Intrinsic and Extrinsic Semiconductors

Total Page:16

File Type:pdf, Size:1020Kb

Intrinsic and Extrinsic Semiconductors 1 MTLE-6120: Advanced Electronic Properties of Materials Intrinsic and extrinsic semiconductors Contents: I Band-edge density of states I Intrinsic Fermi level and carrier concentrations I Dopant states and ionization I Extrinsic Fermi level and carrier concentrations I Mobility: temperature and carrier density dependence I Recombination mechanisms Reading: I Kasap: 5.1 - 5.6 2 Band structure and conduction I Metals: partially filled band(s) i.e. bands cross Fermi level I Semiconductors / insulators: each band either filled or empty (T = 0) eτ I Drude formula applicable, mobility µ = m∗ ∗ 2 ~ −1 I Effective mass m = ~ [r~kr~kEn(k)] tensorial in general R ∗ −1 I Filled band does not conduct: eτ dk(m ) = 0 for each band 2 2 I Metals conduct due to carriers near Fermi level σ = g(EF )e vF τ=3 I Semiconductors: g(EF ) = 0 (will show shortly) ) no conduction at T = 0 3 Band structure of silicon (diamond-cubic semiconductor) 6 E c E 0 v E in eV −6 −12 LΛΓΔ ΧΣΓ I HOMO = Valence Band Maximum (VBM) with energy Ev and LUMO = Conduction Band Minimum (CBM) with energy Ec I HOMO-LUMO gap Eg = Ec − Ev ≈ 1:1 eV I HOMO and LUMO at different ~k ) indirect band gap I Diamond: similar band structure, much larger gap (≈ 5:5 eV) ) insulator 2 2 I Valence electrons/cell = 8 (even), configuration: 3s 3p (two Si/cell) 4 Band structure of GaAs (zinc-blende semiconductor) I HOMO-LUMO gap Eg = Ec − Ev ≈ 1:4 eV I HOMO and LUMO at same ~k (Γ) ) direct band gap 2 1 2 3 I Valence electrons/cell = 8 (even), configuration: Ga(4s 4p ), As(4s 4p ) 5 Density of states: silicon I Can calculate numerically from band structure I Parabolic band approximation valid for narrow energy range near gap 6 Density of states: parabolic-band semiconductor g(E) [eV-1nm-3] Valence band, m* = -0.3 Conduction band, m* = 0.5 4 3 2 1 0 -3 -2 -1 0 1 2 3 4 5 E [eV] I Parabolic bands near each band edge, with different effective masses I Overall DOS reduces with reduced effective mass magnitude I Set Ev = 0 conventionally (overall energy not well-defined) I Conduction band edge Ec = Eg I Where is the Fermi level? 7 Where is the Fermi level? I At T = 0, valence band fully occupied ) f(Ev = 0) = 1 ) EF > 0 I At T = 0, conduction band fully empty ) f(Ec = Eg) = 0 ) EF < Eg I Therefore, at T = 0, 0 < EF < Eg i.e. Fermi level is in the band gap I Chemical potential µ ! EF as T ! 