Intel Corporation Annual Report 1999
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Wayne Community College 2009-2010 Strategic Plan End-Of-Year Report Table of Contents
Wayne Community College INSTITUTIONAL EFFECTIVENESS THROUGH PLAN & BUDGET INTEGRATION 2009-2010 Strategic Plan End-of-Year Report Wayne Community College 2009-2010 Strategic Plan End-of-Year Report Table of Contents Planning Group 1 – President Foundation Institutional Advancement Planning Group 2 – VP Academic Services Academic Skills Center Ag & Natural Resources Allied Health Arts & Sciences Business Administration Cooperative Programs Dental Engineering & Mechanical Studies Global Education Information Systems & Computer Technology Language & Communication Library Mathematics Medical Lab Sciences Nursing Pre-Curriculum Public Safety Public Services Science SJAFB Social Science Transportation Planning Group 3 – VP Student Services VP Student Services Admissions & Records Financial Aid Student Activities Student Development Planning Group 4 – VP Educational Support Services VP Educational Support Services Campus Information Services Educational Support Technologies Facilities Operations Information Technology Security Planning Group 5 – VP Continuing Education VP Continuing Education Basic Skills Business & Industry Center Occupational Extension WCC PLANNING DOCUMENT 2009-2010 Department: Foundation Long Range Goal #8: Integrate state-of-practice technology in all aspects of the college’s programs, services, and operations. Short Range Goal #8.2: Expand and improve program accessibility through technology. Objective/Intended Outcome: The Foundation has experienced phenomenal growth in the last three years. With the purchase of the Raisers Edge Software, we have been able to see a direct increase in our revenues. In order to sustain this level of growth, The Foundation either needs to hire extra manpower or purchase additional Raiser’s Edge software to support our growth. 1. Raiser’s Edge NetSolutions: Enhance the Foundation office’s fundraising abilities. The Foundation would be able to accept online donations, reservations for golf tournament, gala, arts and humanities programs and reach out to alumni. -
Intel Corporation 2000 Annual Report
silicon is in 2000 Annual Report i n t e l .c o m i n t c . c o m Intel facts and figures Net revenues Diluted earnings per share Dollars in billions Dollars, adjusted for stock splits 35 1.6 33.7 1.51 30 29.4 1.2 26.3 25 25.1 Intel revenues 1.05 20.8 20 grew 15% in 2000, 0.97 0.86 0.8 giving us our 14th 16.2 15 0.73 consecutive year of 11.5 10 0.50 0.4 8.8 revenue growth. 0.33 0.33 5.8 5 4.8 0.12 0.16 0 0 91 92 93 94 95 9697 98 99 00 91 92 93 94 95 9697 98 99 00 Geographic breakdown of 2000 revenues Return on average stockholders’ equity Percent Percent 100 40 38.4 35.5 35.6 33.3 North America 41% Intel has 30 75 30.2 experienced strong 27.3 28.4 26.2 international growth, 21.6 20 50 with 59% of revenues 20.4 Asia-Pacific 26% outside North America in 2000. 10 25 Europe 24% 0 Japan 9% 91 92 93 94 95 9697 98 99 00 0 Capital additions to property, Stock price trading ranges by fiscal year plant and equipment † Dollars, adjusted for stock splits Dollars in millions 75 8,000 Capital invest- 6,674 ments reflect Intel’s 6,000 50 commitment to building leading-edge manu- 4,501 4,000 4,032 facturing capacity for 3,550 3,403 25 3,024 state-of-the-art 2,441 2,000 silicon products. -
The Future of the Microprocessor Industry”
MASSACHUSETTS INSTITUTE OF TECHNOLOGY SLOAN SCHOOL OF MANAGEMENT 15.912 Technology Strategy Professor Rebecca Henderson “The Future of the Microprocessor Industry” Final Paper Juan Chaia Paulo Marchesan Bernardo Neves Cambridge, Massachusetts. May 11th, 2005 15.912 Technology Strategy Massachusetts Institute of Technology Professor Rebecca Henderson Sloan School of Management EXECUTIVE SUMMARY Intel has been one of the most successful companies in modern corporate history. They are the clear leader in the microprocessor industry, in which they have set the pace of technological advance in the past three decades. They were able to do this