AW-99 Gold Bonding Wire for the Most Demanding Looping and Finest Pad Pitch
AW-99 Benefits Large process windows with robust 1st and 2nd bonds for a wide range of applications and pad pitch (down to 35 µm) Highest strength and modulus comparable to 2N (99%) Au alloy Robust looping and shortest HAZ length caters for demanding and ultra-low loops such as multi- stacked die and multi-tier BGA configurations Application Data* High strength retention provides excellent First bond results on optimum setting resistance to sway and mold sweep Ball Diameter Squash Height Shear Force Shear Strength Suitable for aggressive wire diameter (µm) (µm) (g) (g/mil) reduction programs Mean 31.8 10.2 12.4 7.0 Delivers superior strength while retaining com - Std Dev 0.4 0.6 0.5 0.3 patibility to sensitive/thin pad metallizations Min 37.5 9.0 11.7 6.56 Environmental friendly – Beryllium free Max 38.8 11.2 13.3 7.72 *Results may vary with package and die configuration, as well as bond process. e m g - a m
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Recommended Technical Data of AW-99 Diameter Microns 15 18 20 23 25 28 30 Mils 0.6 0.7 0.8 0.9 1.0 1.1 1.2 Recommended Specs for Ball Bonding Elongation (%) 2 –5 2 –6 2 –6 2 –7 2 –7 2 –7 2 –7 Breaking Load (g) 3 –6 4 –8 5 – 10 7 – 12 9 – 14 11 – 16 13 – 20 In-Line Pad Pitch (µm) Min. In-Line Pad Pitch 35 45 50 60 65 70 80 For other diameters, please contact Heraeus Bonding Wires sales representative. AW-99 Characteristics for 25 µm diameter
Non-Gold Elements < 100 ppm GPa 90 ف Elastic Modulus
Heat Affected Zone (HAZ) 40 – 170 µm N , Layout: HET14010-0516-1 Melting Point 1063 °C Density 19.32 g/cm3 Heat Conductivity 3.17 W/cm.K Electrical Resistivity 2.36 µ⍀-cm Coeff. of Linear Expansion (20 – 100°C) 14.2 ppm/K Fusing Current for 25 µm, dia 10 mm length (in air) 0.37 A
Parameter Window for 1st Bond Parameter Window for 2nd Bond
1.4 1.5
1.2 AW-99 AW-88 AW-99 AW-88 Relative Force Relative Force
1.0 1.0 configuration, as well as bond process. 0 1.0 1.1 1.2 0 1.0 1.2 1.4 1.6 1.8 *Results may vary with package and die Relative Power Relative Power
Gold Wire Segmentation by Properties alterations .
Superior Reliability Superior Reliability Superior Reliability High
High Loop / Low Loop the right to make technical reserve
Sensitivestructure pad We
Electrical Performance given here is valid.
Widest Bonding Highest Looping Widest Bonding Highest Looping Widest Bonding Highest Looping Average data
Window Performance Window Performance Window Performance The
Heraeus Electronics Americas China Heraeus Deutschland GmbH & Co. KG Phone +1 610 825 6050 Phone +86 21 3357 5457 Heraeusstraße 12-14 [email protected] [email protected] 63450 Hanau, Germany www.heraeus-electronics.com Asia Pacific Europe, Middle East and Africa Phone +65 6571 7677 Phone +49 6181 35 3069 [email protected] +49 6181 35 3627 [email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.