0 I In semiconductor physics, typically refer to EF (T ) instead of µ(T ) I Therefore, Fermi functions will be 1 f(E; T ) = exp E−EF (T ) + 1 kB T 8 Where is the Fermi level at T > 0? I Given Fermi level EF and density of states g(E) R 1 I Number of electrons in conduction band is Ne = dEg(E)f(E) Eg R 0 I Number of holes in valence band is Nh = −∞ dEg(E)(1 − f(E)) I Total number of electrons cannot change with T ) Ne = Nh Z 0 Z 1 dEg(E)(1 − f(E)) = dEg(E)f(E) −∞ Eg Z 0 exp E−EF Z 1 1 dEg(E) kB T = dEg(E) E−EF E−EF −∞ exp + 1 E exp + 1 kB T g kB T Z 0 Z 1 dEg(E)e−(EF −E)=(kB T ) ≈ dEg(E)e−(E−EF )(kB T ) −∞ Eg 1 1 Z " Z " −EF =(kB T ) − k T (EF −Eg )=(kB T ) − k T e d"g(−")e B ≈ e d"g(Eg + ")e B 0 0 | {z } | {z } ≡Nv ≡Nc Assuming EF ;Eg − EF kBT , " ≡ energy from band edge 9 Band edge effective density of states I Given density of states as a function of energy away from band edge 1 Z " − k T Nc=v ≡ d"gc=v(")e B 0 p 3 2m∗ p I In parabolic band approximation g(") = 4π " for both bands 2π~ ∗ ∗ (but with different m ; for tensor m , above defines DOS meff) I Therefore band-edge effective of density states: 3 0q ∗ 1 1 2m Z c=v p " − k T Nc=v ≡ d" @ A 4π "e B 0 2π~ 3 3 0q ∗ 1 0q ∗ 1 2mc=v 2πmc=vkBT 3=2 = @ A 4πΓ(3=2)(kBT ) = 2 @ A 2π~ 2π~ ∗ 3=2 I Nc=v / (mc=v) (steeper g(") parabola) 3=2 I Nc=v / T (climb higher up the g(") parabola) 10 Fermi level for T > 0 I Charge neutrality imposes −EF =(kB T ) (EF −Eg )=(kB T ) Nve = Nce I Solve for Fermi level position: Eg kBT Nv EF (T ) = + ln 2 2 Nc I At T ! 0, EF is exactly at the middle of the band gap I At finite T , EF moves away ∼ kBT Eg (still close to gap center) I Which way does the Fermi level move with increasing T ? I For electrons in metals (and classical gases), µ # with T " I For semiconductors, EF (T ) # with T " iff Nc > Nv (more DOS in positive m∗ band; negative m∗ pulls µ other way) 11 Electron and hole concentrations −(Eg −EF )=(kB T ) I Number density of electrons n ≡ Ne = Nce −EF =(kB T ) I Number density of holes p ≡ Nh = Nve I Which one is larger? So far, they are equal: charge neutrality! −Eg =(kB T ) 2 I Note product np = NcNve ≡ ni , independent of EF I Neutral pure semiconductor, n = p = ni, intrinsic carrier density I If EF ", then n " and p # (more electrons than holes) I If EF #, then n # and p " (more holes than electrons) 2 I But np = ni , constant in all these cases + − −14 2 I This is an equilibrium constant, eg. [H ][OH ] = 10 M in water I How do you change EF ? Doping! (Also later, gating) 12 Intrinsic semiconductor thermodynamics and transport I Fermi level far from band edges ) Boltzmann statistics in both bands I Velocity distribution: Maxwell-Boltzmann distribution (classical gases) I Internal energy of electrons n · (Eg + 3kBT=2) I Internal energy of holes −p · (−3kBT=2) (holes are missing electrons!) I Net internal energy n · (Eg + 3kBT=2) − p · (−3kBT=2) I Drude theory conductivity σ = neµe + peµh 13 Intrinsic semiconductors: typical values at T = 300 K ∗ ∗ -3 -3 -3 Eg [eV] me=me mh=me Nc [cm ] Nv [cm ] ni [cm ] Ge 0.66 0.04,0.28 1.64,0.08 1:0 × 1019 6:0 × 1018 2:3 × 1013 Si 1.10 0.16,0.49 0.98,0.19 2:8 × 1019 1:2 × 1019 1:0 × 1010 GaAs 1.42 0.082 0.067 4:7 × 1017 7:0 × 1018 2:1 × 106 I Note that meff for Nc=v is an average of longitudinal / transverse values 1=3 2=3 (meff = mL mT ; for