PC/104 Embedded Solutions Submit New Products At: 4 / Winter 2005 PC/104 Embedded Solutions

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COLUMNS FEATURES

8 PC/104 Embedded Consortium HARDWARE: Embedded motherboards The need for technological refresh 22 Mini-ITX offers a useful alternative to traditional By Tom Barnum, PC/104 Embedded Consortium embedded boards By Roland Groeneveld, Logic Supply, Inc. 14 PC/104 Fundamentals 101 Sensor fundamentals 101 By Joel Huebner TECHNOLOGY: Sensors 30 Interpolating DACs offer high speeds, but are they 18 European Perspective controllable? Company profile: DIGITAL-LOGIC AG By Scott Hames, ICS Constant innovation is the key to success By Stefan Baginski BUYER’S GUIDE: 66 Editor’s Insight 36 2006 PC/104 Buyer’s Guide EPIC Express paves “bridge to the future” By Chris A. Ciufo EVENTS DEPARTMENTS February 14-16, 2006 April 3-7, 2006 Embedded World Embedded Systems Conference Nuremburg, Germany San Jose, CA 45 Editor’s Choice Products www.embedded-world-2006.de www.esconline.com April 4-6, 2006 RTS 2006 Paris, France www.birp.com/rts2006/an/intro.htm

On the cover: EEPD’s M1VE PCI-104 single board computer adds serious horsepower to embedded systems. Now available with a 1 GHz Intel Celeron, the module E-LETTER is essentially a tiny desktop motherboard that fits into PC/104-based Winter: www.pc104online.com/eletter systems. PCI-104 is a PCI-only ■ SOM vs. SBC: Comparing differences in embedded version of PC/104 with the technology legacy ISA bus omitted. By Michele Lukowski, VersaLogic ■ Cover inset product: Can this COTS-based system be saved? Photo courtesy of EEPD. By Robert J. Leach, Howard University www.EEPD.com

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The Journal of Small Embedded Form Factors

A N OPENS YSTEMS PUBLICATION Military & Aerospace Group ■ DSP-FPGA Product Resource Guide ■ DSP-FPGA.com ■ DSP-FPGA.com E-letter ■ Military Embedded Systems ■ Military Embedded Systems E-letter ■ PC/104 Embedded Solutions ■ PC/104 Embedded Solutions E-letter ■ PC/104 & Small Form Factor Catalog ■ VMEbus Systems ■ VMEbus Systems E-letter Group Editorial Director Chris Ciufo [email protected] Assistant Editor Sharon Schnakenburg [email protected] Senior Editor (columns) Terri Thorson [email protected] European Bureau Chief Stefan Baginski [email protected] Managing Editor Bonnie Crutcher Art Director Steph Sweet Senior Web Developer Konrad Witte Graphic Specialist David Diomede Circulation/Office Manager Phyllis Thompson [email protected] RSC #601 @ www.pc104online.com/rsc OpenSystems Publishing Editorial/Production office: 16872 E. Ave. of the Fountains, Ste 203 Fountain Hills, AZ 85268 Tel: 480-967-5581 ■ Fax: 480-837-6466 Website: www.opensystems-publishing.com

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6 / Winter 2005 PC/104 Embedded Solutions RSC #7 @ www.pc104online.com/rsc The need for technological refresh By Tom Barnum

PC/104, EPIC, and EBX, are ubiquitous in the probability that a component from a single board supplier. In today’s in defense, medical, telecommunication, obsolescence could, in turn, cause high-paced environment, the OEM would and industrial applications where long- the obsolescence of the embedded be wise to allocate resources and have a term availability is mandated. Many of computer board) sustaining plan that includes the inevitable these applications go through a rigorous ■ Consolidations or mergers technological refresh to either upgrade or certification and approval process. The ■ Changes in business conditions or replace selected board-level product. time required to move a project from con- otherwise ceptual development to testing, and subse- The nature of the problem: quently to full production, can approach Furthermore, the length of time required Long-term component availability 3-5+ years. When the testing is complete, to design-in an embedded computer plat- vs. long development cycles the expectation is that embedded product form exacerbates the ability to support the There are multiple drivers impacting long- used in the application will be available for product selected over the OEM’s targeted term embedded computer availability. As an additional 5-10 years with some medi- product life cycle. mentioned, early component obsolescence cal and military applications lasting for due to changes in business con- 25 years or more. “In today’s high- ditions often forces a board- level manufacturer to either For their PC/104 and other small form paced environment, render a product obsolete earlier factor parts, manufacturers select high- than originally scheduled or to quality components from multiple vendors, the OEM would be move forward with a redesign. seek long-term commitments from silicon At present, there is the move suppliers, offer last-time buy opportuni- wise to allocate towards Restriction of the use ties, and maintain deep stocks of critical of certain Hazardous Substances components to ensure long-term prod- resources and have a (RoHS)-compliant products and uct availability. Many of those vendors the changeover by many silicon offer life-cycle management programs to sustaining plan that vendors from a leaded to an ostensibly save OEMs time and money by RoHS-compliant manufacturing eliminating product redesigns. In addition, includes the inevitable process. That affords the oppor- embedded manufacturers have improved tunity for some firms to obsolete their time to market for new platforms technological refresh less-profitable leaded compo- and new derivatives of existing product. nent lines. After all, why expend In tandem, there are increasing promises to either upgrade resources to change your manu- from embedded manufacturers to shepherd facturing process if volumes do product “from cradle to grave” and to back or replace selected not warrant? In addition, techno- up newly introduced products with a lon- logical advances will continue to gevity guarantee. board-level product.” affect the availability of today’s silicon. The physical size of inte- Regrettably, the time associated with “from To sustain a product over time requires grated circuits will continue to get smaller cradle to grave” appears to be contracting. embedded computer manufacturers to with improvements in chip-scale and wafer- There are considerable pressures in the abil- continue their efforts to identify long- scale packaging, and functionality previ- ity to sustain these products over the span of lived components and ensure a long-term, ously implemented on several chips will 10-15 years or more, due to: stable product supply. These requirements integrate into single-chip, multi-chip, or reinforce the need for embedded manufac- System-on-Chip module solutions. These ■ Early component obsolescence turers to provide open specifications, sup- improvements, in turn, will serve to con- ■ The ever-present trend towards an ported by multiple vendors, to ensure that tinue the trend of packing additional func- increasing number of components on a suitable option is available in case busi- tions and features onto embedded computer a platform (and concomitant increase ness conditions prompt early obsolescence manufacturers’ current and future products.

8 / Winter 2005 PC/104 Embedded Solutions RSC #9 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 9 With the increased number of components, there is an associated rise in the probability that the board may go obsolete or will need to be upgraded to address the obsolescence at the component level.

The OEM’s long development cycle exacerbates the problem. For example, the FDA approval process for a Class II medical device consists of multiple phases. A medical device manufacturer starts out with strategic regulatory, scientific, and safety planning in the preclinical phase. This process eventually moves into full- fledged “pivotal” clinical trials, then moves into intensive coordination of clinical and post-marketing safety data collection, processing, and reporting. The documentation associated with these phases is massive. Military device development is no less time consuming and resource intensive. Some military applications follow the documentation protocol equivalent to the FDA certification process. Intensive HALT, HASS, extended temperature, and shock (hammer/drop/barge) testing often follows this protocol. The latter series of tests simu- lates conditions associated with torpedo or missile attacks against military armament that contains embedded computer devices.

It is a rare event for most industrial applications to be quickly developed. Although not burdened by regulatory requirements, in most industrial applications there are multiple environmental conditions and development issues that must be taken into account before moving into production. Environmental issues include the temperature and humidity requirements of the system. Development concerns include packaging requirements, OS selection, application software development and testing, and the market development associated with the device.

As a result, we have board-level manufacturers looking for long-lived components and a “guarantee” of long-term availability from IC suppliers. However, high-end embedded motherboards can take 12 or more months to develop, test, and deploy. Complicating matters, in most cases, board designers do not immediately ana- RSC #10 @ www.pc104online.com/rsc lyze newly released ICs and move forward

10 / Winter 2005 PC/104 Embedded Solutions RSC #11 @ www.pc104online.com/rsc ingly important role in future development ply true form, fit, and function upgrade efforts. The RoHS initiative will influence paths that fit with the technological refresh component availability while simultane- requirements of end users. ously introducing new components. As with a new design. Therefore, it could be usual, the development and deployment of In summary, as a first step towards ensur- quite far along the silicon vendor’s guaran- new technology will displace legacy and ing long-term availability, we have open- teed availability timeline before the board- currently available integrated circuits. standards-based architecture supported by level manufacturer has their embedded multiple board-level manufacturers, which product available. Even with a five-year OEMs will continue to select and develop allows OEMs to select from multiple availability guarantee (from the date of around board-level products that may vendors. Additionally, these board-level new silicon introduction), by the time an surpass the silicon supplier’s guarantee. suppliers need to continue their efforts in embedded computer board manufacturer Accordingly, OEMs deploying embedded offering life-cycle management programs designs and deploys their product and the computer products should have a formal that mitigate product redesigns. Keep in OEM goes through their development and product life-cycle strategy during their mind that component obsolescence will certification process, there is a high prob- sustainment phase that includes planned, occur, and the board-level supplier must ability that the silicon originally selected routine, and technological refresh stages. do their part by offering either a revision will have reached the end of its targeted The technological refresh stage is an to the original platform or an upgrade path product life cycle. opportunity to cut in upgraded product to to accommodate the OEM’s form, fit, and address component obsolescence issues at function requirements. OEMs will need to As depicted in Figure 1, the IC Manufac- the board level. In addition, it is an oppor- allocate significant resources to allow for turer (ICM) introduces their new com- tunity for the OEM to enhance additional the periodic technological refreshes that ponent at time(0) while the Embedded functionality and/or features that may be will invariably arise due to component and Board Manufacturer (EBM) selects that available as a result of upgrades made to board-level obsolescence. component at time(1). The EBM takes product stemming from the board-level approximately one year to design-in the manufacturer’s integration of a replace- ICM’s component bringing us to time(2). ment component or migration path option The OEM selects the EBM’s embedded to address obsolescence issues. computer at time(3) and spends three years going through development and cer- Embedded computer manufacturers must For further information, tification bringing us to full production at continue to do their part to sustain product contact the Consortium: time(6), just following the ICM’s expected over the targeted life cycle of their OEM End-Of-Life (EOL). customers. Migration options offering PC/104 Embedded Consortium form/fit/function solutions are generally 490 2nd Street, Suite 301 The nature of the solution: not drop-in replacements. For example, San Francisco, CA 94107 Open specifications, multiple a new video chip will invariably require Tel: 415-243-2104 vendors, and periodic/staged a new board layout, an updated driver, Fax: 415-836-9094 technological refreshes by OEMs and perhaps a change in the connector E-mail: [email protected] and end users scheme. An OEM may need to update Website: www.pc104.org We can expect continued evolution their software, change their connector of embedded systems during the next configuration, or even update packaging few years. There is the inevitable trend to accommodate a board vendor’s change. towards higher performance processors Board-level manufacturers need to better and advancements in memory and I/O understand the impact that even minimal bandwidth. FPGAs and switched fabrics, board-level changes have on specific OEM notably PCI-Express, will play an increas- applications and should endeavor to sup-

