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Signal Integrity Analysis of Single-Ended and Differential Signaling in Pcbs with EBG Structure

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Signal Integrity Analysis of Single-Ended and Differential Signaling in Pcbs with EBG Structure Signal Integrity Analysis of Single-Ended and Differential Signaling in PCBs with EBG structure A. Ciccomancini Scogna #, A. Orlandi+, V. Ricchiuti* # CST of America Inc, 492 Old Connecticut Path, Suite 505, Framingham, MA, 01701, phone: +1-508-665-4400 Fax: +1-508-665-4401, e-mail: [email protected] + UAq EMC Lab, University of L’Aquila, 67100, Poggio di Roio, L’Aquila, Italy Phone: +39-0862-434432, Fax: +39-0862-434403, e-mail: [email protected] *Technolabs S.p.A., ss. 17, Loc. Pile, 67100, L’Aquila, Italy Phone: +39-0862-344517, Fax: +39-0862-344527, e-mail: [email protected] Abstract – Object of this paper is the signal integrity analysis of shorting the planes at the physical location of the patches Printed Circuit Boards with Electromagnetic Bandgap within the band-stop frequency range, thus suppressing the structures. In particular the signal quality of single-ended and propagation of electromagnetic noise in between the planes. DIFF lines is discussed both in time and frequency domain (S- Since the last few years, researchers have been focusing parameters, TDR and eye-diagrams). their effort on the more cost effective two dimensional (2D) Two different configurations (two dimensional and three dimensional) of Electromagnetic Bandgap structures are planar EBG: the power (PWR) or the ground (GND) layers analyzed by means of a three dimensional full wave field are patterned and shorting vias connecting the metal patches simulator based on the Finite Integration Technique. Results with an extra metal layer are not required. show a consistent improvement of the signal integrity when On the contrary of the well demonstrated SSN attenuation DIFF signaling is used, while keeping the typical advantage of (within tunable frequency ranges) when the EBGs are noise mitigation due to Electromagnetic Bandgap layers. employed, there is not a systematic and available scientific literature regarding the signal integrity performances of PCB with EBG structures and their impact on the transmission I. INTRODUCTION properties of waveguide structures (like stripline, vias and microstripline) in high speed digital systems. In the present paper the signal integrity analysis of signals propagating on PCB with EBGs is discussed. Electromagnetic band gap (EBG) structures are becoming a In particular the signal quality of single-ended (SE) and popular choice for the suppression of unwanted DIFF (DIFF) lines is analyzed. A recent contribution on this electromagnetic mode transmission and simultaneous topic is [9] where the advantage of DIFF signaling in PCBs switching noise (SSN) in power distribution networks with EBG layers is highlighted. (PDNs) of high speed digital systems [1-8] Nevertheless in [9] only eye diagrams are considered as Other techniques are known in literature for the SSN figure of merit for the investigation of the signal quality. mitigation: 1) decoupling capacitors located over the entire With the present contribution an attempt is made in Printed Circuit Board (PCB), 2) splitting planes to block the presenting more figures of merit computed both in time and propagation of unwanted electromagnetic waves, 3) power frequency domain such as S-parameters, TDR waveforms islands, 4) shorting vias. and the already mentioned eye diagrams. Unfortunately all these techniques are effective only in the Two different configurations of EBG structures, already MHz range and/or are restricted to a very narrowband published for their stop band properties [7,8] are analyzed by frequency ranges. means of CST MICROWAVE STUDIO®, a three The use of EBG structures in PCB environments was first dimensional full wave field simulator based on the Finite introduced by M. Ramahi, but EBG structures have been Integration Technique (FIT) [10,11]. initially employed for antenna applications because of their Results show a consistent improvement of the signal unique behavior. In fact, EBGs can satisfy a Perfect transmission quality when DIFF signals are employed, while Magnetic Conductor (PMC) condition over a certain keeping the typical advantages of SSN mitigation due to frequency band and impose a zero degree reflection phase to EBG layers. normal incident waves, making them suitable for The paper is organized as follows: in Section II the applications such as coupling reduction between antennas geometric details of the test structures are briefly described; and antenna directivity improvement. in Section III a comparative study between single-ended and When inserting a three dimensional (3D) EBG structure in DIFF signalling is presented for two different