Degree Applicable Glendale Community College Course ID: 001447 April 2016

COURSE OUTLINE

Electronics and Computer Technology 113 Printed Circuit Boards and Technology

Catalog Statement

ECT 113 is a comprehensive course providing functional training in the concepts of high-reliability soldering, solder extraction, and component removal/replacement, including terminal inter- connections using -wrap techniques. It covers rework, repair, and specialized high-technology industrial equipment. This course also encompasses rework, repair, and modification of electronic printed circuit boards. Additionally, automated industrial wave solder processes are studied.

Total Lecture Units: 1.0 Total Laboratory Units: 0.5 Total Course Units: 1.5

Total Lecture Hours: 16.0 Total Laboratory Hours: 24.0 Total Faculty Contact Hours: 32.0

Prerequisite: None

Recommended Preparation: Eligibility for ENGL 120 or ESL 151.

Course Entry Expectations

Prior to enrolling in the course, the student should be able to:  critically analyze selected prose works dealing with important contemporary issues;  summarize, analyze, and synthesize information, express and apply standards for judgment, compare and contrast, and evaluate evidence in order to form and state reasoned opinions;  gather and organize information through library research;  demonstrate a command of grammar, diction, syntax, and mechanics sufficient for college level work.

ECT 113 Page 2 of 4

Course Exit Standards

Upon successful completion of the required course work, the student will be able to:  demonstrate proper high-reliability soldering and de-solder techniques, using the "Pace" TR 5 industrial work station equipment to interconnect and disconnect components in several contact configurations, following proper LAB safety procedures;  demonstrate wire-wrap techniques, using the industrial wire-wrap gun and related tools and equipment, connecting in several directed applications;  demonstrate rework and repair, using the "Pace" PRC-151 industrial repair station equipment, removing and replacing defective components, and repair defective board surfaces;  demonstrate critical thinking skills by attaining satisfactory scores on examination procedures covering high-reliability soldering, wire-wrap, and printed circuit rework, and repair methods and concepts.

Course Content Total Faculty Contact Hours = 32.0

Introduction (Lecture 4 hours) Safety Solder types Common soldering irons Solder process Methods and Concept (Lecture 4 hours) Tools Basic terminal soldering High reliability soldering techniques High reliability soldering equipment Soldering Procedures (Lecture 4 hours) Turret terminals Cup terminals Bifurcated terminals Applications process Components Replacement (Lecture 4 hours) Axial lead components Radial lead components ICs De-soldering procedures Applications process Wire Wrap (Lab 6 hours) Introductions Tools and equipment Identification and preparation of wire ECT 113 Page 3 of 4

Wrapping connection methods Applications process Printed Circuit Board (PCB) Rework and Repair (Lab 18 hours) Introductory concepts Tools and equipment Procedures and Techniques Single layer PCBs Multi-layers PCBs Board connectors Test and inspection procedures Applications processes

Methods of Instruction

The following instructional methodologies may be used in the course:  lectures;  demonstrations;  digital recordings;  guest speakers.

Out of Class Assignments

The following out of class assignments may be used in this course:  final project (e.g. research on methods of soldering).

Methods of Evaluation

The following methods of evaluation may be used in the course:  regular quizzes;  examination at the end of each instructional module;  final examination.

Textbook

Smith, H T. Quality Hand Soldering and Circuit Board Repair. 6th ed. Clifton Park: Delmar, 2013. Print. 10th Grade Textbook Reading Level. ISBN 13: 9781111642662

Student Learning Outcomes

Upon successful completion of the required coursework, the student will be able to: ECT 113 Page 4 of 4

 interconnect and disconnect components in several contact configurations, following proper LAB safety procedure;  use the industrial wire-wrap gun and related tools, and equipment, connecting wires in several directed applications;  print circuit board rework and repair, using the "Pace" PRC-151 industrial repair station equipment, removing and replacing defective components, and repair defective board surfaces;  manufacture electronic circuits, modular and devices using PCB and electronic components, connectors and terminals.