Colonial Bronze Decorative Hardware

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Decorative Visual Hardware A 751, 752 Series B Material: Brass Made in the U.S.A. Finish also available in: S • French Gold Brass BT751-10B BT751-26 BT751-26D BT751-28 BT751-10 BT751-3 • Polished Brass 3” c/c 3” c/c 3” c/c 3” c/c 3” c/c 3” c/c • Satin Brass Wire Pull Wire Pull Wire Pull Wire Pull Wire Pull Wire Pull • Matte Satin Brass Oil Rubbed Bright Satin Natural Dull Bronze Bright Brass • Antique Brass Bronze Chrome Chrome Aluminum • Matte Antique Brass • Distressed Antique Brass • Polished Bronze • Satin Bronze • Matte Satin Bronze • Antique Bronze • Oil Rubbed Bronze BT752-10B BT752-26 BT752-26D BT752-28 BT752-10 • Matte Oil Rubbed Bronze 3-1/2” c/c 3-1/2” c/c 3-1/2” c/c 3-1/2” c/c 3-1/2” c/c • Distressed Statuary Bronze Wire Pull Wire Pull Wire Pull Wire Pull Wire Pull • Light Statuary Bronze Oil Rubbed Bright Satin Natural Dull Bronze • Heritage Bronze Bronze Chrome Chrome Aluminum • Matte Light Statuary Bronze • Dark Statuary Bronze • Matte Dark Statuary Bronze • Distressed Oil Rubbed Bronze • Polished Copper • Satin Copper • Matte Satin Copper 753, 754, 755 Series BRONZE COLONIAL • Antique Copper B Material: Brass • Matte Antique Copper • Distressed Antique Copper • Polished Chrome • Satin Chrome • Matte Satin Chrome • Satin Black • Matte Satin Black • Distressed Black BT753-10B BT753-26 BT753-26D BT753-28 BT753-10 • Polished Nickel 4” c/c 4” c/c 4” c/c 4” c/c 4” c/c • Nickel Stainless Large Wire Pull Large Wire Pull Large Wire Pull Large Wire Pull Large Wire Pull • Satin Nickel Oil Rubbed Bright Chrome Satin Chrome Natural Dull Bronze • Matte Satin Nickel Bronze Aluminum • Pewter • Matte Pewter • Distressed Pewter BT754-26 BT754-10B BT754-26D BT755-26D BT755-26 5” c/c 5” c/c 5” c/c 6” c/c 6” c/c Large Wire Pull Large Wire Pull Large Wire Pull Large Wire Pull Large Wire Pull Bright Chrome Oil Rubbed Satin Satin Chrome Bright Chrome Bronze Chrome 778, 403, 690 & 699 Series B Material: Brass BJ02-2996-810611 BT778-10B BT778-26D 1-1/2” Dia. BT690-11 BT699-15B 5/8” Dia. 5/8” Dia. Large Knob 1-3/16” c/c 1-1/2” c/c Small Backplate Small Backplate Copper/Nickel Standard Knob Standard Knob Oil Rubbed Bronze Satin Chrome Antique Pewter Copper Finish also available in: S • Bright Chrome • Natural Aluminum • Polished Brass Note: Available any quantity. Note: Available any quantity. 800-BUY-BAER (289-2237) • www.baersupply.com • Fax: 888-558-2237 800-BUY-BAER (289-2237) • www.baersupply.com • Fax: 888-558-2237 A-167.

