Embedded Computing for Business-Critical Continuity™

Embedded Computing Product Guide Our customers operate in many diverse markets. What unites them is a need to work with a company that has an outstanding record as a reliable supplier. That’s Emerson Network Power. That’s the critical difference.

The Embedded Computing business of Emerson Network Power enables original equipment manufacturers and systems integrators to develop better products quickly, cost effectively and with less risk.

Emerson is a recognized leading provider of embedded computing solutions ranging from application-ready platforms, embedded PCs, enclosures, motherboards, blades and modules to enabling software and professional services.

For nearly 30 years, we have led the ecosystem required to enable new technologies to succeed including defining open specifications and driving industry-wide interoperability. This makes your integration process straightforward and allows you to quickly and easily build systems that meet your application needs.

Emerson’s engineering and technical support is backed by world-class manufacturing that can significantly reduce Table of Contents your time-to-market and help you gain a clear competitive edge. And, as part of Emerson, the Embedded Computing 4 AdvancedTCA Products business has strong financial credentials. 9 Commercial ATCA Products Let Emerson help you improve time-to-market and shift 10 Motherboard & COM Products your development efforts to the deployment of new, 14 RapiDex™ Board Customization value-add features and services that create competitive 15 OpenVPX Products advantage and build market share. With Emerson behind you, anything is possible. 16 VME Products 18 CompactPCI Products 20 Solution Services 21 Innovation Partnership Program 22 Terms & Conditions

2 Our leadership and heritage includes embedded computing solutions for military, aerospace, government, medical, automation, industrial and telecommunications applications.

“This business has the DNA that includes Motorola’s embedded computing business, Artesyn, Force Computers, Heurikon, Blue Wave Systems, Mizar, Prolog, NetPlane and Spider Software! The combined strength and experience of these companies, fused with pedigrees of quality, innovation and a deep understanding of our customers’ needs, position Emerson Network Power for continued growth and leadership in the embedded computing markets.”

Stephen Dow President, Embedded Computing Emerson Network Power

3 AdvancedTCA® Products Emerson Network Power AdvancedTCA® products are designed to address applications requiring high performance, high reliability and long life cycles. The telecommunications industry was quick to recognize the fit with its carrier-grade requirements. Applications include control plane and packet and media processing infrastructure for wireless networks, IP Multimedia Subsystem (IMS), IPTV, other central office applications and network data center environments. ATCA® products have also been deployed in a range of military, aerospace and industrial automation applications such as C4ISR and batch processing control.

Emerson offers a comprehensive portfolio of 10G and 40G ATCA products including shelf, switch blade and payload blade products. Payload blade options include high performance server, flexible I/O, packet processing and storage blades. Multiple business engagement models are designed to suit almost any customer – from purchasing ATCA products separately and integrating them yourself, to detailed integration and custom packaging services from our dedicated Solution Services group.

AdvancedTCA Platform Cores The Emerson Centellis™ series of ATCA platform cores integrate the ATCA shelf (enclosure, shelf management, cooling and power distribution), switch blades, a complete software operating environment and SpiderWare®M3 shelf management software. This provides an off-the-shelf solution on which you can add your service-related hardware and software. Tested and verified hardware and software components, designed for NEBS, ETSI and other regulatory compliance, help to reduce development costs and accelerate time-to-market. Original equipment manufacturers (OEMs) can focus development resources on critical, differentiating features that provide a competitive advantage.

Centellis 2000 Platform Core ƒ Release 1: DC power options ƒ Release 2: AC power options, 10G User Card ƒ Release 3: Upgraded shelf management, Telco Alarm User Card

Centellis 2625 40GbE Platform Core ƒ Release 1: AXP640 shelf, ATCA-F125 switch blade, integrated software package

Centellis 4440 40GbE Platform Core ƒ Release 1: AXP1440 shelf, ATCA-F120 switch blade, integrated software package ƒ Release 2: AXP1440 shelf, ATCA-F140 switch blade, integrated software package

Centellis 4410 10GbE Platform Core ƒ Release 1: AXP1410 shelf, ATCA-F120 switch blade, integrated software package ƒ Release 2: AXP1411 shelf, ATCA-F125 switch blade, integrated software package

Centellis 4620 10GbE Platform Core ƒ Release 1: AXP1620 shelf, ATCA-F120 switch blade, integrated software package

