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Wayne Community College 2009-2010 Strategic Plan End-Of-Year Report Table of Contents
Wayne Community College INSTITUTIONAL EFFECTIVENESS THROUGH PLAN & BUDGET INTEGRATION 2009-2010 Strategic Plan End-of-Year Report Wayne Community College 2009-2010 Strategic Plan End-of-Year Report Table of Contents Planning Group 1 – President Foundation Institutional Advancement Planning Group 2 – VP Academic Services Academic Skills Center Ag & Natural Resources Allied Health Arts & Sciences Business Administration Cooperative Programs Dental Engineering & Mechanical Studies Global Education Information Systems & Computer Technology Language & Communication Library Mathematics Medical Lab Sciences Nursing Pre-Curriculum Public Safety Public Services Science SJAFB Social Science Transportation Planning Group 3 – VP Student Services VP Student Services Admissions & Records Financial Aid Student Activities Student Development Planning Group 4 – VP Educational Support Services VP Educational Support Services Campus Information Services Educational Support Technologies Facilities Operations Information Technology Security Planning Group 5 – VP Continuing Education VP Continuing Education Basic Skills Business & Industry Center Occupational Extension WCC PLANNING DOCUMENT 2009-2010 Department: Foundation Long Range Goal #8: Integrate state-of-practice technology in all aspects of the college’s programs, services, and operations. Short Range Goal #8.2: Expand and improve program accessibility through technology. Objective/Intended Outcome: The Foundation has experienced phenomenal growth in the last three years. With the purchase of the Raisers Edge Software, we have been able to see a direct increase in our revenues. In order to sustain this level of growth, The Foundation either needs to hire extra manpower or purchase additional Raiser’s Edge software to support our growth. 1. Raiser’s Edge NetSolutions: Enhance the Foundation office’s fundraising abilities. The Foundation would be able to accept online donations, reservations for golf tournament, gala, arts and humanities programs and reach out to alumni. -
Intel Announces X25-V 40GB Solid-State Drive for $125 15 March 2010
Intel Announces X25-V 40GB Solid-State Drive for $125 15 March 2010 applications and their favorite gaming application, such as Dragon Age: Origins, and experience up to 43 percent faster overall system performance or 86 percent improvement in their gaming experience. The SSD also speeds operations such as system start up, the opening of applications and files or resuming from standby. The Intel X25-V SSD The Intel X25-V features 40GB of 34nm NAND flash memory. This non-volatile memory retains data, even when the power is turned off, and is used in applications such as smartphones, Intel Corp. announced today a new addition to its personal music players, memory cards or SSDs for award-winning lineup of high-performance solid- fast and reliable storage of data. SSD benefits over state drives (SSDs): the Intel X25-V Value SATA a traditional HDD include higher performance, SSD. Priced at $125, the 40 gigabyte (GB) drive is battery saving and ruggedness. "Adding the Intel aimed at value segment netbooks and dual- X25-V to our existing family of high-performance drive/boot drive desktop set-ups to offer users the SSDs gives our resellers a full range of high- performance and reliability advantages of solid- performing, quality SSDs for notebook upgrades, state computing at an affordable, entry-level price. dual-drive desktop set ups or embedded applications," said Pete Hazen, director of SSDs can replace or coexist with traditional hard marketing for the Intel NAND Solutions Group. disk drives (HDDs). With no movable parts or spinning platters, SSDs are more reliable and The 40GB Intel X25-V complements Intel's higher higher performing than HDDs. -
Intel Corporation 2000 Annual Report