Figure 1

12 / Winter 2005 PC/104 Embedded Solutions RSC #13 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 13 Sensor fundamentals 101 By Joel Huebner

A variation of an LVDT is the Rotary No matter how much data processing speeds continue to advance, the Variable Differential Transformer (RVDT). fundamental embedded systems requirement is for sensors to measure The RVDT is based upon the same princi- and convert real-world data into a digitized format for PC/104 systems ples and produces the same type of output as to process. the LVDT. The magnetic core of an RVDT moves in a rotary motion with respect to the This PC/104 Embedded Solutions Fundamentals 101 column focuses on primary and each secondary. This is useful for 0º-360° rotational motion, as opposed to some of the more exciting and unique sensors that are readily available on the linear motion of an LVDT. Table 1 lists the commercial market. It briefly presents some of the basic but important a number of sensor applications. aspects of A/D converters and reviews some of the common pitfalls to avoid when selecting a PC/104 data acquisition board with onboard A/D Accelerometers converters for a particular PC/104 embedded system design. Acceleration is the measure of how quickly speed changes, and an accelerometer is a sensor that measures accelera- LVDT ferential AC voltage output. The phase of tion. Accelerometers have made the most A Linear Variable Differential Trans- the summation signal will be in-phase with remarkable advancements in the last five former (LVDT) is a type of displacement the primary or 180° out-of-phase with the to 10 years. They used to be very large, transducer. It measures the displacement primary, depending on which secondary power-hungry, and expensive devices. of a mechanical moving object in actual winding the core moves toward. Some of the newer accelerometer technol- applications ranging from jet engines to ogy enables measuring the angle of tilt of robotics. For example, hydraulics and Some of the advantages of an LVDT are: the sensor itself. mechanical assemblies utilize LVDTs. ■ They are readily available and very The incorporation of accelerometers in Figure 1 depicts a transformer with a primary economical. embedded systems has been, and contin- winding and two secondary windings con- ■ They are very reliable in terms of ues to be, very diverse. Accelerometers nected in opposition with a movable core. service life due to a magnetic-based can monitor acceleration, angle of tilt, col- The dots at each transformer winding indi- sensor. lision, gravity, and rotation. Such diverse cate the polarity of the induced voltage. The ■ The core does not contact the applications as automobile collision sen- movable core of an LVDT is part of a shaft transformer. sors, monitoring the pitch and roll of that extends out of the LVDT and attaches to any movable object. As the object moves, causing the shaft or core to move within the LVDT, the LVDT accurately measures the displacement of the object.

The excitation provided to an LVDT is usually a sine wave measuring several volts RMS and is typically between 1 kHz to 20 kHz. The output of an LVDT is based upon the relative displacement of the magnetic core. When the magnetic core is centered, with respect to the two secondary windings, the output summation of both secondary windings is zero or null. As the core moves toward one of the secondary windings, the net summation output increases in amplitude and produces a non-zero dif- Figure 1

14 / Winter 2005 PC/104 Embedded Solutions Sensor applications LVDT Used to measure the displacement of mechanical moving objects Accelerometers Used to measure acceleration, angle of tilt, collision, gravity, and rotation Hall effect sensor Used to measure changes in a magnetic field Table 1 unmanned aerial vehicles, and the thumb through the semiconductor is disturbed. joystick found in many handheld elec- As a result, a DC voltage will be present. tronic devices utilize accelerometers. The DC voltage measured is proportional to the strength of the magnetic field. This Many of today’s accelerometers either principle is the Hall effect (see Figure 2). incorporate a heated gas bubble located on the silicon or a spring-suspended capaci- More than 125 years ago, Dr. Edwin Hall tive-based system. Thermal sensors sur- discovered the Hall effect while using con- round the gas bubble system and detect the ductors. However, no one applied the Hall movement of the gas bubble in much the effect to actual applications until semi- same way that the bubble in a carpenter’s conducting materials were invented in level works. The suspended, capacitive- the 1950s. In addition, no one utilized the based accelerometer includes a spring- Hall effect sensors in the electronics indus- suspended plate above the silicon surface. try until the last several decades when the A differential capacitor created by the sus- advancement of semiconducting materials pended plate and a fixed plate located on made the availability of the sensors more the silicon surface measures deflections in common. the plate due to external acceleration. In fact, a vast array of sensors available on Hall effect sensor the market today ranging from tempera- The Hall effect sensor is simply a mag- ture sensors, pressure sensors, and position netic field sensor. It is especially useful sensors incorporate a Hall effect sensor. if the targeted component incorporates These sensors internally include a magnet or can incorporate a magnetic field. Hall and Hall effect sensor, which enable the effect sensors operate in applications such desired physical element (temperature, as anti-lock brake systems, gear rotation pressure, or position) to alter the physical monitoring, and solid-state switch applica- distance of the magnetic element to the tions. Hall effect sensors are advantageous Hall effect sensor. because they have no moving parts, are solid state, are available in a broad tem- A/D converters perature range, and are very reliable. The most fundamental requirement for any type of analog-based sensor is to convert Semiconductor current flow is not orthog- the analog signal to a digital format for pro- onal. When a constant DC current is pres- cessing by a CPU, DSP, or FPGA located ent in a semiconductor in one direction, within the PC/104 stack. The A/D converter no voltage (potential) is created in a per- is the IC that performs this process. The pendicular direction. But when a magnetic two main parameters that determine how field is placed at a right angle to the semi- accurately it converts the analog input to a conductor material, the current passing digital signal are the bit resolution of the

Constant Constant Current Current

Magnetic field

RSC #15 @ www.pc104online.com/rsc

Semiconductor Semiconductor OV Measured DC Voltage Measured

Figure 2 A/D converter and how fast the A/D con- A/D selection verter samples the input analog signal. Careful selection of the resolution of the A/D is very important. Utilize a Analog sensor output will have a fixed bit resolution that produces an accuracy that is satisfactory to the accuracy voltage range that it uses to represent the required by the embedded system design. The system sensor’s data sheet total range of the signal that it is measur- will determine the maximum bit resolution that is practical to use based ing. For example, a pressure sensor may upon the minimum accuracy the output of the sensor itself can provide. be able to measure a range of 0-100 psi and outputs an analog signal range of 0- For example, suppose a data sheet of a sensor lists a minimum accuracy output 5 VDC, which proportionally represents of 2.5 mV per something (gauss, PSI, temperature) and has an output range of the pressure it is measuring at any given 0-10 VDC. An A/D converter with a 12-bit resolution and input analog range point in time. Alternatively, an LVDT sen- 0-10 VDC would be able to accurately measure the maximum accuracy of the sor may have an analog AC output range sensor (12-bit = 4,096 binary numbers, 10 V/4,096 = 2.4m V). of ±10 VAC. It is also more important to determine if it is necessary to have that level The analog input range that the A/D con- of resolution. If the end application of the PC/104 system dictates only an verter can accept should match with the accuracy required by the sensor that is a value greater than the resolu- output voltage range of the sensor. A vari- tion capabilities of the sensor itself, then utilize an A/D with a lower bit ety of A/D converters are available with resolution that meets the system requirements of the embedded design. The many different input ranges and are typi- PC/104 embedded system design requirements should dictate the accuracy cally dependent upon the supply voltages used to power the A/D converter itself. level of the required A/D converter.

Analog sensor output typically has to be scaled through analog circuitry to match the input range of the A/D converter.

The A/D converter takes discrete samples of the incoming analog signal and converts each sample to a digital number. This digital number is proportional to the full-scale input analog range that the A/D converter can accept as an analog input. An 8-bit A/D converter can digitally represent 28 steps. The higher the bit resolution of the A/D converter, the more steps that can be represented. The bit resolution, in con- junction with the analog input range of the A/D converter, determines the overall resolution of the digital output. A 10-bit A/D converter with a 0-5 V analog input range can digitally represent the analog input signal in 4.9 mV increments or steps. (10-bit = 1,024 binary numbers, 5 V/1,024 = 4.9 mV). The bit resolution, in addition to how fast the A/D converter can perform the conversion process, determines the digital accuracy of the measured analog signal. Nyquist Theorem dictates that the sample frequency needs to be at least twice the highest frequency found in the input analog signal to the A/D converter. If an LVDT sensor has a 10 kHz output, the A/D RSC #16 @ www.pc104online.com/rsc converter needs to have a sample rate of at

16 / Winter 2005 PC/104 Embedded Solutions least 20 kHz or take a sample every 0.1 ms or smaller to avoid anti-aliasing.

The technology of A/D converters continues to advance along with the entire electronics industry. Many of today’s A/D converters have integrated mux systems, self-calibrating circuitry, integrated error compensation, and additional features that have advanced the accuracy, reliabil- ity, and capability of A/D converters as a whole. The important thing is to select a PC/104 data acquisition board that has an A/D converter that possesses the func- tional parameters and capabilities that meet the needs of the external sensors and the requirements of the PC/104 embedded system design itself.

PC/104 meets the physical world The true advancement of PC/104 systems is not necessary at the silicon level with smaller and faster processors and memory, but rather at the real-world interface level. When the embedded engineer identifies new ways of utilizing existing sensors to gather data from the physical world in new and creative ways, that is when the embedded engineer pushes the envelope of PC/104 technology and embedded systems as a whole.

Additional information, references, and Web links about sensors and A/D converters are available at www.jacyltechnology.com.

Web links on LVDT/RVDT, accelerometers, the Hall effect sensor, and A/D converters are available at www.pc104online.com/ departments/fundamentals/2005/winter/.

Joel Huebner is president of Jacyl Technology, Inc. He holds two degrees with honors from Purdue University in electrical engineering and computer engineering. Joel has more than 15 years’ experience as an electrical design engineer in the military aerospace industry and in the custom electronic design R&D industry.

For further information, contact Joel at:

Jacyl Technology, Inc. PO Box 350 Leo, IN 46765 Tel: 800-590-6067 E-mail: [email protected] RSC #17 @ www.pc104online.com/rsc Website: www.jacyltechnology.com

PC/104 Embedded Solutions Winter 2005 / 17 Company profile: DIGITAL-LOGIC By Stefan Baginski Constant innovation is the key to success

The PC/104 market is composed of a variety of companies that often manufacture more than just PC/104 modules. The Swiss company DIGITAL-LOGIC is no exception. A supplier of PC/104 and other small form factors, the company is indicative of the market’s many innovators. DIGITAL-LOGIC was among the first to deploy Pentium processors on PC/104 by designing a unique heat sink, and they continue to offer insight on how small-form-factor vendors are meeting the challenges of market demands concerning more performance, reducing costs, and meeting European Restriction of the use of Hazardous Substances (RoHS) requirements.

OpenSystems Publishing European bureau chief Stefan Baginski recently caught up with DIGITAL-LOGIC’s CEO, Felix Kunz.