values see Table 5.1 in Kasap) I Nc and Nv increase with meff I ni drops exponentially with increasing Eg 14 Diamond-cubic structure: sp3 bonding 3 I Valence s and three p orbitals ) four sp hybrid orbitals I Orbitals point towards vertices of regular tetrahedron I Si, C, Ge: 4 valence electrons each I Form covalent bonds with four neighbours (8 shared electrons/atom) I Bonding orbitals ! valence band, anti-bonding orbitals ! conduction band I Tetrahedral network: FCC lattice with two atoms per cell 15 Zinc-blende structure: sp3 bonding 3 I Valence s and three p orbitals ) four sp hybrid orbitals I Orbitals point towards vertices of regular tetrahedron I Combine Ga,In (3 electrons) with As,Sb (5 electrons) I Form covalent bonds with four neighbours (8 shared electrons/atom) I Bonding orbitals ! valence band, anti-bonding orbitals ! conduction band I Tetrahedral network: FCC lattice with two atoms per cell I With Al and N, tend to form closely related Wurtzite structure (FCC to HCP cell) 16 Doping: acceptors and donors I Extra / impurity Group III atoms: one less electron per atom I Extra / impurity Group V atom: one extra electron per atom I Covalent bonding theory: atoms want 8 (filled-shell) of shared electrons I Group III `acceptor': pick up electron from solid ) hole in valence band I Group V `donor': give electron to solid ) electron in conduction band Simple picture of doping: I Density Na of acceptor atoms: charge −eNa I Density Nd of donor atoms: charge +eNd I Charge neutrality −en + ep − eNa + eNd = 0 ) n − p = Nd − Na 2 I Change in n and p due to shift in EF , but np = ni Eg kB T nNv kB T n I Solve for n and p, then find EF = + ln = EF 0 + ln 2 2 pNc 2 p I Even simpler picture: usually Nd;Na ni ) either p n or n p 17 Doping: p-type and n-type n-type semiconductor: I Donor impurities dominate Nd > 0 (Na = 0 or < Nd) 2 I Typically Nd − Na ni ) n p (since p = ni =n) 2 I Therefore n ≈ Nd − Na; p ≈ ni =(Nd − Na) kB T n Nd−Na I EF = EF 0 + ln = EF 0 + kBT ln (shifted " towards CBM) 2 p ni I Current predominantly carried by electrons p-type semiconductor: I Acceptor impurities dominate Na > 0 (Nd = 0 or < Na) 2 I Typically Na − Nd ni ) p n (since n = ni =p) 2 I Therefore p ≈ Na − Nd; n ≈ ni =(Na − Nd) kB T n Na−Nd I EF = EF 0 + ln = EF 0 − kBT ln (shifted # towards VBM) 2 p ni I Current predominantly carried by holes 18 Doping: a more complete picture I Simple picture: donor atom donates an electron, becomes positively charged I Positively charged donor ion can bind electrons: like a hydrogen atom −2 m∗ I Binding energy of pseudo-hydrogenic atom Eb = Ryd ∼ 0:05 eV r me I Donor level: Ed = Ec − Eb (electrons bound relative to CBM) I Exact argument for acceptors and holes, with charges swapped I Acceptor level: Ea = Ev + Eb (holes bound relative to VBM) I Levels in Si: note some impurities introduce multiple levels Physics of Semiconductor Devices, S.