because of the uniqueness of its technology at the beginning, and the development of strong complementary assets, namely manufacturing expertise and branding, later on. As a consequence, Intel has been able to capture a significant portion of the value created by the microprocessor industry. However, the electronic microprocessor technology is reaching maturity, and may be subject to a disruption within the next two decades. In this paper, we predict that such disruption may come from microphotonics. Microphotonics technology, which very crudely uses photons for the transmission and processing of data, has been on the spotlight for at least a decade. According to experts from MIT, it may be ready to be used on commercial chips in a decade. Some large companies around the world, such as Pirelli, IBM, Lucent and others, are already making big bets that this will be the next chip technology. Our paper microphotonics analyzes different scenarios that the industry leader, Intel, may face if indeed microphotonics turns out to be the disruptive technology in the microprocessor industry. -
(12) United States Patent (10) Patent No.: US 7,020,893 B2 Connelly (45) Date of Patent: Mar
US007020893B2 (12) United States Patent (10) Patent No.: US 7,020,893 B2 Connelly (45) Date of Patent: Mar. 28, 2006 (54) METHOD AND APPARATUS FOR 5,945,988 A 8, 1999 Williams et al. CONTINUOUSLY AND 5,977.964. A 11/1999 Williams et al. OPPORTUNISTICALLY DRIVING AN 5.991,841 A 11/1999 Gafken et al. OPTIMIAL BROADCAST SCHEDULE BASED 6,002,393 A 12/1999 Hite et al. ON MOST RECENT CLIENT DEMAND FEEDBACK FROMA DISTRIBUTED SET OF (Continued) BROADCAST CLIENTS FOREIGN PATENT DOCUMENTS (75) Inventor: Jay H. Connelly, Portland, OR (US) WO WO 99,65237 12/1999 (73) Assignee: Intel Corporation, Santa Clara, CA (Continued) (US) OTHER PUBLICATIONS (*) Notice: Subject to any disclaimer, the term of this Intel: Intel Architecture Labs. Internet and Broadcast: The patent is extended or adjusted under 35 Key To Digital Convergence. Utilizing Digital Technology U.S.C. 154(b) by 882 days. to Meet Audience Demand, 2000, pp. 1-4. (21) Appl. No.: 09/882,487 (Continued) Filed: Jun. 15, 2001 Primary Examiner Ngoc Vu (22) (74) Attorney, Agent, or Firm—Blakely, Sokoloff, Taylor & (65) Prior Publication Data Zafman LLP US 20O2/O194598 A1 Dec. 19, 2002 (57) ABSTRACT (51) Int. C. HO)4N 7/173 (2006.01) Abroadcast method and system for continuously and oppor (52) U.S. Cl. ............................ 725/97; 725/91. 725/95; tunistically driving an optimal broadcast schedule based on 725/114; 725/121 most recent client demand feedback from a distributed set of (58) Field of Classification Search .................. 725/95, broadcast clients. The broadcast system includes an opera 725/97, 98, 105,109, 118, 121, 46,91, 92, tion center that broadcasts meta-data to a plurality of client 725/114, 120 systems. -
Ultra-Wideband Research and Implementation
UltraWideband Research and Implementation Senior Capstone Project 2007 Final Report by: Jarrod Cook Nathan Gove Project Advisors: Dr. Brian Huggins Dr. In Soo Ahn Dr. Prasad Shastry Abstract Ultra‐wideband (UWB) is a wireless transmission standard that will soon revolutionize consumer electronics. UWB is interesting because of its inherent low power consumption, high data rates of up to 480 Mbps, and large spatial capacity1. Furthermore, the power spectral density is low enough to prevent interference with other wireless services. This new standard has recently been approved by the FCC for unlicensed use and has been gaining interest throughout the consumer electronics industry. The main goal of the project is to increase interest in UWB technology, and to explore its usefulness. The history and benefits of UWB will be discussed, followed by the project goals, implementation, and results. Texas Instruments DSP platforms were used in conjunction with Simulink and Code Composter Studio to implement the scaled‐down baseband modulation scheme. Also, RF microwave components were donated from Hittite Corporation to perform quadrature modulation and up conversion to a frequency of 3.4 GHz. 1 Spatial capacity is defined as bits/sec/square‐meter. UWB is projected at having 6 devices working simultaneously within a 10 m range [16]. ii. Acknowledgements There are some people that need to be acknowledged for their work with this project. They include, but are not limited to: • Luke Vercimak and Karl Weyeneth for work on their 2006 Senior Capstone Project, Software Defined Radio. • Dr. Brian Huggins, Dr. In Soo Ahn and Dr. Prasad Shastry for advising, guidance and general encouragement throughout. -
