Embedded Computing Solutions Engineered for Your solution—our engineering expertise WINSYSTEMS’ collaborative approach expedites product selection, capitalizes on the best Long-Term ROI and Extreme Environments technology and maximizes cost-effectiveness. Our seasoned hardware, software and application engineers adeptly address the unique nuances of designing small, rugged, highly reliable embedded solutions—from single board computers to data acquisition and processing, power supplies, networking and security. We go beyond replicating component reference designs to meet the unique challenges of our customers. Our application engineers carefully evaluate the system-level requirements to design the most effective embedded platform. Then, they help you identify the right product, adapt off-the-shelf components or develop a custom computing solution that satisfies your product specifications, desired service life, quality standards, production schedule and budget. Minimize risk—maximize success At WINSYSTEMS, we understand the risk, uncertainty and costs that come with introducing new products. By relying on our experience and capabilities in embedded computing technologies, you can concentrate on creating solutions that differentiate your business through unique features and advanced functionality. Avoid the added stress and resources involved in sifting through myriad options and developing your own custom boards. Instead, focus on your product’s critical design elements and get it to market faster. WINSYSTEMS—The Proven Source for Powerful Solutions When time to market, performance and your reputation are on the line, entrust your embedded computer requirements to the recognized authority: WINSYSTEMS. For 38 years, we have designed and manufactured highly reliable solutions for customers around the world. In that time, we have supplied tens of thousands of embedded computer systems that enable long-lasting, dependable operation of products in every type of environment—from outer space to the sea floor, and everywhere in between. WINSYSTEMS is consistently on the forefront of embedded solution development. Regardless of application or industry, we are committed to delivering value through exceptional platform design, communication, service and support to assure our customers’ ultimate success. With products delivering superior uptime, life cycles up to 15 years, and faster delivery, our customers achieve increased value for long-term ROI. 1 2020 CAPABILITIES From Industrial SBCs to Complete Embedded Systems Technology solutions that transcend boards WINSYSTEMS’ embedded technology solutions extend from single board computers and I/O modules to touch-panel PCs, industrial Ethernet switches, and turnkey embedded systems. Expect well-engineered solutions that deliver exceptional performance and operational efficiencies. We support and promote open hardware and software standards such as PC/104, EBX, EPIC, 3.5-in, ITX and COM Express®. Leveraging our commercial off-the-shelf (COTS) designs enables us to quickly adapt custom solutions providing high reliability and extended product life cycles. We also help engineer cost-effective solutions based on customers’ existing technology while positioning them for future upgrades. Valued Specialists in Embedded Computing Ultra-reliable in any application or environment Flexible processing architectures and expansion options Our engineers design extreme durability and reliability into every product while minimizing maintenance requirements. During product development, WINSYSTEMS uses multiple WINSYSTEMS’ embedded computing systems align with the most relevant CPUs and software environmental chambers and test racks to qualify components and product designs, ensuring resources. Our reliable, versatile Arm-based products fulfill diverse application requirements and they meet the required specifications. Rigorous performance testing and quality control deliver a remarkable power-to-performance ratio. We also offer multiple PC-compatible products processes assure maximum uptime. to improve performance and integrate with most software ecosystems. WINSYSTEMS is a recognized trailblazer in engineering rugged computers with extreme temperature resistance. Most of our standard products offer operating temperature ranges from -40 to +85 Experienced Design and Manufacturing degrees Celsius. Coupled with superb shock and vibration resistance, they stand up to the harshest, most demanding environments. Our systems also feature low power requirements and a multiyear Centrally located U.S. headquarters speeds product development warranty. WINSYSTEMS is certified to ISO 9001:2015. WINSYSTEMS’ new and expanded headquarters is located in Grand Prairie, Texas, USA, between Dallas and Fort Worth. Our