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Engineers' Guide to PCI Express Solutions

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Engineers' Guide to PCI Express Solutions Engineers’Engineers’ GuideGuide toto PCIPCI ExpressExpress SolutionsSolutions PCI Express Moves Outside the Box Switching Simplifies PCI Express Testing Bridging Legacy Equipment with PCIe PCI-SIG-nificant Changes Brewing in Mobile and Small form Factor www.eecatalog.com/pciewww.eecatalo Gold Sponsors XDS PCIe HMP Line Interface Boards – Designed to Help You Easily Build Your Applications! XDS HMP PCIe 4-Port 2/4-Wire E&M Board Announcing the XDS PCIe HMP Modular Line Interface board! Includes 16 ports of mix-and-match FXO or FXS line interface modules NEW! on a single low-profile PCIe board! Other H.100 PCIe boards available from AMTELCO XDS: r 12/24-Port Loop Start boards r 24-Port Station/DID boards r 4/8-Span T1/PRI boards r 4/8-Span E1/PRA boards r 8-Port E&M boards Asterisk® compliant channel drivers available for use with all AMTELCO PCIe boards. Find out more today! Web: xds.amtelco.com E-mail: [email protected] r(608)838-4194 4800 Curtin Drive r McFarland, WI 53558 Classroom/Virtual-Classroom TrainingTraining and eLearnineLearningg Courses: 1)1) PCI Express 3.0 (5-day course)se 2)2) NVM Express (1-day course)) 3)3) MobileMobile PCI ExpressExpress (M-PCIe)(M-PCIe) (4-day(4-day course)course) PCIPCI Express TechnologyTechnology 3.0 Book and eBook Authors: MMikeike Jackson, Ravi Budruk PPublisher:ublisher: MMindShareindShare Press PPages:ages: 11056056 RetailRetail PPrice:rice: $94.99$94.99 Book Sale Price: $$79.9979.99 eeBookBook PriPrice:ce: $$40.0040.00 Book + eBook Price: $99.99$99.99 % !"#" !"!"##"" % " # !# # !# % "" % !# # !" !# # !" % ! ! Contact MindShare phone: +1.800.633.1440 email: [email protected] web: www.mindshare.com Engineers’ Guide to PCI Express® Solutions 2014 Welcome to the 2014 www.eecatalog.com/pcie Engineers’ Guide to Vice President & Publisher Clair Bright [email protected] PCI Express Solutions (415) 255-0390 ext. 15 Editorial As Extension Media’s Chris Ciufo says, the PCI-SIG is one industry Vice President/Chief Content Officer consortium that doesn’t let the grass grow under its feet. Chris took a John Blyler [email protected] deep dive into the PCI-SIG’s most recent PCI Express announcements (503) 614-1082 (made earlier this year), and looks ahead as well. You won’t want to miss Editor-in-Chief Chris A. Ciufo his insight in “PCI-SIG “nificant” Changes Brewing in Mobile” where he [email protected] covers everything from the PCIe 3.1 spec through expectations for 4.0, as Editor Cheryl Berglund Coupé well as the M.2 and M-PCIe specifications that are aimed squarely at the [email protected] exploding mobile markets. We also looked to our industry experts to get Creative/Production Production Manager their take on these changes and more, in our roundtable discussion, “PCI Spryte Heithecker Express Moves Outside the Box.” Media Coordinator Jenn Burkhardt In other articles, Pericom’s Rakesh Bhatia explains how PCIe supports Graphic Designers Nicky Jacobson connectivity with legacy equipment built on interfaces that are all but Jacob Ewing obsolete in “Bridging Legacy Equipment with PCIe.” Agilent’s Rick Eads Senior Web Developer addresses the complex task of testing PCI Express transmissions—and Mariam Moattari Advertising/Reprint Sales how that will only get tougher with the upcoming Gen 4 release. In his Vice President & Publisher article, “Switching Simplifies PCI Express Testing,” he explains how Embedded Electronics Media Group Clair Bright switches can not only speed up measurements, but can also provide [email protected] results that compare favorably or even exceed current test practices. And (415) 255-0390 ext. 15 Sales Manager because USB 3.0 and PCIe share some common specifications, we’ve Michael Cloward included Eric Huang’s (Synopsys) article, “The Accelerating Demand for [email protected] (415) 255-0390 ext. 17 10 Gbps SuperSpeed USB 3.0.” Marketing/Circulation Jenna Johnson Elsewhere in this issue, you’ll find more information on how this popular To Subscribe standard takes high-performance into a range of embedded applications. www.eecatalog.com/subscribe CES’s Akos Csilling looks at the advantages of PCI Express for traditional VME-based applications in “Modern Technology in a Traditional Form Extension Media, LLC Factor,” while Emerson’s Brian Carr explains how a PCI Express media Corporate Office processing accelerator card offers benefits for high-density voice and (415)255-0390 President and Group Publisher video processing in “Accelerate Server-based Media Processing.” Finally, Vince Ridley GE’s Peter Thompson explains how multiprocessing—and PCI Express— [email protected] Vice President, Sales are at the heart of high-performance embedded computing