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PC/104 Embedded Solutions Submit New Products At: 4 / Winter 2005 PC/104 Embedded Solutions RSC #2 @ www.pc104online.com/rsc RSC #3 @ www.pc104online.com/rsc Winter 2005 Volume 9 Number 5 www.pc104online.com COLUMNS FEATURES 8 PC/104 Embedded Consortium HARDWARE: Embedded motherboards The need for technological refresh 22 Mini-ITX offers a useful alternative to traditional By Tom Barnum, PC/104 Embedded Consortium embedded boards By Roland Groeneveld, Logic Supply, Inc. 14 PC/104 Fundamentals 101 Sensor fundamentals 101 By Joel Huebner TECHNOLOGY: Sensors 30 Interpolating DACs offer high speeds, but are they 18 European Perspective controllable? Company profile: DIGITAL-LOGIC AG By Scott Hames, ICS Constant innovation is the key to success By Stefan Baginski BUYER’S GUIDE: 66 Editor’s Insight 36 2006 PC/104 Buyer’s Guide EPIC Express paves “bridge to the future” By Chris A. Ciufo EVENTS DEPARTMENTS February 14-16, 2006 April 3-7, 2006 Embedded World Embedded Systems Conference Nuremburg, Germany San Jose, CA 45 Editor’s Choice Products www.embedded-world-2006.de www.esconline.com April 4-6, 2006 RTS 2006 Paris, France www.birp.com/rts2006/an/intro.htm On the cover: EEPD’s M1VE PCI-104 single board computer adds serious horsepower to embedded systems. Now available with a 1 GHz Intel Celeron, the module E-LETTER is essentially a tiny desktop motherboard that fits into PC/104-based Winter: www.pc104online.com/eletter systems. PCI-104 is a PCI-only ■ SOM vs. SBC: Comparing differences in embedded version of PC/104 with the technology legacy ISA bus omitted. By Michele Lukowski, VersaLogic ■ Cover inset product: Can this COTS-based system be saved? Photo courtesy of EEPD. By Robert J. Leach, Howard University www.EEPD.com WEB RESOURCES Subscribe to the magazine or E-letter at: www.opensystems-publishing.com/subscriptions Industry news: Published by: OpenSystems Read: www.pc104online.com/news Publishing™ Submit: www.opensystems-publishing.com/news/submit © 2005 OpenSystems Publishing © 2005 PC/104 Embedded Solutions Submit new products at: www.opensystems-publishing.com/vendors/submissions/np 4 / Winter 2005 PC/104 Embedded Solutions The Journal of Small Embedded Form Factors A N OPENS YSTEMS PUBLICATION Military & Aerospace Group ■ DSP-FPGA Product Resource Guide ■ DSP-FPGA.com ■ DSP-FPGA.com E-letter ■ Military Embedded Systems ■ Military Embedded Systems E-letter ■ PC/104 Embedded Solutions ■ PC/104 Embedded Solutions E-letter ■ PC/104 & Small Form Factor Catalog ■ VMEbus Systems ■ VMEbus Systems E-letter Group Editorial Director Chris Ciufo [email protected] Assistant Editor Sharon Schnakenburg [email protected] Senior Editor (columns) Terri Thorson [email protected] European Bureau Chief Stefan Baginski [email protected] Managing Editor Bonnie Crutcher Art Director Steph Sweet Senior Web Developer Konrad Witte Graphic Specialist David Diomede Circulation/Office Manager Phyllis Thompson [email protected] RSC #601 @ www.pc104online.com/rsc OpenSystems Publishing Editorial/Production office: 16872 E. Ave. of the Fountains, Ste 203 Fountain Hills, AZ 85268 Tel: 480-967-5581 ■ Fax: 480-837-6466 Website: www.opensystems-publishing.com Publishers John Black, Michael Hopper, Wayne Kristoff Vice President Editorial Rosemary Kristoff Communications Group Editorial Director Joe Pavlat Associate Editor (articles) Anne Fisher Senior Editor (columns) Terri Thorson Technology Editor Curt Schwaderer European Representative Hermann Strass Embedded and Test & Analysis Group Editorial Director Jerry Gipper Editorial Director Don Dingee Senior Editor (articles) Terri Thorson Technical Editor Chad Lumsden Associate Editor Jennifer Hesse Special Projects Editor Bob Stasonis European Representative Hermann Strass PC/104 Embedded Solutions ISSN Print 1096-9764, ISSN Online 1550-0373 Publication Agreement Number: 40048627 Canada return address: WDS, Station A, PO Box 54, Windsor, ON N9A 615 PC104 Embedded Solutions is published five times a year by OpenSystems Pub lish ing LLC., 30233 Jefferson Ave., St. Clair Shores, MI 48082. Subscrip tions are free, upon request in writing, to persons dealing with or consid er ing PC104 Embedded Solutions. For others inside the US and Canada, sub scriptions are $24/year. For 1st class delivery outside the US and Canada, subscriptions are $50/year (advance payment in US funds required). POSTMASTER: Send address changes to PC104 Embedded Solutions 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 RSC #602 @ www.pc104online.com/rsc 6 / Winter 2005 PC/104 Embedded Solutions RSC #7 @ www.pc104online.com/rsc The need for technological refresh By Tom Barnum PC/104, EPIC, and EBX, are ubiquitous in the probability that a component from a single board supplier. In today’s in