campus houses all the departments necessary to efficiently design, manufacture and deliver embedded computer systems from project initiation to production ramp. We are more agile and responsive to customers because our operations are tightly integrated: Product manufacturing is collocated with engineering and testing, and it’s easier to get fast, well-informed answers from our application engineers at any stage. In-house manufacturing supports faster prototyping to production and quick-turn production cycles. And, having testing equipment onsite as well positions WINSYSTEMS to consistently maintain higher quality standards. Contact us for specific products or an engineered solution custom-tailored to particular functionality, connectivity, storage or I/O-expansion requirements. 3 2020 CAPABILITIES 2020 CAPABILITIES 4 Broad and deep domain expertise Unrivaled Quality and Support WINSYSTEMS provides solutions to disparate OEM customers across the globe. While their unique WINSYSTEMS’ expertise in embedded computer design and integration assures that your products products and requirements may vary, they all depend on our rugged and highly reliable computing are built on a highly reliable computer system. All of our solutions are backed by world-class platforms engineered for performance and long life—regardless of environment. customer service and responsive technical support from knowledgeable application engineers every WINSYSTEMS has particular expertise serving the following industries: step of the way. From initial consultation through production—and even questions once your product is in the field— Energy Management • our team is there to help. Industrial Automation • Discover for yourself how WINSYSTEMS’ embedded solutions can cut your product development • Industrial IoT (IIoT) costs and time to market while reducing the burdens and risk associated with launching new products. Contact us to request a consultation. • Transportation Management • Aerospace and Defense • Medical Diagnostics • Unmanned Systems (submersible, marine surface, ground, air and space) • Digital Signage • Security 5 2020 CAPABILITIES 2020 CAPABILITIES 6 www.WINSYSTEMS.com [email protected] +1-817-274-7553 SAMPLE PRODUCT OVERVIEW 7 2020 CAPABILITIES 2020 CAPABILITIES 8 SINGLE BOARD COMPUTERS SINGLE BOARD COMPUTERS HIGHLIGHTS COTS, modified PPM-C412 PC/104-Plus DMP® Vortex86DX3® and custom Designs SBC with Dual Ethernet High-reliability/ industrial grade SBC-C398Q Quad-Core NXP® i.MX 6Q Cortex®-A9 Shock- and EPX-C414 Industrial Arm SBC vibration-resistant EPIC Industrial SBC with Intel® Flexible I/O expansion Atom™ E3800 Series Processor EBC-C413 Various form factors EBX Industrial SBC with Intel® IA64, X86, Atom™ E3800 Series Processor and Arm expertise Extended temperature range: -40°C to +85°C FORM FACTORS PC/104 3.5-Inch EPIC EBX Nano-ITX Pico-ITX Femto-ITX ITX-N-3900 PX1-C415 ITX-P-444 ITX-F-3800 Nano-ITX SBC with Intel® PC/104 OneBank SBC with Intel® PIco-ITX SBC with NXP® i.MX8M Femto-ITX SBC with Intel® PROCESSORS Atom™ E3900 Series Processor E900 Series Processor Low-Power Processor Atom™ E3800 Series Processor Intel® NXP® Arm DM+P SBC FORM FACTOR SIZE COMPARISON EBX 5.75 x 8 in (146 × 203 mm) EPIC 4.5 x 6.5 in (114 × 165 mm) 3.5-Inch 4 x 5.7 in (101 mm x 146 mm) Nano-ITX 4.72 x 4.72 in (120 x 120 mm) PC/104 3.6 x 3.6 in (91.4 x 91.4 mm) Pico-ITX 3.9 x 2.8 in (100 x 172 mm) Femto-ITX 3.31 x 2.17 in (84 x 55 mm) 9 2020 CAPABILITIES 2020 CAPABILITIES9 10 INDUSTRIAL ENCLOSED COMPUTERS PANEL PCS SYS-405Q PPC65B-1X ® Rugged Intel Atom™ E3800 Series Processor Sealed, IP65-Compliant Quad-Core Fanless HIGHLIGHTS Quad-Core SBC with Dual Ethernet and USB 3.0 Panel PC with Intel® Atom™ E3845 Processor COTS, modified and custom designs High-reliability/ HIGHLIGHTS industrial grade Industrial grade Shock- and Shock- and vibration-resistant vibration-resistant Extended Extended temperature range: temperature range: -40°C to +85°C PPC65BP-1X -40°C to +85°C Fanless performance Sealed, IP65-Compliant Panel PC with Intel® SYS-ITX-P-3845 Fanless performance Low-Power Pico-ITX-Based Computer with Atom™ E3845 Processor and P-CAP Touchscreen Intel® E3800 Series Processor Low-power Versatile I/O Versatile I/O FORM FACTORS PROCESSORS PC/104 3.5-Inch Intel® EPIC NXP® EBX Nano-ITX TYPE Pico-ITX PPC12-427-3900 Femto-ITX Sealed Industrial 12.1” Panel PC with Intel® E3900 Open Frame SYS-ITX-N-3900 Processor, Dual Ethernet and Expansion SYSTEMS Fanless NANO-ITX SBC with Intel® E3900 Series Processor, Dual Ethernet and USB 3.0 x86 Arm PPC-10W-398D SYS-427-3900 Open-Frame, Dual-Core ARM® Panel PC ® Industrial Computer with Intel E3900 with NXP® i.MX 6DL Cortex®-A9 Processor Processor, Flexible Power Inputs and Expansion 11 2020 CAPABILITIES 2020 CAPABILITIES