silicon is in 2000 Annual Report i n t e l .c o m i n t c . c o m Intel facts and figures Net revenues Diluted earnings per share Dollars in billions Dollars, adjusted for stock splits 35 1.6 33.7 1.51 30 29.4 1.2 26.3 25 25.1 Intel revenues 1.05 20.8 20 grew 15% in 2000, 0.97 0.86 0.8 giving us our 14th 16.2 15 0.73 consecutive year of 11.5 10 0.50 0.4 8.8 revenue growth. 0.33 0.33 5.8 5 4.8 0.12 0.16 0 0 91 92 93 94 95 9697 98 99 00 91 92 93 94 95 9697 98 99 00 Geographic breakdown of 2000 revenues Return on average stockholders’ equity Percent Percent 100 40 38.4 35.5 35.6 33.3 North America 41% Intel has 30 75 30.2 experienced strong 27.3 28.4 26.2 international growth, 21.6 20 50 with 59% of revenues 20.4 Asia-Pacific 26% outside North America in 2000. 10 25 Europe 24% 0 Japan 9% 91 92 93 94 95 9697 98 99 00 0 Capital additions to property, Stock price trading ranges by fiscal year plant and equipment † Dollars, adjusted for stock splits Dollars in millions 75 8,000 Capital invest- 6,674 ments reflect Intel’s 6,000 50 commitment to building leading-edge manu- 4,501 4,000 4,032 facturing capacity for 3,550 3,403 25 3,024 state-of-the-art 2,441 2,000 silicon products. -
Career Center Annual Report
CAREER CENTER ANNUAL REPORT 2019–2020 th Best Return on 5Investment 1 73 % Students Utilized Mines % Career Services 95 Positive Outcomes Rate2,3 IN A YEAR OF UNPRECEDENTED CHALLENGES, 1,200 Organizations THE STUDENTS, FACULTY, AND STAFF OF Recruited or MINES HAVE RISEN TO THE OCCASION, Hired at Mines REFLECTING THE INDOMITABLE OREDIGGER SPIRIT OF RESILIENCE THAT IS AT THE HEART OF THE MINES EXPERIENCE. THE CAREER Average CENTER HAS BEEN NIMBLE IN ADAPTING TO Starting $ Salary 3 NEW CIRCUMSTANCES AND CHANGING NEEDS. k 1 Among public universities nationwide 2 Employed79 in industry, government, military, www.payscale.com/college-salary-report/best-schools-by- continuing education, or international students type/bachelors/public-schools returning to their home countries. 3 Combined BS, MS, and PhD grads “IT IS ABSOLUTELY AMAZING TO BE ABLE TO PUT ON GLOVES AND TOUCH A VEHICLE THAT IS GOING INTO SPACE, LET ALONE CONTRIBUTE TO A TEAM OF INCREDIBLY SMART INDIVIDUALS TO HELP BUILD THIS VEHICLE AND GET IT INTO SPACE.” NADIA SMITH Mechanical Engineering REACHING BS, Class of 2021 FOR THE STARS GR ADUATED $ STUDENT 79K Average Starting OUTCOMES Salary 1 % A Record 22 Graduates Continue with 1,548 Advanced Education3 Total Graduates The Class of 2020 graduated into a labor market unlike any in recent history with a pandemic impacting course delivery and an unexpected, % sudden shift in the economy. Despite these Positive challenges, Mines graduates saw positive outcomes, Outcomes similar to prior years—a testament to their enduring 95 1,2 Rate value as professionals and graduates. 2 Employed in industry, government, military, continuing education, 1 BS, MS, and PhD grads or international students returning to their home countries. -
PART I ITEM 1. BUSINESS Industry We Are
PART I ITEM 1. BUSINESS Industry We are the world’s largest semiconductor chip maker, based on revenue. We develop advanced integrated digital technology products, primarily integrated circuits, for industries such as computing and communications. Integrated circuits are semiconductor chips etched with interconnected electronic switches. We also develop platforms, which we define as integrated suites of digital computing technologies that are designed and configured to work together to provide an optimized user computing solution compared to ingredients that are used separately. Our goal is to be the preeminent provider of semiconductor chips and platforms for the worldwide digital economy. We offer products at various levels of integration, allowing our customers flexibility to create advanced computing and communications systems and products. We were incorporated in California in 1968 and reincorporated in Delaware in 1989. Our Internet address is www.intel.com. On this web site, we publish voluntary reports, which we update annually, outlining our performance with respect to corporate responsibility, including environmental, health, and safety compliance. On our Investor Relations web site, located at www.intc.com, we post the following filings as soon as reasonably practicable after they are electronically filed with, or furnished to, the U.S. Securities and Exchange Commission (SEC): our annual, quarterly, and current reports on Forms 10-K, 10-Q, and 8-K; our proxy statements; and any amendments to those reports or statements. All such filings are available on our Investor Relations web site free of charge. The SEC also maintains a web site (www.sec.gov) that contains reports, proxy and information statements, and other information regarding issuers that file electronically with the SEC. -
