DOCSLIB.ORG

XPERI CORPORATION (Exact Name of Registrant As Specified in Its Charter)

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
XPERI CORPORATION (Exact Name of Registrant As Specified in Its Charter) UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, DC 20549 FORM 10-K (Mark One) ☒ ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended December 31, 2018 OR ☐ TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 Commission File Number: 001-37956 XPERI CORPORATION (Exact Name of Registrant as Specified in Its Charter) Delaware 81- 4465732 (State or Other Jurisdiction of (I.R.S. Employer Incorporation or Organization) Identification No.) 3025 Orchard Parkway, San Jose, California 95134 (Address of Principal Executive Offices) (Zip Code) (408) 321-6000 (Registrant’s Telephone Number, Including Area Code) Securities registered pursuant to Section 12(b) of the Act: Title of each class Name of each exchange on which registered Common stock, par value $0.001 per share The Nasdaq Global Select Market Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes ☒ No ☐ Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Securities Exchange Act. Yes ☐ No ☒ Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. Yes ☒ No ☐ Indicate by check mark whether the registrant has submitted electronically every Interactive Data File required to be submitted pursuant to Rule 405 of Regulation S-T (§ 232.405 of this chapter) during the preceding 12 months (or for such shorter period that the registrant was required to submit such files). Yes ☒ No ☐ Indicate by check mark if disclosure of delinquent filers pursuant to Item 405 of Regulation S-K is not contained herein, and will not be contained, to the best of registrant’s knowledge, in definitive proxy or information statements incorporated by reference in Part III of this Form 10-K or any amendment to this Form 10-K. ☐ Indicate by check mark whether the registrant is a large accelerated filer, an accelerated filer, a non-accelerated filer, a smaller reporting company, or an emerging growth company. See the definitions of “large accelerated filer,” “accelerated filer,” “smaller reporting company” and “emerging growth company” in Rule 12b-2 of the Exchange Act: Large accelerated filer ☒ Accelerated filer ☐ Non-accelerated filer ☐ Smaller reporting company ☐ Emerging growth company ☐ If an emerging growth company, indicate by check mark if the Registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. ☐ Indicate by check mark whether the registrant is a shell company (as defined in Rule 12b-2 of the Securities Exchange Act). Yes ☐ No ☒ The aggregate market value of the registrant’s common stock held by non-affiliates of the registrant as of June 30, 2018 was $463,642,793 (based on the closing sale price of the registrant’s common stock as reported on The Nasdaq Global Select Market). The number of shares outstanding of the registrant’s common stock as of February 4, 2019 was 48,652,499. DOCUMENTS INCORPORATED BY REFERENCE: Portions of the registrant’s Proxy Statement for the registrant’s 2019 Annual Meeting of Stockholders will be filed with the Commission within 120 days after the close of the registrant’s 2018 fiscal year and are incorporated by reference in Part III. XPERI CORPORATION ANNUAL REPORT ON FORM 10-K FOR THE YEAR ENDED DECEMBER 31, 2018 TABLE OF CONTENTS Page PART I Item 1. Business 4 Item 1A. Risk Factors 12 Item 1B. Unresolved Staff Comments 28 Item 2. Properties 28 Item 3. Legal Proceedings 28 Item 4. Mine Safety Disclosures 35 PART II Item 5. Market for Registrant's Common Equity, Related Stockholder Matters and Issuer Purchases of Equity Securities 36 Item 6. Selected Financial Data 39 Item 7. Management's Discussion and Analysis of Financial Condition and Results of Operations 40 Item 7A. Quantitative and Qualitative Disclosures About Market Risk 56 Item 8. Financial Statements and Supplementary Data 57 Item 9. Changes in and Disagreements With Accountants on Accounting and Financial Disclosure 60 Item 9A. Controls and Procedures 60 Item 9B. Other Information 61 PART III Item 10. Directors, Executive Officers and Corporate Governance 62 Item 11. Executive Compensation 62 Item 12. Security Ownership of Certain Beneficial Owners and Management and Related Stockholder Matters 62 Item 13. Certain Relationships and Related Transactions, and Director Independence 62 Item 14. Principal Accountant Fees and Services 62 PART Iv Item 15. Exhibits and Financial Statement Schedules 63 Item 16. Form 10-K Summary 106 Signatures 107 2 Cautionary Statement Regardin g Forward-Looking Statements This Annual Report contains forward-looking statements, which are subject to the safe harbor provisions created by the Private Securities Litigation Reform Act of 1995. Words such as “expects,” “anticipates,” “plans,” “believes,” “seeks,” “estimates,” “could,” “would,” “may,” “intends,” “targets” and similar expressions or variations of such words are intended to identify forward-looking statements, but are not the exclusive means of identifying forward-looking statements in this Annual Report. The identification of certain statements as “forward-looking” is not intended to mean that other statements not specifically identified are not forward-looking. All statements other than statements about historical facts are statements that could be deemed forward-looking statements, including, but not limited to, statements that relate to our future revenue, product development, demand, acceptance and market share, growth rate, competitiveness, gross margins, levels of research, development and other related costs, expenditures, the outcome or effects of and expenses related to litigation and administrative proceedings related to our patents, our intent to enforce our intellectual property, our ability to license our intellectual property, tax expenses, cash flows, our ability to liquidate and recover the carrying value of our investments, our management’s plans and objectives for our current and future operations, our plans for quarterly dividends and stock repurchases, the levels of customer spending or research and development activities, general economic conditions, and the sufficiency of financial resources to support future operations and capital expenditures. Although forward-looking statements in this Annual Report reflect the good faith judgment of our management, such statements can only be based on facts and factors currently known by us. Consequently, forward-looking statements are inherently subject to risks, uncertainties, and changes in condition, significance, value and effect, including those discussed below under the heading “Risk Factors” within Part I, Item 1A of this Annual Report and other documents we file from time to time with the Securities and Exchange Commission (the “SEC”), such as our annual reports on Form 10-K, our quarterly reports on Form 10-Q and our current reports on Form 8-K. Such risks, uncertainties and changes in condition, significance, value and effect could cause our actual results to differ materially from those expressed herein and in ways not readily foreseeable. Readers are urged not to place undue reliance on these forward-looking statements, which speak only as of the date of this Annual Report and are based on information currently and reasonably known to us. We undertake no obligation to revise or update any forward-looking statements in order to reflect any event or circumstance that may arise after the date of this Annual Report. Readers are urged to carefully review and consider the various disclosures made in this Annual Report, which attempt to advise interested parties of the risks and factors that may affect our business, financial condition, results of operations and prospects. 3 PART I Item 1. Business Corporate Information Our principal executive offices are located at 3025 Orchard Parkway, San Jose, California 95134 USA. Our telephone number is +1 (408) 321-6000. We maintain a corporate website at www.xperi.com. The reference to our website address does not constitute incorporation by reference of the information contained on this website. Xperi, the Xperi logo, Tessera, the Tessera logo, DTS, the DTS logo, FotoNation, the FotoNation logo, Invensas, the Invensas logo, BVA, ZiBond, DBI, DTS‑ HD , DTS Audio Processing, DTS:X Ultra, DTS Virtual:X, DTS Headphone:X, DTS Play‑Fi, DTS:X and HD Radio are trademarks or registered trademarks of Xperi Corporation or its affiliated companies in the U.S. and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies. In this Annual Report, the “Company,” “we,” “us” and “our” refer to Xperi Corporation (“Xperi”), which operates its business through its subsidiaries. Unless specified otherwise, the financial results in this Annual Report are those of the Company and its subsidiaries on a consolidated basis. Overview Xperi is a publicly-traded technology company with headquarters in Silicon Valley and operations around the world. Through its operating subsidiaries, Xperi creates, develops and licenses innovative audio, imaging, semiconductor packaging and interconnect technologies. We have approximately 700 employees and over 25 years of operating experience. We completed the acquisition of DTS, Inc. (“DTS”), a publicly-traded developer of sound-based technologies, in December 2016. At the time of the acquisition, Tessera Technologies, Inc. and DTS were combined under the newly-formed Tessera Holding Corporation. During the first quarter of 2017, we introduced our new corporate name, Xperi Corporation, launched a new corporate logo, and began trading under a new ticker symbol XPER.
