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Equipment and Materials for 3D NAND Manufacturing 2020

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Equipment and Materials for 3D NAND Manufacturing 2020 From Technologies to Markets Equipment and Materials for 3D NAND Manufacturing 2020 Market and Technology Report 2020 Sample © 2020 TABLE OF CONTENTS • WFE solutions for 3D-NAND manufacturing 177 • Glossary and definitions 2 o Deposition – CVD, ALD 187 • Table of contents 10 o Dry etching 194 • Report objectives 14 o Lithography 202 • Report scope 15 o Hybrid bonding 210 • Methodology & definitions 16 • 3D-NAND business players 222 • About the authors 17 o Financial analysis 248 • Companies cited in this report 19 o List of recent mergers and acquisitions 265 • Who should be interested in this report? 20 • Equipment for 3D-NAND manufacturing – market overview 270 • Market forecast – deposition for 3D-NAND manufacturing 278 • Yole Group related reports 21 Revenues, shipments (# of chambers), ASP, tool mix, and more • Three-slide summary 23 • Market forecast – dry etching for 3D-NAND manufacturing 286 • Executive summary 27 Revenues, shipments (# of chambers), ASP, tool mix, and more • Introduction and context 61 • Market forecast – lithography for 3D-NAND manufacturing 294 o Overview of the stand-alone memory business 67 Revenues, shipments (# of tools), ASP, tool mix, and more o Overview of semiconductor equipment market 86 • Market forecast – Hybrid bonding for 3D-NAND manufacturing 302 • 3D-NAND business – market, applications, and key players 93 Revenues, shipments (# of chambers) and ASP for two distinct scenarios • 3D-NAND technology and manufacturing process 109 • Impact of COVID-19 on the NAND Business 309 • General conclusions 316 o 3D-NAND technologies, roadmaps, and trends 121 • Noteworthy news 320 o 3D-NAND manufacturing process flows 138 • How to use our data? 326 o Technical challenges 153 • Yole Group presentation 327 • 3D-NAND manufacturing materials 163 Equipment and Materials for 3D NAND Manufacturing 2020 | Sample | www.yole.fr | ©2020 2 COMPANIES CITED IN THIS REPORT ACM Research, Adeka, Advantest, AGC, Air Liquide, Air Products, Amec, Applied Materials, ASM International, ASML, Cabot Microelectronics, Canon, Coventor, Cypress, Dow, Dupont, Entegris, Enthone, Eugene Technology, EVG, Fujifilm, Fusion IO, GigaDevice, GlobalFoundries, Hansol Chemical, Heraeus, Hitachi Chemical, Hitachi High Technologies, Intel, JSR Corporation, Jusung Engineering, Kingston, Kioxia, KLA Tencor, Lam Research, Linde, Macronix, Materion, Merck, Micron, Mitsubishi Materials, Nanometrics, Naura, Nikon, Nippon Kayakli, Nova, Onto Innovation, Samsung, SanDisk, Screen, Seagate, Semes, Shin Etsu, SK hynix, SK materials, Smee, Spansion, Sumitomo Bakelite Co., Praxair, Rudolph Technologies, SMIC, Tok, Tokyo Electron, Teradyne, Tes, Toshiba, Tok, Tsinghua Unigroup, TSMC, Ultratech, UMC, UniIC Semiconductors, Uyemura, Veeco, Versum, Western Digital, Winbond, Wonik IPS, Wonik Materials, XFab, XMC, Xperi, YMTC, Zeon, and more. Equipment and Materials for 3D NAND Manufacturing 2020 | Sample | www.yole.fr | ©2020 3 ABOUT THE AUTHORS Simone Bertolazzi, Ph.D. Simone is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of Yole’s memory team and contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals and was awarded the prestigious Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics. Simone earned a double M. A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude. Contact: [email protected] Walt Coon Walt Coon joined Yole Développement’s memory team as VP of NAND and Memory Research, part of the Semiconductor & Software division. Walt leads the day-to-day production of market updates, Market Monitors and Pricing Monitors, with a focus on the NAND market and semiconductor industries. In addition, he is deeply involved in the business development of these activities. Walt has significant experience within the memory & semiconductor industry. He spent 16 years at Micron Technology, managing the team responsible for competitor benchmarking, and industry supply, demand, and cost modeling. His team also supported both corporate strategy and Mergers & Acquisition analysis. Previously, he spent time in Information Systems, developing engineering applications to support memory processes and yield enhancement. Walt Coon earned a Master of Business Administration from Boise State University (Idaho, United States) and a Bachelor of Science in Computer Science from the University of Utah (United