Platinum Group Organometallics COATINGS for ELECTRONICS and RELATED USES by Professor A
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Platinum Group Organometallics COATINGS FOR ELECTRONICS AND RELATED USES By Professor A. Z. Rubezhov Institute of Organo-Element Compounds. U.S.S.K. Academy of Sciences, Moscow Platinum group organometallics have recently been the subject of inten- sive investigation designed to establish the basic characteristics of their derontposition, which results in the formation of metallic or nietal- containing coatings. This review has been compiled from a literature search and indicates some of the applications that are, or could be, of commercial significance. This survey is devoted to some aspects of the regarded as separate techniques. These types of use of organometallic platinum group com- organometallic compounds can decompose to a pounds for the preparation of materials suitable metal, or to an oxide under the influence of for industrial applications, mainly in electronics heat, electric discharge, electron beam, and (1,2). The detailed chemistry of organometallic laser radiation, and these techniques are platinum group compounds is not included, as employed for vapour phase decomposition. a number of monographs on this subject are Decomposition of organometallic compounds available (3, 4, 5). In some instances, however, in solution is frequently performed thermally, information about co-ordination complexes of photochemically, electrochemically or via platinum group metals will be included. The chemical reduction and hydrolysis. Each possible practical use of organometallic method will now be considered separately, and platinum group compounds for the deposition a list of the compounds and metals used in each of coatings and films by various decomposition will be given. techniques was suggested in early works on The requirements for vapour phase thermal synthesis, see for example (6). To date, decomposition are as follows (1, 2): however, organic derivatives of platinoids have (a) the compound should be transformed into found little commercial use despite fairly exten- the vapour phase without decomposition sive data, especially in the patent literature. (b) the compound should be highly volatile The reasons for this include the high cost of the (c) organic products resulting from the decom- compounds, the lack of suitable coating equip- position of the organometallic compounds ment, and, in some cases, the lack of routine should be gaseous, and should not contaminate production processes for the synthesis of the the coating required complexes. (d) the organometallic compounds should be A brief outline of general coating and film non-toxic and ideally should be stable to air and deposition techniques based on organometallic moisture. platinum group compounds is first given. The first two of these are the determining fac- To date, there are two main decomposition tors. In order to characterise the volatility of methods for the production of coatings, namely organometallic compounds, the vapour vapour phase decomposition and decomposi- pressure-temperature equation should be ap- tion in solutions. The decompositions of plied. However, for organometallic platinum organometallic compounds in the solid state group compounds, this is known only for and as components of various viscous composi- ruthenocene (7), CpPtMe, (8) and MeC,- tions, such as pastes and polymers, can be H,PtMe, (8). For a number of compounds Platinum Metals Rev., 1992, 36, (11, 26-33 26 sublimation point (sub1m.p.) and boiling point individual ruthenium tris-p-diketonates are (b.p.) data are available, but in most cases there mentioned in the literature. The latter com- are no known quantitative values for the pounds are patented for use in the formation of volatility of the organometallic platinum group ruthenium films on various substrates via the compounds. deposition of (acac) ,Ru or (F, acac) ,Ru Most of the data on the decomposition of vapour onto a suitable support, heated to the organometallic platinum group compounds is decomposition point of the compound (16-18). concerned with their thermal decomposition. Ruthenocene, (C,H,),Ru, is the most pro- (The formation of iridium oxide films via mising compound for the formation of vapour deposition in an oxygen discharge (9) is ruthenium films. First, it is a commercially not considered in this review.) Information on available product, and it is suitably volatile each metal is considered separately. (sub1m.p. 100°C/lO-l mm), air-stable, non- toxic and may be prepared in a highly pure Ruthenium state. Attention was first drawn to the possibili- Complexes potentially suitable for the deposi- ty of preparing high purity ruthenium via tion of ruthenium films are ruthenium car- ruthenocene decomposition in 1964 (19). A bonyls, ruthenium carbonyl halides, ruthenium pure ruthenium film was generated at 595OC in cyclopentadienyls, ruthenium acetyl- a hydrogen atmosphere; iron (- 0.01 per cent) acetonates, and some of their organic and and palladium ( - 0.005 per cent) were present co-ordination derivatives. Pentacarbonyl as