Recommended publications
  • CHAPTER 8: Diffusion
    1 Chapter 8 CHAPTER 8: Diffusion Diffusion and ion implantation are the two key processes to introduce a controlled amount of dopants into semiconductors and to alter the conductivity type. Figure 8.1 compares these two techniques and the resulting dopant profiles. In the diffusion process, the dopant atoms are introduced from the gas phase of by using doped-oxide sources. The doping concentration decreases monotonically from the surface, and the in-depth distribution of the dopant is determined mainly by the temperature and diffusion time. Figure 8.1b reveals the ion implantation process, which will be discussed in Chapter 9. Generally speaking, diffusion and ion implantation complement each other. For instance, diffusion is used to form a deep junction, such as an n-tub in a CMOS device, while ion implantation is utilized to form a shallow junction, like a source / drain junction of a MOSFET. Boron is the most common p-type impurity in silicon, whereas arsenic and phosphorus are used extensively as n-type dopants. These three elements are highly soluble in silicon with solubilities exceeding 5 x 1020 atoms / cm3 in the diffusion temperature range (between 800oC and 1200oC). These dopants can be introduced via several means, including solid sources (BN for B, As2O3 for As, and P2O5 for P), liquid sources (BBr3, AsCl3, and POCl3), and gaseous sources (B2H6, AsH3, and PH3). Usually, the gaseous source is transported to the semiconductor surface by an inert gas (e.g. N2) and is then reduced at the surface. 2 Chapter 8 Figure 8.1: Comparison of (a) diffusion and (b) ion implantation for the selective introduction of dopants into a semiconductor substrate.
    [Show full text]
  • Which Pnictogen Is Best?† Cite This: New J
    NJC PAPER Pnictogen bonding with alkoxide cages: which pnictogen is best?† Cite this: New J. Chem., 2019, 43,14305 Henry J. Trubenstein, ‡ Shiva Moaven, ‡ Maythe Vega, Daniel K. Unruh and Anthony F. Cozzolino * Pnictogen bonding is beginning to emerge as a useful supramolecular interaction. The design strategies for these systems are still in the early stages of development and much attention has been focused on the lighter pnictogens. Pnictogen bond donors can have up to three independent sites for binding which can result in triple pnictogen bonding. This has been observed in the self-assembly of antimony alkoxide cages, but not with the lighter congeners. This work reports structural characterization of an analogous arsenic alkoxide cage that engages in a single pnictogen bond and synthetic explorations of Received 14th July 2019, the bismuth congener. DFT calculations are used to evaluate the differences between the structures. Accepted 13th August 2019 Ultimately the partial charge on the pnictogen and the energy of the pnictogen lone pair dictate the DOI: 10.1039/c9nj03648b strength, orientation and number of pnictogen bonds that these cages form. Antimony cages strike the best balance between strength and directionality, allowing them to achieve triple pnictogen bonding rsc.li/njc where the other congeners do not. Introduction or bismuth.15–23 Recently, antimony centred PnBs have been purposefully designed into molecules to actively direct the self- A pnictogen bond (PnB), in analogy to a halogen or chalcogen assembly of reversed bilayer vesicles,24 enable anion binding bond (XB/HaB or ChB), is ‘‘the net attractive interaction between with applications in sensing and transport,25–28 self-assembly an electrophilic region associated with a [pnictogen] atom in a complex architectures through triple pnictogen bonding29 and molecular entity [the PnB donor] and a nucleophilic region in allow for supramolecular catalysis.30 These applications rely on another, or the same, molecular entity [the PnB acceptor].’’1 the predictable formation of PnBs.
