École De Technologie Supérieure Université Du Québec

Total Page:16

File Type:pdf, Size:1020Kb

École De Technologie Supérieure Université Du Québec ÉCOLE DE TECHNOLOGIE SUPÉRIEURE UNIVERSITÉ DU QUÉBEC MÉMOIRE PRÉSENTÉ À L’ÉCOLE DE TECHNOLOGIE SUPÉRIEURE COMME EXIGENCE PARTIELLE À L’OBTENTION DE LA MAÎTRISE EN GÉNIE ÉLECTRIQUE M.Ing. PAR Tennessee CARMEL-VEILLEUX ADAPTATION MULTICOEUR D’UN NOYAU DE PARTITIONNEMENT ROBUSTE VERS L’ARCHITECTURE POWERPC MONTRÉAL, LE 7 SEPTEMBRE 2011 © Tous droits réservés, Tennessee Carmel-Veilleux, 2011 PRÉSENTATION DU JURY CE MÉMOIRE A ÉTÉ ÉVALUÉ PAR UN JURY COMPOSÉ DE : M Jean-François Boland, directeur de mémoire Département de génie électrique, ÉTS M Guy Bois, codirecteur Département de génie informatique et logiciel, École Polytechnique M Claude Thibeault, président du jury Département de génie électrique, ÉTS M Bruno De Kelper, membre du jury Département de génie électrique, ÉTS M Daniel Roy, examinateur externe CMC Électronique inc. IL A FAIT L’OBJET D’UNE SOUTENANCE DEVANT JURY ET PUBLIC LE 26 AOÛT 2011 À L’ÉCOLE DE TECHNOLOGIE SUPÉRIEURE REMERCIEMENTS En premier lieu, j’aimerais remercier mon directeur Jean-François Boland et mon codirecteur Guy Bois, qui m’ont donné une grande latitude dans la réalisation de mon projet de maîtrise. J’ai aussi apprécié leur support tout au long de ma maîtrise et en particulier après la naissance de mon fils Léon, arrivé au milieu de mon cheminement. J’aimerais aussi remercier l’École de technologie supérieure (ÉTS), le Fonds québécois de recherche sur la nature et les technologies (FQRNT) et le Regroupement stratégique en mi- croélectronique du Québec (ReSMiQ) pour leur support financier qui m’a permis de réaliser mes travaux. Enfin, je voudrais remercier tout particulièrement ma conjointe Melissa. Ses encouragements et son support ont été instrumentaux à la réussite de mes travaux. ADAPTATION MULTICOEUR D’UN NOYAU DE PARTITIONNEMENT ROBUSTE VERS L’ARCHITECTURE POWERPC Tennessee CARMEL-VEILLEUX RÉSUMÉ L’utilisation de plus en plus commune de l’architecture d’avionique modulaire intégrée (IMA) a permis de réduire le poids, la taille et l’encombrement des systèmes avioniques en consoli- dant l’exécution logicielle de plusieurs fonctions sur un même processeur. En même temps que l’adoption accélérée de l’architecture IMA, les microprocesseurs multicoeurs ont gagné en po- pularité en raison de la stagnation des fréquences d’horloge des processeurs monocoeurs. Les processeurs multicoeurs promettent d’augmenter l’intégration de fonctions logicielles, mais ces derniers ne sont toujours pas acceptés en avionique, pour des raisons de complexité qui affectent la sûreté. La technologie principale permettant l’utilisation de l’architecture IMA est le noyau de par- titionnement robuste. Un noyau de partitionnement robuste permet d’isoler les applications indépendantes d’un système IMA pour prévenir la propagation des fautes. Cette isolation est réalisée par partitionnement spatial et temporel robustes. Dans ce domaine, il n’existe actuel- lement aucun système d’exploitation supportant les recherches sur l’évaluation de sûreté des processeurs multicoeurs. Nous proposons dans ce mémoire d’adapter un noyau de partitionnement robuste existant, afin qu’il supporte le déploiement de partitions en parallèle sur plusieurs coeurs d’un processeur multicoeur. Nous avons analysé l’architecture d’un noyau existant, nommé XtratuM, puis nous l’avons adapté à un modèle de partitionnement robuste multicoeur. Nous avons ensuite réalisé une implémentation de cette adaptation sur un processeur PowerPC multicoeur de la famille MPC8641 de Freescale. Le prototype résultant est nommé XtratuM-PPC. Nous présentons enfin une étude de cas de l’utilisation de XtratuM-PPC avec un plan d’exécution multicoeur. Lors des phases d’adaptation et de réalisation, nous avons