Load more

Recommended publications
  • Ar Vr Uhd Ip
    Issue No. 51 DVBSCENE March 2018 Delivering the Digital Standard www.dvb.org Promotions & Communication Module broadband Television Satellite Beam Hopping tion DVB World Hybrid casting a - t Emergency Warning System -based e T n L embers Targeted Advertising t il n F Second Generation M o TM Commercial Module I T 8k Broadcast VC DVB-C2 A - impleme Augmented Reality CI-Plus Bit-Rate M e elopme C r Steering Board w 25 Years v a a V VC ABR Multicast e implementation t>IP w A t s L f D T ’ a Technical Module e Satellite k e echnology ta so r c r S 4k T s Meetings ebinars a o y IP oo HbbTV OTT a V bitmap w D M W ansponders e HEVC t r t c T e Displ Terrestrial erien N TM-AVC vi in AR p Seminars r e S DVB IP DVB-T2 ome UHD onsensus Liaisons V C H k oding T r - ts C y of tion tion Transmission internet y 2018 n o a a t a QoS SMG Subtitling A os m p T w r - c y Systems eme ideo o M able t QoE t es f r C el V c ast ualtiy of Ex sics e in C T uali FTA llumin y c vi I Q h e N equi Q metadata VR HD R P ds echnology r Low latency IP oks T DVB-S2 IP cial o r Single Specication UHD Phase 2 eaming r B CS t tual Reali S Patent Pools tanda Multi DVB DASH Low latency DASH R r i S ilecasting onsumer D omme V F Consumer Electronics C STBs C Wideband SI T E Ultra High Definition Transport Stream Blue Study Mission Groups DVB-I Service Portal 05 Wideband Re-use 1 Future Forward DVB Internet TV Services CES Attention Grabbers DVB-I Client 08 Targeted Advertising DVB-I Client 10 NGA The open internet 12 Report from CM-VR including CDNs, Cable, Fiber, xDSL, DVB-I Client mobile access networks, 13 Other Realities WiFi, etc.
    [Show full text]
  • Blu-Ray Disc Association Begins Licensing
    Blu-ray Disc Association Begins Licensing For Next-Generation Broadcast Recordable Blu-ray™ Format New Recordable Format Enables Recording of Ultra HD Broadcast Content in Japanese Market LOS ANGELES – January9 2018 – The Blu-ray Disc Association (BDA) today commenced licensing of its latest expansion of the Blu-ray Disc format. The specifications for next-generation broadcast recordable Blu-ray format will allow consumers in the Japanese market to record, view and archive Ultra HD broadcast content on new BD-RE XL media, as well as on legacy BD-R and BD-RE discs. Blu-ray Disc’s large data capacity has made it a top choice for archiving personal video content. In Japan, where there are three times more Blu-ray recorders in homes than there are players, it’s widely used for recording and archiving broadcast content. According to JEITA, more than 2 million Blu-ray recorders were shipped in 2016 and a similar number is forecasted for 2017, while approximately 600,000 Blu-ray players were shipped during the same years. "Due to different business models and certain cultural aspects in Japan, Blu-ray recorder sales have outpaced player sales since the introduction of the format,” noted Victor Matsuda, Chair of BDA Global Promotions Committee. “Recording and archiving broadcast content is common in Japan and, with Ultra HD broadcast scheduled to launch there towards the end of 2018, adding Ultra HD recording capability was a given for the BDA and is an important benefit for Japanese consumers.” Highlights of the Ultra HD Blu-ray recordable specifications, which were completed in November of 2017, include: Recording and playback of Ultra HD broadcast streams at up to 100Mbps in new BD-RE XL media Recording of Ultra HD broadcast streams on legacy BD-R/BD-RE media New File system specifications for recording AV streams up to 100Mbps AACS2 recordable technology Support for HEVC and HDR (Hybrid Log Gamma) The new BD-RE-XL discs will allow for more than two hours of recording, even in the case of 100Mbps AV streams.