    [Show full text]
  • Donor Qubits in Silicon
    04/09/2015 Experiments with spin qubits in siliconDonor and diamond qubits in silicon Gavin W Morley University of Warwick Gavin W Morley, Spin qubits in silicon and diamond, QuICC Warwick, August 2015 Experiments with spin qubits in silicon and diamond: overview • Lecture 1 – Magnetic resonance – Silicon • Lecture 2 – Silicon (cont.) Lab tours • Lecture 3 Friday morning – Diamond Gavin W Morley, Spin qubits in silicon and diamond, QuICC Warwick, August 2015 1 04/09/2015 Experiments with spin qubits in silicon and diamond: overview • Lecture 1 – Magnetic resonance 1. Prepare (spin Hamiltonian) 2. Control (electromagnetic pulses) 3. Measure (spin state readout) – Silicon Gavin W Morley, Spin qubits in silicon and diamond, QuICC Warwick, August 2015 – Magnetic resonance 1. Prepare (spin Hamiltonian) 2. Control (electromagnetic pulses) 3. Measure (spin state readout) Gavin W Morley, Spin qubits in silicon and diamond, QuICC Warwick, August 2015 2 04/09/2015 Magnetic resonance: prepare - put a spin ½ into a magnetic field H Ŝ Hamiltonian = ωS z with energy, ħ ωS = g µB B0 for g-factor, g ~ 2, Bohr magneton µB = e ħ/2me, electron spin S = ½ Energy m = ½ of a s spin Magnetic field, B0 ms = -½ Gavin W Morley, Spin qubits in silicon and diamond, QuICC Warwick, August 2015 Magnetic resonance: prepare - put a spin ½ into a magnetic field Larmor precession at angular frequency ωS Gavin W Morley, Spin qubits in silicon and diamond, QuICC Warwick, August 2015 3 04/09/2015 Magnetic resonance: prepare - put a spin ½ into a magnetic field Larmor precession
    [Show full text]
  • Donor-Acceptor Methods for Band Gap Reduction in Conjugated Polymers: the Role of Electron Rich Donor Heterocycles
    DONOR-ACCEPTOR METHODS FOR BAND GAP REDUCTION IN CONJUGATED POLYMERS: THE ROLE OF ELECTRON RICH DONOR HETEROCYCLES By CHRISTOPHER A. THOMAS A DISSERTATION PRESENTED TO THE GRADUATE SCHOOL OF THE UNIVERSITY OF FLORIDA IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF DOCTOR OF PHILOSOPHY UNIVERSITY OF FLORIDA 2002 Copyright 2002 by Christopher A. Thomas All rights reserved. ACKNOWLEDGMENTS I thank my parents, Nancy and Larry, for their continuous support and attempts to understand and encourage me during what has been simultaneously the most enjoyable and most stressful part of my life. They made this document possible by encouraging and par- ticipating in experiences that ensured I would have the backgound and interest in trying to figure out how the world works. The decision about whom to work for in graduate school is one of the events I have agonized the most about in my life. As promised, the graduate advisor-student relationship is a complicated entity consisting of advisor, boss, counselor and friend that can change its active role without warning. Despite this, I am positive that there is no other person that I would rather have worked with during this process. I especially appreciate being given an unusual amount of decision making and direction setting power in the projects I was involved with and the freedom to explore aspects of science that interested me even when they did not overlap cleanly with Professor Reynolds’ research interests or funding. For their major contributions to my enjoyment and interest in chemistry, I thank Joe Carolan for his contagious enthusiasm, and Joel Galanda, who immensely affected the three years of my life he was involved with my chemistry and physical science education.
    [Show full text]
  • Donor-Acceptor Properties of Trivalent Phosphorus and Arsenic Ligands Larry James Vande Griend Iowa State University
    Iowa State University Capstones, Theses and Retrospective Theses and Dissertations Dissertations 1975 Donor-acceptor properties of trivalent phosphorus and arsenic ligands Larry James Vande Griend Iowa State University Follow this and additional works at: https://lib.dr.iastate.edu/rtd Part of the Inorganic Chemistry Commons Recommended Citation Vande Griend, Larry James, "Donor-acceptor properties of trivalent phosphorus and arsenic ligands " (1975). Retrospective Theses and Dissertations. 5764. https://lib.dr.iastate.edu/rtd/5764 This Dissertation is brought to you for free and open access by the Iowa State University Capstones, Theses and Dissertations at Iowa State University Digital Repository. It has been accepted for inclusion in Retrospective Theses and Dissertations by an authorized administrator of Iowa State University Digital Repository. For more information, please contact [email protected]. INFORMATION TO USERS This material was produced from a microfilm copy of the original document. While the most advanced technologcal means to photogaph and reproduce this document have been used, the quality is heavily dependent upon the quality of the original submitted. The following explanation of techniques is provided to help you understand markings or patterns which may appear on this reproduction. 1. The sign or "terget" for pages apparently lacking from the document photographed is "Missing Page(s)". If it was possible to obtain the missing page(s) or section, they are spliced into the film along with adjacent pages. This may have necasitstsd cutung thru an image and du^icating adjacent pages to insure you complete continuity. 2. When an image on the film is obliterated with a large round black mark, it is an indication that the photographer suspected that the copy may have moved during exposure and thus cause a blurred image.
