PN and Metal–Semiconductor Junctions
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PN Junction Is the Most Fundamental Semiconductor Device
Fundamentals of Microelectronics CH1 Why Microelectronics? CH2 Basic Physics of Semiconductors CH3 Diode Circuits CH4 Physics of Bipolar Transistors CH5 Bipolar Amplifiers CH6 Physics of MOS Transistors CH7 CMOS Amplifiers CH8 Operational Amplifier As A Black Box 1 Chapter 2 Basic Physics of Semiconductors 2.1 Semiconductor materials and their properties 2.2 PN-junction diodes 2.3 Reverse Breakdown 2 Semiconductor Physics Semiconductor devices serve as heart of microelectronics. PN junction is the most fundamental semiconductor device. CH2 Basic Physics of Semiconductors 3 Charge Carriers in Semiconductor To understand PN junction’s IV characteristics, it is important to understand charge carriers’ behavior in solids, how to modify carrier densities, and different mechanisms of charge flow. CH2 Basic Physics of Semiconductors 4 Periodic Table This abridged table contains elements with three to five valence electrons, with Si being the most important. CH2 Basic Physics of Semiconductors 5 Silicon Si has four valence electrons. Therefore, it can form covalent bonds with four of its neighbors. When temperature goes up, electrons in the covalent bond can become free. CH2 Basic Physics of Semiconductors 6 Electron-Hole Pair Interaction With free electrons breaking off covalent bonds, holes are generated. Holes can be filled by absorbing other free electrons, so effectively there is a flow of charge carriers. CH2 Basic Physics of Semiconductors 7 Free Electron Density at a Given Temperature E n 5.21015T 3/ 2 exp g electrons/ cm3 i 2kT 0 10 3 ni (T 300 K) 1.0810 electrons/ cm 0 15 3 ni (T 600 K) 1.5410 electrons/ cm Eg, or bandgap energy determines how much effort is needed to break off an electron from its covalent bond. -
Chapter 5 Semiconductor Laser
Chapter 5 Semiconductor Laser _____________________________________________ 5.0 Introduction Laser is an acronym for light amplification by stimulated emission of radiation. Albert Einstein in 1917 showed that the process of stimulated emission must exist but it was not until 1960 that TH Maiman first achieved laser at optical frequency in solid state ruby. Semiconductor laser is similar to the solid state laser like the ruby laser and helium-neon gas laser. The emitted radiation is highly monochromatic and produces a highly directional beam of light. However, the semiconductor laser differs from other lasers because it is small in 0.1mm long and easily modulated at high frequency simply by modulating the biasing current. Because of its uniqueness, semiconductor laser is one of the most important light sources for optical-fiber communication. It can be used in many other applications like scientific research, communication, holography, medicine, military, optical video recording, optical reading, high speed laser printing etc. The analysis of physics of laser is quite difficult and we summarize with the simplified version here. The application of laser although with a slow start in the 1960s but now very often new applications are found such as those mentioned earlier in the text. 5.1 Emission and Absorption of Radiation As mentioned in earlier Chapter, when an electron in an atom undergoes transition between two energy states or levels, it either absorbs or emits photon. When the electron transits from lower energy level to higher energy level, it absorbs photon. When an electron transits from higher energy level to lower energy level, it releases photon. -
First Line of Title
GALLIUM NITRIDE AND INDIUM GALLIUM NITRIDE BASED PHOTOANODES IN PHOTOELECTROCHEMICAL CELLS by John D. Clinger A thesis submitted to the Faculty of the University of Delaware in partial fulfillment of the requirements for the degree of Master of Science with a major in Electrical and Computer Engineering Winter 2010 Copyright 2010 John D. Clinger All Rights Reserved GALLIUM NITRIDE AND INDIUM GALLIUM NITRIDE BASED PHOTOANODES IN PHOTOELECTROCHEMICAL CELLS by John D. Clinger Approved: __________________________________________________________ Robert L. Opila, Ph.D. Professor in charge of thesis on behalf of the Advisory Committee Approved: __________________________________________________________ James Kolodzey, Ph.D. Professor in charge of thesis on behalf of the Advisory Committee Approved: __________________________________________________________ Kenneth E. Barner, Ph.D. Chair of the Department of Electrical and Computer Engineering Approved: __________________________________________________________ Michael J. Chajes, Ph.D. Dean of the College of Engineering Approved: __________________________________________________________ Debra Hess Norris, M.S. Vice Provost for Graduate and Professional Education ACKNOWLEDGMENTS I would first like to thank my advisors Dr. Robert Opila and Dr. James Kolodzey as well as my former advisor Dr. Christiana Honsberg. Their guidance was invaluable and I learned a great deal professionally and academically while working with them. Meghan Schulz and Inci Ruzybayev taught me how to use the PEC cell setup and gave me excellent ideas on preparing samples and I am very grateful for their help. A special thanks to Dr. C.P. Huang and Dr. Ismat Shah for arrangements that allowed me to use the lab and electrochemical equipment to gather my results. Thanks to Balakrishnam Jampana and Dr. Ian Ferguson at Georgia Tech for growing my samples, my research would not have been possible without their support. -
Extremely High-Gain Source-Gated Transistors
Extremely high-gain source-gated transistors Jiawei Zhanga,1, Joshua Wilsona,1, Gregory Autonb, Yiming Wangc, Mingsheng Xuc, Qian Xinc, and Aimin Songa,c,1,2 aSchool of Electrical and Electronic Engineering, University of Manchester, Manchester M13 9PL, United Kingdom; bNational Graphene Institute, University of Manchester, Manchester M13 9PL, United Kingdom; and cState Key Laboratory of Crystal Materials, Centre of Nanoelectronics and School of Microelectronics, Shandong University, Jinan 250100, People’s Republic of China Edited by Alexis T. Bell, University of California, Berkeley, CA, and approved January 29, 2019 (received for review December 6, 2018) Despite being a fundamental electronic component for over 70 turn-on voltage (19, 20). This susceptibility to negative bias illu- years, it is still possible to develop different transistor designs, mination temperature stress (NBITS) is one of the main factors including the addition of a diode-like Schottky source electrode delaying the wide-scale adoption of IGZO in the display industry. to thin-film transistors. The discovery of a dependence of the Another major problem is that TFTs require precise lithography source barrier height on the semiconductor thickness and deriva- to enable large-area uniformity, and difficulties with registration tion of an analytical theory allow us to propose a design rule to between different TFT layers are likely to be compounded by the achieve extremely high voltage gain, one of the most important use of flexible substrates. One major advantage of the SGT is that figures of merit for a transistor. Using an oxide semiconductor, an it does not require such precise registration, because the current intrinsic gain of 29,000 was obtained, which is orders of magni- is controlled by the dimensions of the source contact rather than tude higher than a conventional Si transistor. -
Junction Field Effect Transistor (JFET)
Junction Field Effect Transistor (JFET) The single channel junction field-effect transistor (JFET) is probably the simplest transistor available. As shown in the schematics below (Figure 6.13 in your text) for the n-channel JFET (left) and the p-channel JFET (right), these devices are simply an area of doped silicon with two diffusions of the opposite doping. Please be aware that the schematics presented are for illustrative purposes only and are simplified versions of the actual device. Note that the material that serves as the foundation of the device defines the channel type. Like the BJT, the JFET is a three terminal device. Although there are physically two gate diffusions, they are tied together and act as a single gate terminal. The other two contacts, the drain and source, are placed at either end of the channel region. The JFET is a symmetric device (the source and drain may be interchanged), however it is useful in circuit design to designate the terminals as shown in the circuit symbols above. The operation of the JFET is based on controlling the bias on the pn junction between gate and channel (note that a single pn junction is discussed since the two gate contacts are tied together in parallel – what happens at one gate-channel pn junction is happening on the other). If a voltage is applied between the drain and source, current will flow (the conventional direction for current flow is from the terminal designated to be the gate to that which is designated as the source). The device is therefore in a normally on state. -