4 AdvancedTCA Shelves AdvancedTCA Switch Blades Emerson offers a complete suite of ATCA shelf products including A variety of switch blades are available with flexible options for two-slot, six-slot, 14-slot and 16-slot shelf form factors with both processor AMCs, local storage and Telco clocking. Switch blade 10G and 40G capable backplanes. products include 10G and 40G variants to satisfy different perfor- mance and price points depending on application requirements. All Emerson ATCA shelf products have superior power and cooling characteristics; 350 Watt/slot power distribution, front-to-rear ATCA-F140 40G Switch Blade cooling architecture and CP-TA B.4 compliant cooling performance. ƒ PICMG® 3.0 compliant base interface Shelf Management functionality is integrated into each ATCA shelf switch and all, redundant field replaceable units (FRUs) are included. ƒ PICMG 3.1, Option 1, 9 fabric interface switch (1G/10G) ƒ 4x 10GBASE-KR fabric interface (40G) Centellis™ 2000 – 40G ATCA Shelf ƒ Single AMC site ƒ Two-slot, 3U, 19” form factor ƒ Optional SATA HDD ƒ 10G/40G fabric support ƒ Optional Telecom clocking support ƒ AC & DC power input options ƒ Integrated software package ƒ Simplex and duplex configurations available ATCA-F125 10G Switch Blade ƒ PICMG 3.0 compliant base interface switch ƒ PICMG 3.1, Option 1, 9 fabric interface AXP640 – 40G ATCA Shelf switch (1G/10G) ƒ 6-slot, 7U, 19” form factor ƒ Single AMC site ƒ 10G/40G fabric support ƒ Optional SATA HDD ƒ AC & DC power input options ƒ Optional Telecom clocking support ƒ Integrated software package

ATCA-F120 System Controller and AXP1440 – 40G ATCA Shelf Switching Blade ƒ 14-slot, 13U, 19” form factor ƒ PICMG 3.0 & 3.1 dual-star support ƒ 10G/40G fabric support ƒ 1G & 10G fabric support ƒ Dual AMC slot support for optional AXP1410/1 – 10G ATCA Shelf processor and storage ƒ 14-slot, 13U, 19” form factor ƒ Copper & optical rear transition module ƒ 10G fabric support (RTM) options

AMC-8001 Telecom Clocking AMC Module ƒ Stratum 3 performance AXP1620 – 10G ATCA Shelf ƒ Multiple modes of operation ƒ 14-slot, 13U, 19” form factor ƒ Redundant BITS/SSU inputs ƒ 10G fabric support ƒ Redundant CLK distribution and synchronization

PrAMC-7211 AMC Module ƒ Intel® Core™2 Duo processor core with 4MB L2 cache, running at 1.5 GHz ƒ 667 MHz frontside bus, connecting processor and Intel® 3100 chipset ƒ 2GB DDR-400 memory with ECC

5 AdvancedTCA IA Server Blades ATCA-7360 Quad-Core Processor Blade Emerson is committed to closely following the Intel® Embedded ƒ Two quad-core Intel Xeon processors Roadmap for ATCA server blades. Look for Emerson to deliver L5518 (2.13 GHz) best-in-class performance through features like dual Intel® Xeon® ƒ Up to 80GB main memory 5600 series processors, and extreme memory capacity with up to ƒ eUSB storage device twelve DIMM sockets, for demanding applications like subscriber ƒ Additional flash storage device options databases and video-on-demand servers. Additional features such via SATA module as hot-swappable hard drives and telecom clock synchronization ƒ Multiple network and storage I/O are also provided. All of the server blades work with a range of connectivity available rear transition modules (RTM) supporting hot-swappable hard disks with flexible choice of storage options and RAID 0/1 ƒ Additional GbE or Fibre Channel functionality. Unless otherwise stated, the ATCA fabric interface on interfaces via RTM option each blade is PICMG 3.1 Option 1, 9 (1/10GbE) compliant.