    [Show full text]
  • CHAPTER 1: Semiconductor Materials & Physics
    Chapter 1 1 CHAPTER 1: Semiconductor Materials & Physics In this chapter, the basic properties of semiconductors and microelectronic devices are discussed. 1.1 Semiconductor Materials Solid-state materials can be categorized into three classes - insulators, semiconductors, and conductors. As shown in Figure 1.1, the resistivity of semiconductors, ρ, is typically between 10-2 and 108 Ω-cm. The portion of the periodic table related to semiconductors is depicted in Table 1.1. Figure 1.1: Typical range of conductivities for insulators, semiconductors, and conductors. Semiconductors can be composed of a single element such as silicon and germanium or consist of two or more elements for compound semiconductors. A binary III-V semiconductor is one comprising one element from Column III (such as gallium) and another element from Column V (for instance, arsenic). The common element and compound semiconductors are displayed in Table 1.2. City University of Hong Kong Chapter 1 2 Table 1.1: Portion of the Periodic Table Related to Semiconductors. Period Column II III IV V VI 2 B C N Boron Carbon Nitrogen 3 Mg Al Si P S Magnesium Aluminum Silicon Phosphorus Sulfur 4 Zn Ga Ge As Se Zinc Gallium Germanium Arsenic Selenium 5 Cd In Sn Sb Te Cadmium Indium Tin Antimony Tellurium 6 Hg Pd Mercury Lead Table 1.2: Element and compound semiconductors. Elements IV-IV III-V II-VI IV-VI Compounds Compounds Compounds Compounds Si SiC AlAs CdS PbS Ge AlSb CdSe PbTe BN CdTe GaAs ZnS GaP ZnSe GaSb ZnTe InAs InP InSb City University of Hong Kong Chapter 1 3 1.2 Crystal Structure Most semiconductor materials are single crystals.
    [Show full text]
  • SOLID STATE PHYSICS PART II Optical Properties of Solids
    SOLID STATE PHYSICS PART II Optical Properties of Solids M. S. Dresselhaus 1 Contents 1 Review of Fundamental Relations for Optical Phenomena 1 1.1 Introductory Remarks on Optical Probes . 1 1.2 The Complex dielectric function and the complex optical conductivity . 2 1.3 Relation of Complex Dielectric Function to Observables . 4 1.4 Units for Frequency Measurements . 7 2 Drude Theory{Free Carrier Contribution to the Optical Properties 8 2.1 The Free Carrier Contribution . 8 2.2 Low Frequency Response: !¿ 1 . 10 ¿ 2.3 High Frequency Response; !¿ 1 . 11 À 2.4 The Plasma Frequency . 11 3 Interband Transitions 15 3.1 The Interband Transition Process . 15 3.1.1 Insulators . 19 3.1.2 Semiconductors . 19 3.1.3 Metals . 19 3.2 Form of the Hamiltonian in an Electromagnetic Field . 20 3.3 Relation between Momentum Matrix Elements and the E®ective Mass . 21 3.4 Spin-Orbit Interaction in Solids . 23 4 The Joint Density of States and Critical Points 27 4.1 The Joint Density of States . 27 4.2 Critical Points . 30 5 Absorption of Light in Solids 36 5.1 The Absorption Coe±cient . 36 5.2 Free Carrier Absorption in Semiconductors . 37 5.3 Free Carrier Absorption in Metals . 38 5.4 Direct Interband Transitions . 41 5.4.1 Temperature Dependence of Eg . 46 5.4.2 Dependence of Absorption Edge on Fermi Energy . 46 5.4.3 Dependence of Absorption Edge on Applied Electric Field . 47 5.5 Conservation of Crystal Momentum in Direct Optical Transitions . 47 5.6 Indirect Interband Transitions .