identifié un ensemble de problèmes techniques affectant la sûreté des noyaux de partitionnement robuste sur les processeurs multi- coeurs. Ces problèmes mettent en relief la complexité d’implémentation de ce type de système logiciel. Nos travaux nous permettent de conclure que l’adaptation d’un noyau de partitionnement ro- buste monocoeur existant à une architecture multicoeur est possible. Cependant, les problèmes de sûreté qui apparaissent avec les processeurs multicoeurs demeurent non résolus. Notre pro- totype de noyau de partitionnement robuste multicoeur est un point de départ pour la résolution de ces problèmes dans un environnement réel. Mots-clés : Partitionnement, processeurs multicoeurs, systèmes d’exploitation, systèmes em- barqués, avionique, IMA ADAPTATION MULTICOEUR D’UN NOYAU DE PARTITIONNEMENT ROBUSTE VERS L’ARCHITECTURE POWERPC Tennessee CARMEL-VEILLEUX ABSTRACT Increasing use of the integrated modular avionics (IMA) architecture has helped reduce the size, weight and power consumption of avionics systems by consolidating multiple software functions on a same processor. At the same time as the accelerated adoption rate of IMA archi- tectures, multi-core microprocessors have gained popularity due to stagnating performances of single-core offerings. Multi-core processors promise to increase software functions integra- tion, but they are still not widely accepted in avionics, for reasons of complexity which affect safety. The technological underpinning of the IMA architecture is the robust partitioning kernel. A robust partitioning kernel maintains an isolation between independant applications to prevent the propagation of faults within the system. This isolation is achieved by robust time and space partitioning. Unfortunately, there are no multicore-capable robust partitioning kernels currently available to support research in using multicore processors in IMA. In this master’s thesis, we propose to adaptat an existing robust partitioning kernel, so that it supports the deployment of partitions on several cores of a multi-core processor. To achieve this goal, we analyzed the existing XtratuM partitioning kernel and adapted it to support a multi-core robust partitioning model. We then implemented this adaptation on the Freescale MPC8641 multi-core PowerPC processor. The resulting prototype is named XtratuM-PPC. Finally, we present a case study using a multi-core execution plan on XtratuM-PPC. During the adaptation and implementation phases, we identified a set of technical problems which affect the safety of robust partitioning kernels on multi-core processors. These problems highlight the implementation complexity of implementation of multi-core robust partitioning kernels. Our work allows us to conclude that it is indeed possible to adapt a robust partitioning ker- nel from a single-core to a multi-core architecture. However, the safety-related problems that appeared due to the use of multi-core processors remain unresolved. Our multi-core robust partitioning kernel prototype is thus a starting point for the resolution of these problems in a real-world environment. Keywords: Partitionning, multicore processors, operating systems, embedded systems, avio- nics, IMA IV TABLE DES MATIÈRES Page INTRODUCTION.............................................................................. 1 CHAPITRE 1 PROBLÉMATIQUE ......................................................... 7 1.1 Problème de recherche ............................................................... 7 1.2 Objectifs............................................................................... 7 1.3 Contributions.......................................................................... 8 1.4 Hypothèses et suppositions........................................................... 9 CHAPITRE 2 REVUE DE LA LITTÉRATURE ET FONDEMENTS.................... 