    [Show full text]
  • Since the Advent of Integrated Circuit Technology in 1958, the Integration Has Been Primarily Monolithic
    Opening Keynote #1 Extending Moore’s Law with Advanced Packages Abstract: Since the advent of integrated circuit technology in 1958, the integration has been primarily monolithic. Unfortunately, due to physical and economic reasons, the vast majority of analog chips, digital chips, and memory chips are each built on separate technologies. Therefore, in order to deliver optimum system performance, power, and cost, it is desirable to integrate multiple different die, each using its own optimized technology, in a single package. Advanced packaging technologies, e.g. 3DIC, SSIT(stacked silicon Interconnect technology) etc., have been developed to extend scaling beyond the Moore’s Law to achieve higher transistor count, increased functionality and superior performance. Xilinx is the leading provider of all programmable FPGA (Field Programmable Gate Array) products. To achieve high performance, but low power and cost, Xilinx has developed an innovative SSIT technology that employs microbumps and through-silicon vias (TSVs) to integrate multiple FPGA die slices placed side-by-side on a passive silicon interposer, and successfully delivered the industry’s first 28nm homogeneous SSIT device. This technology is further developed for advanced technical nodes (20nm, 16nm and beyond) to allow integrating heterogeneous components such as Processor, FPGA, GPU, Memory, Serdes, etc. on the same interposer die enabling faster computing through reduced latency. The advance of packaging and assembly technology will be introduced, and the benefits of advanced packaging to the various products will be highlighted. Successful qualification of these products is driving the high growth in the applications e.g. cloud computing, embedded vision, industrial IOT, and 5G wireless etc.
    [Show full text]
  • Patent Landscape Shifts from M&A in the Semiconductor Industry
    ® Patent Landscape Shifts from M&A in the Semiconductor Industry George Park Great things 8 April 2021 happen when ideas prosper Property of IPValue Management Inc. – All rights reserved. The views expressed do not necessarily represent the views of IPValue. Semiconductor industry experienced a boom in M&A in the last two years Technology area of company or business Date deal Buyer Seller Deal Value unit being acquired announced Renesas Dialog Semiconductor $5.9B Internet of Things, Mixed Signal Feb-21 Qualcomm Nuvia $1.4B Custom CPU core design for servers Jan-21 AMD Xilinx $35B Programmable chips Oct-20 SK hynix Intel NAND/SSD business unit $9B NAND/SSD Oct-20 High-speed interconnect and mixed- Marvell Inphi $10B Oct-20 signal IC Nvidia ARM (owned by Softbank) $40B Processor design technology Sep-20 Analog Devices Maxim $21B Analog & mixed signal products Jul-20 AMS OSRAM €4.6B Lighting technology Dec-19 Apple Intel business unit $1B Smartphone modem Jul-19 MCUs, software, connectivity Infineon Cypress Semiconductor €9B Jun-19 components Marvell wireless connectivity NXP Semiconductors $1.76B WiFi and Bluetooth May-19 business unit ON Semiconductor Quantenna $1B WiFi Mar-19 Nvidia Mellanox $7B High performance networking technology Mar-19 Note: certain deals, including Nvidia-ARM, remain subject to governmental approval Source: IAM-Media; press releases Property of IPValue Management Inc. – All rights reserved. 2 SOXX Performance: Jan 2019 to Dec 2020 Source: Yahoo Property of IPValue Management Inc. – All rights reserved. 3 Total 2020 M&A deals in the semiconductor space has been estimated at ~$100B Source: Press releases Property of IPValue Management Inc.
    [Show full text]
  • XPERI CORPORATION (Exact Name of Registrant As Specified in Its Charter)
    UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, DC 20549 FORM 10-K (Mark One) ☒ ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended December 31, 2019 OR ☐ TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 Commission File Number: 001-37956 XPERI CORPORATION (Exact Name of Registrant as Specified in Its Charter) Delaware 81-4465732 (State or Other Jurisdiction of (I.R.S. Employer Incorporation or Organization) Identification No.) 3025 Orchard Parkway, San Jose, California 95134 (Address of Principal Executive Offices) (Zip Code) (408) 321-6000 (Registrant’s Telephone Number, Including Area Code) Securities registered pursuant to Section 12(b) of the Act: Trading Title of each class Symbol(s) Name of each exchange on which registered Common Stock, par value $0.001 per share XPER The Nasdaq Global Select Market Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes ☒ No ☐ Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Securities Exchange Act. Yes ☐ No ☒ Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days.
