Intel® Xeon® Processor E3-1125C V2 and E3-1105C V2: Datasheet

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Intel® Xeon® Processor E3-1125C V2 and E3-1105C V2: Datasheet Intel® Xeon® E3-1125C v2, E3-1105C v2, Intel® Pentium® Processor B925C, and Intel® Core™ i3-3115C Processors for Communications Infrastructure - Volume 1 of 2 Supporting: Intel® Xeon® Processor E3-1125C v2 Intel® Xeon® Processor E3-1105C v2 Intel® Core™ Processor i3-3115C Intel® Pentium® Processor B925C Mobile/Desktop 3rd Generation Intel® Core™ Processor Family Datasheet, Volume 2, completes the documentation set and contains additional product information. November 2013 Order Number: 329374-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. The Ivy Bridge Gladden product may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. MPEG is an international standard for video compression/decompression promoted by ISO. Implementations of MPEG CODECs, or MPEG enabled platforms may require licenses from various entities, including Intel Corporation. Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting HT Technology and a HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See http://www.intel.com/ products/ht/Hyperthreading_more.htm for additional information. This External Design Specification as well as the software described in it is furnished under license and may only be used or copied in accordance with the terms of the license. The information in this manual is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Intel Corporation. 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BlueMoon, BunnyPeople, Celeron, Celeron Inside, Centrino, Centrino Inside, Cilk, Core Inside, E-GOLD, Flexpipe, i960, Intel, the Intel logo, Intel AppUp, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Insider, the Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel Sponsors of Tomorrow., the Intel Sponsors of Tomorrow. logo, Intel StrataFlash, Intel vPro, Intel XScale, InTru, the InTru logo, the InTru Inside logo, InTru soundmark, Itanium, Itanium Inside, MCS, MMX, Moblin, Pentium, Pentium Inside, Puma, skoool, the skoool logo, SMARTi, Sound Mark, Stay With It, The Creators Project, The Journey Inside, Thunderbolt, Ultrabook, vPro Inside, VTune, Xeon, Xeon Inside, X-GOLD, XMM, X-PMU and XPOSYS are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. Copyright © 2013, Intel Corporation. All Rights Reserved. Intel® Xeon® E3-1125C v2, E3-1105C v2, Intel® Pentium® Processor B925C, and Intel® Core™ i3-3115C Processors for Communications Infrastructure Datasheet November 2013 2 Order Number: 329374-002US Contents—Intel® Xeon® and Intel® Core™ Processors for Communications Infrastructure Contents 1.0 Introduction ............................................................................................................ 10 1.1 Purpose / Scope / Audience ................................................................................ 10 1.2 Related Documents ........................................................................................... 10 1.3 Terminology ..................................................................................................... 12 2.0 Product Overview .................................................................................................... 14 2.1 Processor Feature Details ................................................................................... 16 2.1.1 Supported Technologies .......................................................................... 16 2.2 Interface Features ............................................................................................. 16 2.2.1 System Memory Support ......................................................................... 16 2.2.2 PCI Express* ......................................................................................... 17 2.2.3 Direct Media Interface (DMI).................................................................... 19 2.2.4 Platform Environment Control Interface (PECI)........................................... 20 2.3 Power Management Support ............................................................................... 20 2.3.1 Processor Core....................................................................................... 20 2.3.2 System ................................................................................................. 20 2.3.3 Memory Controller.................................................................................. 20 2.3.4 PCI Express* ......................................................................................... 20 2.3.5 DMI...................................................................................................... 20 2.4 Thermal Management Support ............................................................................ 20 2.5 Package ........................................................................................................... 21 2.6 Processor Compatibility ...................................................................................... 21 3.0 Interfaces................................................................................................................ 22 3.1 System Memory Interface .................................................................................. 22 3.1.1 System Memory Configurations Supported................................................. 22 3.1.2 System Memory Timing Support............................................................... 25 3.1.3 System Memory Organization Modes......................................................... 26 3.1.4 Rules for Populating Memory Slots............................................................ 27 3.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA).......... 27 3.1.6 Data Scrambling .................................................................................... 28 3.1.7 DRAM Clock Generation........................................................................... 28 3.1.8 DDR3 Reference Voltage Generation ......................................................... 28 3.2 PCI Express* Interface....................................................................................... 29 3.2.1 PCI Express* Architecture
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