ATCA-7368 Six-Core Processor Blade AdvancedTCA I/O Blades ƒ High performance Intel® Architecture Through the use of industry standard mezzanines like the processor blade designed to meet Advanced Mezzanine Card (AMC), these blades are designed cost-sensitive applications for flexibility, and can be optimized to meet the needs of ƒ One 6-core Intel® Xeon® processor your applications. L5638 (2.0 GHz) Common applications include: ƒ Up to 48GB main memory ƒ 3G RNCs with ATM I/O and signaling interfaces ƒ One mid-size AMC site supporting ƒ IP packet gateway interfaces with security and network address offload, storage & I/O translation requirements ƒ Cost-effective on-board SATA drive ƒ Modular computing applications with processor AMCs for Intel® option Architecture, PowerPC® or Cavium OCTEON processing ƒ eUSB storage device option ƒ Additional flash storage device options Differentiating features of these blades include support for via SATA module 10Gb/s fabrics; redundant boot banks of flash; reset persistent ƒ Multiple storage and I/O connectivity memory for black box data logging; backplane clock interfaces; and flexible options for on-board storage. ATCA-7367 Six-Core Processor Blade ƒ One 6-core Intel Xeon processor L5638 (2.0 GHz) ATCA-7301 Processor Blade ƒ Up to 48GB main memory ƒ Intel® Core™2 Duo processor (2.16 GHz) ƒ One mid-size AMC site support network, ƒ On-board GbE switch storage, I/O and Telecom clocking ƒ Two mid-size AdvancedMC™ (AMC) sites ƒ Cost-effective on-board SATA drive ƒ PICMG 3.1, Option 1, 2 and 9 fabric option interface support ƒ eUSB storage device ƒ SAS disk option ƒ Additional flash storage device options via SATA module ƒ Multiple network and storage I/O connectivity ƒ Additional GbE or Fibre Channel interfac- es via RTM option

ATCA-7365 Dual Six-Core Emerson Network Power provides customers Processor Blade ƒ Two 6-core Intel Xeon processor with a complete suite of ATCA blades including high L5638 (2.0 GHz) ƒ Up to 96GB main memory performance computing, flexible I/O, packet and ƒ eUSB storage device media processing, and storage blades. Most ƒ Additional flash storage device options via SATA module current blades support 10GbE fabric technology, ƒ Multiple network and storage I/O connectivity but blades supporting 40GbE fabric are imminent.

6 AdvancedTCA Packet & Media Processing Blades AdvancedTCA Storage Blades Emerson packet processing blades are optimized for data plane or Applications that require persistent data storage will benefit from signal plane processing in telecommunications or data communications Emerson's tiered storage strategy. This includes: applications. Our family of Cavium OCTEON processing blades is designed for IP packet processing in applications like packet gateways, ƒ On-board storage – available with most of our ATCA processing blades 4G wireless gateways, deep packet inspection applications, and ƒ Direct attached storage (DAS) blades provide a set of independent network security. hard drives to server blades via SAS or SATA direct attachment ƒ Shared storage blades – capable of being accessed by one or more Emerson packet processing blades support a wide variety of performance server blades through either FibreChannel or iSCSI SAN interfaces and bandwidth options. On-board Ethernet switches support ƒ flexible data paths. Integrated into Emerson 10GbE and 40GbE board External storage arrays – reference sales model via our partnership and system core products, the Emerson packet processor products with EMC, and certified to operate with our ATCA server blades offer application-ready platforms for signaling and call control, network gateway and edge functions, deep packet inspection and Collectively, these storage solutions are capable of meeting your security processing. reliable storage requirements, from hundreds of gigabytes through many terabytes, with various RAID configurations. ATCA-8310 DSP Blade ƒ Up to 30 Texas Instruments TMS320TCI6486 6-core DSPs ATCA-S201 Storage Blade ƒ 8-core Freescale QorIQ™ P4080 for ƒ In-shelf ATCA SAN/NAS blade packet processing and load balancing in ƒ Four AMC-based hotswap disks the IP I/O path ƒ Two fixed SFF disks via RTM ƒ Pre-installed Linux on P4080 with ƒ iSCSI target function utilities for blade configuration, switch ƒ External SAS expansion management and DSP setup ® ƒ Red Hat RHEL certified 2-core Intel Core™ i7 processor for control plane ATCA-S120 Storage Blade application ƒ In-shelf ATCA JBOD blade ƒ Local Ethernet switch connecting all DSPs, CPUs, ATCA networks and I/O ƒ Four AMC-based hotswap disks ƒ IP RTM supporting 10Gigabit Ethernet ƒ Two fixed SFF disks via RTM ƒ External SAS connection ATCA-9305 Many-Core Processor Blade ƒ Two Cavium OCTEON 16-core CN5860 AMC-S303 AMC Storage Module processors (800 MHz) ƒ 320GB SATA Extended Duty HDD ƒ Freescale MPC8548 PowerQuicc III ƒ Single wide, mid-size service processor ƒ Hardware acceleration with thread AMC-S321 AMC Storage Module pinning, security, de-/compression, ƒ 80GB SATA Extended Duty HDD regexp with RLDRAM support, packet ƒ Single wide, mid-size queuing and scheduling functions ƒ 10 GbE Broadcom BCM56802 switch AMC-S402 AMC Storage Module ƒ 18-port GbE RTM ƒ 146 GB 10K SAS HDD ƒ 12-port GbE plus 10GbE RTM port ƒ 300 GB 10K SAS HDD ƒ 6-port 10GbE RTM with flash storage ƒ Single wide, mid-size ƒ Wind River PNE based management software including L2 and L3 switch AMC-S502 AMC Storage Module management ƒ 32GB SATA SSD ƒ Debian Linux and Wind River PNE Linux ƒ Single wide, mid-size support for the Cavium OCTEON+ processors including Cavium SDK support ƒ 6Wind 6Windgate support

