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How to Choose the Right Cable Category
How to Choose the Right Cable Category Why do I need a different category of cable? Not too long ago, when local area networks were being designed, each work area outlet typically consisted of one Category 3 circuit for voice and one Category 5e circuit for data. Category 3 cables consisted of four loosely twisted pairs of copper conductor under an overall jacket and were tested to 16 megahertz. Category 5e cables, on the other hand, had its four pairs more tightly twisted than the Category 3 and were tested up to 100 megahertz. The design allowed for voice on one circuit and data on the other. As network equipment data rates increased and more network devices were finding their way onto the network, this design quickly became obsolete. Companies wisely began installing all Category 5e circuits with often three or more circuits per work area outlet. Often, all circuits, including voice, were fed off of patch panels. This design allowed information technology managers to use any circuit as either a voice or a data circuit. Overbuilding the system upfront, though it added costs to the original project, ultimately saved money since future cable additions or cable upgrades would cost significantly more after construction than during the original construction phase. By installing all Category 5e cables, they knew their infrastructure would accommodate all their network needs for a number of years and that they would be ready for the next generation of network technology coming down the road. Though a Category 5e cable infrastructure will safely accommodate the widely used 10 and 100 megabit-per-second (Mbits/sec) Ethernet protocols, 10Base-T and 100Base-T respectively, it may not satisfy the needs of the higher performing Ethernet protocol, gigabit Ethernet (1000 Mbits/sec), also referred to as 1000Base-T. -
Lecture 9: More About Wires and Wire Models
Lecture 9: More about wires and wire models Computer Systems Laboratory Stanford University [email protected] Copyright © 2007 Ron Ho, Mark Horowitz R Ho EE371 Lecture 9 Spring 2006-2007 1 Introduction • Readings • Today’s topics – Wires become more important with scaling • Smaller features mean faster devices but not faster wires. – Different kinds of wires have different scaled performance • Wires that scale in length • Wires that are fixed-length – How to deal with and estimate wire performance R Ho EE371 Lecture 9 Spring 2006-2007 2 A modern technology is mostly wires • Cross-section, Intel’s 65nm tech – 8 metal layers – Low-κr dielectrics (κr = 2.7) – Wires are 2x taller than wide • Wires are here • Transistors are here P. Bai, et al., “A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect…,” IEDM 2004. R Ho EE371 Lecture 9 Spring 2006-2007 3 Resistance, revisited… Resistance is resistivity/area, but… • Copper needs a diffusion barrier that reduces its cross-section – Also, barrier may not be evenly deposited • Copper can be overpolished – Can cause dishing (less thick) • Electrons can scatter off the edges – Happens more for thinner wires – Increases the base resistivity t w P. Kapur, “Technology and reliability constrained future copper interconnects: Resistance modeling,” IEEE Trans. Electron Devices, April 2002. R Ho EE371 Lecture 9 Spring 2006-2007 4 Capacitance, revisited… Model capacitance by four plates, each κ(A/d) • Plus a near-constant fringe term 0.1fF/um (fringe scales slowly) • Relative dielectrics differ, with low-κ within a layer – SiOF (3.5) or SiOC (2.5) – Reduces (dominant) sidewall cap – Wires are taller than they are wide κr2 •No low-κ between wire layers κr1 κr1 – For material strength κr2 s ILD A “sandwich” model R. -
Chapter 9 Chip Bonding At