in mil/aero Embedded Electronics Media Group systems with significantly improved performance in “Multiple Processors Clair Bright [email protected] in High-Performance Embedded Computing: “Only Connect”.” Vice President, Business Development Melissa Sterling There’s all this, plus product information, news, white papers and more, [email protected] (415)-970-19100 so dig in and enjoy! Special Thanks to Our Sponsors Cheryl Berglund Coupé Editor Engineers’ Guide to PCI Express Solutions is published by Extension Media LLC. Extension Media makes no warranty for the use of its products and assumes no responsibility for any errors which may appear in this Catalog nor does it make a commitment to update the information contained herein. The Engineers’ Guide to P.S. To subscribe to our series of Engineers’ Guides for PCI Express Solutions is Copyright ®2013 Extension Media LLC. No information in this Catalog may be reproduced without expressed written permission from developers, engineers, designers, and managers, visit: Extension Media @ 1786 18th Street, San Francisco, CA 94107-2343. All registered trademarks and trademarks included in this Catalog are www.eecatalog.com/pcie held by their respective companies. Every attempt was made to include all trademarks and registered trademarks where indicated by their companies. 2 Engineers’ Guide to PCI Express Solutions 2014 Contents PCI Express Moves Outside the Box By Cheryl Coupé, Managing Editor ..........................................................................................................................................5 Bridging Legacy Equipment with PCIe By Rakesh Bhatia, Pericom .......................................................................................................................................................8 Switching Simplifies PCI Express Testing By Rick Eads, Agilent Technologies, Inc. ................................................................................................................................ 11 Modern Technology in a Traditional Form Factor By Ákos Csilling, CES - Creative Electronic Systems SA ........................................................................................................ 14 Accelerate Server-based Media Processing By Brian Carr, Emerson Network Power .................................................................................................................................18 PCI-SIG-nificant Changes Brewing in Mobile and Small Form Factor Designs By Chris A. Ciufo, Editor-in-Chief ............................................................................................................................................ 21 Multiple Processors in High-Performance Embedded Computing: “Only Connect” By Peter Thompson, GE Intelligent Platforms .........................................................................................................................23 The Accelerating Demand for 10 Gbps SuperSpeed USB 3.0 By Eric Huang, Synopsys ........................................................................................................................................................26 PRODUCT SERVICES Board-to-Board Boards/Hardware ACCES I/O Products, Inc. PCI Express Data Acquisition and Control Cards ..........28 General Standards Corporation Analog, Digital and Serial I/O Boards ...........................29 Chip-to-Chip ICs PLX Technology ExpressLane™ PCI Express 3.0/2.0/1.x .........................30 ExpressLane™ PCI Express 3.0 Switches ......................31 Test and Analysis Teledyne LeCroy Teledyne LeCroy’s PCI Express® Protocol Analysis and Test Tools .................................................32 4 Engineers’ Guide to PCI Express Solutions 2014 SPECIAL FEATURE PCI Express Moves Outside the Box Our roundtable discussion hits PCIe’s generational shifts to ad- dress demanding requirements, the outlook for the new PCIe OCu- Link cable, and the move to mobile and low-power applications. By Cheryl Coupé, Managing Editor It’s tough to limit a discussion on PCI Express, as the nect together the components inside embedded systems. standard continues to evolve into nearly every aspect of As with most of the industry, PCIe Gen 2 has been broadly computing. New generations will support highly demanding adopted, and Gen 3 is showing up in newer systems. Since applications in the data center as well as remote exploration, embedded platforms have long lives, designers tend to use surveillance and research equipment that collect and pro- components that will not soon be obsolete, but at the same cess large amounts of data before they can be transported time the components must have an established track record for the next level of processing. And new efforts are taking of quality; embedded
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