    [Show full text]
  • Opening Keynote #1 Extending Moore's Law with Advanced
    Opening Keynote #1 Extending Moore’s Law with Advanced Packages Abstract: Since the advent of integrated circuit technology in 1958, the integration has been primarily monolithic. Unfortunately, due to physical and economic reasons, the vast majority of analog chips, digital chips, and memory chips are each built on separate technologies. Therefore, in order to deliver optimum system performance, power, and cost, it is desirable to integrate multiple different die, each using its own optimized technology, in a single package. Advanced packaging technologies, e.g. 3DIC, SSIT(stacked silicon Interconnect technology) etc., have been developed to extend scaling beyond the Moore’s Law to achieve higher transistor count, increased functionality and superior performance. Xilinx is the leading provider of all programmable FPGA (Field Programmable Gate Array) products. To achieve high performance, but low power and cost, Xilinx has developed an innovative SSIT technology that employs microbumps and through-silicon vias (TSVs) to integrate multiple FPGA die slices placed side-by-side on a passive silicon interposer, and successfully delivered the industry’s first 28nm homogeneous SSIT device. This technology is further developed for advanced technical nodes (20nm, 16nm and beyond) to allow integrating heterogeneous components such as Processor, FPGA, GPU, Memory, Serdes, etc. on the same interposer die enabling faster computing through reduced latency. The advance of packaging and assembly technology will be introduced, and the benefits of advanced packaging to the various products will be highlighted. Successful qualification of these products is driving the high growth in the applications e.g. cloud computing, embedded vision, industrial IOT, and 5G wireless etc.
    [Show full text]
  • High-End Performance Packaging 2020
    From Technologies to Markets High-End Performance Packaging: 3D/2.5D Integration 2020 Market and Technology Report Sample © 2020 TABLE OF CONTENTS Part 1/2 Table of contents 2 o Package ASP split by technology 85 Scope of report 4 o Market value split by technology 88 Report methodologies & definitions 6 o 3D SoC Key features of this report 5 o 3D stacked memory About the author 7 o 2.5D interposers Yole Group of companies related reports 9 o UHD FO Glossaries 11 o Embedded Si bridge Companies cited in this report 12 o Chapter conclusion 94 3-Page summary 13 Market trends 96 Executive summary 17 o Cloud & edge computing 97 Context 66 o Cloud computing and networking 103 o Semiconductor industry – players pursuing Moore’s law 67 o High-Performance Computing (HPC) 111 o High-end performance packaging definition 71 o Artificial intelligence for autonomous vehicles 119 o Scope of report 72 o Chapter conclusion 125 o High-end performance packaging market segment 73 Commercialized products and its supply chain 127 o High-end performance packaging introduction 74 o Product launches 130 Market forecasts 75 o 3D stacked memories o Market Revenue 76 o (x)PU o Total market revenue o GPU for HPC o Split by end-market o Supply chain for high-end performance packaging 156 o Split by technology o Global mapping of high-end packaging o Market Units 80 o Global mapping based on technology o Total market units o Supply chain for high-end packaging products o Split by end-market o Latest progress of key players 175 o Split by technology High-end
    [Show full text]
  • Sony IMX400 Tri-Stacked Image Sensor First Stacked CIS with Logic, Memory and Sensing Die IMAGING Report by Stéphane ELISABETH July 2017
    Sony IMX400 Tri-Stacked Image Sensor First stacked CIS with Logic, Memory and sensing die IMAGING report by Stéphane ELISABETH July 2017 ©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 1 Table of Contents Overview / Introduction 3 Manufacturing Process Flow 93 o Executive Summary o Global Overview o Reverse Costing Methodology o DRAM Front-End Process Company Profile 6 o DRAM Wafer Fabrication Unit o Sony o Logic Front-End Process o CIS Market Forecast o Logic Wafer Fabrication Unit o New generation of CIS? o Pixel Array Front-End Process o Sony XZs Teardown o CIS Wafer Fabrication Unit Physical Analysis 14 o DRAM/Logic Circuit Bonding Process Flow o Pixel Circuit Process Flow o Synthesis of the Physical Analysis o Pixel Array/DRAM/Logic Circuit Bonding Process Flow o Physical Analysis Methodology o