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Lecture 9: More About Wires and Wire Models
Lecture 9: More about wires and wire models Computer Systems Laboratory Stanford University [email protected] Copyright © 2007 Ron Ho, Mark Horowitz R Ho EE371 Lecture 9 Spring 2006-2007 1 Introduction • Readings • Today’s topics – Wires become more important with scaling • Smaller features mean faster devices but not faster wires. – Different kinds of wires have different scaled performance • Wires that scale in length • Wires that are fixed-length – How to deal with and estimate wire performance R Ho EE371 Lecture 9 Spring 2006-2007 2 A modern technology is mostly wires • Cross-section, Intel’s 65nm tech – 8 metal layers – Low-κr dielectrics (κr = 2.7) – Wires are 2x taller than wide • Wires are here • Transistors are here P. Bai, et al., “A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect…,” IEDM 2004. R Ho EE371 Lecture 9 Spring 2006-2007 3 Resistance, revisited… Resistance is resistivity/area, but… • Copper needs a diffusion barrier that reduces its cross-section – Also, barrier may not be evenly deposited • Copper can be overpolished – Can cause dishing (less thick) • Electrons can scatter off the edges – Happens more for thinner wires – Increases the base resistivity t w P. Kapur, “Technology and reliability constrained future copper interconnects: Resistance modeling,” IEEE Trans. Electron Devices, April 2002. R Ho EE371 Lecture 9 Spring 2006-2007 4 Capacitance, revisited… Model capacitance by four plates, each κ(A/d) • Plus a near-constant fringe term 0.1fF/um (fringe scales slowly) • Relative dielectrics differ, with low-κ within a layer – SiOF (3.5) or SiOC (2.5) – Reduces (dominant) sidewall cap – Wires are taller than they are wide κr2 •No low-κ between wire layers κr1 κr1 – For material strength κr2 s ILD A “sandwich” model R.
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Chapter 9 Chip Bonding At
9 CHIP BONDING AT THE FIRST LEVEL The I/O interface to the die primarily interconnects electrical power, ground and signals. It must provide for low impedance for the power distribution system, so as to keep switching noise within specification, and controlled impedance for the signal leads to allow adequate signal integrity. In addition it must accommodate all the I/O and power and ground leads required, and at the same time, minimize the cost for high volume assembly. The secondary role of chip bonding is to be mechanically robust, not interfere with thermal man- agement and be the geometrical transformer from the die features to the next level of packaging features. There are many options for the next level of interconnect, including: ¥ leadframe in a single chip package ¥ ceramic substrate in a single chip package ¥ laminate substrate in a single chip package ¥ ceramic substrate in a multichip module ¥ laminate substrate in a multichip module ¥ glass substrate, such as an LCD (liquid crystal display) ¥ laminate substrate, such as a circuit board ¥ ceramic substrate, such as a circuit board For all of these first level interfaces, the chip bonding options are the same. Illustrated in Figure 9-1, they are: ¥ wirebond ¥ TAB (tape automated bonding) ¥ flip chip; either with a solder interface, a polymer adhesive or a welded joint Because of the parallel efforts in widely separated applications involving similar, but slightly dif- ferent variations of chip attach techniques, seemingly confusing names have historically evolved to describe some of the attach technologies. COG (chip on glass) refers to assembly of bare die onto LCD panels.
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Brass Wire Safety Data Sheet S
Brass Wire Safety Data Sheet s SECTION 1: Identification of the substance/mixture and of the company/undertaking 1.1. Product identifier Product name : Brass Wire 1.2. Relevant identified uses of the substance or mixture and uses advised against Use of the substance/mixture : Manufacturing 1.3. Details of the supplier of the safety data sheet Weiler Corporation 1 Weiler Drive Cresco, PA 18326 1.4. Emergency telephone number Emergency number : 570-595-7495 SECTION 2: Hazards identification 2.1. Classification of the substance or mixture This product as manufactured is defined as an article per 29 CFR 1910.1200. No exposure hazards are anticipated during normal product handling conditions. In most cases, the material(s) removed from the workpiece may present a greater hazard than material released by the product. Based upon the materials that are contained within the working portion of this product it is possible that some dust particles from this product may be generated. The following safety data is presented for potential exposure hazards as associated with the dust particles that are related to this product. Classification (GHS-US) Not classified 2.2. Label elements GHS-US labeling This product as manufactured is defined as an article, therefore no labeling is required for the product as manufactured. 2.3. Other hazards No additional information available 2.4. Unknown acute toxicity (GHS US) Not applicable SECTION 3: Composition/information on ingredients 3.1. Substance Not applicable 3.2. Mixture Name Product identifier % Classification (GHS-US) Copper (CAS No) 7440-50-8 69 - 70 Not classified Zinc (CAS No) 7440-66-6 29 - 31 Not classified Lead (CAS No) 7439-92-1 <= 0.07 Carc.
