Hiroshi Inoue TOSHIBA CORP. Yasuhiro Koshio MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD. Toshiyuki Fukuda Members AMKOR THECHNOROGY JAPAN. INC. Naomitchi Syoji ENPLAS CORP. Yoshiyuki Ohashi ENPLAS CORP. Hisao Oshima ELPIDA MEMORY, INC. Fumitake Okutsu OKI ELECTRONICS INDUSTRY CO.,LTD. Kazuhiko Sera KYOCERA CORP. Akihiro Funahashi KOGUNEX Takahiro Aoki SANYO ELECTRIC CORP Kiyoshi Mita SUMITOMO 3M CORP. Akiko Tsubota SEIKO EPSON CORP. Yoshiaki Emoto SONY CORP. Hiroshi Abe TOSHIBA CORP Morihiko Ikemizu NEC CORP. Kenichi Kurihara NEC CORP. Kaoru Sonobe IBM JAPAN CORP. Tuneo Kobayashi TEXAS INSTRUMENTS JAPAN LTD. Takayuki Ohuchida HITACHI LTD. Yoshinori Miyaki HITACHI Cable LTD. Tadashi Kawanobe FUJITSU LTD. Kaoru Tachibana FUJI ELECTRIC CO.,LTD. Osamu Hirohashi MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD. Tomoki Tamaki MITSUBISHI ELECTRIC CORP. Kazuya Fukuhara MELCO INC. Tsuneo Watanabe YAMAICHI ELECTRIC CO.,LTD. Noriyuki Matsuoka UNITECHNO INC. Hitoshi Matsunaga ROHM CO.,LTD. Osamu Miyata Special Members SHIN-ETSU POLYMER Ken Tamura TOYOJUSHI CO.,LTD. Hitoshi Kazuma kk - 127 - .
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