9 CHIP BONDING AT THE FIRST LEVEL The I/O interface to the die primarily interconnects electrical power, ground and signals. It must provide for low impedance for the power distribution system, so as to keep switching noise within specification, and controlled impedance for the signal leads to allow adequate signal integrity. In addition it must accommodate all the I/O and power and ground leads required, and at the same time, minimize the cost for high volume assembly. The secondary role of chip bonding is to be mechanically robust, not interfere with thermal man- agement and be the geometrical transformer from the die features to the next level of packaging features. There are many options for the next level of interconnect, including: ¥ leadframe in a single chip package ¥ ceramic substrate in a single chip package ¥ laminate substrate in a single chip package ¥ ceramic substrate in a multichip module ¥ laminate substrate in a multichip module ¥ glass substrate, such as an LCD (liquid crystal display) ¥ laminate substrate, such as a circuit board ¥ ceramic substrate, such as a circuit board For all of these first level interfaces, the chip bonding options are the same. Illustrated in Figure 9-1, they are: ¥ wirebond ¥ TAB (tape automated bonding) ¥ flip chip; either with a solder interface, a polymer adhesive or a welded joint Because of the parallel efforts in widely separated applications involving similar, but slightly dif- ferent variations of chip attach techniques, seemingly confusing names have historically evolved to describe some of the attach technologies. COG (chip on glass) refers to assembly of bare die onto LCD panels. -
Brass Wire Safety Data Sheet S
Brass Wire Safety Data Sheet s SECTION 1: Identification of the substance/mixture and of the company/undertaking 1.1. Product identifier Product name : Brass Wire 1.2. Relevant identified uses of the substance or mixture and uses advised against Use of the substance/mixture : Manufacturing 1.3. Details of the supplier of the safety data sheet Weiler Corporation 1 Weiler Drive Cresco, PA 18326 1.4. Emergency telephone number Emergency number : 570-595-7495 SECTION 2: Hazards identification 2.1. Classification of the substance or mixture This product as manufactured is defined as an article per 29 CFR 1910.1200. No exposure hazards are anticipated during normal product handling conditions. In most cases, the material(s) removed from the workpiece may present a greater hazard than material released by the product. Based upon the materials that are contained within the working portion of this product it is possible that some dust particles from this product may be generated. The following safety data is presented for potential exposure hazards as associated with the dust particles that are related to this product. Classification (GHS-US) Not classified 2.2. Label elements GHS-US labeling This product as manufactured is defined as an article, therefore no labeling is required for the product as manufactured. 2.3. Other hazards No additional information available 2.4. Unknown acute toxicity (GHS US) Not applicable SECTION 3: Composition/information on ingredients 3.1. Substance Not applicable 3.2. Mixture Name Product identifier % Classification (GHS-US) Copper (CAS No) 7440-50-8 69 - 70 Not classified Zinc (CAS No) 7440-66-6 29 - 31 Not classified Lead (CAS No) 7439-92-1 <= 0.07 Carc. -
CAC, COPPER ALLOY CONDUCTOR in CORROSIVE ENVIRONMENTS Xavier Closa, Overhead Line Electrical Engineer Carme Saez, Strategic Marketing Director
CAC, Copper Alloy Conductor CAC, COPPER ALLOY CONDUCTOR IN CORROSIVE ENVIRONMENTS Xavier Closa, Overhead Line Electrical Engineer Carme Saez, Strategic Marketing Director ABSTRACT: Copper Alloy Conductors (CAC) transport due to its high electrical and mechanical offer a solution for overhead lines located in corrosive properties. environments, as it has been proved through the experience acquired in a 25 kV line refurbishment in Spain. Historically, the UK has always used copper for small conductors within 10km of the coast due to the heavy salt corrosion of aluminium. Samples of copper and aluminium conductors were collected and further analysed; quantifying the degradation suffered during their service, which in the aluminum case show a significant loss of electrical and mechanical properties. Thanks to the copper microalloy, it can operate at high An economic analysis has also been included, providing temperatures without creeping, thus increasing its an estimation of the necessary investment. capacity. La Farga has designed 5 different copper alloys in order to satisfy different cases, specially the KEY WORDS: Copper, CAC, corrosive most demanding ones: environments, La Farga, overhead lines, a CAC-50-Pica d’Estats-UHC. UHC (Ultra High Conductivity) HC (High Conductivity) STD (Standard) 1. INTRODUCTION HS (High Strength) UHS (Ultra High Strength) La Farga is a copper manufacturer with more than 200 years of history, its large experience covers a wide As well as these characteristics, copper also has the range of copper products used in different sectors: inherent advantage that it does not suffer from railways, tubes, electrical wiring, automotive, etc. vibration fatigue as badly as aluminium. It has a significantly higher EDS (Every Day Stress) limit than The extensive knowledge of copper alloys and the aluminium. -