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Technical Information Handbook Wire and Cable
Technical Information Handbook Wire and Cable Fifth Edition Copyright © 2018 Trademarks and Reference Information The following registered trademarks appear in this handbook: Information in this handbook has been drawn from many Alumel® is a registered trademark of Concept Alloys, LLC publications of the leading wire and cable companies in the industry and authoritative sources in their latest available Chromel® is a registered trademark of Concept Alloys, LLC editions. Some of these include: Copperweld® is a registered trademark of Copperweld Steel Company CSA® is a registered trademark of the Canadian Standards Association • American Society for Testing and Materials (ASTM) CCW® is a registered trademark of General Cable Corporation • Canadian Standards Association (CSA) ® DataTwist is a registered trademark of Belden • Institute of Electrical and Electronics Engineers (IEEE) Duofoil® is a registered trademark of Belden Flamarrest® is a registered trademark of Belden • Insulated Cable Engineers Association (ICEA) Halar® is a registered trademark of Solvay Solexis • International Electrotechnical Commission (IEC) Hypalon® is a registered trademark of E. I. DuPont de Nemours & Company • National Electrical Manufacturers Association (NEMA) Hypot® is a registered trademark of Associated Research, Inc. • National Fire Protection Association (NFPA) IBM® is a registered trademark of International Business Machines Corporation Kapton® is a registered trademark of E. I. DuPont de Nemours & Company • Naval Ship Engineering Center (NAVSEC) Kevlar® is a registered trademark of E. I. DuPont de Nemours & Company • Telecommunications Industry Association (TIA) ® K FIBER is a registered trademark of General Cable Corporation • Underwriters Laboratories (UL). Kynar® is a registered trademark of Arkema, Inc. Loc-Trac® is a registered trademark of Alpha Wire Note: National Electrical Code (NEC) is a registered trademark of the National Fire Protection Association, Quincy, MA.
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1.Catalog of Tungsten Wire
Black Tungsten Wire Black tungsten wire is tungsten wire with graphite coated. The important applications of black tungsten wire are for the production of coiled incandescent lamp filaments, cathode and support structures for power tubes, heating elements for high temperature furnaces and evaporation sources in metalizing processes. Thicker wire sizes, straightened, finish-ground and cut into rod pieces are widely used for glass-to-metal seal lead parts in the lighting and electronic industries. Cleaned Tungsten Wire Cleaned Tungsten Wireis raised foreign elements and graphite from black tungsten wire. Cleaned Tungsten Wire is the surface of electrolytic polished tungsten wire, and it shall be smooth, clean, gray silver with metal luster. The tungsten wire features excellent formability, long life and super lighting efficiency. Cleaned tungsten wire is mainly applied for making various electron tubes, H series auto lamp, halogen lamp and other special lamp. Tungsten Rhenium Wire Tungsten rhenium wireis used for heating elements in high temperature furnaces, thermocouples and in electronics. Its advantage is its ability to maintain greater ductility compared to tungsten after exposure to extremely high temperatures. Tungsten wire has fiber structure, when the temperature reaches 1500-1600 ℃, the tungsten filament would turn, and cause high-temperature sag. To improve the quality of tungsten wire, it is always mixed some additives during sintering procession, such as Na2O, K2O, SiO2, ThO to enhance the capacity of high-temperature creep resistance and high temperature anti-sag of tungsten wire. In order to improve the tenacity of tungsten wire and prevent the deformation under high temperature, it usually added some oxides, such as silica, alumina, and potassium and so on.