DIGITAL-LOGIC is a mid-size company We are not only a design and layout S.B. And now you are facing the RoHS specializing in supplying its customers company, but we have to make sure that challenge. What does that entail? with PC/104 and other small-form-factor every DIGITAL-LOGIC-designed board embedded computers. Their modules are has solved the thermal dissipation prob- F.K. In Europe, use of leaded products small, provide relatively high performance lem. CPU performance generates heat, will be restricted beginning in summer for their size, and usually offer an excel- and its dissipation or optimized distribu- 2006. But we already have lead-free lent compromise between power con- tion is one of our main objectives. One computer boards. As soon as we can get sumption and performance. Furthermore, of the ways we do this is to use a copper all associated components such as hard the company offers a range of small and ring acting as a power dissipation radia- drives in RoHS-compliant versions, our fanless computers called MICROSPACE tor. One example of this implementation products will be lead-free from the begin- computer systems. is our smartModule board, measuring ning of 2006. But beyond components, 66 mm x 85 mm x 14 mm (2.6" x 3.3" the lead-free production process is also DIGITAL-LOGIC is x 0.6"), that has a Pentium processor more expensive. Our process must be free located in the north- working at 2 GHz (see Figure 1). I have of tin whiskers. western part of Switz- not yet seen a smaller module from our erland and supplies competition with an equivalent or better Some customers, such as the military, are customers in the areas processor. likely to remain using leaded products of industry, govern- because of their experience with quality. ment (including mili- They are prepared to pay for the 10-year tary and space), and applied sciences. guarantee that coincides with their typical Below is a recap of my recent conversation life cycle. with the company’s CEO, Felix Kunz. S.B. How is the market changing S.B. What is your market position, and for you? where do you see DIGITAL-LOGIC now? F.K. We had our revenues growing even at times of a slower growth in the mar- F.K. We are in the embedded market and ket. During 2002-2004, we experienced Figure 1 have the smallest size product of its class about 15 percent growth per year, and we on the market. I do not know of any other expect our growth to rise to 20 percent company that offers the same performance The MICROSPACE PC systems are fully or more in the next few years. We are in the same- or smaller-size product for- equipped with hard disk, DVD, and pas- growing organically, from the financial mat. This achievement is not easy. We have sive cooling system. You will find no fan, point of view, and we are a conserva- to keep to the standard interfaces, of which and everything is rock solid in this clever tive company. We keep ourselves more there are quite a few, and reducing module patented cooling concept. Other features and more debt-free, and that’s what our sizes is not easy and often even impossi- of our products include scalability, designs shareholders like. Thus, we are not plan- ble. In addition, we have to follow thermal that are built for rugged environments, and ning an IPO, as we plan to stay stable. restrictions of all sorts. a long life-cycle availability guarantee. In our business, the customer loses

18 / Winter 2005 PC/104 Embedded Solutions RSC #19 @ www.pc104online.com/rsc For large quantity projects, we cooperate new generation of products featuring the with subcontractors for assembly. GX 800LX processor. confidence if he observes too much On the technology side, we started very S.B. Where are you staying on the movement around the supplier. Over the early with RoHS, and the other challenge value chain? years, we have kept the same sales peo- is to stay close to Intel. The technology ple to service our customers and changed changes rapidly, and DIGITAL-LOGIC is F.K. We are staying with our core compe- only the products to meet their needs. focused on Intel because of product sta- tence. Our SM855 and SM915 are amaz- bility and the 10-year long life program. ing modules. As I said, we consider them In 1998 and 2000, we had a couple of As a positive example, we have 386 chips to be the world’s smallest Pentium M rounds of refinancing and invested in in stock, which is a device that has been computer modules, which are based new technologies. Since then, we’ve been running now for more than 20 years. We on the Intel 915GM chipset (533 MHz operating in a high-cost marketplace, with take care to supply our customers with front-side bus) and use the Pentium M high salaries, and we must therefore push products for up to 10 years. Only product processor at speeds from 0.6 to 2.0 GHz. the automation rate as high as possible to stability, product quality, and continued Performance is our goal, and with 2 MB make ourselves competitive with the Far new developments guarantee our leading of L2 cache, the Pentium M clocked at East production competitors. We do not position in the embedded market. 1.8 GHz reaches a performance level expect to outsource our production to off- compatible to that of a 3.4 GHz Pentium 4 shore countries. Our biggest challenge is S.B. What technology or services are to processor. Our module consumes only here, in continuing innovation, increasing be expected in the future? 6 W to 20 W. The SM915 uses the Extreme yields, and investing in people. Graphics video controller and supports F.K. DIGITAL-LOGIC will integrate DirectX 9 with up to 256 MB. Note that 90 percent of our shipments are Intel’s high-performance CPUs as dual exported, outside of Switzerland, and about core Pentiums with low power consump- We also use a sophisticated cooling con- 50 percent end up in Europe. We always tion. For medium performance and lower cept in which a cover is made out of a concentrate on top performance. With our priced applications, we will come up with high-strength, milled aluminum block own production, we are capable of assem- products featuring the AMD Geode800. with a fixed bearing system around the bling approximately 100,000 units per year, At the computer show SPS 2005, in circuit board, and it has a special cop- so we have to concentrate on niche markets. Nuremberg, we are going to introduce our per core mounted on the CPU, which is pressed tightly against the enclosure wall or against the heat sink. The unit works in the standard temperature range of -0 °C to +60 °C, screened under the E48 modules. With lower CPU clock rates such as 600 MHz, the module has also been approved for an extended temperature range of -40 °C and +85 °C. As you see, we try to always move upwards in the value chain, thus our products are easier to use and they provide cost-effective solutions to the end user.

S.B. Finally, how much software is involved in your product development?

F.K. We provide all board support packages and drivers and support all major operating systems such as VxWorks, Linux, Microsoft’s offerings, QNX, and several others.

For more information, contact Felix at: DIGITAL-LOGIC AG

Nordstrasse 11/F CH-4542 Luterbach Tel: +41-0-32-681-5800 Fax: +41-0-32-681-5801 E-mail: [email protected] RSC #20 @ www.pc104online.com/rsc Website: www.digitallogic.com

20 / Winter 2005 PC/104 Embedded Solutions RSC #21 @ www.pc104online.com/rsc Hardware Embedded motherboards Mini-ITX offers a useful alternative to traditional embedded boards

By Roland Groeneveld

Embedded systems engineers face the same question at the beginning of every project – “Which embedded system board is best suited to my application?” While custom design is technically feasible, it’s not always fiscally realistic. Among the significantly smaller than a traditional off-the-shelf open standards such as PC/104, EBX, EPIC, and the ATX PC board and suitable for many de facto 5.25" and 3.5" form factors, the Mini-ITX form factor applications where smaller, but not micro, stands out as a relative newcomer to the embedded scene. System sizing is desired. engineers are discovering the advantages of Mini-ITX. While this As compared to smaller form factors, the form factor isn’t the answer in all situations, the Mini-ITX main extra real estate on the Mini-ITX board board is emerging as a powerful alternative in the embedded creates ample space for integrated I/O. arena. The layout of the mounting holes, back panel I/O shield, and PCI slot is simi- lar to ATX-style PC boards. In fact, this VIA originally launched Mini-ITX as a ref- marketing took note, and to this day, the standardized layout has encouraged the erence design to showcase their core prod- company focuses especially on consumer rapid development of Mini-ITX specific ucts, chipsets, and processors. The enthusi- products utilizing the EPIA line of main chassis. Moreover, most Mini-ITX moth- astic response to these boards spurred VIA boards. erboards work with standard ATX power to begin commercial production. They supplies and a 20-pin ATX power con- formally launched the VIA EPIA line of This pedigree of PC similarity as well as nector. With “backward” compatibility, a Mini-ITX motherboards (see Figure 1) in consumer attractiveness are perhaps why Mini-ITX board is even useful in an ATX 2002. Shortly thereafter, Logic Supply, hard-core embedded designers have, in enclosure. Inc., a Mini-ITX distributor and solutions the past, looked suspiciously at Mini-ITX. provider, started offering this new form But with the possible exception of the mil- Morex and Casetronic are manufacturers factor and related components. itary market, we are seeing the form fac- who specialize in Mini-ITX cases. They tor used more frequently in “embedded” offer very small (mobile) cases, expand- areas. Industrial board manufacturers such able cases with PCI slots, and rackmount as Kontron, DFI-ACP, and Commell have cases. Serener has created a relatively taken notice and are now offering a range new solution – a range of fanless Mini- of solutions in 17 cm x 17 cm, many capa- ITX cases. Using heat pipe technology, ble of carrying ultra low-voltage Celeron, they make VIA C3 and Pentium M-based Pentium M, and P4 processors. systems completely fanless by bringing the heat to the side of the finned chassis Figure 1 There are both technical and business (refer to Figure 2). advantages fueling the market’s demand. The VIA Eden and C3 processors used on The appeal of the boards is derived, in Technical advantages many Mini-ITX motherboards are power- large part, from their usability. Mini-ITX Mini-ITX boards are defined by their size, boards offer all the features of a standard layout, degree of integration, and com- PC motherboard in a smaller package. patibility. As well, VIA offers a unique The form factor measures 17 cm x 17 feature known as the VIA Padlock cm (6.7" x 6.7") and frequently contains Security Suite. an integrated processor. The EPIA line was especially popular among computer At 17 cm x 17 cm, the Mini-ITX form fac- hobbyists eager for a smaller alterna- tor is hardly the smallest of the standard tive to their large desktop towers. VIA’s embedded form factors. It is, however, Figure 2

22 / Winter 2005 PC/104 Embedded Solutions RSC #23 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 23 Hardware Embedded motherboards efficient and fully x86 compatible. These ■ Windows 2000 and Windows XP ture onboard CompactFlash and PCMCIA processors are ideal for embedded appli- ■ Windows XP Embedded and slots, DVI, LVDS, RGB, Gigabit LAN, cations where those considerations are CE .NET Serial ATA, and programmable digital I/O key. For applications requiring more pro- ■ Linux, BSD ports. cessing power, Intel-based motherboards ■ Embedded Linux and RT-Linux are also available. All Mini-ITX motherboards come with a Just like a regular PC, Mini-ITX boards PCI or PCI-Express slot, and some also With full PC compatibility and mature have a range of I/O ports available: Serial, include mini-PCI, enabling additional hardware, developing software applica- parallel, USB, FireWire, keyboard/mouse, add-ons like video capture cards, extra tions is straightforward and fast. Available audio, VGA, TV and S-Video out, 10/100 network, or wireless interfaces. With the support for almost all x86-based operat- Ethernet LAN, floppy, and IDE ports are use of dual PCI riser cards, it’s possible to ing systems includes: standard. The more advanced boards fea- add two PCI cards. Most main boards use standard DDR266 or DDR400 memory or the newer and faster DDR2 memory. The high-end Mini-ITX boards offer a watch- dog timer and standard system monitoring interfaces, not unlike many embedded computer boards such as VME.

VIA EPIA Mini-ITX motherboards with the latest VIA C3, Eden, and Eden N processors offer the VIA Padlock Security Suite. This consists of an on-die hardware number generator and Advanced Cryptography Engine. The hardware number generator harvests oscillations across the die for an extremely high degree of randomness. These oscillations can be used for the creation of virtual pri- vate networks and digital certificates. The integrated cryptography engine offers on-the-fly data encryption and decryp- tion and encoding of locally stored data. The VIA Padlock Security Suite offers almost transparent encryption with minimal impact on system performance. For an overview of popular Mini-ITX motherboards, see Table 1.