Technical Information Handbook Wire and Cable
Technical Information Handbook Wire and Cable Fifth Edition Copyright © 2018 Trademarks and Reference Information The following registered trademarks appear in this handbook: Information in this handbook has been drawn from many Alumel® is a registered trademark of Concept Alloys, LLC publications of the leading wire and cable companies in the industry and authoritative sources in their latest available Chromel® is a registered trademark of Concept Alloys, LLC editions. Some of these include: Copperweld® is a registered trademark of Copperweld Steel Company CSA® is a registered trademark of the Canadian Standards Association • American Society for Testing and Materials (ASTM) CCW® is a registered trademark of General Cable Corporation • Canadian Standards Association (CSA) ® DataTwist is a registered trademark of Belden • Institute of Electrical and Electronics Engineers (IEEE) Duofoil® is a registered trademark of Belden Flamarrest® is a registered trademark of Belden • Insulated Cable Engineers Association (ICEA) Halar® is a registered trademark of Solvay Solexis • International Electrotechnical Commission (IEC) Hypalon® is a registered trademark of E. I. DuPont de Nemours & Company • National Electrical Manufacturers Association (NEMA) Hypot® is a registered trademark of Associated Research, Inc. • National Fire Protection Association (NFPA) IBM® is a registered trademark of International Business Machines Corporation Kapton® is a registered trademark of E. I. DuPont de Nemours & Company • Naval Ship Engineering Center (NAVSEC) Kevlar® is a registered trademark of E. I. DuPont de Nemours & Company • Telecommunications Industry Association (TIA) ® K FIBER is a registered trademark of General Cable Corporation • Underwriters Laboratories (UL). Kynar® is a registered trademark of Arkema, Inc. Loc-Trac® is a registered trademark of Alpha Wire Note: National Electrical Code (NEC) is a registered trademark of the National Fire Protection Association, Quincy, MA. -
1.Catalog of Tungsten Wire
Black Tungsten Wire Black tungsten wire is tungsten wire with graphite coated. The important applications of black tungsten wire are for the production of coiled incandescent lamp filaments, cathode and support structures for power tubes, heating elements for high temperature furnaces and evaporation sources in metalizing processes. Thicker wire sizes, straightened, finish-ground and cut into rod pieces are widely used for glass-to-metal seal lead parts in the lighting and electronic industries. Cleaned Tungsten Wire Cleaned Tungsten Wireis raised foreign elements and graphite from black tungsten wire. Cleaned Tungsten Wire is the surface of electrolytic polished tungsten wire, and it shall be smooth, clean, gray silver with metal luster. The tungsten wire features excellent formability, long life and super lighting efficiency. Cleaned tungsten wire is mainly applied for making various electron tubes, H series auto lamp, halogen lamp and other special lamp. Tungsten Rhenium Wire Tungsten rhenium wireis used for heating elements in high temperature furnaces, thermocouples and in electronics. Its advantage is its ability to maintain greater ductility compared to tungsten after exposure to extremely high temperatures. Tungsten wire has fiber structure, when the temperature reaches 1500-1600 ℃, the tungsten filament would turn, and cause high-temperature sag. To improve the quality of tungsten wire, it is always mixed some additives during sintering procession, such as Na2O, K2O, SiO2, ThO to enhance the capacity of high-temperature creep resistance and high temperature anti-sag of tungsten wire. In order to improve the tenacity of tungsten wire and prevent the deformation under high temperature, it usually added some oxides, such as silica, alumina, and potassium and so on. -