Study of Velocity Distribution of Thermionic Electrons with Reference to Triode Valve
Bulletin of Physics Projects, 1, 2016, 33-36 Study of Velocity Distribution of Thermionic electrons with reference to Triode Valve Anupam Bharadwaj, Arunabh Bhattacharyya and Akhil Ch. Das # Department of Physics, B. Borooah College, Ulubari, Guwahati-7, Assam, India # E-mail address: [email protected] Abstract Velocity distribution of the elements of a thermodynamic system at a given temperature is an important phenomenon. This phenomenon is studied critically by several physicists with reference to different physical systems. Most of these studies are carried on with reference to gaseous thermodynamic systems. Basically velocity distribution of gas molecules follows either Maxwell-Boltzmann or Fermi-Dirac or Bose-Einstein Statistics. At the same time thermionic emission is an important phenomenon especially in electronics. Vacuum devices in electronics are based on this phenomenon. Different devices with different techniques use this phenomenon for their working. Keeping all these in mind we decided to study the velocity distribution of the thermionic electrons emitted by the cathode of a triode valve. From our work we have found the velocity distribution of the thermionic electrons to be Maxwellian. 1. Introduction process of electron emission by the process of increase of Metals especially conductors have large number of temperature of a metal is called thermionic emission. The free electrons which are basically valence electrons. amount of thermal energy given to the free electrons is Though they are called free electrons, at room temperature used up in two ways- (i) to overcome the surface barrier (around 300K) they are free only to move inside the metal and (ii) to give a velocity (kinetic energy) to the emitted with random velocities. -
The P-N Junction (The Diode)
Lecture 18 The P-N Junction (The Diode). Today: 1. Joining p- and n-doped semiconductors. 2. Depletion and built-in voltage. 3. Current-voltage characteristics of the p-n junction. Questions you should be able to answer by the end of today’s lecture: 1. What happens when we join p-type and n-type semiconductors? 2. What is the width of the depletion region? How does it relate to the dopant concentration? 3. What is built-in voltage? How to calculate it based on dopant concentrations? How to calculate it based on Fermi levels of semiconductors forming the junction? 4. What happens when we apply voltage to the p-n junction? What is forward and reverse bias? 5. What is the current-voltage characteristic for the p-n junction diode? Why is it different from a resistor? 1 From previous lecture we remember: What happens when you join p-doped and n-doped pieces of semiconductor together? When materials are put in contact the carriers flow under driving force of diffusion until chemical potential on both sides equilibrates, which would mean that the position of the Fermi level must be the same in both p and n sides. This results in band bending: - + - + + - - Holes diffuse + Electrons diffuse The electrons will diffuse into p-type material where they will recombine with holes (fill in holes). And holes will diffuse into the n-type materials where they will recombine with electrons. 2 This means that eventually in vicinity of the junction all free carriers will be depleted leaving stripped ions behind, which would produce an electric field across the junction: The electric field results from the deviation from charge neutrality in the vicinity of the junction. -
Alkamax Application Note.Pdf
