Sony IMX400 Tri-Stacked Image Sensor First Stacked CIS with Logic, Memory and Sensing Die IMAGING Report by Stéphane ELISABETH July 2017

Sony IMX400 Tri-Stacked Image Sensor First stacked CIS with Logic, Memory and sensing die IMAGING report by Stéphane ELISABETH July 2017

Overview / Introduction 3 Manufacturing Process Flow 93 o Executive Summary o Global Overview o Reverse Costing Methodology o DRAM Front-End Process Company Profile 6 o DRAM Wafer Fabrication Unit o Sony o Logic Front-End Process o CIS Market Forecast o Logic Wafer Fabrication Unit o New generation of CIS? o Pixel Array Front-End Process o Sony XZs Teardown o CIS Wafer Fabrication Unit Physical Analysis 14 o DRAM/Logic Circuit Bonding Process Flow o Pixel Circuit Process Flow o Synthesis of the Physical Analysis o Pixel Array/DRAM/Logic Circuit Bonding Process Flow o Physical Analysis Methodology o Optical Process Flow o Module 17 Cost Analysis 105  Module Views & Dimensions o Synthesis of the cost analysis  Module Opening: o Yields Explanation & Hypotheses Lenses, AF driver & Hall sensor, Plastic Filter o Circuits Wafer 110  Module Opening: Wire Bonding, BSI, TSVs Process  Logic Circuit Front-End Cost  Module Cross-Section :  DRAM Circuit Front-End Cost Plastic Filter, Wire Bonding, PCB, FOV, Adhesives, FOV  Pixel Array Circuit Front-End Cost o CIS Die 46 o Bonded Wafer 113  Pads, Pixels, Active Area Overview  BSI & TSVs Front-End Cost  Die View & Dimensions  BSI & TSVs Front-End Cost per process steps  Delayering:  Color Filter & Microlenses Front-End Cost Pixel Array, DRAM, Logic  Total Front-End Cost  Cross-Section:  CIS Back-End 0 : Probe Test & Dicing Die Bonding, TSVs, Die Process  CIS Wafer & Die Cost  Process Characteristics Estimated Price Analysis 121 Physical Comparison 87 Company services 125 o History of Sony’s CIS Module, Die area, PDAF, Pixel Area, TSVs

Overview / Introduction o Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, manufacturing o Reverse Costing Methodology cost and selling price of the Sony IMX400. Company Profile & Supply Chain

Physical Analysis • This innovative CIS will be the next generation from Sony. The CIS included a 22 Mpixels array, a 1Gb Physical Comparison DRAM die and a Digital Signal Processing on the same die footprint. This is the first tri-layers stacked CIS Manufacturing Process Flow that we can found on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving object thanks to the high capacity DRAM between the Pixel Array Cost Analysis circuit and the DSP circuit.

• Using the Sony’s Exmor-RS and the Xperi’s Zibond technology, Sony managed to integrate the three dies in a single thin, small and cost-effective die sensor. Surprisingly, the die sensor a unique sort of TSV with multiple level to interconnected the dies.

• This report includes a complete analysis of the Camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-section. It also includes a comparison with Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.

Overview / Introduction

Company Profile & Supply Chain o Sony Rear camera o Market Forecast Module o Next generation of CIS? o Sony XZs Teardown

Physical Analysis

Physical Comparison

Manufacturing Process Flow Sony XZs Opened view Cost Analysis

Front Camera Ambient Light Sensor

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction • Module is analyzed and measured. Company Profile & Supply Chain

Physical Analysis o Synthesis • The module is opened to get overall dies data: dimensions, main characteristics, device markings. o Module o Pictures of selected area are made in order to understand the connections of the CIS. o Module Cross-Section o CIS Die o Cross section of Module to measure thicknesses and understand the assembly o CIS Cross-Section

Physical Comparison • The CIS is separated to get overall die data: dimensions, main blocks, pad number and pin out, die marking. Manufacturing Process Flow o Removal of metal layers (step by step) to identify the dies and measure the minimum dimensions. Cost Analysis o Pictures of selected areas to identify the nature of the transistors. o SEM photographs to measure the transistors dimensions.

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Module o Module Cross-Section o CIS Die o CIS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Module o Die Area o PDAF o Pixel Area o TSVs

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Module o Die Area o PDAF o Pixel Area o TSVs

Manufacturing Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow o Global Overview o Wafers Front-End Process o Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow o Global Overview o Wafers Front-End Process o Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow o Global Overview o Wafers Front-End Process o Process Flow

Cost Analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o Circuits Wafer Cost o Bonded Wafer & Die Cost

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o Circuits Wafer Cost o Bonded Wafer & Die Cost

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o Circuits Wafer Cost o Bonded Wafer & Die Cost