States). Contact: [email protected] Amandine Pizzagalli Amandine Pizzagalli is a Technology & Market Analyst, Equipment & Materials - Semiconductor Manufacturing, at Yole Développement (Yole). Amandine is part of the development of the Semiconductor & Software division of Yole with the production of reports and custom consulting projects. She oversees comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes. Previously, Amandine worked as Process engineer on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine was based in Japan for one year to manage these projects. She has spoken in numerous international conferences and has authored or co-authored more than 10 papers. Amandine holds an international MBA from IAE Lyon, School of Management (France) and an electronic engineering master degree from the engineering school, CPE Lyon (France) with an added degree, focusing on semiconductor manufacturing technology, from KTH Royal institute of technology (Sweden). Contact: [email protected] Elvire Soltani Elvire Soltani joined Yole as an analyst intern working within the Semiconductor, Memory & Computing division. Elvire is engaged in a daily technical/strategic analysis focused on 3D NAND manufacturing and related equipment and materials. Elvire has obtained an engineering degree in materials science with a major in semiconductor applications. Equipment and Materials for 3D NAND Manufacturing 2020 | Sample | www.yole.fr | ©2020 4 METHODOLOGIES & DEFINITIONS Yole’s market forecast model is based on the matching of several sources: Preexisting information Market Volume (in Munits) ASP (in $) Revenue (in $M) Information aggregation Equipment and Materials for 3D NAND Manufacturing 2020 | Sample | www.yole.fr | ©2020 5 REPORT OBJECTIVES • Leveraging on an extensive knowledge of the NAND business and related manufacturing equipment/processes Yole Développement is glad to introduce the brand-new report “Equipment and Materials for 3D-NAND Manufacturing”. • This report is the result of a tight collaboration between Yole Développement’s Memory and Semiconductor-Manufacturing teams and the reverse-engineering company System Plus Consulting, who carried out a detailed analysis of the leading-edge 3D-NAND devices by all suppliers. The main objectives of the report are as follows: (1) Provide an overview of the stand-alone memory (4) Describe the 3D-NAND manufacturing equipment, business with deep focus on NAND: materials and processes • Stand-alone memory market technologies and trends • 3D-NAND manufacturing process flows by suppliers • NAND business: market, applications, competitive landscape • 3D-NAND architectures and technical trends: string stacking, circuit under array (CUA) vs. XtackingTM, and more (2) Present an overview of the wafer-fab equipment • Technical challenges and equipment solutions for manufacturing technologies and processes: 3D-NAND chips • Chemical-vapor and atomic layer deposition (CVD,ALD) • Manufacturing materials: suppliers and technology/market trends. • Dry etching for dielectrics and conductors, high-aspect ratio (HAR) etching for deep features (e.g. channel holes) (5) Detail and analyze the competitive landscape • Immersion and dry lithography • Financial analysis of top NAND memory manufacturers and (3) Market forecast for the time period 2019-2025 equipment suppliers • Revenues, ASP and units for deposition and dry-etching chambers, • Recent acquisitions and funding as well as tools for lithography and hybrid bonding • Latest company news, mergers and acquisition Equipment and Materials for 3D NAND Manufacturing 2020 | Sample | www.yole.fr | ©2020 6 SCOPE OF THE REPORT • This technology-and-market report focuses on the main equipment used for manufacturing Flash NAND memory, namely deposition (CVD, ALD), dry etching and lithography tools; we also provide an analysis of the hybrid-bonding market for manufacturing of 3D- NAND with XtackingTM like approaches. • The report also contains a detailed description of the materials employed during the manufacturing process, their key features, technical requirements, players and future trends. Market forecast for materials are not included in this report. Deposition Dry etching Lithography Hybrid bonding Materials Materials, Players, Challenges, Trends Image source: EVG Image source: Lam Research Image source: Applied Materials Image source: ASML From Higher to Lower Resolution: • CVD for dielectric materials • Etching for dielectric materials Your needs are • ArF immersion
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