11 2.1 Survol ................................................................................. 11 2.2 Systèmes embarqués avioniques ..................................................... 11 2.2.1 Fonctions avioniques........................................................ 12 2.2.2 Sûreté des systèmes avioniques ............................................ 13 2.2.2.1 Fiabilité des systèmes avioniques ................................ 13 2.2.2.2 Lignes directrices de certification ................................ 13 2.2.2.3 Directive DO-178B visant le développement logiciel ........... 14 2.2.3 Architecture des systèmes embarqués avioniques ......................... 15 2.2.3.1 L’avionique fédérée ............................................... 15 2.2.3.2 L’avionique modulaire intégrée................................... 17 2.3 Partitionnement robuste .............................................................. 18 2.3.1 Définition du partitionnement robuste ..................................... 19 2.3.2 Partitionnement spatial...................................................... 20 2.3.3 Partitionnement temporel ................................................... 21 2.3.4 Le partitionnement robuste selon la norme ARINC-653 .................. 22 2.3.5 Interdépendances entre partitionnement spatial et temporel .............. 24 2.4 Méthodes de partitionnement spatial ................................................ 25 2.5 Méthodes de partitionnement temporel .............................................. 30 2.6 Choix d’un noyau de partitionnement robuste à adapter ............................ 31 2.7 Processeurs multicoeurs .............................................................. 33 CHAPITRE 3 ARCHITECTURE ET IMPLÉMENTATION DU NOYAU XTRATUM SUR PROCESSEURS LEON ............................................... 35 3.1 Survol ................................................................................. 35 3.2 Historique de XtratuM...............................................................
Recommended publications
  • CPU ボードカタログ サポート CPU Intel :Core I7、Xeon-E5 Freescale :T4240、P4080、MPC8640D AMD :Radeon HD 6970M、HD 7970M GPGPU NVIDIA :Fermi、Kepler Architecture GPGPU
    組込みシステム向け CPU ボードカタログ サポート CPU Intel :Core i7、Xeon-E5 Freescale :T4240、P4080、MPC8640D AMD :Radeon HD 6970M、HD 7970M GPGPU NVIDIA :Fermi、Kepler Architecture GPGPU サポートバス規格 OpenVPX VME/VXS CompactPCI PMC/XMC ATCA/AMC PCI Express 403102 Ⓒ MISH International Co., Ltd. MISH International Co., Ltd. ミッシュインターナショナルでは CPU ボードをスピーディに 導入頂けますよう、次のような サービスを提供しております CPU ボードのお貸出しサービス CPU ボードの性能評価検証サービス ミッシュインターナショナルでは、ユーザが実際に製品を導入する前に性能評価を実施していただけ ミッシュインターナショナルでは、専門の CPU ボードサポート技術者がお客様のご要望に応じて CPU ますよう各種評価用 CPU ボードをお貸出ししています。お貸出し時には、リアルタイム OS を含めた ボードの性能を評価・検証させていただきます。たとえばFFT の処理速度やボード間のデータ転送スピー CPU ボードに関するトータルな技術サポートを行っております。 ドの測定などユーザがシステムインテグレーションする上で必要なデータを検証の上、レポートさせて いただきます。(お客様のご要望内容によっては別途有償の場合もあります) CPU ボードの技術サポート ミッシュインターナショナルでは、専門のCPU ボードサポート技術者が導入前はもちろん、導入後もハー ド・ソフトの両面からお客様の技術サポートをいたします。CPU ボードのドライバソフトウェアやアプ リケーションの開発方法等をトータルにバックアップいたします。また、リアルタイム OS を含んだシ CPU ボード用フレームワークソフトウェアの開発サービス ステムインテグレーッションに関するアドバイスも対応しています。 CPU ボードを含んだ組込み用システムを構 築する上では、CPU ボードのハード・ソフ トに関する技術的な知識経験はもちろんです が、CPU ボード以外の A/D、D/A、DIO ボー ド等の各種 I/O ボードとのシームレスな高速 データ通信やリアルタイム OS を使用したイ ンテグレーションが必要です。当社では複数 のボードを使ったマルチ CPU ボードシステ ムやレーダ、ソナー、移動体通信等の無線信 号のリアルタイム処理等をトータルにサポートしています。全体的なデータのパスをサポートした『フ レームワークソフトウェア』の開発もお手伝いしています。ユーザは『フレームワークソフトウェア』 の開発を当社へ外注することにより、アプリケーションソフトウェアの開発や FPGA の開発に専念する ことが出来ます。(お客様のご要望内容によっては別途有償の場合もあります) インテル製 プロセッサ搭載 CPU ボード ボード CPU スピード 拡張 USB 耐環境 型名 プロセッサ メモリ NVRAM Ethernet インテル製 プロセッサ Core i7(Ivy Bridge)、 タイプ (Max) メザニン 2.0 仕様 Xeon E5-2648L x 2 32GB DDR3- 8MB NOR 1000BASE-T x 1 Level HDS6601 6U VPX 1.8GHz - 3 Xeon(8 Core) 搭載 CPU ボード (Sandy Bridge)
    [Show full text]
  • Abaco Systems / SBS CM6 Series Datasheet