A Study of the Characteristics and Limitations of Various Platings
A STUDY OF THE CHARACTERISTICS AND LIMITATIONS OF VARIOUS PLATINGS ON CYLINDRICAL ELECTRICAL CONDUCTORS by ROBERT C. SCULLY Presented to the Faculty of the Graduate School of The University of Texas at Arlington in Partial Fulfillment of the Requirements for the Degree of DOCTOR OF PHILOSOPHY THE UNIVERSITY OF TEXAS AT ARLINGTON December 2013 Copyright © by Robert C. Scully 2013 All Rights Reserved ii Acknowledgements This work might never have been completed without the patience and understanding of Dr. Jonathan Bredow, my advisor for it seems too many years to number. His constancy and quiet demeanor gave me the strength and resolve to see this through in spite of life’s adversities and setbacks. I also would like to acknowledge the support of my co-workers and my professional colleagues, without who I would have given up long ago. Last, and certainly not least, I want to mention the love and support from my wife and lifelong companion, Elizabeth, a guiding star through thick and thin, and most importantly in the darkest days of my despair, as I struggled through this process. November 20, 2013 iii Abstract A STUDY OF THE CHARACTERISTICS AND LIMITATIONS OF VARIOUS PLATINGS ON CYLINDRICAL ELECTRICAL CONDUCTORS Robert C. Scully, PhD The University of Texas at Arlington, 2013 Supervising Professor: Jonathan Bredow This work explores the impedance characteristics of copper wires plated with tin, silver, or nickel, the most common type of wiring used in the computer, communications, and aerospace industries. The background of plated wires and a brief review of related research is provided. This is followed by a detailed development of the theory of plated wires, accompanied by a MAPLE code in the appendix that can be used for the numerical analysis of plated wires having two or more plating layers. -
RG-6 Cable Coax Cable
C51 pg 017 8/4/06 9:10 AM Page 17 Coax Cable Wire and Cable Coaxial Cable Belden New Generation coaxial cable. UL type CM approval. Foam dielectric Plenum Rated and black PVC jacket. 549945 is Siamese Section construction, 1 RG-59/U with 2/18 AWG. 1 Coax Cable 573945 is miniature RG-59/U. Applications: 1 Belden New Generation plenum coaxial cable. UL CCTV and CATV (CATV 5339B5 and 5339Q5 type CMP approval. Foam dielectric and natural only). Key: BC=Bare Copper, CCS= Copper Flamarrest jacket. 649948 is Siamese construction, covered steel, FB= Foil plus braid. 1 RG-59/U with 2/18AWG. Applications: CCTV Ctr./ Wire and Cable and CATV (CATV 633938 and 6339Q8 only). Key: Order # Length RG/U Shield (ea.) (2-4) (5-up) BC=Bare Copper, CCS= Copper covered steel, Antenna Wire . .21 Hook-Up Wire . .24 FB= Foil plus braid. Mfr. #543945 Audio Control Wire 21, 22 Kynar Wire . .24 24-4980 1000' 59 BC/BC $273.00 $252.04$234.66 Audio/Video Cables 25~35 Magnetic Wire . .23 Ctr./ 24-4985 500' 59 BC/BC 152.00 138.88 128.40 Audio Snake Cables . .34 Microphone Cable . .21 Order # Length RG/U Shield (ea.) (2-4) (5-up) Mfr. # 533985 Automotive Wire . .24 Multi-Conductor Mfr. # 643948 24-4990 1000' 6 BC/FB 196.00 180.93 168.45 Cable Management 36~41 Wire . .22, 23 24-4930 1000' 59 BC/BC $859.00 $794.63 $739.83 24-4995 500' 6 BC/FB 109.00 99.70 92.17 Car Audio Wire . -
A New High Strength Gold Bond Wire
A NEW HIGH STRENGTH GOLD BOND WIRE Giles Humpston e'r David M. Jacobson, Hrst Research Centre, GEC-Marconi Ltd., Wembley, Middlesex HA9 7PP United Kingdom As semiconductor technology develops, conventional bond wires are reaching the limits of their capability. Industry is demanding finer diameter wire coupled with higher strength, and the retention of this strength at elevated temperatures would be a decided advantage. It has been demonstrated that a fine wire of the composition Au-lwt.%Ti, which was originally formulated for high carat jewellery, can be endowed with these beneficial properties by appropriate thermomechanical treatments. A three-fold increase in the strength of 25 µm diameter wire over that of conventional gold wire has been achieved. The mechanical properties are stable even when the wire is subjected to heating at 400 °C for over a year. Wire based on the Au-1 wt. %Ti alloy can be made comparable to that of the standard gold products in terms of its electrical properties and bonding characteristics. Moreover, it is more resilient to the demands of the fabrication process. 