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A New High Strength Gold Bond Wire
A NEW HIGH STRENGTH GOLD BOND WIRE Giles Humpston e'r David M. Jacobson, Hrst Research Centre, GEC-Marconi Ltd., Wembley, Middlesex HA9 7PP United Kingdom As semiconductor technology develops, conventional bond wires are reaching the limits of their capability. Industry is demanding finer diameter wire coupled with higher strength, and the retention of this strength at elevated temperatures would be a decided advantage. It has been demonstrated that a fine wire of the composition Au-lwt.%Ti, which was originally formulated for high carat jewellery, can be endowed with these beneficial properties by appropriate thermomechanical treatments. A three-fold increase in the strength of 25 µm diameter wire over that of conventional gold wire has been achieved. The mechanical properties are stable even when the wire is subjected to heating at 400 °C for over a year. Wire based on the Au-1 wt. %Ti alloy can be made comparable to that of the standard gold products in terms of its electrical properties and bonding characteristics. Moreover, it is more resilient to the demands of the fabrication process. 132 Gold Bull., 1992, 25 (4) INTRODUCTION individual wire bond are illustrated schematically in Figure 2. A semiconductor chip connected to its pack- Electronic circuitry normally contains semiconductor age with gold bond wires is shown in Figure 3. chips, which are elaborate miniature circuits processed In TAB, the device is joined using a `gang' bonding in thin slices of silicon or gallium arsenide, typically operation to a set of cantilever beams on a polymeric 1 to 500 mm2 in size. These semiconductor chips are tape (inner lead bonding) and subsequently these beam housed in hermetic packages to protect them from leads are attached to the circuit board or package (outer moisture and mechanical damage.
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A Studio Manual for Casting Bronze by the Lost-Wax Method
A STUDIO MANUAL FOR CASTING BRONZE BY THE LOST-WAX METHOD. Presented to The Art Faculty of University of Minnesota, Duluth by Terry M. Anderson for the degree of Master of Arts August 1974 Duluth, l:linnesota " TOPOG Rl\PHIC_ II II 24 x 18 inch bronze r elief This bronze casting done by myself, portrays my fascina- tion and delight towards the method of lost-wax casting. It also contai ns my inter est in geol ogy , aerial photography, and cartography. Earth, air, and fire generate the creation of the bronze through the t echnic; just as the earth, and its own evolution through a a si milar t echnic, is t he subject matter. For my self, the execu tion of t he br onze is s imilar to the geological manifestations of t ectonics i t sel f ; hopef ully, giving to the vi ewer and myself a glimpse of the magnet ude, soundness , and sensuous r eality of the earth. - CONTENTS - Development of Casting . 1 Introduction to the Method 3 What is the Value of the Process? 8 The Materials 10 Bronze . 10 Wax .. 11 Plaster . 12 The Plaster Mold 13 The Wax Pattern . 20 Melting the Wax. 20 Making the Pattern • 2() The Sprue System . • . .. 22 Sprueing the Wax Pattern .. 22 Making the Sprues & Runners. 27 Examples of Sprue Systems .. 28 Investment 31 Types of Investment 31 Investing the Wax . 33 Burnout 42 Packing the Molds 43 Melting & Pouring 45 Care & Use of the Crucible . 45 Charging the Crucible With Bronze. • 45 Preheating the Charge Bronze .
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Pdf [70] BE Semiconductor Industries N.V
This is an accepted version of a paper published in Journal of Micromechanics and Microengineering. This paper has been peer-reviewed but does not include the final publisher proof-corrections or journal pagination. Citation for the published paper: Fischer, A., Korvink, J., Wallrabe, U., Roxhed, N., Stemme, G. et al. (2013) "Unconventional applications of wire bonding create opportunities for microsystem integration" Journal of Micromechanics and Microengineering, 23(8): 083001 Access to the published version may require subscription. Permanent link to this version: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-124074 http://kth.diva-portal.org UNCONVENTIONAL APPLICATIONS OF WIRE BONDING CREATE OPPORTUNITIES FOR MICROSYSTEM INTEGRATION A. C. Fischer1, J. G. Korvink23, N. Roxhed1, G. Stemme1, U. Wallrabe2 and F. Niklaus1 1 Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden 2 Department of Microsystems Engineering - IMTEK, University of Freiburg, Germany 3 Freiburg Institute for Advanced Studies - FRIAS, University of Freiburg, Germany E-mail: [email protected] Abstract. Automatic wire bonding is a highly mature, cost-eﬃcient and broadly available back-end process, intended to create electrical interconnections in semiconductor chip packaging. Modern production wire bonding tools can bond wires with speeds of up to 30 bonds per second with placement accuracies of better than 2 µm, and the ability to form each wire individually into a desired shape. These features render wire bonding a versatile tool also for integrating wires in applications other than electrical interconnections. Wire bonding has been adapted and used to implement a variety of innovative microstructures. This paper reviews unconventional uses and applications of wire bonding that have been reported in the literature.