Intel Corporation Annual Report 1999
clients networking and communications intel.com 1999 annual report the building blocks of the internet economy intc.com server platforms solutions and services 29.4 30 2.25 90 2.11 26.3 1.93 25.1 1.73 20.8 20 1.45 1.50 60 16.2 1.01 11.5 10 0.75 30 8.8 0.65 0.65 High 5.8 4.8 3.9 0.31 Close 0.24 0.20 Low INTEL CORPORATION 1999 0 0 0 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 Net revenues Diluted earnings per share Stock price trading ranges (Dollars in billions) (Dollars, adjusted for stock splits) by fiscal year (Dollars, adjusted for stock splits) 3,111 1999 facts and figures 3,000 45 2,509 Intel’s stock 38.4 2,347 35.5 35.6 price has risen 33.3 2,000 28.4 30 1,808 27.3 at a 48% 26.2 21.2 21.6 20.4 1,296 1,111 970 compound 1,000 15 780 618 517 annual growth 0 rate in the 0 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 Research and development Return on average (Dollars in millions, excluding purchased last 10 years. stockholders’ equity in-process research and development) (Percent) 9.76 4,501 9 Japan 4,500 7% 4,032 7.05 3,550 3,403 3,024 5.93 6 Asia- 3,000 Pacific North 5.14 23% America 2,441 43% 1,9 33 3.69 2.80 3 1,500 1,228 2.24 Machinery 948 & equipment 1.63 1.35 Europe 680 1.12 27% Land, buildings & improvements 0 0 90 91 92 93 94 95 96 97 98 99 90 91 92 93 94 95 96 97 98 99 Book value per share Geographic breakdown of 1999 revenues Capital additions to property, at year-end (Percent) plant and equipment† (Dollars, adjusted for stock splits) (Dollars in millions) Past performance does not guarantee future results. -
System Design for Telecommunication Gateways
P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS Alexander Bachmutsky Nokia Siemens Networks, USA A John Wiley and Sons, Ltd., Publication P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS Alexander Bachmutsky Nokia Siemens Networks, USA A John Wiley and Sons, Ltd., Publication P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come This edition first published 2011 C 2011 John Wiley & Sons, Ltd Registered office John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West Sussex, PO19 8SQ, United Kingdom For details of our global editorial offices, for customer services and for information about how to apply for permission to reuse the copyright material in this book please see our website at www.wiley.com. The right of the author to be identified as the author of this work has been asserted in accordance with the Copyright, Designs and Patents Act 1988. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, except as permitted by the UK Copyright, Designs and Patents Act 1988, without the prior permission of the publisher. -
(12) United States Patent (10) Patent No.: US 7,020,893 B2 Connelly (45) Date of Patent: Mar
US007020893B2 (12) United States Patent (10) Patent No.: US 7,020,893 B2 Connelly (45) Date of Patent: Mar. 28, 2006 (54) METHOD AND APPARATUS FOR 5,945,988 A 8, 1999 Williams et al. CONTINUOUSLY AND 5,977.964. A 11/1999 Williams et al. OPPORTUNISTICALLY DRIVING AN 5.991,841 A 11/1999 Gafken et al. OPTIMIAL BROADCAST SCHEDULE BASED 6,002,393 A 12/1999 Hite et al. ON MOST RECENT CLIENT DEMAND FEEDBACK FROMA DISTRIBUTED SET OF (Continued) BROADCAST CLIENTS FOREIGN PATENT DOCUMENTS (75) Inventor: Jay H. Connelly, Portland, OR (US) WO WO 99,65237 12/1999 (73) Assignee: Intel Corporation, Santa Clara, CA (Continued) (US) OTHER PUBLICATIONS (*) Notice: Subject to any disclaimer, the term of this Intel: Intel Architecture Labs. Internet and Broadcast: The patent is extended or adjusted under 35 Key To Digital Convergence. Utilizing Digital Technology U.S.C. 154(b) by 882 days. to Meet Audience Demand, 2000, pp. 1-4. (21) Appl. No.: 09/882,487 (Continued) Filed: Jun. 15, 2001 Primary Examiner Ngoc Vu (22) (74) Attorney, Agent, or Firm—Blakely, Sokoloff, Taylor & (65) Prior Publication Data Zafman LLP US 20O2/O194598 A1 Dec. 19, 2002 (57) ABSTRACT (51) Int. C. HO)4N 7/173 (2006.01) Abroadcast method and system for continuously and oppor (52) U.S. Cl. ............................ 