types of EBG the parallel-plate waveguide-like structure of the power bus structures: 3D (with shorting vias) and 2D (with patterned of a PCB, a resonant circuit composed of the top plate, a planar GND plane). Section IV offers finally some single patch, the corresponding via and the plane connecting concluding remarks. the vias together is created. This resonant structure provides a low-impedance path to high-frequency currents in the power-planes therefore 978-1-4244-1699-8/08/$25.00 ©2008 IEEE II. EBG STRUCTURES shorting vias, and therefore the stack-up presents an extra layer, as shown in Fig. 2a. The test board used to analyze the performances of single- In particular two different designs are analyzed: 1) triangular ended and DIFF signals is the same proposed in [7]: it is a patches in a hexagonal array and 2) square patches. The details and the dimensions of the patches as well as the 9.15 cm x 4.15 cm board in FR4 dielectric (εr = 4.4 and tan δ = 0.02 at 0.5 GHz) board stack-up are listed in [7, 8]. The EBG layer is characterized by square patches and by double L branches (which increase the inductance) whose geometric details are reported in [7]. Figs. 1a-1c illustrate the SE and DIFF configurations with nominal characteristic impedance of 50 Ω SE and 100 Ω DIFF respectively. (a) (a) (b) (c) (b) Fig. 2 – PCB with 3D EBG layer: (a) side view and relevant dimensions, (b) triangle patches and (c) square patches. III. SIGNAL INTEGRITY ANALYSIS In this section, the signal integrity of SE and DIFF signals for the proposed EBG structures is investigated both in the time domain and frequency domain by using S-parameters, eye pattern and TDR characterization. Fig. 3 illustrates the comparison of the insertion loss, for the configuration of Fig. 1, between SE and DIFF signals. It is relevant to see how the quality of the S21 consistently improves, as in the classic case of the continuous reference planes, for the DIFF configuration and it is not affected by the stop-band properties of the EBG structure. Considering an allowable attenuation of -3dB, a bandwidth of 0 – 9 GHz can be obtained when a DIFF signaling is used. (c) For the SE configuration, due to a consistent resonance in the relatively low frequency range, only a narrow band Fig. 1 – PCB with 2D planar EBG layer: (a) side view and frequency range (0 – 2 GHz) allows verifying the value of - relevant dimensions in mm, (b) SE case and (c) DIFF case. 3dB constrain. The eye diagram is also calculated for both configurations in order to give an indication of the signal The second kind of configuration is a 3D EBG. The metal quality. patches are connected to the bottom layer by means of A pseudorandom (PRBS) bit sequence has been used as The same kind of analysis has been carried out for the input sequence with the following parameters: Tbit = 0.5 ns, second configuration illustrated in Fig. 2: 3D EBG with tr = tf = 0.05 ns, Vhigh = 1 V, Vlow = 0 V. triangular patches (Fig. 2b) and 3D EBG with square patches (Fig. 2c). In particular Fig. 5 represents the insertion loss for SE and DIFF signaling for the studied 3D EBG structures. In both cases the improvement when the DIFF signaling is used appears relevant, infact the already mentioned figure of merit (-3dB) is applicable up to about 8.5 GHz for the EBG structure with triangular patches and it is valid over the full broadband range (0-10 GHz) for EBG structure with square patches. The slight reduction of performance in the case of EBG with triangular patches is probably related to the large inductive effect of the higher number of shorting vias connecting the metal patches with the bottom metal layer. Fig. 3 – Insertion loss for SE and DIFF lines for the 2D planar EBG structure in Fig. 1. (a) (a) (b) Fig. 5 – Insertion loss for SE and DIFF lines for: (a) the 3D EBG structure with triangle patches and (b) the 3D EBG structure with square patches. The improved performance of the DIFF signals is also visible in the eye diagrams (see Figs. 6a and 6b for (b) triangular patches and Figs. 7a and 7b for square patches) in Fig. 4 – Eye diagrams for the (a) SE and (b) DIFF lines for which the same previous input bit sequence has been used. the 2D planar EBG structure in Fig. 1. In the first case for the SE transmission line, it results MEO = 0.40 V and MEW = 0.41 ns (see Fig.6a) while for the Maximum Eye Opening (MEO) and Maximum Eye Width DIFF signaling, MEO = 0.46 V and MEW = 0.48 ns (see (MEW) are used as metrics of the eye pattern quality. For Fig.6b). With regarding to the square patches configuration the SE transmission line (see Fig. 4a), it results MEO = 0.42 in the SE signaling MEO = 0.38 V and MEW = 0.47 ns, V and MEW = 0.43 ns, for the DIFF signaling (see Fig. 4b), while in the DIFF signaling MEO = 0.44 V and MEW = it results MEO = 0.48 V and MEW = 0.48 ns.
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