Optical Process Flow o Module 17 Cost Analysis 105 Module Views & Dimensions o Synthesis of the cost analysis Module Opening: o Yields Explanation & Hypotheses Lenses, AF driver & Hall sensor, Plastic Filter o Circuits Wafer 110 Module Opening: Wire Bonding, BSI, TSVs Process Logic Circuit Front-End Cost Module Cross-Section : DRAM Circuit Front-End Cost Plastic Filter, Wire Bonding, PCB, FOV, Adhesives, FOV Pixel Array Circuit Front-End Cost o CIS Die 46 o Bonded Wafer 113 Pads, Pixels, Active Area Overview BSI & TSVs Front-End Cost Die View & Dimensions BSI & TSVs Front-End Cost per process steps Delayering: Color Filter & Microlenses Front-End Cost Pixel Array, DRAM, Logic Total Front-End Cost Cross-Section:
    [Show full text]
  • Blu-Ray Disc Association Announces Specification for Next-Generation Broadcast Recordable Blu-Ray Disc™ Product Licensing to Commence in 2018
    Blu-ray Disc Association Announces Specification for Next-Generation Broadcast Recordable Blu-ray Disc™ Product Licensing to Commence in 2018 LOS ANGELES – December19, 2017 – The Blu-ray Disc Association (BDA) today announced completion of specifications for next-generation broadcast recordable Blu-ray Disc™ for the Japanese market. This is the culmination of the work of global leaders from the consumer electronics, IT and content creation industries. The next-generation broadcast recordable Blu- ray format will enable recording of Ultra HD content in the successful Japanese recordable market. Blu-ray Disc’s large data capacity has made it a top choice for archiving personal video content. Recordable Blu-ray Disc is widely used for recording and archiving broadcast content in Japan where Blu-ray recorders continue to represent almost 75% of the Blu-ray hardware market. "With 4K becoming the standard, not only for TVs, but also mobile devices and video cameras, extending recordable Blu-ray to enable Ultra HD content is a logical and very practical extension of format,” said Victor Matsuda, Chair of BDA Global Promotions Committee. “We are also anticipating that Ultra HD broadcasting will start in Japan around the end of 2018. The ability to continually expand to keep up with consumer demand for high quality experiences, remains one of Blu-ray’s greatest strengths and a primary reason for its success and longevity.” Licensing of the next-generation broadcast recordable Blu-ray format is scheduled to begin by January 2018. The BDA is working closely with industry leaders to develop the tools and processes needed to ensure interoperability between recorders, players and software.
    [Show full text]
  • Hybrid Bonding Patent Landscape 2019
    Patent Landscape Analysis Hybrid Bonding Patent Landscape Analysis – November 2019 Who has the ability to hamper the development of products using hybrid bonding processes? A technology driven by CIS but on its way to conquer other industries. REPORT OUTLINE • Hybrid Bonding The pace of Moore’s law is slowing, if it has not already stopped, as mentioned by Forbes and • Patent landscape analysis Nvidia. It’s reaching its limits because developing smaller technology nodes is doable • November 2019 technically, but is no longer cost efficient. The digital electronics market requires a higher • Ref.: KM19008 density semiconductor memory chip to cater to recently released central processing unit • PDF > 80 slides (CPU) components. To answer the growing demand and overcome Moore’s law’s limits, • Excel file > 1,000 patents multiple die stacking has been suggested as a solution. Advanced packaging technology • €6,490 for a multi-user license development, specifically 2.5D technology, was first used in high performance applications. Today, scaling the Z axis is becoming more and more important in what is called 3D stacking. REPORT’S KEY FEATURES: Generally, 2.5D-3D stacking was achieved thanks to Through Silicon Via (TSV) technology. • IP trends, including time-evolution However, TSVs are large and using them limits efforts to reach very dense architectures. of published patents, countries of Furthermore, filling TSVs with metals is complex and requires significant know how. To patent filings, etc. overcome these limitations, players have started to look at other solutions. A first step toward • Ranking of main patent assignees a new way of 3D stacking is ZiBond, developed by Ziptronix, a company founded in 2000 as a • Key players’ IP position and spin-out of Research Triangle Institute.