132 Gold Bull., 1992, 25 (4) INTRODUCTION individual wire bond are illustrated schematically in Figure 2. A semiconductor chip connected to its pack- Electronic circuitry normally contains semiconductor age with gold bond wires is shown in Figure 3. chips, which are elaborate miniature circuits processed In TAB, the device is joined using a `gang' bonding in thin slices of silicon or gallium arsenide, typically operation to a set of cantilever beams on a polymeric 1 to 500 mm2 in size. These semiconductor chips are tape (inner lead bonding) and subsequently these beam housed in hermetic packages to protect them from leads are attached to the circuit board or package (outer moisture and mechanical damage. -
A Comparison of Aluminum Vs. Copper As Used in Electrical Equipment
A COMPARISON OF ALUMINUM VS. COPPER AS USED IN ELECTRICAL EQUIPMENT Larry Pryor, P.E. – Sr. Specification Engineer, GE Consumer & Industrial Rick Schlobohm, P.E. – Sr. Specification Engineer, GE Consumer & Industrial Bill Brownell, P.E – Specification Engineer, GE Consumer & Industrial ABSTRACT strength limits its use to special applications The debate over the pros and cons of aluminum vs. such as joint plating and sliding contact surfaces. copper conductors has been discussed for many years. Many of the concerns are based on old For the purposes of this paper, the areas of information and also misinformation. These discussion are: concerns center on the very different properties of the two materials and their suitability for - Current Carrying Capacity, Conductivity application within the Electrical Equipment - Physical Properties Industry. Reliable performance from the a. Expansion conductors, the joints and terminations of the b. Weight conductors is essential to the operation of the c. Tensile Strength electrical system. With the recent increases in the - Connections and Terminations cost of copper, customers are seeing these - Plating and Environmental Concerns increases passed on to them by the equipment - Product Offerings manufacturer. The variance in cost between - Cost Comparison equipment with copper versus aluminum - Impact on Various Pieces of Equipment conductors is now affecting the customer’s buying decision. CURRENT CARRYING CAPACITY This paper provides a comparison of the The electrical and mechanical properties of a mechanical and electrical properties of copper (Cu) material are dependent on its alloy. For the and aluminum (Al) and their relevance as applied to comparison between copper and aluminum in electrical distribution products. -
A Studio Manual for Casting Bronze by the Lost-Wax Method
A STUDIO MANUAL FOR CASTING BRONZE BY THE LOST-WAX METHOD. Presented to The Art Faculty of University of Minnesota, Duluth by Terry M. Anderson for the degree of Master of Arts August 1974 Duluth, l:linnesota " TOPOG Rl\PHIC_ II II 24 x 18 inch bronze r elief This bronze casting done by myself, portrays my fascina- tion and delight towards the method of lost-wax casting. It also contai ns my inter est in geol ogy , aerial photography, and cartography. Earth, air, and fire generate the creation of the bronze through the t echnic; just as the earth, and its own evolution through a a si milar t echnic, is t he subject matter. For my self, the execu tion of t he br onze is s imilar to the geological manifestations of t ectonics i t sel f ; hopef ully, giving to the vi ewer and myself a glimpse of the magnet ude, soundness , and sensuous r eality of the earth. - CONTENTS - Development of Casting . 1 Introduction to the Method 3 What is the Value of the Process? 8 The Materials 10 Bronze . 10 Wax .. 11 Plaster . 12 The Plaster Mold 13 The Wax Pattern . 20 Melting the Wax. 20 Making the Pattern • 2() The Sprue System . • . .. 22 Sprueing the Wax Pattern .. 22 Making the Sprues & Runners. 27 Examples of Sprue Systems .. 28 Investment 31 Types of Investment 31 Investing the Wax . 33 Burnout 42 Packing the Molds 43 Melting & Pouring 45 Care & Use of the Crucible . 45 Charging the Crucible With Bronze. • 45 Preheating the Charge Bronze .