    [Show full text]
  • Lecture 7: Extrinsic Semiconductors - Fermi Level
    Lecture 7: Extrinsic semiconductors - Fermi level Contents 1 Dopant materials 1 2 EF in extrinsic semiconductors 5 3 Temperature dependence of carrier concentration 6 3.1 Low temperature regime (T < Ts)................7 3.2 Medium temperature regime (Ts < T < Ti)...........8 1 Dopant materials Typical doping concentrations in semiconductors are in ppm (10−6) and ppb (10−9). This small addition of `impurities' can cause orders of magnitude increase in conductivity. The impurity has to be of the right kind. For Si, n-type impurities are P, As, and Sb while p-type impurities are B, Al, Ga, and In. These form energy states close to the conduction and valence band and the ionization energies are a few tens of meV . Ge lies the same group IV as Si so that these elements are also used as impurities for Ge. The ionization energy data n-type impurities for Si and Ge are summarized in table 1. The ionization energy data for p-type impurities for Si and Ge is summarized in table 2. The dopant ionization energies for Ge are lower than Si. Ge has a lower band gap (0.67 eV ) compared to Si (1.10 eV ). Also, the Table 1: Ionization energies in meV for n-type impurities for Si and Ge. Typical values are close to room temperature thermal energy. Material P As Sb Si 45 54 39 Ge 12 12.7 9.6 1 MM5017: Electronic materials, devices, and fabrication Table 2: Ionization energies in meV for p-type impurities. Typical values are comparable to room temperature thermal energy.
    [Show full text]
  • Defects in Semiconductors
    Chapter 3 Defects in Semiconductors 3.1 Introduction In an ideal crystal lattice, each atom is at its designated position and deviations from this perfect structure are called imperfections or defects. These defects may introduce electronic energy states into the semiconductor band gap, which can be placed into two categories: shallow levels and deep levels. Shallow levels are located near their related band edges (valence band for acceptors and conduction band for donors) i.e. ~0.1 eV from the band edge, thus these levels are thermally ionized at room temperature. The ionization energy of a shallow level can be approximately described by a modified hydrogenic model [1]. For example, a shallow donor resembles a hydrogen atom with a positive nucleus binding an electron. Impurity elements which are used as dopants in semiconductors normally create these shallow levels which are ionized at room temperature and provide free carriers to form p-type or n-type semiconductor. Deep levels are those defects positioned deeper in the band gap than the dopant levels and are found to bind the carriers much more strongly into highly compact, localized states. The deep levels have higher ionization energies, therefore contribute very little to the free charge carriers. Defects with deep levels in the band gap are often referred to as, ‘traps’, ‘recombination centers’, or ‘generation centers’. Deep levels are important in semiconductors since they modify the properties of the semiconductors and therefore, those of the devices fabricated thereon. Deep levels are desirable in some applications, e.g. in fast switching devices, where they can be exploited as recombination centers which quickly remove minority carriers, enhancing the device’s switching speed thereby increasing efficiency [2,3].