Microprocessor Packaging (Intel)
MicroprocessorMicroprocessor PackagingPackaging The Key Link in the Chain Koushik Banerjee Technical Advisor Assembly Technology Development Intel Corporation 1 MicroprocessorsMicroprocessors 1971 2001 2 GlobalGlobal PackagingPackaging R&DR&D China Shanghai Philippines Cavite Arizona Chandler Malaysia Penang VirtualVirtual ATDATD 3 MainMain R&DR&D facilityfacility inin Chandler,Chandler, AZAZ 4 Computing needs driving complexity First to introduce organic in mainstream CPUs First to introduce flip chip in Intel 486TM Pentium®mainstreamPentium® Pro Pentium® CPUs II Pentium® III Pentium® 4 Itanium® Processor Processor Processor Processor Processor Processor Processor 25 MHz 1.0+ GHz Ceramic Wire-bond To Organic To Flip Chip 5 LookingLooking aheadahead …… ComplexityComplexity andand ChallengesChallenges toto supportsupport Moore’sMoore’s LawLaw 1. Silicon to package interconnect 2. Within package interconnect 3. Power management 4. Adding more functionality GoalGoal :: BringBring technologytechnology innovationinnovation intointo HighHigh volumevolume manufacturingmanufacturing atat aa LOWLOW COSTCOST 6 SiliconSilicon ?? PackagePackage RelationshipRelationship AnatomyAnatomy 101101 Silicon Processor: The “brain” of the computer (generates instructions) Packaging: The rest of the body (Communicates instructions to the outside world, adds protection) NoNo PackagePackage == NoNo ProductProduct !! Great Packaging = Great Products !! Great Packaging = Great Products !! 7 TheThe KeyKey LinkLink inin thethe ChainChain OpportunityOpportunity Transistor-to-Transistor -
Configuring and Scheduling an Eager-Writing Disk Array
Configuring and Scheduling an Eager-Writing Disk Array for a Transaction Processing Workload Chi Zhang∗ Xiang Yu∗ Arvind Krishnamurthyy Randolph Y. Wang∗ Abstract cult challenges to storage systems than office work- loads. These applications exhibit little locality or Transaction processing applications such as those sequentiality; a large percentage of the I/O requests exemplified by the TPC-C benchmark are among the are writes, many of which are synchronous; and most demanding I/O applications for conventional there may be little idle time. storage systems. Two complementary techniques exist to improve the performance of these systems. Traditional techniques that work well for office Eager-writing allows the free block that is closest to workloads tend to be less effective for these transac- a disk head to be selected for servicing a write re- tion processing applications. Memory caching pro- quest, and mirroring allows the closest replica to be vides little relief in the presence of poor locality and selected for servicing a read request. Applied indi- a small read-to-write ratio. As disk areal density im- vidually, the effectiveness of each of these techniques proves at 60-100% annually [9], as memory density is limited. An eager-writing disk array (EW-Array) improves at only 40% per year, and as the amount combines these two complementary techniques. In of data in transaction processing systems continues such a system, eager-writing enables low-cost replica to grow, one can expect little improvement in cache propagation so that the system can provide excel- hit rates in the near future. Delayed write tech- lent performance for both read and write operations niques become less applicable in the presence of a while maintaining a high degree of reliability. -
STARTER KIT INSTRUCTIONS Paper Stock: White Offset • Make Sure Your Computer Has Sounds Enabled and Speakers Turned on to Hear Paper Weight: 70 Lb