725/97; 725/91. 725/95; tunistically driving an optimal broadcast schedule based on 725/114; 725/121 most recent client demand feedback from a distributed set of (58) Field of Classification Search .................. 725/95, broadcast clients. The broadcast system includes an opera 725/97, 98, 105,109, 118, 121, 46,91, 92, tion center that broadcasts meta-data to a plurality of client 725/114, 120 systems. -
Semiconductor Manufacturers. Our Primary Semiconductor Competitors
Semiconductor Manufacturers. Our primary semiconductor competitors currently include Hynix, IM Flash Technologies LLC, or IMFT (a company formed by Micron and Intel), Micron, Samsung, and Toshiba. Flash Memory Card and USB Drive Manufacturers. Our primary card and USB drive competitors currently include, among others, A-DATA Technology Co., Ltd., or A-DATA, Buffalo, Inc., or Buffalo, Chips and More GmbH, or CnMemory, Dane-Elec Memory, or Dane-Elec, Eastman Kodak Company, or Kodak, Elecom Co., Ltd., or Elecom, FUJIFILM Corporation, or FUJI, Gemalto N.V., or Gemalto, Hagiwara Sys-Com Co., Ltd., or Hagiwara, Hama, Hynix, Imation Corporation, or Imation, and its division Memorex Products, Inc., or Memorex, I-O Data Device, Inc., or I-O Data, Kingmax Digital, Inc., or KingMax, Kingston Technology Company, Inc., or Kingston, Lexar, Micron, Netac Technology Co., Ltd., or Netac, Panasonic, PNY Technologies, Inc., or PNY, RITEK Corporation, or RITEK, Samsung, Sony, STMicroelectronics N.V., or STMicroelectronics, Toshiba, Tradebrands International, or Tradebrands, Transcend Information, Inc., or Transcend, and Verbatim Americas LLC, or Verbatim. Solid-State Drive and Hard Disk Drive Manufacturers. Our SSDs face competition from other manufacturers of SSDs, including Intel, Samsung, Toshiba, and others. Our SSDs also face competition from hard disk drives, which are offered by companies including, among others, Seagate Technology LLC, or Seagate, Samsung and Western Digital Corporation, or Western Digital. Digital Audio/Video Player Manufacturers. Our digital audio/video players face strong competition from products offered by companies, including Apple Inc., or Apple, ARCHOS Technology, or ARCHOS, Coby Electronics Corporation, or Coby, Creative Technology Ltd., or Creative, Koninklijke Philips Electronics N.V., or Royal Philips Electronics, Microsoft Corporation, or Microsoft, Samsung and Sony. -
Ultra-Wideband Research and Implementation
UltraWideband Research and Implementation Senior Capstone Project 2007 Final Report by: Jarrod Cook Nathan Gove Project Advisors: Dr. Brian Huggins Dr. In Soo Ahn Dr. Prasad Shastry Abstract Ultra‐wideband (UWB) is a wireless transmission standard that will soon revolutionize consumer electronics. UWB is interesting because of its inherent low power consumption, high data rates of up to 480 Mbps, and large spatial capacity1. Furthermore, the power spectral density is low enough to prevent interference with other wireless services. This new standard has recently been approved by the FCC for unlicensed use and has been gaining interest throughout the consumer electronics industry. The main goal of the project is to increase interest in UWB technology, and to explore its usefulness. The history and benefits of UWB will be discussed, followed by the project goals, implementation, and results. Texas Instruments DSP platforms were used in conjunction with Simulink and Code Composter Studio to implement the scaled‐down baseband modulation scheme. Also, RF microwave