    Full-service, independent repair center -~ ARTISAN® with experienced engineers and technicians on staff. TECHNOLOGY GROUP ~I We buy your excess, underutilized, and idle equipment along with credit for buybacks and trade-ins. Custom engineering Your definitive source so your equipment works exactly as you specify. for quality pre-owned • Critical and expedited services • Leasing / Rentals/ Demos equipment. • In stock/ Ready-to-ship • !TAR-certified secure asset solutions Expert team I Trust guarantee I 100% satisfaction Artisan Technology Group (217) 352-9330 | [email protected] | artisantg.com All trademarks, brand names, and brands appearing herein are the property o f their respective owners. Find the Abaco Systems / SBS CTM19 at our website: Click HERE DATASHEET CM6 PowerPC® MPC 8641D 3U CompactPCI™ Embedded Computer The CM6 is a 3U CompactPCI CPU board are addressed with an optional extended with integrated dual core or single core temperature range of -40 °C to +85 °C and FEATURES: Freescale MPC8641 processor. The conformal coating. Shock and vibration • Freescale™ PowerPC® MPC8641 MPC8641D follows the system on a chip immunity is designed in with stiffener bars, in single or dual core with approach by integrating the memory wedge locks and conduction cooling. AltiVec™ controller, Ethernet channels, PCI Express as • Freescale 8640/8640D ready well as UARTs and timers. The CM6 provides a unique feature set, including up to 1 Gbyte of DDR2 SDRAM • Up to 1333 MHz The processor includes one or two execution with ECC, system and non-system mode • Integrated 64 Kbyte L1 and 1 cores in a single processor case, each core support for the CPCI backplane, one PMC Mbyte L2 cache per core with its own L1 and L2 cache including interface (64-bit/100 MHz).
    [Show full text]
  • Embedded Computing Product Guide Our Customers Operate in Many Diverse Markets
    Embedded Computing for Business-Critical Continuity™ Embedded Computing Product Guide Our customers operate in many diverse markets. What unites them is a need to work with a company that has an outstanding record as a reliable supplier. That’s Emerson Network Power. That’s the critical difference. The Embedded Computing business of Emerson Network Power enables original equipment manufacturers and systems integrators to develop better products quickly, cost effectively and with less risk. Emerson is a recognized leading provider of embedded computing solutions ranging from application-ready platforms, embedded PCs, enclosures, motherboards, blades and modules to enabling software and professional services. For nearly 30 years, we have led the ecosystem required to enable new technologies to succeed including defining open specifications and driving industry-wide interoperability. This makes your integration process straightforward and allows you to quickly and easily build systems that meet your application needs. Emerson’s engineering and technical support is backed by world-class manufacturing that can significantly reduce Table of Contents your time-to-market and help you gain a clear competitive edge. And, as part of Emerson, the Embedded Computing 4 AdvancedTCA Products business has strong financial credentials. 9 Commercial ATCA Products Let Emerson help you improve time-to-market and shift 10 Motherboard & COM Products your development efforts to the deployment of new, 14 RapiDex™ Board Customization value-add features and services that create competitive 15 OpenVPX Products advantage and build market share. With Emerson behind you, anything is possible. 16 VME Products 18 CompactPCI Products 20 Solution Services 21 Innovation Partnership Program 22 Terms & Conditions 2 Our leadership and heritage includes embedded computing solutions for military, aerospace, government, medical, automation, industrial and telecommunications applications.