Bottom line business advantages At some point during an engineer’s analysis of technical options, business considerations enter the picture. Here, the VIA pioneered solution is most compelling since the Mini-ITX form factor speeds development time, is widely available, and is in general quite economical. By using standard, off-the-shelf PC components, the development and operational cost of Mini-ITX solutions is consider- ably lower than most other embedded form factors. With a range of compatible accessories such as enclosures, power supplies, CF adapters, riser cards, and IDE adapters, it’s possible to quickly set up a working prototype without designing RSC #24 @ www.pc104online.com/rsc a custom enclosure.

24 / Winter 2005 PC/104 Embedded Solutions 673NS Supports Pentium M / Celeron M socket 479 400/533MHz FSB Intel 915GM & ICH6M 2 x 240-pin DDRII400/533 2 x Back Panel USB2 – Integrated Graphic Media Accelerator 900 Onboard LVDS Intel ICH6R 6-channel 1 x PS/2 keyboard port 1 x PS/2 mouse port COM 1 x Mini-PCI Onboard 12V 4-pin power connector 2 2 x Onboard USB2 Supports Pentium 4 / Celeron D with LGA775 800MHz FSB Intel 915G & ICH6R 2 x 240-pin DDRII400/533 4 x Back Panel USB2 2 x Back Panel 1394 Integrated Graphic Media Accelerator 900 –– Intel ICH6R 6-channel 1 x PS/2 keyboard port 1 x PS/2 mouse port 1 x Mini-PCI (bottom) style with P4 ATX power connector in ATA100 1 x 40-pin ATA100 1 x 40-pin ATA100 Onboard COM 2 x Back Panel COM 2 x Back Panel 4 / Celeron socket 478 400/533MHz FSB Intel 845GV & ICH4 1 x 184-pin DDR200/266/333 2 x Back Panel USB2 1 x Back Panel 1394 Integrated Intel Extreme Graphics Core ––– out) Intel ICH4 6-channel 1 x PS/2 keyboard port 1 x PS/2 mouse port power connector 26-pin flat cable 1 x floppy port 1 x 26-pin flat cable 1 x 26-pin flat cable 1 x 44-pin ATA100 1 x 44-pin ATA1004 x Back Panel USB2 1394 1 x 44-pin ATA100 1 x Onboard 1394 1 x Onboard 1394 Integrated VIA Unichrome Pro IGP Graphics Core with MPEG-2/MPEG-4 Accelerator Onboard DVI header 2 x 10/100 1 x 10/100 2 x 10/100 2 x Gigabit VIA CN400 & VT8237 1 x 184-pin DDR266/333/400 VIA VT1616 6-channel 1 x PS/2 keyboard port 1 x PS/2 mouse port 2 x Back Panel USB2 Integrated VIA Unichrome Pro AGP Graphics Core with MPEG-2/MPEG-4 Accelerator –––– 10/100 VIA CN400 & VT8238 2 x 184-pin DDR266/333/400 VIA VT1617A 6-channel 2 x PS/2 onboard headers USB2 Integrated VIA Unichrome Pro AGP Graphics Core with MPEG-2/MPEG-4 Accelerator VIA CN400 & VT8237 1 x 184-pin DDR266/333/400 VIA VT1617A 6-channel 1 x PS/2 keyboard port 1 x PS/2 mouse port –––1 x x –––1 6 x Onboard USB2 2 x Back Panel Integrated VIA Unichrome Pro AGP Graphics Core with MPEG-2 Accelerator VIA CLE266 & VT8237 1 x 200-pin SODIMM VIA VT1616 6-channel 2 x PS/2 onboard headers 4 x Back Panel USB2 Integrated VIA Unichrome AGP Graphics Core with MPEG-2 Accelerator VIA CLE266 & VT8237 1 x 184-pin DDR266 – – 1 x Onboard 1394 1 x Onboard 1394VIA VT1612A 2 x Back Panel 2-channel 1 x PS/2 keyboard port 1 x PS/2 mouse port –––––––– 2 x Back Panel USB2 Integrated VIA Unichrome AGP Graphics Core with MPEG-2 Accelerator 1.2GHz VIA C3VIA CLE266 & VT8236 1 x 184-pin DDR266 1.2GHz VIA C3 Panel 1394 VIA VT1616 6-channel 1 x PS/2 keyboard port 1 x PS/2 mouse port 2 x Back Panel USB2 Integrated VIA Unichrome AGP Graphics Core with MPEG-2 Accelerator ––––2 x SATA2 x SATA2 x SATA–4 x SATA2 x SATA x SATA2 x SATA–4 x SATA2 x 600MHz VIA Eden SATA2 600MHz VIA Eden1GHz VIA C3 600MHz VIA Eden 800MHz VIA Eden 1GHz VIA C3 800MHz VIA Eden Dual Processor x 1GHz VIA C3 1GHz VIA C31 x 184-pin DDR266 1GHz VIA Eden Supports Pentium 2 x 40-pin ATA133 2 x 40-pin ATA133 1.3GHz VIA C3 2 x 40-pin ATA133––––2 2 x 40-pin ATA133 1GHz VIA Eden-N 1 x floppy port 2 x 40-pin ATA133 1 x 40-pin ATA133 1 x 40-pin ATA100 1 x floppy port 1 x 40-p 2 x Onboard USB2 2 x Onboard USB2 1 x floppy port 2 x Onboard 1394 2 x Onboard USB2 1 x Back –––––– 6 x Onboard USB2 2 x Onboard USB2VT1622 2 x Onboard USB2Yes 2 x Onboard USB2 2 x Onboard USB readyLVDS VT1622AVIA VT1616 6-channel ready LVDS 1 x 10/100 Yes –1 x PS/2 keyboard ready LVDS port 1 x 10/1001 x PS/2 mouse port – ready LVDS 1 x Back Panel COM 1 x Back Panel COM 2 x 10/100 1 x Back Panel COM 2 x Onboard COM VT1622A 1 x Back Panel COM ready LVDS 1 x Back Panel COM 2 x Back Panel COM 1 x 10/100 1 x VT1623 Onboard header 1 x 10/100 Yes VT1623 1 x Gigabit, 2 Yes – – Chrontel CH7011 – (disables TV Yes Chrontel CH7011 Fanless (600MHz) Fanless (600MHz)Fan (1GHz) Fanless (600MHz)VIA CLE266 Fanless (.8 & 1GHz)& VT8235 Fanless (800MHz) Fan (1 & 1.2GHz) Fan (1GHz) Fan (1GHz) Fan (1GHz) Fan (1.3GHz) Not included Single Fan Not included Fan 1 x Onboard COM 1 x Onboard COM1 x Parallel port 3 x Onboard COM1 x PCI 1 x Onboard header 1 x Parallel port 1 x Onboard header– 1 x Onboard header – 1 x PCI– styleATX 1 x Onboard COM 1 x PCI 1 x Onboard COM style ATX 1 x CompactFlash 2 x Onboard COM – – 1 x PCMCIA slot style ATX 1 x PCI 1 x Parallel port 1 x CompactFlash style ATX 1 x PCI – – style ATX 2 x PCI – style ATX – 1 x PCI style ATX 1 x CompactFlash 1 x PCI – style with P4 ATX 1 x PCI Express 1 x PCI Express – – USB Model VIA EPIA M VIA EPIA MII VIA EPIA PD VIA EPIA MS VIA EPIA SP VIA EPIA DP Commell LV-667D Commell LV-670 Commell LV-672 Commell LV- Processor Memory IDE Serial ATA Floppy Firewire (1394) VGA DVI TV Out S-Video Out LVDS Audio LAN Keyboard/ Mouse Serial Port Processor Cooling Chipset Parallel Port PCI Slot CF Slot PCMCIA Power Supply

Table 1 PC/104 Embedded Solutions Winter 2005 / 25 26 / Winter 2005 PC/104 Embedded Solutions RSC #26 @ www.pc104online.com/rsc Hardware

Tens of thousands of VIA boards are to “hot swap” units if they need to sold each month in Asia, Europe, and update the software. the United States. The popularity of the ■ Communications – A broadcast board among consumers and engineers telephony company employs a Mini- has resulted in a range of different main ITX board as the basis for one of its boards from which to choose. The broad codecs, and a wireless networking appeal of the product ensures availability company uses a Mini-ITX system as and shortens lead times. its mesh network box. ■ Digital signage – A satellite-based Retail prices for VIA Mini-ITX boards digital signage company uses a range from $129-225. Prices for Pentium M Mini-ITX product as the plasma and P4-compatible boards are higher, but display engine, powering static and few break $400. While there are certainly multimedia content. other form factors that offer comparable ■ Dedicated appliance – A software per unit costs, most require upfront devel- company specializing in license plate opment costs that Mini-ITX minimizes. recognition offers its customers a complete (software plus hardware) Applications and examples solution, including an appliance based As a solution provider specializing in around the Mini-ITX form factor. the Mini-ITX form factor, Logic Supply ■ Mobile computing – A security com- regularly works with engineers to develop pany uses Mini-ITX systems to create and refine Mini-ITX-based systems. a mobile video recording and trans- Customers are using Mini-ITX systems mitting unit for law enforcement. as the engine to capture video security data, power home automation appliances, Mini-ITX-based systems can be tougher run kiosk and point-of-sale systems, and than one might suppose. Processor fans, serve as robots’ “brains.” We are certainly enclosure fans, and hard drives are typi- seeing them used as digital entertainment cal points of failure. Fanless solutions devices, set-top boxes, personal PCs and are best suited to harsh environments, servers, and thin clients. However, an and a fanless, solid state system (utiliz- analysis of our customer base revealed ing flash memory) is ideal. Fortunately, that these consumer-oriented and PC-like both fanless and solid state systems are applications are actually less pervasive easy to create in this form factor. The than one might suppose. low-power, low-heat characteristic of Mini-ITX enabled the development The following are examples of our cus- of several lines of fanless cases. These tomer base using Mini-ITX in tradition- enclosures make it possible to create ally embedded arenas: an extremely rugged and reliable solution for harsh environments and other ■ Date logging – A Florida engineering embedded solutions. firm uses Mini-ITX systems inside a NEMA enclosure to measure and The future of Mini-ITX monitor the structural integrity of VIA is planning a range of new Mini-ITX Department of Transportation-run motherboards with their highly efficient, state bridges. low-power C7 processor. These mother- ■ Industrial control – A Maine paper boards will include the latest technology mill utilizes a Mini-ITX fanless sys- such as SATA, DDR2 400/533 memory, tem in its pulp room, where dust and Gigabit Ethernet, DVI, and mini-PCI chemicals will, in the words of the slots. Also planned is the new High mill’s IT director, “break down a Dell Definition Multimedia Interface (HDMI), in three months.” which offers eight-channel digital audio, ■ Kiosk – A PC-based ATM manu- high definition video, and data (including RSC #27 @ www.pc104online.com/rsc facturer uses embedded VIA boards I2C data). HDMI is backwards-compat- inside their cash machines. A gaming ible with DVI, but it uses a much smaller kiosk manufacturer is using enclosed connector, which is always good news for Mini-ITX systems, enabling them the embedded market.