components were donated from Hittite Corporation to perform quadrature modulation and up conversion to a frequency of 3.4 GHz. 1 Spatial capacity is defined as bits/sec/square‐meter. UWB is projected at having 6 devices working simultaneously within a 10 m range [16]. ii. Acknowledgements There are some people that need to be acknowledged for their work with this project. They include, but are not limited to: • Luke Vercimak and Karl Weyeneth for work on their 2006 Senior Capstone Project, Software Defined Radio. • Dr. Brian Huggins, Dr. In Soo Ahn and Dr. Prasad Shastry for advising, guidance and general encouragement throughout. -
Microprocessor Packaging (Intel)
MicroprocessorMicroprocessor PackagingPackaging The Key Link in the Chain Koushik Banerjee Technical Advisor Assembly Technology Development Intel Corporation 1 MicroprocessorsMicroprocessors 1971 2001 2 GlobalGlobal PackagingPackaging R&DR&D China Shanghai Philippines Cavite Arizona Chandler Malaysia Penang VirtualVirtual ATDATD 3 MainMain R&DR&D facilityfacility inin Chandler,Chandler, AZAZ 4 Computing needs driving complexity First to introduce organic in mainstream CPUs First to introduce flip chip in Intel 486TM Pentium®mainstreamPentium® Pro Pentium® CPUs II Pentium® III Pentium® 4 Itanium® Processor Processor Processor Processor Processor Processor Processor 25 MHz 1.0+ GHz Ceramic Wire-bond To Organic To Flip Chip 5 LookingLooking aheadahead …… ComplexityComplexity andand ChallengesChallenges toto supportsupport Moore’sMoore’s LawLaw 1. Silicon to package interconnect 2. Within package interconnect 3. Power management 4. Adding more functionality GoalGoal :: BringBring technologytechnology innovationinnovation intointo HighHigh volumevolume manufacturingmanufacturing atat aa LOWLOW COSTCOST 6 SiliconSilicon ?? PackagePackage RelationshipRelationship AnatomyAnatomy 101101 Silicon Processor: The “brain” of the computer (generates instructions) Packaging: The rest of the body (Communicates instructions to the outside world, adds protection) NoNo PackagePackage == NoNo ProductProduct !! Great Packaging = Great Products !! Great Packaging = Great Products !! 7 TheThe KeyKey LinkLink inin thethe ChainChain OpportunityOpportunity Transistor-to-Transistor -
Configuring and Scheduling an Eager-Writing Disk Array
Configuring and Scheduling an Eager-Writing Disk Array for a Transaction Processing Workload Chi Zhang∗ Xiang Yu∗ Arvind Krishnamurthyy Randolph Y. Wang∗ Abstract cult challenges to storage systems than office work- loads. These applications exhibit little locality or Transaction processing applications such as those sequentiality; a large percentage of the I/O requests exemplified by the TPC-C benchmark are among the are writes, many of which are synchronous; and most demanding I/O applications for conventional there may be little idle time. storage systems. Two complementary techniques exist to improve the performance of these systems. Traditional techniques that work well for office Eager-writing allows the free block that is closest to workloads tend to be less effective for these transac- a disk head to be selected for servicing a write re- tion processing applications. Memory caching pro- quest, and mirroring allows the closest replica to be vides little relief in the presence of poor locality and selected for servicing a read request. Applied indi- a small read-to-write ratio. As disk areal density im- vidually, the effectiveness of each of these techniques proves at 60-100% annually [9], as memory density is limited. An eager-writing disk array (EW-Array) improves at only 40% per year, and as the amount combines these two complementary techniques. In of data in transaction processing systems continues such a system, eager-writing enables low-cost replica to grow, one can expect little improvement in cache propagation so that the system can provide excel- hit rates in the near future. Delayed write tech- lent performance for both read and write operations niques become less applicable in the presence of a while maintaining a high degree of reliability.