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Full Range Catalog
10-50 WIRES ACCORDING TO YOUR EXCELLENCE PRODUCTION NEEDS: IN WIRES 10 VERY HIGH SPEED & PRECISION WHO WE ARE 02 THERMO XCC®®®® A world market leading specialist in EDM: we support THERMO TEX®®® our client with excellence for over 45 years THERMO SWX®®® 18 HIGH SPEED & PRECISION THERMO SE®®® CHOOSE YOUR WIRE ® 06 THERMO SWD®® About precision and threading SPEED THERMO SWW®®®® 28 THERMO D®®® & PRECISION THERMO SD®®® MAKE AN EASY ® 08 THERMO SD2®® ® CHOICE VISUALLY THERMO JP®®®® THERMO JP2®®®® 3 criteria & usage recommended SUPER PRECISION + ® 40 THERMO JP ®® & SPEED THERMO SA+®®®®® THERMO SA®®® THERMO SWA®®®® ALL PURPOSE THERMO SWS®®®® 54 THERMO A®®®® THERMO BRASS 1000®®®® THERMO BRASS 900®®®® THERMO BRASS 500®®®® THERMO BRASS 400®®®® ® THERMO FIRST 900®/500®®® ® 62 ZINC FREE THERMO ZF®®®®® THERMO ZF+®®®® THERMO ZF sigma®®®® PLAN YOUR 70 PRODUCTION PLAN YOUR ORDERS – 72 STORAGE CONDITIONS 2 EDM WIRES EDM WIRES 3 Innovative coatings and wires ECO FRIENDLY SOLUTIONS for high tech industry TO PROTECT OUR PLANET RESOURCES We prefer short circuits for the supplies of raw materials. We are committed to zero pollution. All our technological processes continuously Locations on 3 continents : Europe, Asia and America. improve the waste recycling and eliminate any chemical pollution. Our innovative solutions allow energy savings on manufacturing equipment. THERMOCOMPACT FSP-one TSDM INNOVATION: Innov Wire FRANCE Technology (IWT) PART OF OUR DNA USA SRO FSP-one Shanghai More than 18 patents for CHINA Forward-looking, with a dynamic and proven approach of product and process Hi-Tech Wires Asia (HWA) continuous progress and innovation, our Research and VIETNAM 2% revenues invested Development team pushes the limit of performance of every year in R&D the process and products and works continuously on new material structures: R&D’s group regularly demonstrates Major partnerships results including world wide patents that cover innovative with research centers, EDM wires and manufacturing processes.
