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VIA C3 Nehemiah Processor Datasheet VIA C3 Nehemiah Processor Datasheet Revision 1.13 September 29, 2004 VIA TECHNOLOGIES, INC. VIA C3 Nehemiah Processor Datasheet September 29, 2004 This is Version 1.13 of the VIA C3 Nehemiah Processor Datasheet. © 2003-2004 VIA Technologies, Inc All Rights Reserved. VIA reserves the right to make changes in its products without notice in order to improve design or performance characteristics. This publication neither states nor implies any representations or warranties of any kind, including but not limited to any implied warranty of merchantability or fitness for a particular purpose. No license, express or implied, to any intellectual property rights is granted by this document. VIA makes no representations or warranties with respect to the accuracy or completeness of the con- tents of this publication or the information contained herein, and reserves the right to make changes at any time, without notice. VIA disclaims responsibility for any consequences resulting from the use of the information included herein. Cyrix and VIA C3 are trademarks of VIA Technologies, Inc. CentaurHauls is a trademark of Centaur Technology Corporation. AMD, AMD K6, and Athlon are trademarks of Advanced Micro Devices, Inc. Microsoft and Windows are registered trademarks of Microsoft Corporation. Intel, Pentium, Celeron, and MMX are registered trademarks of Intel Corporation. Other product names used in this publication are for identification purposes only and may be trade- marks of their respective companies. LIFE SUPPORT POLICY VIA processor products are not authorized for use as components in life support or other medical devices or systems (hereinafter life support devices) unless a specific written agreement pertaining to such intended use is executed be- tween the manufacturer and an officer of VIA. 1. Life support devices are devices which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. This policy covers any component of a life support device or system whose failure to perform can cause the failure of the life support device or system, or to affect its safety or effectiveness. September 29, 2004 VIA C3 Nehemiah Processor Datasheet Revision History Document Release Date Revision Initials 1.0 11/26/03 Initial external release EY 1.10 3/11/04 Updated table 5-3 JW Updated POWERGOOD information in figures 4-5, 4-6 and 1.11 07/30/04 table 3-3 JW 1.12 9/1/04 Updated table 4-13 JW 1.13 9/29/04 Updated table A-3 JW Revision History i VIA C3 Nehemiah Processor Datasheet September 29, 2004 This page is intentionally left blank. ii Revision History September 29, 2004 VIA C3 Nehemiah Processor Datasheet Table of Contents INTRODUCTION .........................................................................................................................................................1-1 1.1 DATASHEET OUTLINE ....................................................................................................................1-1 1.2 BASIC FEATURES ...........................................................................................................................1-2 1.3 PROCESSOR VERSIONS ...................................................................................................................1-3 1.4 COMPATIBILITY .............................................................................................................................1-4 PROGRAMMING INTERFACE..................................................................................................................................2-1 2.1 GENERAL .......................................................................................................................................2-1 2.2 ADDITIONAL FUNCTIONS ...............................................................................................................2-3 2.3 ACHINE-SPECIFIC FUNCTIONS........................................................................................................2-4 2.3.1 general.......................................................................................................................................2-4 2.3.2 standard cpuid instruction functions.........................................................................................2-4 2.3.3 extended cpuid instruction functions.........................................................................................2-6 2.3.4 centaur extended cpuid instruction functions............................................................................2-9 2.3.5 processor identification...........................................................................................................2-10 2.3.6 edx value after reset ................................................................................................................2-10 2.3.7 control register 4 (cr4)............................................................................................................2-11 2.3.8 Machine-Specific Registers.....................................................................................................2-11 2.4 OMITTED FUNCTIONS...................................................................................................................2-12 HARDWARE INTERFACE .........................................................................................................................................3-1 3.1 BUS INTERFACE .............................................................................................................................3-1 3.1.1 differences .................................................................................................................................3-2 3.1.2 clarifications .............................................................................................................................3-3 3.1.3 omissions...................................................................................................................................3-6 3.2 PIN DESCRIPTION ...........................................................................................................................3-7 3.3 POWER MANAGEMENT.................................................................................................................3-10 3.4 TEST & DEBUG ............................................................................................................................3-12 3.4.1 bist...........................................................................................................................................3-12 3.4.2 jtag ..........................................................................................................................................3-12 3.4.3 debug port ...............................................................................................................................3-12 ELECTRICAL SPECIFICATIONS .............................................................................................................................4-1 4.1 AC TIMING TABLES ........................................................................................................................4-1 4.2 DC SPECIFICATIONS .....................................................................................................................4-12 4.2.1 recommended operating conditions ........................................................................................4-12 4.2.2 maximum ratings.....................................................................................................................4-14 4.2.3 dc characteristics ....................................................................................................................4-15 4.2.4 power dissipation ....................................................................................................................4-16 MECHANICAL SPECIFICATIONS............................................................................................................................5-1 5.1 CPGA PACKAGE .............................................................................................................................5-1 5.2 EBGA PACKAGE .............................................................................................................................5-7 THERMAL SPECIFICATIONS ...................................................................................................................................6-1 6.1 INTRODUCTION..............................................................................................................................6-1 6.2 TYPICAL ENVIRONMENTS ..............................................................................................................6-1 6.3 MEASURING TC ..............................................................................................................................6-2 Table of Contents i VIA C3 Nehemiah Processor Datasheet September 29, 2004 6.4 MEASURING TJ ...............................................................................................................................6-2 6.5 ESTIMATING TC ..............................................................................................................................6-3 MACHINE SPECIFIC REGISTERS.........................................................................................................................
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