Returning to Online Play INSTRUCTION SHEET 6+ SPECIFICATIONS • Once you have completed installation, you can launch the Xtractaurs™ website Toy: STARTER KIT anytime by connecting the Extraction Gun to your computer’s USB port. Toy No.: P7218 • Alternately, you may open your computer’s web browser, go to Part No.: 0920 www.XTRACTAURS.com and select “Sign In.” Trim Size: A5 Tips & Troubleshooting Folded Size: A6 Type of Fold: • After you have successfully installed the Xtractaurs™ program and registered One ™ # colors: online, you do not need to install the CD again to play. Keep the CD in case Colors: Black you need to reinstall at a later date. STARTER KIT INSTRUCTIONS Paper Stock: White Offset • Make sure your computer has sounds enabled and speakers turned on to hear Paper Weight: 70 lb. the game's sound effects. EDM No.: • To see if the Extraction Gun is connected, look at the lights on the gun: ○ A slow, pulsing red light means it is successfully connected to your PC. Getting Started ○ A fast, flashing green light means the program did not install. Reload the • Load the CD into your Mac or PC. CD and repeat the steps under “Getting Started.” • On a PC, the program will auto install; on a • Need help? Visit service.mattel.com or call toll-free 1-800-524-8697. Mac, select “RUN ME” to install. • When prompted, connect the Extraction Keep these instructions for future reference as they contain important information. Gun to your computer’s USB port. Minimum System Requirements • Once installation is complete, your web All PC MAC browser will open and you will be taken to • USB 2.0 • Windows XP/Vista OS • OS 10.5 (Leopard) or higher www.XTRACTAURS.com. -
Oral History Avram Miller
Oral History of Avram Miller Interviewed by: Dane Elliot Recorded: August 19, 2013 Mountain View, California CHM Reference number: X6923.2014 © 2013 Computer History Museum Oral History of Avram Miller Elliot: All right. I’m here with Avram Miller today. It’s August 19, 2013. And we’re interviewing Avram specifically on how Intel invests in their future. Miller: How Intel invested in their Future Elliot: Very good. I’m Dane Elliot, and this is: Miller: Avram Miller. Elliot: Let’s start off with a little bit of background here. Miller: Okay. Elliot: And the background that I’d like to get is education and significant contributions in your career path that led you to Intel. So education? Miller: Well, I basically am self-educated. I always say that I graduated from Avram U. I studied music when I was in high school and then I became a Merchant Seaman for a while. Eventually, I got into science. I was always interested in electronics, and I started doing science at the University of California Medical School in San Francisco. Long story short, I ended up in Holland, at the Faculty of Medicine, Erasmus University. By the time I was 28, I was in an assistant professor in Medicine (medical informatics). When I was 29, I moved with my family to Israel where I was an Adjunct Associate Professor at the Medical Faculty of the University of Tel Avi and started up a medical computer business. What’s probably most relevant to our discussion is that I returned to the United States in 1979 and joined Digital Equipment Corporation. -
Abkürzungs-Liste ABKLEX
Abkürzungs-Liste ABKLEX (Informatik, Telekommunikation) W. Alex 1. Juli 2021 Karlsruhe Copyright W. Alex, Karlsruhe, 1994 – 2018. Die Liste darf unentgeltlich benutzt und weitergegeben werden. The list may be used or copied free of any charge. Original Point of Distribution: http://www.abklex.de/abklex/ An authorized Czechian version is published on: http://www.sochorek.cz/archiv/slovniky/abklex.htm Author’s Email address: [email protected] 2 Kapitel 1 Abkürzungen Gehen wir von 30 Zeichen aus, aus denen Abkürzungen gebildet werden, und nehmen wir eine größte Länge von 5 Zeichen an, so lassen sich 25.137.930 verschiedene Abkür- zungen bilden (Kombinationen mit Wiederholung und Berücksichtigung der Reihenfol- ge). Es folgt eine Auswahl von rund 16000 Abkürzungen aus den Bereichen Informatik und Telekommunikation. Die Abkürzungen werden hier durchgehend groß