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Factsheet AW-99
AW-99 Gold Bonding Wire for the Most Demanding Looping and Finest Pad Pitch AW-99 Benefits Large process windows with robust 1st and 2nd bonds for a wide range of applications and pad pitch (down to 35 µm) Highest strength and modulus comparable to 2N (99%) Au alloy Robust looping and shortest HAZ length caters for demanding and ultra-low loops such as multi- stacked die and multi-tier BGA configurations Application Data* High strength retention provides excellent First bond results on optimum setting resistance to sway and mold sweep Ball Diameter Squash Height Shear Force Shear Strength Suitable for aggressive wire diameter (µm) (µm) (g) (g/mil) reduction programs Mean 31.8 10.2 12.4 7.0 Delivers superior strength while retaining com - Std Dev 0.4 0.6 0.5 0.3 patibility to sensitive/thin pad metallizations Min 37.5 9.0 11.7 6.56 Environmental friendly – Beryllium free Max 38.8 11.2 13.3 7.72 *Results may vary with package and die configuration, as well as bond process. e m g - a m 1 k g c 5 2 n . a m i 0 : 4 P µ d 2 n - - . n o 0 F o i t 5 S 2 F . B a 8 : 4 3 z . r i 2 1 l : e l 0 t AW-99 (99.99% pure) provides the highest resistance to sway and mold sweep coupled 4 n m a e 8 t a : µ y e p m r S s 5 a a m i & l 6 strength and modulus 4N wire in the market with robust looping characteristics makes it e l d i e r K 1 i i º - p e : D r 1 r 0 a W i e .
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Understanding Electrical Terms
Understanding Electrical Terms ® Understanding Electrical Terms In today’s computer-intensive work environments, a critical issue is clean, reliable power. Haworth is the industry leader in furniture-based power solutions. The ability to handle any power requirement is an important component in Haworth’s mission to completely satisfy customers’ needs. This booklet is designed to help you become familiar with electrical terms commonly used in the contract furniture industry. You’ll find descriptions of specific Haworth electrical products as well. Having a working knowledge of these terms and descrip- tions will help you understand Haworth’s furniture-based power capabilities. Remember, Haworth field sales engineers are also always ready and available to answer specific customer inquiries. Use this booklet to become conversant in the language of power, and as a companion to the other Haworth booklets on electrical topics: “Using the 6-Circuit Power Base,” “Complying with Electrical Standards,” and “Interfacing with Building Power.” Table of Contents Industry-Common Electrical Terms . 2-15 Access Flooring Floor Duct Power Zone Ampacity Floor Monument/Floor Access Receptacle Outlet Amperage, Ampere, Amp Ground Conductor Separate Neutral Balancing, Load Balancing Harmonic Currents, Harmonics Shared Neutral Ballast Hot Conductor Short Circuit Branch Circuit Inspector Surge Protector, Spike Protector Circuit Isolated Ground Terminal Circuit Breaker(s) Junction Box Three-Phase Power Clean Power Load 3+D Circuit Configuration Codes, Local Electrical
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Wire Silver Wire Gold
CONNOISSEUR'S CHOICE CALVIN J. ANDERSON JOHN RAKOVAN Calvin Anderson is a graduate student working on the struc- Department of Geology and ture, chemistry, and texture of wire silver for a master’s of sci- Environmental Earth Science ence degree at Miami University in Oxford, Ohio. 250 South Patterson Avenue Dr. John Rakovan, an executive editor of Rocks & Miner- Miami University als, is a professor of mineralogy and geochemistry at Miami Oxford, Ohio 45056 University in Oxford, Ohio. [email protected] [email protected] Wire Silver Kongsberg, Norway Wire Gold Ground Hog& Mine, Gilman, Colorado ince the dawn of civilization, silver and gold have been hand-stamped staters from Anatolia (western Turkey, about treasured for their surpassing beauty and captivating 600 BC) made of electrum, a natural alloy of silver and gold luster. Some of the earliest known gold jewelry, dating (Wallace 1987). Throughout history and around the globe, Sfrom approximately 4500 BC, was found in a cemetery in gold and silver have been mined, refined, and fashioned into Varna, Bulgaria, on the west coast of the Black Sea (Gim- nearly every kind of object imaginable. But perhaps some butas 1977). Precious metals have been used for currency of the most intriguing examples of these beloved metals are around the Mediterranean since at least the third millen- those whose stunning and graceful forms cannot be attrib- nium BC (Balmuth 1975), and the oldest preserved coins are uted to the hand of man. Figure 1. Section cut through a wire silver from Kazakhstan Figure 2. SEM image of a synthetic wire silver shows striations shows roughly equigranular texture as opposed to a bundle of superimposed on a roughly equigranular texture.
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