    [Show full text]
  • The Metal-Semiconductor Junction: Review
    Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination The Metal-Semiconductor Junction: Review Energy band diagram of the metal and the semiconductor before (a) and after (b) contact Barrier Height Built-in Potential M-S Junctions: Thermal Equilibrium Depletion Region Region Depletion Energy band diagram of a metal-semiconductor contact in thermal equilibrium. Under Bias Full depletion approximation Review (a) Charge density, (b) electric field, (c) potential and (d) energy with the full depletion analysis. MOS Capacitors: Review The MOS capacitor consists of a Metal-Oxide-Semiconductor structure Current Transport at the MS Interface The current across a metal-semiconductor junction is mainly due to majority carriers. Three distinctly different mechanisms exist: diffusion of carriers from the semiconductor into the metal, thermionic emission of carriers across the Schottky barrier and quantum-mechanical tunneling through the barrier. Diffusion Current: driving force is distributed over the length of the depletion layer. Thermionic Emission: only energetic carriers, with energy equal to or larger than the conduction band energy at the metal-semiconductor interface, contribute to the current flow. Tunneling: the wave-nature of the electrons, allowing them to penetrate through thin barriers. Diffusion, Thermionic Emission & Tunneling For Diffusion current, the depletion layer is large compared to the mean free path, so that the concepts of drift and diffusion are valid. The current depends exponentially on the applied voltage, Va, and the barrier height, B. Electric-field at MS Junction: The thermionic emission theory assumes that electrons, with an energy larger than the top of the barrier, will cross the barrier provided they move towards the barrier.
    [Show full text]
  • Bulk and Transfer Doping of Diamond
    A First-Principles Study on BULK AND TRANSFER DOPING OF DIAMOND Stephen John Sque Original submission: November 1, 2005 Examination: December 19, 2005 This version: April 1, 2007 Submitted by Stephen John Sque, to the University of Exeter as a thesis for the degree of Doctor of Philosophy in Physics, November 2005. This thesis is available for Library use on the understanding that it is copyright material and that no quotation from the thesis may be published without proper acknowledge- ment. I certify that all material in this thesis which is not my own work has been identified and that no material has previously been submitted and approved for the award of a degree by this or any other University. — Stephen Sque i Abstract Presented herein are the results of theoretical investigations addressing current issues in the doping of diamond. The work has been conducted using first-principles calculations based on density-functional theory under the local-density approximation. Particular emphasis is placed upon two currently problematic aspects of doping diamond: the lack of a suitable shallow donor impurity for n-type doping of the bulk, and the need for a sta- ble adsorbate material for p-type doping of the diamond surface (transfer doping). Since the latter clearly requires an understanding of the properties of the various diamond sur- faces, the effects of atomic geometry and surface termination on the electronic structure of the technologically important diamond surfaces have also been investigated. This study reproduces the experimentally well-known properties of nitrogen and phos- phorus defects in diamond, and proceeds to predict that arsenic and antimony will be shallower donors than phosphorus, which is at present the most successful n-type dopant.
    [Show full text]
  • Electrons and Holes in Semiconductors
    Hu_ch01v4.fm Page 1 Thursday, February 12, 2009 10:14 AM 1 Electrons and Holes in Semiconductors CHAPTER OBJECTIVES This chapter provides the basic concepts and terminology for understanding semiconductors. Of particular importance are the concepts of energy band, the two kinds of electrical charge carriers called electrons and holes, and how the carrier concentrations can be controlled with the addition of dopants. Another group of valuable facts and tools is the Fermi distribution function and the concept of the Fermi level. The electron and hole concentrations are closely linked to the Fermi level. The materials introduced in this chapter will be used repeatedly as each new device topic is introduced in the subsequent chapters. When studying this chapter, please pay attention to (1) concepts, (2) terminology, (3) typical values for Si, and (4) all boxed equations such as Eq. (1.7.1). he title and many of the ideas of this chapter come from a pioneering book, Electrons and Holes in Semiconductors by William Shockley [1], published Tin 1950, two years after the invention of the transistor. In 1956, Shockley shared the Nobel Prize in physics for the invention of the transistor with Brattain and Bardeen (Fig. 1–1). The materials to be presented in this and the next chapter have been found over the years to be useful and necessary for gaining a deep understanding of a large variety of semiconductor devices. Mastery of the terms, concepts, and models presented here will prepare you for understanding not only the many semiconductor devices that are in existence today but also many more that will be invented in the future.
    [Show full text]