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Pentium(R) 4 Processor in the 775-Land Package Electrical, Mechanical, and Thermal Specifications

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Pentium(R) 4 Processor in the 775-Land Package Electrical, Mechanical, and Thermal Specifications Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet – On 90 nm Process in the 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ , and supporting Intel® Virtualization Technology November 2005 Document Number: 306382-003 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Pentium® 4 processor 6xx sequence, and Intel® Pentium® 4 processor Extreme Edition on 90 nm process in the 775-land package may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details. 1Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting Hyper-Threading Technology and an HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See http:/ /www.intel.com/info/hyperthreading/ for more information including details on which processors support HT Technology. ΦIntel® Extended Memory 64 Technology (Intel® EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support EM64T or consult with your system vendor for more information. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality. Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and for some uses, certain platform software enabled for it. Functionality, performance or other benefit will vary depending on hardware and software configurations. Intel Virtualization Technology-enabled BIOS and VMM applications are currently in development. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst, Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2005 Intel Corporation. All rights reserved. 2 Datasheet Contents Contents 1 Introduction..................................................................................................................................11 1.1 Terminology ........................................................................................................................12 1.1.1 Processor Packaging Terminology ........................................................................13 1.2 References .........................................................................................................................14 2 Electrical Specifications .............................................................................................................15 2.1 FSB and GTLREF...............................................................................................................15 2.2 Power and Ground Lands...................................................................................................15 2.3 Decoupling Guidelines........................................................................................................15 2.3.1 VCC Decoupling ....................................................................................................16 2.3.2 FSB GTL+ Decoupling...........................................................................................16 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ...................................................16 2.4 Voltage Identification ..........................................................................................................17 2.4.1 Phase Lock Loop (PLL) Power and Filter ..............................................................19 2.5 Reserved, Unused, FC, and TESTHI Signals.....................................................................20 2.6 FSB Signal Groups .............................................................................................................20 2.7 GTL+ Asynchronous Signals ..............................................................................................22 2.8 Test Access Port (TAP) Connection ...................................................................................22 2.9 FSB Frequency Select Signals (BSEL[2:0]) .......................................................................23 2.10 Absolute Maximum and Minimum Ratings .........................................................................23 2.11 Processor DC Specifications ..............................................................................................24 2.12 VCC Overshoot Specification .............................................................................................33 2.12.1 Die Voltage Validation ...........................................................................................33 2.13 GTL+ FSB Specifications....................................................................................................34 3 Package Mechanical Specifications ..........................................................................................35 3.1 Package Mechanical Drawing ............................................................................................35 3.2 Processor Component Keep-Out Zones.............................................................................39 3.3 Package Loading Specifications.........................................................................................39 3.4 Package Handling Guidelines.............................................................................................39 3.5 Package Insertion Specifications........................................................................................40 3.6 Processor Mass Specification.............................................................................................40 3.7 Processor Materials ............................................................................................................40 3.8 Processor Markings ............................................................................................................40 3.9 Processor Land Coordinates ..............................................................................................41 4 Land Listing and Signal Descriptions .......................................................................................43 4.1 Processor Land Assignments .............................................................................................43 4.2 Alphabetical Signals Reference..........................................................................................66 5 Thermal Specifications and Design Considerations................................................................75 5.1 Processor Thermal Specifications ......................................................................................75 5.1.1 Thermal Specifications ..........................................................................................75 5.1.2 Thermal Metrology.................................................................................................79 5.2 Processor Thermal
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