OLEDs are an attractive and promising candidate for the next generation of displays and light sources (Tang, 2002). OLEDs have the potential to achieve high performance, as well as being ecologically clean. However, there are still some development issues, and the following targets need to be achieved (Bardsley, 2001). Z Lower the operating voltage—to reduce power consumption, allowing cheaper driving circuitry Z Increase luminosity—especially important for light source applications Z Facilitate a top-emission structure—a solution to small aperture of back-emission AMOLEDs Z Improve production yield These targets can be achieved (Scott, 2003) through improvements in the metal-organic interface and charge injection. SAES Getters’ Alkali Metal Dispensers (AMDs) are widely used to dope photonic surfaces and are applicable for use in OLED applications. This application note discusses use of AMDs in fabrication of alkali metal cathode layers and doped organic electron transport layers. OLEDs OLEDs are a type of LED with organic layers sandwiched between the anode and cathode (Figure 1). Holes are injected from the anode and electrons are injected from the cathode. They are then recombined in an organic layer where light emission takes place. Cathode Unfortunately, fabrication processes Electron transport layer are far from ideal. Defects at the Emission layer cathode-emission interface and at the Hole transport layer anode-emission interface inhibit Anode charge transfer. Researchers have added semiconducting organic transport layers to improve electron Figure 1 transfer and mobility from the cathode to the emission layer. However, device current levels are still too high for large-size OLED applications. SAES Getters S.p.A. -
Manipulation of Electrical Resistivity and Optical Properties of Zinc Oxide Thin Films Grown by Pulsed Laser Deposition and the Sol-Gel Method
MANIPULATION OF ELECTRICAL RESISTIVITY AND OPTICAL PROPERTIES OF ZINC OXIDE THIN FILMS GROWN BY PULSED LASER DEPOSITION AND THE SOL-GEL METHOD by Ryan W. Crisp A thesis submitted to the Faculty and the Board of Trustees of the Colorado School of Mines in partial fulfillment of the requirements for the degree of Master of Science (Applied Phsyics). Golden, Colorado Date Signed: Ryan W. Crisp Signed: Dr. Reuben T. Collins Thesis Advisor Golden, Colorado Date Signed: Dr. Thomas E. Furtak Professor and Head Department of Physics ii ABSTRACT Adjusting and optimizing the electrical resistivity and optical transparency of transparent conducting oxides (TCOs) is critically important to the quality of many solid state devices. In this work, the electrical and optical properties of zinc oxide thin films grown by the sol- gel method and by pulsed laser deposition are studied. A minimum electrical resistivity of 5.7×10−4 Ω·cm at an oxygen partial pressure of 0.01 mbar for room temperature (RT) growth by pulsed laser deposition (PLD) was achieved. This optimal film had a calculated transparency >90% in the visible region. The measurement techniques used and a full ex- ploration of the various growth parameters (growth temperature, ambient gas type, ambient gas pressure, and annealing treatments) are discussed. The optimized growth parameters were applied to create a TCO top contact to nanorod structures that are potentially useful as solar cell devices. The application of this optimized film offers future work possibilities to perfect a promising up and coming device. iii TABLE OF CONTENTS ABSTRACT . iii LIST OF FIGURES . -
The Pennsylvania State University the Graduate School THE
The Pennsylvania State University The Graduate School THE EFFECTS OF INTERFACE AND SURFACE CHARGE ON TWO DIMENSIONAL TRANSITORS FOR NEUROMORPHIC, RADIATION, AND DOPING APPLICATIONS A Dissertation in Electrical Engineering by Andrew J. Arnold © 2020 Andrew J. Arnold Submitted in Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy August 2020 The dissertation of Andrew J. Arnold was reviewed and approved by the following: Thomas Jackson Professor of Electrical Engineering Co-Chair of Committee Saptarshi Das Assistant Professor of Engineering Science and Mechanics Dissertation Advisor Co-Chair of Committee Swaroop Ghosh Assistant Professor of Electrical Engineering Rongming Chu Associate Professor of Electrical Engineering Sukwon Choi Assistant Professor of Mechanical Engineering Kultegin Aydin Professor of Electrical Engineering Head of the Department of Electrical Engineering ii Abstract The scaling of silicon field effect transistors (FETs) has progressed exponentially following Moore’s law, and is nearing