admixtures, and silicon and boron as trace ruthenium, Ru(CO),, with a vapour pressure elements. Patented applications for of 50 mm Hg at 18OC (lo), starts to decompose ruthenocene include: the preparation of layer at -18OC to form Ru,(CO),, and at a resistors (20), additives to liquid crystals (21) temperature of 22OOC decomposition to the and for plating multilayer electrodes with ox- metal occurs. The thermal decomposition of ides and metals (22). The plasma-induced trinuclear Ru,(CO),, to the metal has been vapour phase decomposition of ruthenocene studied by infrared spectroscopy and ther- enables thin metallic films to be produced at a mogravimetric analysis (1 1). A bright metallic sufficiently high rate (23, 24). film is formed on decomposition of Ru(CO),Cl, or of RuCOBr at 2OO0C, in the Osmium absence of air (10, 12). Annealing Ru(CO),Br According to data in the literature (lo), on (b.p. 118OC, sub1m.p. 140OC) or Ru(CO),I decomposition, osmium carbonyl halides are (b.p. 114OC, sub1m.p. 120OC) in a stream of capable of forming bright osmium fdms. Thin oxygen and phosgene leads to the formation films of osmium metal were prepared via the of ruthenium films (10). decomposition of OsO, complexes with However, the thermal decomposition of terpenes in a hydrogen stream at 3OOOC (25, ruthenium carbonyls and ruthenium carbonyl 26). It should be noted that osmium tetroxide chlorides, like analogous platinum metals exhibits high volatility, but its high toxicity, derivatives, is accompanied by severe corrosion equal to that of hydrogen cyanide, precludes its of the equipment and the support materials, use for fdm preparation. The application of a also, the majority of these ruthenium com- solid complex of OsO, with dioxane has been pounds are moisture- and oxygen-sensitive. patented. It is less volatile than osmium tetrox- Thermodynamic functions have been determin- ide and also less toxic (27). Among other ed for ruthenium and osmium carbonyls, osmium derivatives, it should be noted that M(C0) 5, in the gaseous state (13). cyclooctatetraene(tricarbony1)osmium has been Some volatile ruthenium compounds, namely patented for the deposition of coatings from the mixed dienecarbonyls (14) and diene-P- gas phase (14), while osmocene, bis(cyc1openta- diketonate ruthenium complexes (15) and dienyl)osmium, has been recommended as an Platinum Metals Rev., 1992, 36, (1) 27 additive to liquid crystals (21) and also for the to that of carbon (6). The known volatile preparation of high purity osmium (28). The iridium compounds include carbonyl hydrides thermal decomposition of Os, (CO) to and chlorides, which are readily decomposed metallic osmium has been reported in the and sublimed to form bright metallic films (lo), literature (1 1). tris(r-ally1)-iridium (29), r-cyclopentadiene-r- cyclopentadienyliridium (29) and iridium 0- Rhodium diketonates (31-33). The decomposition of The ability of rhodium carbonyls and tris(acety1acetonato)iridium in a stream of rhodium carbonyl halides to form bright hydrogen at 11 5 to 132OC, with deposition onto rhodium films on decomposition has been a support heated to between 400 and 75OoC, known for some time (10). For example, yields an iridium film. The use of [Rh(CO),l, on heating without solvent, and tris(acety1acetonato)iridium for the preparation Rh, (CO) ,? on heating in air, deposit a rhodium of fuel elements, has been claimed (31). Other film (1 1). A dimeric carbonylrhodium chloride volatile organometallic iridium compounds, [Rh(CO)? C11 ? melts at 123OC, readily sublimes namely r-cyclooctadiene-r-cyclopentadienyl- above 100°C, and decomposes at around 300°C iridium (34) and *-cyclooctadieneiridium in a stream of carbon dioxide to deposit a bright acetylacetonate (34) should be mentioned. A metallic film. In the presence of oxygen or four nuclear carbonyl, Ir, (CO) is readily COCl,, [Rh(CO) C11 “flares up” and “burns sublimed in a stream of carbon monoxide under out”, thus depositing bright rhodium films atmospheric pressure (29). (10). Among other volatile rhodium compounds, Palladium tris(ally1)rhodium and liquid r-allyl-a- Palladium is one of the less expensive allyl(cyclopentadienyl)rhodium (29) as well as platinum group metals, and the chemistry of its rhodium complexes with 0-diketones should be organometallic compounds is well developed mentioned. For example, the reduction of (4, 5). In decreasing order of volatility, the tris(trifluoroacety1acetonato)rhodium with volatile compounds are: r-allyl-r-cyclopenta- hydrogen in the vapour phase has been propos- dienylpalladium r-C, H ,Pd-r-C ,H, (sub1m.p. ed for the preparation of thin rhodium films 3O-4O0C/1-2 mm) (35), bis(r-ally1)palladium (30). At a vaporisation temperature of 13OoC, a (a-C, H,),Pd (sub1m.p. 35-4OoC/10- mm) reduction temperature of 25OOC and a (36), and bis(trifluoroethy1dithiocarbonato) hydrogen flow-rate of 16 ml/min, thick uniform palladium compound (CF CH OCS 2) Pd films with good adhesion and good electrocon- (sub1m.p. 130-150°C/10-1-10-2 mm) (5). ductivity were deposited. X-ray phase analysis The volatile co-ordination compounds of the revealed no admixtures in the films.