geschrieben, Akzente, Bindestriche und dergleichen wurden weggelassen. Einige Abkürzungen sind geschützte Namen; diese sind nicht gekennzeichnet. Die Liste beschreibt nur den Ge- brauch, sie legt nicht eine Definition fest. 100GE 100 GBit/s Ethernet 16CIF 16 times Common Intermediate Format (Picture Format) 16QAM 16-state Quadrature Amplitude Modulation 1GFC 1 Gigabaud Fiber Channel (2, 4, 8, 10, 20GFC) 1GL 1st Generation Language (Maschinencode) 1TBS One True Brace Style (C) 1TR6 (ISDN-Protokoll D-Kanal, national) 247 24/7: 24 hours per day, 7 days per week 2D 2-dimensional 2FA Zwei-Faktor-Authentifizierung 2GL 2nd Generation Language (Assembler) 2L8 Too Late (Slang) 2MS Strukturierte -
Trade Marks and Brands
This page intentionally left blank Trade Marks and Brands Recent developments in trade mark law have called into question a variety of basic features, as well as bolder extensions, of legal protection. Other disciplines can help us think about fundamental issues such as: What is a trade mark? What does it do? What should be the scope of its protection? This volume assembles essays examining trade marks and brands from a multiplicity of fields: from business history, marketing, linguistics, legal history, philosophy, sociology and geography. Each part pairs lawyers’ and non-lawyers’ perspectives, so that each commentator addresses and critiques his or her counterpart’s analysis. The perspec- tives of non-legal fields are intended to enrich legal academics’ and practitioners’ reflections about trade marks, and to expose lawyers, judges and policy-makers to ideas, concepts and methods that could prove to be of particular importance in the development of positive law. LIONEL BENTLY is Herchel Smith Professor of Intellectual Property Law at the University of Cambridge, Director of the Centre for Intel- lectual Property and Information Law at the University of Cambridge, and a Professorial Fellow at Emmanuel College, Cambridge. JENNIFER DAVIS is Newton Trust Lecturer and Fellow of Wolfson College, University of Cambridge. JANE C. GINSBURG is the Morton L. Janklow Professor of Literary and Artistic Property Law at Columbia University School of Law. She also directs the law school’s Kernochan Center for Law, Media and the Arts. Cambridge Intellectual Property and Information Law As its economic potential has rapidly expanded, intellectual property has become a subject of front-rank legal importance. -
Linux Hardware Compatibility HOWTO
Linux Hardware Compatibility HOWTO Steven Pritchard Southern Illinois Linux Users Group / K&S Pritchard Enterprises, Inc. <[email protected]> 3.2.4 Copyright © 2001−2007 Steven Pritchard Copyright © 1997−1999 Patrick Reijnen 2007−05−22 This document attempts to list most of the hardware known to be either supported or unsupported under Linux. Copyright This HOWTO is free documentation; you can redistribute it and/or modify it under the terms of the GNU General Public License as published by the Free software Foundation; either version 2 of the license, or (at your option) any later version. Linux Hardware Compatibility HOWTO Table of Contents 1. Introduction.....................................................................................................................................................1 1.1. Notes on binary−only drivers...........................................................................................................1 1.2. Notes on proprietary drivers.............................................................................................................1 1.3. System architectures.........................................................................................................................1 1.4. Related sources of information.........................................................................................................2 1.5. Known problems with this document...............................................................................................2 1.6. New versions of this document.........................................................................................................2