    [Show full text]
  • Computer Architectures an Overview
    Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements.
    [Show full text]
  • Power Architecture® Roadmap
    TM Nikolay Guenov Rich Schnur Matt Short NPD June 2012 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. Overview • QorIQ Portfolio Overview • Market Overview • Roadmap • What’s new? (P5040, T2080, T1040) • Announcing our next generation networking architecture • Enablement Product Deep Dive • P5040/P5021 • T4240 • T2080 • T1042 The Next Generation – Initial Products Summary Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, TM 2 Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service
    [Show full text]
  • ® OS-9 RTOS for Power PC Based Systems Deterministic - Efficient - Scalable - Fast Booting
    MICROWARE® RTOS OS-9 for Power PC based systems Deterministic - Efficient - Scalable - Fast Booting Embedded systems span a myriad of applications, . High availability - OS-9 has the ability to add, ranging from simple microcontrollers to sophisticated remove, and replace individual components in medical imaging systems to complex industrial the system while on-line and in-use. This results applications. At the heart of these diverse applications in a high degree of system availability, even is an operating system (OS) - a software foundation during maintenance. Proven over 30 years in that delivers a common set of services helping mission critical devices around the world. software developers deliver their product to market more quickly. Enter Microware OS‐9, the high‐ performance, high‐availability real‐time operating system platform from MicroSys. The Microware OS‐9 RTOS has been deployed and proven in thousands of products worldwide and represented hundreds of embedded applications, including industrial automation and control and automotive and medical instrumentation. WHY MICROWARE OS-9 Microware OS-9 compact, high- performance multi-user, multi- tasking real-time kernel is a proven foundation for time-to-revenue success. OS-9 is a full-featured operating system framework, . Hard Real-Time Performance - Unlike Windows including the OS kernel, kernel services, and industry- and Linux-based systems, Microware OS-9 was standard APIs, middleware, and a complete IDE-based conceived from the ground up to meet the development framework. high-performance and reliability requirements of time-critical embedded applications. REDUCE RISK FAST BOOTING . High reliability - the OS-9 secure process model, real-time operating system (RTOS) provides .
    [Show full text]
  • Freescale‟S Multicore Technologies Alex Peck Field Applications Engineering
    November, 2010 Multicore and More Freescale‟s Multicore Technologies Alex Peck Field Applications Engineering TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Agenda ► Power Architecture Multicore Roadmap ► E5500 64-bit core Architecture ►Data Path Acceleration Architecture ► Starcore DSP Roadmap ►Software and Tools ► Green Hills Presentation ► Don‟t Miss Jeff Logan‟s Migration to QorIQ session! Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., TM Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2 Power Architecture® and Communications Processor Roadmap TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc.