PC/104 Embedded Solutions Winter 2005 / 27 28 / Winter 2005 PC/104 Embedded Solutions RSC #28 @ www.pc104online.com/rsc Hardware

Other manufacturers like Kontron, DFI- temperature swings, high vibration situ- ACP, iBASE, and Commell are focusing ations, and deployments lasting more their Mini-ITX efforts mainly around than five years. However, Mini-ITX lends Intel processors. ULV, Celeron M, and itself easily and reliably to many applica- Pentium M processors allow for more tions traditionally viewed as core to the powerful solutions while maintaining embedded market. For less extreme uses, low power usage and heat dissipation. Mini-ITX offers a useful alternative to Pentium 4 solutions are also available, but often-employed solutions. generally the power and cooling requirements are difficult to combine with small Links size requirements. VIA Embedded – www.viaembedded.com Mini-ITX information – www.epiapenter.com Logic Supply – www.logicsupply.com VIA’s long-awaited Nano-ITX mother- HDMI – www.hdmi.org board will finally become available at the end of this year. Measuring 12 cm x Roland Groeneveld is founder and 12 cm (4.7" x 4.7"), this motherboard is president of Logic Supply, Inc., a even smaller than the Mini-ITX, while Mini-ITX distributor and solutions maintaining full PC compatibility. The provider. His background is in global Nano-ITX is designed around the VIA IT consultancy with LogicaCMG in Luke CoreFusion processor, which has an Europe and IT management at integrated Northbridge. With integrated Tiscali, a large European ISP. He has audio, video, LAN, SATA, and much degrees in electrical engineering and more, it is poised to be the smallest mul- computer science. timedia-capable single board computer available on the market. For a comparison To learn more, contact Roland at: of ATX, Mini-ITX, and nano-ITX main boards see Figure 3. Logic Supply, Inc. 35 Crossroad Embedded engineers will continue to Waterbury, VT 05676 weigh the pros and cons of their system Tel: 802-244-8302 board choices. There are certain appli- Fax: 802-244-7938 cations where the PC/104, EBX, EPIC, E-mail: [email protected] and other boards shine: Think extreme Website: www.logicsupply.com

Nano

Mini

RSC #29 @ www.pc104online.com/rsc

Figure 3

PC/104 Embedded Solutions Winter 2005 / 29 Technology Sensors Interpolating DACs offer high speeds, but are they controllable?

By Scott Hames

Current state-of-the-art software defined radio transmit techniques typically involve synthesis of signals at the Intermediate Frequency (IF) or, even in some cases, such as High Frequency (HF) and Very High Frequency (VHF), at the Radio Frequency (RF). Such synthesis demands data streaming arbitrarily across channels for transmit beam forming was highly desirable, if to the Digital Analog Converter (DAC) input at very high rates, possible. approaching 1 GHz in some cases. Supplying data at these rates is a serious challenge, even between components on the same The need for user control board. To alleviate the problems of moving data at high speed and Because the DAC in question was operat- simplifying system design, DAC manufacturers are offering parts ing as a quadrature upconverter, it relied on an internal DDS NCO. This operation that include on-chip clock multipliers, Direct Digital Synthesis produced the intermediate frequency for Numerically Controlled Oscillators (DDS/NCOs), interpolating modulation by the incoming data. The filters, and mixers. The theory is that by digitally performing the phase of any signal generated at the DAC final upconversion on the DAC chip, the user need only supply output would depend on the phase of the baseband data and the phase of the DDS data at the baseband rate. Furthermore, the programmable NCO. Unfortunately, even if the onboard NCO can bring substantial flexibility to the hardware, enabling logic perfectly controlled the input data software control for spread spectrum techniques such as timing, the NCO was free running after frequency hopping. While these features provide obvious benefits, chip release from the reset condition. The there are subtle caveats that should be noted when specifying user could not reset the phase of the NCO to zero, or any other known point, on DACs for phase-sensitive applications. demand. Ideally, the requirement was to use the variable Pulse Repetition Interval Experimenting with digital trolling the internal DUC functions of (PRI) trigger input to restart the NCO, so upconverter DACs these parts. This limitation eliminates the that every pulse was identical. Two nec- Phased array radar is a prime example possibility of ensuring that the outputs are essary features that simply did not exist of a phase-sensitive application that truly synchronous. In many applications, were: requires exact synchronization of mul- they do more harm than good. tiple DAC outputs across multiple trigger ■ A register in the chip that would allow events. In the past, it was commonplace At ICS, we have performed an extended specification of the starting phase of to use “standard” DACs – simple but fast evaluation of a particular 200 MHz inter- the DDS NCO devices that enabled clock and data input polating DAC – but have had to abandon ■ An NCO_SYNC pin on the device control. However, the problem was ensur- the effort. The DAC in question includes that would clear the phase accumula- ing clock and data stream synchroniza- all the features previously listed, includ- tor and allow arbitrary synchronization. As DAC conversion rates increased ing an on-chip clock multiplier, DDS tion based on an external event beyond about 300 MHz, keeping the NCO, interpolating filters, and mixers. clock and data rates down to manageable Although it has been very successful Difficulties with synchronization levels drove experimentation with what in some applications, it has been a total On-chip clock multipliers are another could be called interpolating or digital failure in phase-sensitive situations. One feature that adds risk to phase-sensitive upconverter DACs – devices that accept target application was generating a radar multichannel designs. Many high-speed data at the baseband rate, and then per- system FM chirp pulse. It was critical that DACs accept a low-speed clock and mul- form Digital UpConversion (DUC) func- the phase and timing of the output be the tiply it up to a much higher speed inter- tions on the chip, before generating the same (sub-nanosecond consistency) from nal clock. This process is risky because analog output. Unfortunately, in most one trigger to the next, and across multi- in multichannel systems, each chip usu- cases, the user is limited in precisely con- ple channels. Also, the ability to set phase ally generates its own high-speed inter-

30 / Winter 2005 PC/104 Embedded Solutions PC/104RSC Embedded #31 @ www.pc104online.com/rsc Solutions Winter 2005 / 31 32 / Winter 2005 PC/104 Embedded Solutions RSC #32 @ www.pc104online.com/rsc Technology

“...the high want to ensure that they have access to all of these controls. speeds offered by Solution built around GrayChip many of today’s products A solution that has worked was a separate interpolating DDC ASIC from GrayChip (now owned DACs are by Texas Instruments) that converted the baseband input data to the final inter- superficially mediate frequency before feeding it to a standard DAC. The GrayChip 4116 and attractive, but 5016 in particular were outstanding products, with an excellent implementation implementation of all the features previously mentioned (DDS NCOs, interpolating filters, mixers) in real-world and more. A multilevel synchronization scheme enables internal or external syn- applications chronization of virtually every parameter requires a deep in the signal processing chain. Although this scheme puts responsibility for proper understanding control of the device squarely on the system designer or application programmer, of how they and the learning curve is substantial, it is extremely powerful in the hands of an work and their experienced user.

limitations. . .” In summary, the high speeds offered by many of today’s interpolating DACs are nal clock using a Phased Lock Loop superficially attractive, but implementa- (PLL). Since each PLL will lock up at a tion in real-world applications requires slightly different time after the clock is a deep understanding of how they work applied, changed, or the chips are reset, and their limitations if the systems the DAC clocks will always be different. designer is to be able to take advantage Furthermore, after the high-speed clock is of them. generated, it is often contained within the chip, so that no other equipment, such as Scott Hames is Director of Product other DACs, can be synchronized with it. Management, Interactive Circuits and If there is to be a clock multiplier on chip, Systems, Ltd., Ottawa, Canada. ICS it is imperative that it has the ability to is a member of Radstone Embedded deliver the full-speed conversion clock to Computing. Scott’s 11 years at ICS the outside world, not a low-speed deriva- have included positions in hardware, tive of it. test, and field applications engineering. As well as qualifications in electronics, Other parts of the processing chain that Scott holds an MBA from the Richard will affect the phase of the signal are, Ivey School of Business, University of for example, interpolation counters and Western Ontario. Finite Impulse Response/Infinite Impulse Response/Cascaded Integrator Comb For more information, contact ICS (FIR/IIR/CIC) filter pipelines. The state directly: of the interpolation counter determines when new data is accepted into the pipe- ICS line. Unless the counter state can be 5430 Canotek Road controlled based on external conditions, Ottawa, Ontario K1J9G2 RSC #33 @ www.pc104online.com/rsc phase uncertainty exists. In addition, if Canada old, invalid data is not flushed from filter Tel: 800-267-9794 pipelines, it could corrupt the new input. E-mail: [email protected] Designers of phase-sensitive systems will Website: www.ics-ltd.com

RSC #35 @ www.pc104online.com/rsc 2006 PC/104 BUYER’S GUIDE

BOARD LEVEL Chips & Cores: Other DSP Resource Boards: TIM Component-level modules DSP Resource Boards: PC/104-Plus Bridge: PC/104 to DeviceNet DSP algorithm Bridge: PC/104 to ISA DSP Resource Boards: PC/104 Bridge: PC/104 to PC/104 Bridge: PCI-to-ISA Bridge: Other bridges Chips & Cores: Bus interface I/O: Analog Chips & Cores: FPGA I/O: Digital Chips & Cores: Media SoC DSP Resource Boards: PCI-104 Chips & Cores: Pentium TABLE OF CONTENTS TABLE

I/O: FPGA I/O: Industrial

I/O: Multifunction Memory: Flash Memory: General purpose

Memory: Reflective PCMCIA/CardBus PCMCIA/PC card Structured ASIC System Boards

Other Module <100cm2

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36 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE

Remote access TABLE OF CONTENTS CARRIER BOARDS FABRICS Routers/Switches ETX Servers Fabrics: Fibre channel IP Software: Middleware Fabrics: RapidIO PC/104 Software defined radio Fabrics: StarFabric PC/104-Plus Telecom: T1/E1 Turnkey system PACKAGING COMMUNICATIONS Voice: VoIP Air Transport Rack (ATR) Wireless Backplane Datacom: ARCNET Wireless: GPS Backplane accessories Datacom: Ethernet Wireless: GSM/GPRS Backplane: Other Datacom: FDDI Datacom: General Datacom: GPIB/MXI Datacom: LAN Datacom: Security Datacom: Serial controller

Datacom: USB controller

Datacom: WAN Datacom: WLAN Embedded Internet Internet appliances Modem/Fax modem

Optical RSC #37 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 37 2006 PC/104 BUYER’S GUIDE

Battery ESD management PROCESSOR BOARDS Board accessories IEEE 1394 (FireWire) Card rack + card cage Keypad/Keyboard interface 386SX Card rack accessories Power: General 80C188EB Card rack/subrack Power supply AMD SC520 Connectors: Backplane Power-fail module C3 Connectors: Hard metric Production tools Celeron Connectors: PC/104 SCSI controller Celeron M Connectors: Other SCSI peripheral Coldfire Enclosure Shelf and mechanical components Crusoe Enclosure + card rack System monitoring Cyrix Enclosure + card rack + power supply Thermal management Eden TABLE OF CONTENTS TABLE ELAN Ezra Geode Hitachi SH Family MPC5200 Multiple MPU Pentium

Pentium 4 Pentium II Pentium III Pentium M Pentium MMX PowerPC PowerQUICC RISC SC520 Socket 370 Socket 7 STPC Consumer STPC Elite STPC Industrial STPC-ATLAS STPC-Client x86

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38 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE

XScale TEST AND ANALYSIS GPS/Precision time code TABLE OF CONTENTS Other LVDT/RVDT stimulus and measurement Counter/timer Signal conditioner RUGGEDIZED/MIL-SPEC Digital-to-synchro Synchro-to-Digital Data acquisition ARINC Test systems Avionics Waveform digitizers/Digital oscilloscopes MIL-STD-1553 Waveform generator