7 SRstackware Switching and Routing Software

The Emerson SRstackware switching and routing software suite, was developed to fulfill the ever-increasing Layer 2 and Layer 3 networking requirements of telecom and non-telecom network elements. SRstackware supports a wide range of defined standards and protocols and enables easy integration with customer applications. SRstackware is available on all ATCA switch blades and select ATCA payload blade products.

Basic SRstackware software includes all required network functions, switch management and commonly used Layer 2 protocols com- bined into a single product. Enhanced SRstackware is a series of specific protocol modules that can be purchased separately depend- ing on application requirements.

Basic SRstackware features: Switch Management ƒ Command Line Interface (CLI) ƒ Simple Network Management Protocol (SNMPv2) - RFC 1901, 2271 ƒ Simple Network Management Protocol (SNMPv3) - RFC 3414, 3411 ƒ Broadcast storm recovery ƒ Flow control - IEEE 802.3x SpiderWare®M3 Platform Management Software ƒ Application Programming Interface (API) access The control and management of platforms are critical to the efficient and effective use of data and communication networks. Layer 2 Switching SpiderWareM3 is an innovative software product that reduces ƒ Spanning Tree Protocol (STP) - IEEE 802.1d development time and lowers operational expenses for users of ATCA systems. ƒ Rapid Spanning Tree Protocol (RSTP) - IEEE 802.1w ƒ Multiple Spanning Tree Protocol (MSTP) - IEEE 802.1 Manage, monitor and maintain multiple ATCA platforms ƒ Virtual LAN (VLAN) Tagging - IEEE 802.1q ƒ Remote access from any location ƒ Link Aggregation Control Protocol (LACP) - IEEE 802.3ad ƒ Fault and threshold alerts ƒ VLAN Classification by Protocol and Port - IEEE 802.1v ƒ Monitor chassis and blades operational parameters ƒ Class of Service (CoS) - IEEE 802.1p ƒ Link Aggregation Control Protocol (LACP) - IEEE 802.3ad Rapid software integration ƒ Generic Attribute Registration Protocol (GARP) - IEEE 802.1q ƒ GARP Multicast Registration Protocol (GMRP) - IEEE 802.1q ƒ HPI and XML APIs ƒ GARP VLAN Registration Protocol (GVRP) - IEEE 802.1q ƒ Visual representations of hardware parameters ease application software integration ƒ VLAN Stacking (Q-in-Q) - IEEE 802.1ad ƒ Static Filtering (ACL) Quick platform set-up ƒ Enhanced Load Balancing (by TCP/UDP port) ƒ Graphical selection of key IPMI data ƒ Enhanced SRstackware features: Event reporting facilitates rapid integration of multi-vendor systems

Layer 3 Routing Asset management ƒ IPv4 Routing ƒ Access FRU records – Internet Group Management Protocol (IGMP v1) - RFC 1112 ƒ Establish and report platform configurations – Internet Group Management Protocol (IGMP v2) - RFC 2236 – Internet Group Management Protocol (IGMP v3) - RFC 3376 – IGMP Snooping/Proxy - RFC 4541 – Routing Information Protocol (RIPv2) - RFC 2453 – Open Shortest Path First (OSPFv2) -RFC 2328 – Virtual Router Redundant Protocol (VRRP) - RFC 3768 ƒ IPv6 Routing – RIP Next generation (RIPng) - RFC 2080

8 Commercial ATCA® Products

Designed for deployment outside of the telecommunications central office, the Katana® family of Commercial ATCA systems is optimized for applications which value the enhanced reliability, serviceability and longevity of AdvancedTCA technology, without the need to meet the NEBS requirement of operating at elevated ambient temperatures (up to 55 °C). In this case, the enhanced cooling of Emerson ATCA systems can be used to deliver higher levels of performance than traditional AdvancedTCA systems.

Commercial ATCA Bladed Servers and Blades The first product in this family is the Katana 2000. Based on the Centellis™ 2000 two-slot chassis, this system offers high performance dual Intel® Xeon® server blades, each with dual redundant hot swappable hard drives. Both DC and AC powered configurations are supported.