    [Show full text]
  • Hardware Reference Manual CM6 Single/Dual Core Powerpc® 3U Compactpci® SBC Fourth Edition Publication No
    GE Intelligent Platforms Hardware Reference Manual CM6 Single/Dual Core PowerPC® 3U CompactPCI® SBC Fourth Edition Publication No. HRMCM64E Copyright © 2010 GE Intelligent Platforms, Inc. All rights reserved. CM6 Hardware Reference Manual This manual applies to the CM6 single or dual core MPC8641 3U CompactPCI® Single Board Computer hardware revision 1.0 and above until superseded by a higher revision. Document History Edition Date By Chapter Comments First 2007‐10‐29 EH All Initial HHS Chapter 7 Correct storage temperature values & styles (non‐RoHS) HHS All Cosmetic changes HHS All Continued after crash EH All Adapted for hardware revision 1.x EH All Implement correctives MF All Prepared for preliminary release EH Env. cond. add temp chart Elect. char. RS244/RS485 HHS All Adjust page breaks Page 2 Insert new document history table HHS All Update TOC etc. HHS All Cleanup minor errors; cosmetic changes Second 2008‐12‐15 EH Chapter 7 add power and thermal characteristics of CPU types Chapter 6 add memory speed restrictions HHS All Change SBS to GE Intelligent Systems spell‐checking EH Chapter 6 add description of the serial auto load EEPROM PMC Site programming Compact PCI HHS All Change copyright to 2008; change hidden SBS references EH Real Time limit the STORE operations to 200k cycles Clock HHS All Cosmetic changes; change Embedded Systems to Intelligent Platforms in footers EH Env. cond. add card edge temp for 8‐style HHS All Correct company name; web site address HHS All Cosmetic changes; correct email addresses; remove Chinese address
    [Show full text]
  • Kicad R8450 2017 Aug 27
    KiCAD r8450 2017 Aug 27 (Windows)Pfad:kicad\s ar!\kicad\"i#rar$\ %n di!s!& Pfad sind di! 'on (!sc !&a ( )c a"*+"an ) '!rw!nd!*!n ,i#"io* !k!n a#g!"!g* -!w!i"s a"s ./"i# und ./dc& 0usa&&!ng! 1r!nd/ 2ac d!& di! Da*!i!n !infac ! 3!4*da*!i!n sind5 is* das i!r &a" !in 6!rsuc 5 a""!s 'on ./dc& in !in! Da*!i 0u sc r!i#!n5 )$&#o"!5 ,au*!i"! usw/6!rw!nd!* w!rd!n 0w!i 'on 'i!r 7!"d!rn/ Di!s! Da*!i !n* 8"* k!in! 9inks/ :# !s !in!n 2u*0!n a*5 is* frag"ic 5 !s is* a"s ;#!rsic * g!dac */6i!""!ic * i"f*s auc #!i d!& Dau!r* !&a w!i*!r5 KiCAD &1g!n od!r auc nic */ Di! f<r di!s! 9is*! '!rw!nd!*! )of*war! is* nic * ,!s*and*!i" 'on KiCAD/ 3!i"! in d!n ,i#"io* !k!n : (()c !&a=D:C9%, 6!rsion 2/0 ,i#"io* !k: 3!i"! "!*0*! >nd!rung 74xgxx.dcm 156 22-05-2017 74xx.dcm 167 22-05-2017 ac-dc.dcm 60 09-07-2017 actel.dcm 18 22-05-2017 adc-dac.dcm 177 08-08-2017 allegro.dcm 29 22-05-2017 Altera.dcm 7 22-05-2017 analog_devices.dcm 24 21-08-2017 analog_switches.dcm 13 22-05-2017 atmel.dcm 495 22-05-2017 audio.dcm 45 07-06-2017 battery_management.dcm 62 22-08-2017 bbd.dcm 10 22-05-2017 bosch.dcm 1 22-05-2017 brooktre.dcm 12 22-05-2017 cmos4000.dcm 41 27-07-2017 cmos_ieee.dcm 1 22-05-2017 conn.dcm 433 24-08-2017 contrib.dcm 1 22-05-2017 cypress.dcm 30 22-05-2017 dc-dc.dcm 328 21-08-2017 device.dcm 338 07-06-2017 digital-audio.dcm 16 23-07-2017 diode.dcm 155 05-06-2017 display.dcm 68 21-08-2017 dsp.dcm 2 22-05-2017 elec-unifil.dcm 36 22-05-2017 ESD_Protection.dcm 35 02-08-2017 ftdi.dcm 20 22-05-2017 gennum.dcm 3 22-05-2017 graphic_symbols.dcm 29 08-06-2017 hc11.dcm 5 22-05-2017
    [Show full text]
  • Embedded COMPUTING
    Embedded COMPUTING Product Guide Artesyn Embedded Technologies is a leading global provider of embedded computing solutions based on open standards such as ATCA®, VMEbus™, PCI Express and computer-on-module. Our expertise enables OEMs in a wide range of industries to develop better products quickly, cost effectively and with less risk. Artesyn Embedded Technologies is a global leader in the design and manufacture of highly reliable power conversion and embedded computing solutions for a wide range of industries including communications, computing, healthcare, military, aerospace and industrial automation. For more than 40 years, customers have trusted Artesyn to help them accelerate time-to-market