Telemetry

SOFTWARE & DEVELOPMENT

Bus analyzer Development platform Development tools IDE JTAG Prototyping and debugging aids

Software: Application Software: Board support packages Software: Compilers Software: Development tool Software: Java Software: Library Software: Linux Software: Modeling tool Software: Networking Software: Operating system

Software: Protocol stack System integration services RSC #39 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 39 BOARD LEVEL 2006 PC/104 BUYER’S GUIDE

Bridges Chips & Cores DSP Boards I/O Memory

Company Name BOARD LEVEL BOARD PC/104 to DeviceNet PC/104 to ISA PC/104 to PCI-to-ISA Other bridges Bus interface FPGA Media SoC Pentium Other chips & cores PC/104 PC/104-Plus PCI-104 TIM Analog Digital FPGA Industrial Multifunction Flash General purpose Reflective ABIA Technology • ACCES I/O Products ••••• Acromag • ACS-Tech 80 • ADLINK Technology ••• Advanced Digital Logic Advantech •• Ampro Computers •• Andor Design Aprotek •• APS • Aquarela Systems • Arbor Technology •• Arcom Control Systems • Arista Arius • ASRC • Axiomtek ••• BittWare • Blue Chip • CCII Systems • Centralp Automatismes Comark •• •• Commtech •• CyberResearch • Data Device • Data I/O • Datalight • Dataram • Derivation Systems • Diamond Systems •• • Douglas Electronics • DPAC Technologies • DSP Design •• • DSP Systems Eagle Technology • EEPD North America • EL Technology EMAC ••••• Embedded Designs Plus •• Enseo esd • EuroTecH Evalue Technology •

Continued on page 42

40 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE BOARD LEVEL BOARD LEVEL

Other

Website PCMCIA/CardBus PCMCIA/PC card Structured ASIC System Boards Other module <100cm2 Component-level modules DSP algorithm • www.abiatech.com www.accesio.com www.acromag.com www.acs-tech80.com www.adlinktech.com • www.digitallogic.com •• www.advantech.com • www.ampro.com • www.andordesign.com www.aprotek.com www.associatedpro.com www.aquarelasystems.com • www.arborsolution.com www.arcomcontrols.com •• www.aristaipc.com www.arius.com www.akspace.com/home.htm RSC #4101 @ www.pc104online.com/rsc • www.axiomtek.com www.bittware.com www.bluechiptechnology.co.uk www.ccii.co.za • www.centralp.com www.comarkcorp.com www.commtech-fastcom.com www.cyberresearch.com www.ddc-web.com www.dataio.com www.datalight.com www.dataram.com www.derivation.com www.diamondsystems.com www.douglas.com www.dense-pac.com • www.dspdesign.com • www.dspsystems.com www.eagle.co.za •• www.eepd.com • www.eltechnology.com • www.emacinc.com www.embedded-designs-plus.com • www.enseo.com www.esd-electronics.com • www.eurotech.it • www.evalue-tech.com

RSC #4102 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 41 BOARD LEVEL 2006 PC/104 BUYER’S GUIDE

Bridges Chips & Cores DSP Boards I/O Memory

Company Name BOARD LEVEL BOARD PC/104 to DeviceNet PC/104 to ISA PC/104 to PCI-to-ISA Other bridges Bus interface FPGA Media SoC Pentium Other chips & cores PC/104 PC/104-Plus PCI-104 TIM Analog Digital FPGA Industrial Multifunction Flash General purpose Reflective General Standards •• •• Grid Connect • Hectronic ICOP Technology •• Intel • Intelec Technologies Jacyl ••• JS Automation • Kane Computing • Kaxillion • Kontron •• Lanner Electronics • Lattice Semiconductor Corporation • LAVA Computer Manufacturing • LSI Logic Mango DSP •• Measurement Computing •• Mesa Electronics •• •• • Micro Industries • Micro Technic • Micro/sys ••• Microcomputer Systems •• MPL M-Systems •• Nallatech • Octagon Systems •• • • Parvus •• Phoenix Contact • PHYTEC America • Rapid Controls • Ricoh Electronics, Inc. Robotrol • Rochelle Communications • RPA • RTD ••••• S&K Electronics • SBS Technologies • SCIDYNE • • • Sealevel Systems • Sensoray •• Sheldon Instruments •• Signalogic • SSV Software Systems •• • Sundance •••

Continued on page 44

42 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE BOARD LEVEL BOARD LEVEL

Other

Website PCMCIA/CardBus PCMCIA/PC card Structured ASIC System Boards Other module <100cm2 Component-level modules DSP algorithm www.generalstandards.com www.synergetic.com • www.hectronic.se • www.icop.com.tw www.intel.com • www.intelec-tech.com www.jacyltechnology.com www.automation.com.tw www.kanecomputing.com www.kaxillion.com • www.kontron.com www.lannerinc.com www.latticesemi.com www.lavalink.com • www.lsilogic.com www.mangodsp.com www.measurementcomputing.com RSC #4301 @ www.pc104online.com/rsc www.mesanet.com www.microindustries.com www.micro-technic.com • www.embeddedsys.com www.microcomputersystems.com • www.mpl.ch www.m-sys.com www.nallatech.com www.octagonsystems.com • www.parvus.com www.phoenixcontact.com www.phytec.com www.rapidcontrols.com • www.ricoh.com www.robotrolcorp.com www.rochelle.com www.rpaelectronics.com • www.rtdusa.com www.skecorp.com www.sbs.com www.scidyne.com www.sealevel.com www.sensoray.com www.sheldoninst.com www.signalogic.com • www.ssv-embedded.de • www.sundance.com

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Bridges Chips & Cores DSP Boards I/O Memory

RSC #44 @ www.pc104online.com/rsc

44 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE BOARD LEVEL BOARD LEVEL

Other

Website PCMCIA/CardBus PCMCIA/PC card Structured ASIC System Boards Other module <100cm2 Component-level modules DSP algorithm • www.technoland.com www.embeddedARM.com www.tri-m.com • www.versalogic.com www.virtium.com www.vistaelectronics.com www.vmetro.com • www.voxtechnologies.com www.fapo.com www.wdlsystems.com www.whiteedc.com • www.win-ent.com • www.winsystems.com • www.woodhead.com • www.zendex.com www.ztec-inc.com RSC #4501 @ www.pc104online.com/rsc

Editor’s Choice Product Room for everything: 8-Gbit NAND Flash It’s in your cell phone, PDA, MP3 player, and TV remote. And increasingly, it’s designed into PC/104 and embedded boards and systems. What is it? It’s NAND Flash, of course.

It used to be that nonvolatile storage involved rotating disks, battery-backed SRAM, expensive E2PROM, or awkward-to-erase UV EPROMs. But high-density NAND Flash has changed all of that with its cost-effective and increasingly dense nonvolatile storage capacity. Industry leader Micron Technology is helping to drive the market for embedded, highest-density NAND Flash ICs. The company is now shipping 4-Gbit and 8-Gbit devices in 3.3 V flavors and industry-standard 48-pin TSOPs.

The 8-Gbit MT29F8G08FABWP is organized as a 1 Gbit x 8 device, while the 4 Gbit (MT29F4G08BABWP and MT29F4G16BABWP) is available in either 512 Mbit x 8 or 256 Mbit x 16 versions.

Micron Technology www.micron.com RSC #24361 RSC #4502 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 45 COMMUNICATIONS 2006 PC/104 BUYER’S GUIDE

Datacom General

Company Name Website ARCNET Ethernet FDDI General GPIB/MXI LAN Security Serial controller USB controller WAN WLAN Embedded Internet Internet appliances Modem/Fax modem Optical Remote access Routers/Switches Servers Software: Middleware Software defined radio T1/E1 Telecom: system Turnkey Voice: VoIP Wireless Wireless: GPS Wireless: GSM/GPRS 3J Tech • www.3jtech.com 4DSP • www.4dsp.com AAEON Electronics •• www.aaeon.com ABIA Technology • www.abiatech.com COMMUNICATIONS Accelent Systems • www.accelent.com ACCES I/O Products • www.accesio.com ADLINK Technology • www.adlinktech.com Advanced Digital Logic ••••• www.digitallogic.com Advanced Micro Periph. •• www.ampltd.com Advantech ••• www.advantech.com AeroComm www.aerocomm.com Ampro Computers •• www.ampro.com Appliance-Lab • www.app-lab.com Aprotek •• • www.aprotek.com Arbor Technology •• www.arborsolution.com Arista ••www.aristaipc.com Avocent Corporation • www.avocent.com Axiomtek • www.axiomtek.com Bihl+Wiedemann • www.bihl-wiedemann.de C2I2 Systems •• • • • www.ccii.co.za Comark •• www.comarkcorp.com Commtech •• www.commtech-fastcom.com Connect Tech • www.connecttech.com Contemporary Controls • www.ccontrols.com Copeland Communications •• www.copelandcommunications.com CyberResearch •• www.cyberresearch.com Datalight • www.datalight.com DataLink Technologies • www.dltech.net Designtech Engineering • www.designtechengineering.com Diamond Systems •• www.diamondsystems.com DSP Design ••• www.dspdesign.com DSS Networks • www.dssnetworks.com Dynamic Engineering • www.dyneng.com EEPD North America • www.eepd.com EMAC •••• •• • www.emacinc.com Embedded Designs Plus •• www.embedded-designs-plus.com emBoot • www.emboot.com Emtrion • www.emtrion.com EuroTecH •••••www.eurotech.it Gallantry • ww.gallantry.com General Standards • www.generalstandards.com GoAhead Software • www.goahead.com Hardent • www.hardent.com Hectronic • www.hectronic.se ICOP Technology •• www.icop.com.tw

46 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE COMMUNICATIONS COMMUNICATIONS

Datacom General

RSC #4701 @ www.pc104online.com/rsc RSC #4702 @ www.pc104online.com/rsc RSC #4703 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 47 COMMUNICATIONS 2006 PC/104 BUYER’S GUIDE

Datacom General

RSC #48 @ www.pc104online.com/rsc

48 / Winter 2005 PC/104 Embedded Solutions RSC #49 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 49 PACKAGING 2006 PC/104 BUYER’S GUIDE

Backplane Card Rack Connectors Other

Company

PACKAGING Name Backplane Backplane accessories Backplane: Other Card rack + card cage Card rack accessories Card rack/subrack Backplane Hard metric PC/104 Other Shelf and mechanical components System monitoring Thermal management Rack (ATR) Air Transport Battery Board accessories ESD management IEEE 1394 (FireWire) Keypad/Keyboard interface Production tools AAEON Electronics Absopulse Electronics Advanced Digital Logic • • Advanced Industrial Computer • Advantech Amphenol • Ampro Computers • AMREL apra-norm APS Arbor Technology Arcom Control Systems Astron • Axiomtek •• Bestan • C I Systems • C&D Technologies CCII Systems • Centralp Automatismes • Comark Comm Con Connectors • Cooler Master • Data Device Diamond Systems •• Douglas Electronics • Dynamic Engineering • EEPD North America ELMA Electronic EMAC Embedded Designs Plus ••• EnerSys • Enseo • EPT USA • ERNI • EuroTecH • Hapco •