defense, medical, telecommunication, obsolescence could, in turn, cause high-paced environment, the OEM would and industrial applications where long- the obsolescence of the embedded be wise to allocate resources and have a term availability is mandated. Many of computer board) sustaining plan that includes the inevitable these applications go through a rigorous ■ Consolidations or mergers technological refresh to either upgrade or certification and approval process. The ■ Changes in business conditions or replace selected board-level product. time required to move a project from con- otherwise ceptual development to testing, and subse- The nature of the problem: quently to full production, can approach Furthermore, the length of time required Long-term component availability 3-5+ years. When the testing is complete, to design-in an embedded computer plat- vs. long development cycles the expectation is that embedded product form exacerbates the ability to support the There are multiple drivers impacting long- used in the application will be available for product selected over the OEM’s targeted term embedded computer availability. As an additional 5-10 years with some medi- product life cycle. mentioned, early component obsolescence cal and military applications lasting for due to changes in business con- 25 years or more. “In today’s high- ditions often forces a board- level manufacturer to either For their PC/104 and other small form paced environment, render a product obsolete earlier factor parts, manufacturers select high- than originally scheduled or to quality components from multiple vendors, the OEM would be move forward with a redesign. seek long-term commitments from silicon At present, there is the move suppliers, offer last-time buy opportuni- wise to allocate towards Restriction of the use ties, and maintain deep stocks of critical of certain Hazardous Substances components to ensure long-term prod- resources and have a (RoHS)-compliant products and uct availability. Many of those vendors the changeover by many silicon offer life-cycle management programs to sustaining plan that vendors from a leaded to an ostensibly save OEMs time and money by RoHS-compliant manufacturing eliminating product redesigns. In addition, includes the inevitable process. That affords the oppor- embedded manufacturers have improved tunity for some firms to obsolete their time to market for new platforms technological refresh less-profitable leaded compo- and new derivatives of existing product. nent lines. After all, why expend In tandem, there are increasing promises to either upgrade resources to change your manu- from embedded manufacturers to shepherd facturing process if volumes do product “from cradle to grave” and to back or replace selected not warrant? In addition, techno- up newly introduced products with a lon- logical advances will continue to gevity guarantee. board-level product.” affect the availability of today’s silicon. The physical size of inte- Regrettably, the time associated with “from To sustain a product over time requires grated circuits will continue to get smaller cradle to grave” appears to be contracting. embedded computer manufacturers to with improvements in chip-scale and wafer- There are considerable pressures in the abil- continue their efforts to identify long- scale packaging, and functionality previ- ity to sustain these products over the span of lived components and ensure a long-term, ously implemented on several chips will 10-15 years or more, due to: stable product supply. These requirements integrate into single-chip, multi-chip, or reinforce the need for embedded manufac- System-on-Chip module solutions. These ■ Early component obsolescence turers to provide open specifications, sup- improvements, in turn, will serve to con- ■ The ever-present trend towards an ported by multiple vendors, to ensure that tinue the trend of packing additional func- increasing number of components on a suitable option is available in case busi- tions and features onto embedded computer a platform (and concomitant increase ness conditions prompt early obsolescence manufacturers’ current and future products. 8 / Winter 2005 PC/104 Embedded Solutions RSC #9 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 9 With the increased number of components, there is an associated rise in the probability that the board may go obsolete or will need to be upgraded to address the obsolescence at the component level. The OEM’s long development cycle exac- erbates the problem. For example, the FDA approval process for a Class II medi- cal device consists of multiple phases. A medical device manufacturer starts out with strategic regulatory, scientific, and safety planning in the preclinical phase. This process eventually
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