and reduce risk with cost-effective advanced network computing and power conversion solutions. Building on the acquired heritage of industry leaders such as Motorola Computer Group and Force Computers, Artesyn’s Embedded Computing business is a recognized leading provider of advanced network computing solutions ranging from application-ready platforms, single board computers, enclosures, blades and modules to enabling software and professional services. Artesyn’s engineering and technical support is backed by world-class manufacturing that can significantly reduce time-to- market and help customers gain a clear competitive edge. Let Artesyn help your business improve time-to-market and shift development efforts to the deployment of new, value-add features and services that build market share. Contents 4 ControlSafe™ Platform 10 AdvancedTCA® Products 16 AdvancedTCA® Software 18 PCIE Server Accelerators 19 Computer-on-Module (COM) 20 VME™ Products 22 CompactPCI® Products 23 Solution Services 24 Technology Partner Program 2 Local Support Our regional sales offices are ready to provide expert local applications and sales support.
    [Show full text]
  • Migrating from E300- to E500-Based Integrated Devices by Jerry Young Networking and Multimedia Group Freescale Semiconductor, Inc
    Freescale Semiconductor Document Number: AN3445 Application Note Rev. 0, 10/2007 Migrating from e300- to e500-Based Integrated Devices by Jerry Young Networking and Multimedia Group Freescale Semiconductor, Inc. Austin, TX This application note outlines general, high-level, Contents 1. The e300, the e500, and Changes to the architectural differences between the e300 and e500 family Architecture Definition . .2 processors. It does not address microarchitectural 2. Differences between e300 and e500 Cores: Overview 4 differences, such as the sizes of caches, bus architecture, or 3. Power Architecture Details . 6 instruction pipeline design. It does not attempt to describe all 4. Instruction Model . 8 5. Register Model . 26 differences among the members of these two families of 6. Interrupt Model . 38 processors, but is intended as a general guideline for 7. Memory Management Unit (MMU) Model . 42 programmers and system designers who are assessing the 8. Revision History . 46 efforts required in migrating to e500-based devices. For specific details, refer to the user documents for the respective devices. © Freescale Semiconductor, Inc., 2007. All rights reserved. The e300, the e500, and Changes to the Architecture Definition 1 The e300, the e500, and Changes to the Architecture Definition This section describes the changes to the architectural specifications especially as they relate to the e300 and e500 processor families. NOTE The term ‘PowerPC™ architecture’ has come to refer strictly to the original architecture definition for desktop processors that is implemented on the e300, e600, and others and sometimes is referred to as the classic or AIM (Apple, IBM, Motorola) version of the architecture.
    [Show full text]
  • Altivec Vector Processor, Part 2: Enhancements
    TM June 2012 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. Next-generation QorIQ products built on e6500 Power Architecture® technology include an enhanced AltiVec vector processor. This session describes new instructions for extended support for misaligned vectors, support for handling head and tail vectors, and the long-awaited capability to move from general purpose to vector registers. Learn about the performance improvements resulting from enhancement to both AltiVec and the e6500 core. This session compliments AltiVec Vector Processor Introduction for Newcomers (Part 1), but those who are already familiar with SIMD and AltiVec processors can attend as a stand-alone session. Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C-Ware, the Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, TM 2 Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, Vybrid and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.
    [Show full text]