Continued on page 52

50 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE PACKAGING PACKAGING

Enclosures Power SCSI

Website Enclosure Enclosure + card rack Enclosure + card rack power supply General Power supply module Power-fail SCSI controller SCSI peripheral • www.aaeon.com •• www.absopulse.com •• www.digitallogic.com www.aicipc.com • www.advantech.com www.amphenol.com www.ampro.com • www.amrel.com • www.apra.de • www.advpower.com •• www.arborsolution.com • www.arcomcontrols.com www.astron-us.com • www.axiomtek.com www.bestan.com www.ccii.co.za • www.cd4power.com www.ccii.co.za www.centralp.com • www.comarkcorp.com www.commcon.com www.coolermaster.com • www.ddc-web.com ••• www.diamondsystems.com www.douglas.com www.dyneng.com • www.eepd.com • www.elma.com • www.emacinc.com www.embedded-designs-plus.com www.enersys.com www.enseo.com www.ept.de www.erni.com • www.eurotech.it www.hapco.com

RSC #51 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 51 PACKAGING 2006 PC/104 BUYER’S GUIDE

Backplane Card Rack Connectors Other

Company

PACKAGING Name Backplane Backplane accessories Backplane: Other Card rack + card cage Card rack accessories Card rack/subrack Backplane Hard metric PC/104 Other Shelf and mechanical components System monitoring Thermal management Rack (ATR) Air Transport Battery Board accessories ESD management IEEE 1394 (FireWire) Keypad/Keyboard interface Production tools Hardent HARWIN • Hirose Electric • ICOP Technology • Intelligent Instrumentation • Keystone Electronic • Kontron •• • Lambda Electronics LTS • Micro Technic Micro/sys • • Mindready Solutions • MMT Machrone • MPL • M-Systems Parvus ••• • •• • • Phihong Polyonics • Radian Heatsink •• RAF Electronic Hardware • RTD • • Sabritec • Samtec •• Sealevel Systems • Sensoray Simon Industries • SMA • StacoSwitch • Steinhoff Automations Symmetrix Technologic • Teka Interconnection ••• Tri-M Systems • Tyco Electronics •• VersaLogic • Vesta Technology • WinSystems • Zendex •

52 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE PACKAGING PACKAGING

Enclosures Power SCSI

Website Enclosure Enclosure + card rack Enclosure + card rack power supply General Power supply module Power-fail SCSI controller SCSI peripheral www.hardent.com www.harwin.com www.hirose.com •• www.icop.com.tw www.instrument.com www.keyelco.com •• www.kontron.com • www.lambdapower.com www.ltsusa.com • www.micro-technic.com • www.embeddedsys.com www.mindready.com www.machrone.com www.mpl.ch •• www.m-sys.com •• •• www.parvus.com • www.phihong.com www.polyonics.com www.radianheatsinks.com www.rafhdwe.com ••• www.rtdusa.com www.sabritec.com www.samtec.com www.sealevel.com • www.sensoray.com www.simonindustries.com www.SMAcomputers.com www.stacoswitch.com • www.steinhoff.de • www.symtx.com ••• www.embeddedx86.com www.tekais.com •• •• www.tri-m.com www.tycoelectronics.com •• www.versalogic.com www.vestatech.com •••• www.winsystems.com www.zendex.com

PC/104 Embedded Solutions Winter 2005 / 53 RSC #53 @ www.pc104online.com/rsc PROCESSORS 2006 PC/104 BUYER’S GUIDE

Company Name 80C188EB 386SX AMD SC520 C3 Celeron Celeron M Coldfire Crusoe Cyrix Eden ELAN Ezra Geode Hitachi SH Family MPC5200 Multiple MPU Pentium Pentium 4 Pentium II Pentium III Pentium M Pentium MMX PowerPC PowerQUICC AAEON Electronics •••• ABIA Technology •• •

PROCESSORS Acrosser Technology ••• Actis • ADLINK Technology •••• Advanced Digital Logic • • • ••• Advanced Industrial Computer • Advanced Micro Peripherals • Advantech • • •• •• ••• Amer.com USA •• American Predator • Ampro Computers •• ••• ANT Computer •• Appliance-Lab Applied Data Systems Arbor Technology • •••• • Arcom Control Systems •• •• ••• Arise •• • Arista •• •• Arraid • Asine •• Atio Systems, Inc. • Axiomtek ••• Bagotronix Blue Chip •• BWI • Centralp Automatismes Comark ••• COMMELL • CompuLab • Concurrent Technologies • Cybernetic Micro Systems CyberResearch • Densitron •• • Diamond Point • Diamond Systems •• Diversified Technology • DResearch DSL DSP Design •• EEPD North America • ••• EL Technology • ELTEC Electronik •• EMAC • Embedded Planet •• Emtrion •• EuroTecH ••• Evalue Technology •••••• Evoc Technology Eyecross • Eyring Fastwel • Continued on page 56 54 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE PROCESSORS

Website RISC SC520 Socket 370 Socket 7 STPC Consumer STPC Elite STPC Industrial STPC-ATLAS STPC-Client x86 XScale Other • ••• • www.aaeon.com • www.abiatech.com •• www.acrosser.com www.actis-computer.com www.adlinktech.com • www.digitallogic.com www.aicipc.com • www.ampltd.com • • ••• www.advantech.com www.amer.com www.americanpredator.com • www.ampro.com • www.antcomputer.com • www.app-lab.com ••www.applieddata.net • www.arborsolution.com •• www.arcomcontrols.com • www.arisecomputer.com • www.aristaipc.com www.arraid.com www.asinegroup.com • www.atiosys.com •• www.axiomtek.com • www.bagotronix.com • www.bluechiptechnology.co.uk www.bwi.com •• www.centralp.com • www.comarkcorp.com www.commell-sys.com www.compulab-systems.com www.gocct.com • www.controlchips.com • www.cyberresearch.com • www.densitron.com www.dpie.com • www.diamondsystems.com www.dtims.com • www.dreseach.de • www.dsl-ltd.co.uk • www.dspdesign.com www.eepd.com www.eltechnology.com www.eltec.com www.emacinc.com www.embeddedplanet.com • www.emtrion.com • www.eurotech.it • www.evalue-tech.com • www.evoc.com • www.eyecross.com • www.eyring.com www.fastwel.com RSC #55 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 55 PROCESSORS 2006 PC/104 BUYER’S GUIDE

PROCESSORS GE Fanuc Automation • General Micro Systems •• GESPAC ••• • Global American •• Hectronic ••• iBase Technology • ICOP Technology Intelec Technologies Intelligent Instrumentation Kontron • • •• • • •••••• Lanner Electronics •• LiPPERT Automationstechnik •••• Matrix Dynamics LLC Megatel • MEN Micro ••••• Mercury Computer Systems • Mesa Electronics Micro Computer Specialists Micro Digital • Micro Industries Micro/sys •• Microbus •• Microcomputer Systems •• MPL ••• Nagasaki IPC Technology •••• Nagasaki USA • Nematron • NEXCOM International • Octagon Systems •• ••• Parvus ••• PFU Systems •• PHYTEC America Protech Systems •• RTD • SBS Technologies • SECO •••• Sensoray • SMA • Sundance • Technoland ••• •• Technologic Tern TME ••••• Tri-M Systems • VersaLogic • • • • ••• WIN Enterprises ••••• WinSystems •• • • • Xycom • Zendex ZF Micro Solutions

56 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE PROCESSORS PROCESSORS

Website RISC SC520 Socket 370 Socket 7 STPC Consumer STPC Elite STPC Industrial STPC-ATLAS STPC-Client x86 XScale Other ••www.gallantry.com • www.gateworks.com www.gefanuc.com/embedded www.gms4vme.com ••••• www.gespac.ch www.globalamerican.com www.hectronic.se www.ibase-i.com.tw • www.icop.com.tw • www.intelec-tech.com • www.instrument.com •••• www.kontron.com • www.lannerinc.com www.lippert-at.com RSC #57 @ www.pc104online.com/rsc • www.matrixdynamics.com www.megatel.ca www.menmicro.com OpenSystems Publishing www.mc.com Advertising/Business ofﬁ ce: • www.mesanet.com 30233 Jefferson Avenue • www.mcsi1.com St. Clair Shores, MI 48082 www.smxinfo.com Tel: 586-415-6500 ■ Fax: 586-415-4882 • www.microindustries.com ••••www.embeddedsys.com Vice President Marketing & Sales www.microbus.com Patrick Hopper • www.microcomputersystems.com [email protected] •• www.mpl.ch • www.nagasakiipc.com Senior Account Manager www.nagasakiusa.com Dennis Doyle www.nematron.com [email protected] www.nexcom.com ••• www.octagonsystems.com Account Manager • www.parvus.com Tom Varcie www.PFUsystems.com [email protected] • www.phytec.com Print and Online Marketing Specialist www.Protech.com.tw Christine Long • www.rtdusa.com [email protected] www.sbs.com • www.seco.it Advertising/Marketing Coordinator www.sensoray.com Andrea Stabile www.SMAcomputers.com [email protected] • www.sundance.com • www.technoland.com European Bureau Chief ••www.embeddedARM.com Stefan Baginski • www.tern.com [email protected] www.tme-inc.com •• www.tri-m.com Account Manager • www.versalogic.com Doug Cordier •• www.win-ent.com [email protected] •• www.winsystems.com • www.xycom.com Business Manager Karen Layman •• www.zendex.com • www.zfmicro.com For reprints call the sales ofﬁ ce: 586-415-6500

PC/104 Embedded Solutions Winter 2005 / 57 58 / Winter 2005 PC/104 Embedded Solutions RSC #58 @ www.pc104online.com/rsc 2006 PC/104 BUYER’S GUIDE RUGGEDIZED RUGGEDIZED CARRIER BOARDS

Fabrics Ruggedized

Company Name Website Fibre channel RapidIO StarFabric ARINC Avionics MIL-STD-1553 Telemetry AIM-USA • www.aim-online.com Andor Design •• www.andordesign.com Avalon • www.avalondefense.com Advanced Digital Logic • www.digitallogic.com Ballard Technology •• www.ballardtech.com BMC Communications ••• www.bmccorp.com C I Systems •• www.ccii.co.za CCII Systems • www.ccii.co.za Condor Engineering •• www.condoreng.com Data Device • www.ddc-web.com Dynamic Engineering • www.dyneng.com EuroTecH • www.eurotech.it Excalibur Systems ••• www.mil-1553.com Focal Technologies Corp • www.focaltech.ns.ca General Standards • www.generalstandards.com Great River Technology • www.greatrivertech.com Heim Data Systems • www.heimdata.com Parvus •• www.parvus.com SBS Technologies •• www.sbs.com SCI Technology • www.sci.com Silicon Turnkey Express • www.SiliconTKx.com Tech S.A.T. • www.techsat.com Western Avionics • www.western-av.com

RSC #5901 @ www.pc104online.com/rsc RSC #5902 @ www.pc104online.com/rsc RSC #5903 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 59 SOFTWARE 2006 PC/104 BUYER’S GUIDE