    [Show full text]
  • Equipment and Materials for 3D NAND Manufacturing 2020
    From Technologies to Markets Equipment and Materials for 3D NAND Manufacturing 2020 Market and Technology Report 2020 Sample © 2020 TABLE OF CONTENTS • WFE solutions for 3D-NAND manufacturing 177 • Glossary and definitions 2 o Deposition – CVD, ALD 187 • Table of contents 10 o Dry etching 194 • Report objectives 14 o Lithography 202 • Report scope 15 o Hybrid bonding 210 • Methodology & definitions 16 • 3D-NAND business players 222 • About the authors 17 o Financial analysis 248 • Companies cited in this report 19 o List of recent mergers and acquisitions 265 • Who should be interested in this report? 20 • Equipment for 3D-NAND manufacturing – market overview 270 • Market forecast – deposition for 3D-NAND manufacturing 278 • Yole Group related reports 21 Revenues, shipments (# of chambers), ASP, tool mix, and more • Three-slide summary 23 • Market forecast – dry etching for 3D-NAND manufacturing 286 • Executive summary 27 Revenues, shipments (# of chambers), ASP, tool mix, and more • Introduction and context 61 • Market forecast – lithography for 3D-NAND manufacturing 294 o Overview of the stand-alone memory business 67 Revenues, shipments (# of tools), ASP, tool mix, and more o Overview of semiconductor equipment market 86 • Market forecast – Hybrid bonding for 3D-NAND manufacturing 302 • 3D-NAND business – market, applications, and key players 93 Revenues, shipments (# of chambers) and ASP for two distinct scenarios • 3D-NAND technology and manufacturing process 109 • Impact of COVID-19 on the NAND Business 309 • General conclusions
    [Show full text]
  • Complaint of Tessera Advancedtechnologies, Inc
    UNITED STATES INTERNATIONAL TRADE COMMISSION WASHINGTON, D.C. \ In the Matter of CERTAIN WAFER-LEVEL PACKAGING SEMICONDUCTOR DEVICES AND PRODUCTS CONTAINING SAME Investigation N0. 337-TA­ (INCLUDING CELLULAR PHONES, TABLETS, LAPTOPS, AND NOTEBOOKS) AND COMPONENTS THEREOF COMPLAINT OF TESSERA ADVANCEDTECHNOLOGIES, INC. UNDER SECTION 337 OF THE TARIFF ACT OF 1930, AS AMENDED ~ COMPLAINANT PROPOSED RESPONDENTS Tessera Advanced Technologies, Inc. Samsung Electronics C0., Ltd. 3025 Orchard Parkway 129 Samsung-ro, Maetan-3dong, Yeongtong-gu San Jose, CA 95134 Suwon-si, Gyeonggi-do, South Korea 443-742 T: (408) 321-6000 Samsung Electronics America, Inc. COUNSEL FOR COMPLAINANT 85 Challenger Road Ridgefield Park, NJ 07660 Matthew J. Moore Maximilian A. Grant / Samsung Semiconductor, Inc. Bert C. Reiser 3655 N. 15‘Street LATHAM & WATKINS LLP San Jose, CA 95134 555 Eleventh Street, NW, Suite 1000 Washington, DC 20004 Telephone: (202) 637-2200 Facsimile: (202) 637-2201 Charles H. Sanders LATHAM & WATKINS LLP ' 200 Clarendon Street Boston, MA 02116 Telephone: (617) 948-6000 Facsimile: (617) 948-6000 Michael A. David LATHAM & WATKINS LLP 885 Third Avenue New York, NY 10022 Telephone: (212) 906-1200 Facsimile: (212) 751-4864 TABLE OF CONTENTS I. INTRODUCTION .............................................................................................. .. II. COMPLAINANT ............................................................................................... .. III. PROPOSED RESPONDENTS ..........................................................................
    [Show full text]