fundamental limitations related to the materials and physics of the devices. Alternative materials are required to overcome these limitations leading to increasing interest in two dimensional (2D) materials, and transition metal dichalcogenides (TMDs) in particular, due to their atomically thin nature which provides an advantage in scalability. Numerous investigations within the literature have explored various applications of these materials and assessed their viability as a replacement for silicon FETs. This dissertation focuses on several applications of 2D FETs as well as an exploration into one of the most promising methods to improve their performance. Neuromorphic computing is an alternative method to standard computing architectures that operates similarly to a biological nervous system. These systems are composed of neurons and operate based on pulses called action potentials. -
Lecture 3: Diodes and Transistors
2.996/6.971 Biomedical Devices Design Laboratory Lecture 3: Diodes and Transistors Instructor: Hong Ma Sept. 17, 2007 Diode Behavior • Forward bias – Exponential behavior • Reverse bias I – Breakdown – Controlled breakdown Æ Zeners VZ = Zener knee voltage Compressed -VZ scale 0V 0.7 V V ⎛⎞V Breakdown V IV()= I et − 1 S ⎜⎟ ⎝⎠ kT V = t Q Types of Diode • Silicon diode (0.7V turn-on) • Schottky diode (0.3V turn-on) • LED (Light-Emitting Diode) (0.7-5V) • Photodiode • Zener • Transient Voltage Suppressor Silicon Diode • 0.7V turn-on • Important specs: – Maximum forward current – Reverse leakage current – Reverse breakdown voltage • Typical parts: Part # IF, max IR VR, max Cost 1N914 200mA 25nA at 20V 100 ~$0.007 1N4001 1A 5µA at 50V 50V ~$0.02 Schottky Diode • Metal-semiconductor junction • ~0.3V turn-on • Often used in power applications • Fast switching – no reverse recovery time • Limitation: reverse leakage current is higher – New SiC Schottky diodes have lower reverse leakage Reverse Recovery Time Test Jig Reverse Recovery Test Results • Device tested: 2N4004 diode Light Emitting Diode (LED) • Turn-on voltage from 0.7V to 5V • ~5 years ago: blue and white LEDs • Recently: high power LEDs for lighting • Need to limit current LEDs in Parallel V R ⎛⎞ Vt IV()= IS ⎜⎟ e − 1 VS = 3.3V ⎜⎟ ⎝⎠ •IS is strongly dependent on temp. • Resistance decreases R R R with increasing V = 3.3V S temperature • “Power Hogging” Photodiode • Photons generate electron-hole pairs • Apply reverse bias voltage to increase sensitivity • Key specifications: – Sensitivity -
Junction Analysis and Temperature Effects in Semi-Conductor
Junction analysis and temperature effects in semi-conductor heterojunctions by Naresh Tandan A thesis submitted to the Graduate Faculty in partial fulfillment of the requirements for the degree of DOCTOR OF PHILOSOPHY in Electrical Engineering Montana State University © Copyright by Naresh Tandan (1974) Abstract: A new classification for semiconductor heterojunctions has been formulated by considering the different mutual positions of conduction-band and valence-band edges. To the nine different classes of semiconductor heterojunction thus obtained, effects of different work functions, different effective masses of carriers and types of semiconductors are incorporated in the classification. General expressions for the built-in voltages in thermal equilibrium have been obtained considering only nondegenerate semiconductors. Built-in voltage at the heterojunction is analyzed. The approximate distribution of carriers near the boundary plane of an abrupt n-p heterojunction in equilibrium is plotted. In the case of a p-n heterojunction, considering diffusion of impurities from one semiconductor to the other, a practical model is proposed and analyzed. The effect of temperature on built-in voltage leads to the conclusion that built-in voltage in a heterojunction can change its sign, in some cases twice, with the choice of an appropriate doping level. The total change of energy discontinuities (&ΔEc + ΔEv) with increasing temperature has been studied, and it is found that this change depends on an empirical constant and the 0°K Debye temperature of the two semiconductors. The total change of energy discontinuity can increase or decrease with the temperature. Intrinsic semiconductor-heterojunction devices are studied? band gaps of value less than 0.7 eV.