Prototyping Development & Debugging Software

Company SOFTWARE Name Website IDE Platform System integration serv. Tools Aids Bus analyzer JTAG Application Board support packages Compilers Development tool Java Library Linux Modeling tool Networking Operating system Protocol stack Acmet Embedded Services • www.acmet.com ACT/Technico • www.acttechnico.com Advantech • www.advantech.com Aisys • www.aisysinc.com aJile Systems • www.ajile.com Ampro Computers • www.ampro.com Applied Data Systems • www.applieddata.net Arcom Control Systems •• • www.arcomcontrols.com Argon Technology • www.argontechnology.com Artisan Software Tools • www.artisansw.com Ballard Technology • www.ballardtech.com Catalyst Systems • www.openmake.com CMX Systems • www.cmx.com Comark • www.comarkcorp.com Concurrent Computer • www.ccur.com Connect Tech • www.connecttech.com Curtiss-Wright Embedded •• www.cwcembedded.com Datalight •• www.datalight.com Diamond Systems • www.diamondsystems.com Douglas Electronics • www.douglas.com DSP Design • www.dspdesign.com Dynamic Engineering • www.dyneng.com EBSnet, Inc. • www.ebsnetinc.com Embedded Performance • www.episupport.com Flash Vos • www.flashvos.com FuturePlus Systems • www.futureplus.com General Software • www.gensw.com Green Hills Software •••www.ghs.com H.A. Technical Solutions • www.lakeviewtech.com Hitex Development Tools • www.hitex.com ICOP Technology • www.icop.com.tw Ittia • www.ittia.com Kontron •• www.kontron.com LynuxWorks •• ••• www.lynuxworks.com Macraigor www.macraigon.com Metrowerks • ••• www.metrowerks.com Micro Digital www.smxinfo.com Micro/sys •••www.embeddedsys.com MontaVista • www.mvista.com National Instruments • www.ni.com ND Tech • www.nd-tech.com Neoware Systems • www.neoware.com Nova Engineering ••• www.nova-eng.com

60 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE SOFTWARE OTAECARRIER BOARDS SOFTWARE

Prototyping Development & Debugging Software

Company Name Website IDE Platform System integration serv. Tools Aids Bus analyzer JTAG Application Board support packages Compilers Development tool Java Library Linux Modeling tool Networking Operating system Protocol stack Octagon Systems • www.octagonsystems.com OnCore Systems • www.OnCoreSystems.com Opal-RT Technologies • www.opal-rt.com Parvus •• • www.parvus.com PLD Applications • www.plda.com QNX Software Systems • www.qnx.com RadiSys (Microware) • www.radisys.com Real-Time Innovations • www.rti.com REDSonic • www.redsonic.com RTD • www.rtdusa.com S&K Electronics • www.skecorp.com SCIDYNE • www.scidyne.com Sensoray • www.sensoray.com Silicon Turnkey Express • www.SiliconTKx.com SSV Software Systems • www.ssv-embedded.de SynaptiCAD • www.syncad.com Technologic ••www.embeddedx86.com TenAsys Corporation • www.tenasys.com Tri-M Systems •• www.tri-m.com VersaLogic •• • www.versalogic.com Vibren • www.vibren.com WDL Systems • www.wdlsystems.com WIN Enterprises • www.win-ent.com WinSystems •• • www.winsystems.com Xecom, Inc. • www.xecom.com

CARRIER BOARDS

Company Plus Name Website ETX IP PC/104 PC/104-

Aprotek • www.aprotek.com Axiomtek • www.axiomtek.com Dynamic Engineering • www.dyneng.com EEPD North America • www.eepd.com Embedded Designs Plus • www.embedded-designs-plus.com Evalue Technology • www.evalue-tech.com Precision Communications, Inc. • www.precisioncomm.com Tri-M Systems • www.tri-m.com

RSC #6101 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 61 TEST AND ANALYSIS 2006 PC/104 BUYER’S GUIDE

Company Name Website Counter/Timer Data acquisition Digital-to-synchro GPS/Precision time code stimulus LVDT/RVDT Signal conditioner Synchro-to-Digital systems Test digitizers/Scopes Waveform generator Waveform 4DSP ••www.4dsp.com ACCES I/O Products • www.accesio.com Adapters.com • www.adapters.com ADLINK Technology • www.adlinktech.com

TEST AND ANALYSIS ADPI • www.adpi.com Advantech • www.advantech.com Analog Devices • www.analog.com Apex Embedded Systems • www.apexembedded.net Axiomtek • www.axiomtek.com Brandywine Communications • www.brandywinecomm.com Chase Scientific • www.chase2000.com Comark •• www.comarkcorp.com Computer Conversions •• www.computerconversions.com Corelis • www.corelis.com CyberResearch •• www.cyberresearch.com Data Device •• www.ddc-web.com Dataforth Corporation • www.dataforth.com Diamond Systems • www.diamondsystems.com Eagle Technology • www.eagle.co.za EMAC •• www.emacinc.com Embedded Designs Plus • www.embedded-designs-plus.com Emulation Technology • www.emulation.com EuroTecH •• www.eurotech.it Excalibur Systems • www.mil-1553.com Gage Applied Technologies ••www.gage-applied.com General Standards • www.generalstandards.com Hardent • www.hardent.com ICOP Technology • www.icop.com.tw Instant Instrument • www.instantinstrument.com

RSC #6201 @ www.pc104online.com/rsc RSC #6202 @ www.pc104online.com/rsc

62 / Winter 2005 PC/104 Embedded Solutions 2006 PC/104 BUYER’S GUIDE TEST AND ANALYSIS TEST AND ANALYSIS

Company Name Website Counter/Timer Data acquisition Digital-to-synchro GPS/Precision time code stimulus LVDT/RVDT Signal conditioner Synchro-to-Digital systems Test digitizers/Scopes Waveform generator Waveform International Test Technologies • www.intertesttech.com Measurement Computing •• www.measurementcomputing.com Micro Technic • www.micro-technic.com Micro/sys • www.embeddedsys.com Microcomputer Systems • www.microcomputersystems.com North Atlantic Industries ••• www.naii.com Octagon Systems • www.octagonsystems.com OPTEK Technology • www.optekinc.com Parvus • www.parvus.com Quanser Consulting • www.quanser.com RTD •• www.rtdusa.com Sundance • www.sundance.com Symmetric Research • www.symres.com Symmetricom Inc. • www.symmetricom.com Tri-M Systems • www.tri-m.com VersaLogic • www.versalogic.com WinSystems •• www.winsystems.com ZTEC •• www.ztec-inc.com

RSC #63 @ www.pc104online.com/rsc

PC/104 Embedded Solutions Winter 2005 / 63 64 / Winter 2005 PC/104 Embedded Solutions RSC #64 @ www.pc104online.com/rsc PC/104 Embedded Solutions Winter 2005 / 65 RSC #65 @ www.pc104online.com/rsc Insight

By Chris A. Ciufo EPIC Express paves [email protected] “bridge to the future”

Where has the year gone? As 2005 winds based upon EPIC that are intended to VersaLogic – will undoubtedly offer to a close, the embedded board market make designers’ jobs even easier. EPIC their 0.8 revision spec to the PC/104 continues to evolve with new technol- accommodates all standard PC/104 I/O Consortium in time for the annual stra- ogy and products, and PC/104 Embedded modules, so existing custom interface tegic planning session in Q12006. The Solutions continues to evolve with it hardware that drives LCDs, interfaces to Consortium would look closely at how (more on that later). Of note: The demand ball screw assemblies, or controls thermal EPIC Express addresses the past and the for standardized modules has never been ovens can plug right into an EPIC-based future, as well as how it relates to the exist- hotter as designers search for ways to system. ing EPIC specification. Since PC/104 has get to market quicker while avoiding the been successful for so long partly because drudgery and expense of designing an But the PC desktop market is moving be- of its stability, the EPIC Express gang of entire system from scratch. Standardized yond PC/104, first by replacing ISA with five even built in support for legacy ISA- embedded form factors such as PC/104, PCI, and now by moving to PCI Express, based PC/104 boards. PC/104-Plus, PCI-104, and EBX are a serial fabric that offers orders of mag- among the most common types designed nitude more data movement potential This means that if the Consortium were into low- to medium-volume systems than the PCIbus. This same “gang of five” to endorse EPIC Express, the existing where small size, desktop PC compatibil- that created EPIC recently extended the vendor community’s literally thousands ity, and a robust vendor ecosystem are the spec to EPIC Express, bringing – you of PC/104 modules could be carried for- primary design criteria. guessed it – PCI Express capability to ward, protecting the legacy investments of EPIC. Not since the PC/104 spec was first vendors and customers alike. And looking At huge volumes, systems like automo- ratified in 1992 has so much potential to the future, besides the obvious support bile telematics, cell phones, PDAs, or been included in a single proposed board for PCI Express, there is no mechanical iPods use proprietary, custom hardware standard. reason at all that an EPIC Express module designs. And at the low end, onesy-twosy couldn’t be modified to include the popu- prototype systems often just use PCs. The EPIC Express retains the stackability lar PMC (PCIbus) or XMC (serial fab- PC/104 family fits perfectly in the middle of PC/104 by replacing PCI with high- ric) mezzanine modules used with VME with its PC functionality, “rich” software speed PCI Express connectors ready for and CompactPCI. In this case, not only portfolio (to use Microsoft’s terminol- a four-card stack and x1 or x4 lanes. A would EPIC Express use its own “PC/104 ogy), and inherent ruggedness that works 2.5 Gbps x1 lane is about 4x the speed Express” mezzanine modules, it could use beautifully in harsh and low-maintenance of current PC/104 boards, while a x4 those from other markets and standards as applications like military or industrial lane is about 16x. At these speeds, high- well. What a concept. control. end graphics controllers can be mounted on “PC/104 Express” modules (for now I believe the existing EPIC specification But still the market needs more, so called an EPIC Express Module in the and the newer EPIC Express specifica- alternative form factors like the PC/104 specification at www.epic-express.org), tion represent the future of the PC/104 Consortium’s EPIC standard have achieved along with other high-end data capture, Consortium – without breaking the fun- success. At 115 mm x 165 mm (4.528" signal processing, or A/D and D/A con- damental heritage of PC/104. These specs x 6.496"), EPIC is slightly larger than verters. In short: The EPIC Express CPU are a bridge to the future that’s increas- PC/104’s size of 95.89 mm x 90.17 mm basecard and “PC/104 Express” modules ingly based upon small form factors like (3.775" x 3.550"). EPIC is intentionally perfectly meet the needs of high-perfor- PC/104 and others. At PC/104 Embedded designed with space for higher-power pro- mance, contemporary small- to medium- Solutions, we’ve watched this small form cessors that can be conductively cooled volume applications. And because they’re factor trend evolve for several years now. and have additional I/O connections and so small, inherently rugged, and flexible, Accordingly, we’re changing our name in the ability to stack legacy PC/104 I/O or EPIC Express systems have a real poten- 2006 to PC/104 and Small Form Factors processor modules on top. tial to steal market share from other stan- to expand our coverage and bring you dards like 6U VME or 3U CompactPCI. timely technical information about new Vendors including Ampro, VersaLogic, small form factor products and standards. Octagon, WinSystems, Micro/sys, and The EPIC Express creators – Ampro, As always, PC/104 remains our core mis- others all make COTS box-level systems Micro/sys, Octagon, WinSystems, and sion and technology.

66 / Winter 2005 PC/104 Embedded Solutions RSC #67 @ www.pc104online.com/rsc RSC #68 @ www.pc104online.com/rsc