The ATCA-7365-CE, a commercial ATCA blade, host variants of the Intel Xeon 5600 series processors with higher processor speed compared to available NEBS variants and is designed for commercial non-NEBS environment at 35 °C ambient temperature.

Katana® 2000 Commercial ATCA ATCA-7365-CE Dual Four/Six-Core Bladed Server Processor Blade ƒ Two-slot, 19”, 3U form factor ƒ Two 4- or 6-core Intel Xeon ƒ Supplied with up to two server blades, processors, E5620 or E5645 (2.4 GHz) each with two quad-core Intel® Xeon® 5500 ƒ Up to 96GB main memory series processors ƒ Fully supported by the ATCA- 736X ƒ Certified for Red Hat RHEL5.3, RTM family ƒ EMC and VMware ƒ Hot-swappable hard disk with flexible ƒ SpiderWare®M3 ready platform choice of storage options ƒ Front-to-rear cooling ƒ RAID 0/1 support ƒ Power saving features for enhanced ƒ Multiple network and storage I/O energy efficiency connectivity ƒ AC and DC power versions ƒ PICMG 3.1 Option 1, 9 (1/10GbE) ATCA fabric interface, ƒ Designed for Commercial ATCA in a temperature controlled environment

9 Motherboard & COM Products Emerson is fast becoming the embedded motherboard and Computer-on-Module (COM) supplier of choice for a broad range of industries including medical, retail, automation, test and measurement, transportation and renewable energy. Based on long-life embedded silicon, Emerson’s high quality, stable motherboards are delivered from outstanding manufacturing facilities and are backed by our global service presence.

Embedded Motherboards As a Premier member of the Intel® Embedded Alliance, we are able to provide innovative embedded motherboards based on new processor platforms as early as possible into the silicon cycle to maximize the market potential of your product.

NITX-300 Series Nano-ITX Motherboards ƒ <7 Watts typical power consumption ƒ Up to 1.0 GHz Intel® Atom™ processor E640 series ƒ Intel® EG20T Platform Controller Hub ƒ Up to 1GB DDR2 memory, soldered on board ƒ Gigabit Ethernet, SATA and USB ƒ PCI Express x1 and PCI Express Mini Card slot ƒ Dual display support ƒ Four serial ports ƒ Slimline design

MITX-430/440 Mini-ITX Motherboards ƒ Intel Atom D410 or D510 processor ƒ Up to 4GB DDR2 memory ƒ Gigabit Ethernet, SATA and USB ports ƒ PCI Express x1 and PCI Express Mini Card socket ƒ Dual display support ƒ Six serial ports

MITX-CORE-800 Series Mini-ITX Motherboards ƒ PGA socket for 2nd generation Intel® Core™ processor ƒ Intel® QM67 or HM57 PCH ƒ Up to 8GB with 2 DDR3 SO-DIMM sockets ƒ Dual display support ƒ PCI Express x1 and PCI Express Mini Card socket

10 Emerson is quickly becoming the preferred embedded motherboard supplier to a broad range of industries including medical, retail, automation, test and measurement, transportation and renewable energy.

MATXM-CORE-411-B MicroATX Motherboard ƒ rPGA989 socket (Socket G) for Intel® Core™ i7 processor up to 2.6 GHz ƒ QM57 Express MCH ƒ Up to 8GB DDR3 memory ƒ One PCI Express x16 expansion socket and three PCI Express x1 expansions sockets ƒ Dual simultaneous display ƒ PCI Express Mini Card socket for WiFi/WiMAX ƒ Unique midplane allowing easy, cost-effective maintenance ƒ Management technology for remote diagnostics and repair

MATXM-CORE-411-WR Embedded Development Kit ƒ MATXM-CORE-411-B, Intel Core i7-620M CPU, 2GB DDR3 RAM ƒ Wind River LiveUSB evaluation kit demonstrating Hypervisor 1.1, Wind River Linux 3.0.2, Wind River VxWorks 6.8 and Wind River Workbench 3.2 ƒ Start evaluating out-of-the-box in minutes

MATXM-C2-410-B MicroATX Motherboard ƒ 478-pin micro-FCPGA socket (Socket P) for Intel Core 2 Duo T9400 or Intel® Celeron® 575 processors ƒ GM45 Express GMCH and ICH9M ƒ Unique midplane allowing easy, cost-effective maintenance ƒ PoweredUSB ports for connection to POS peripherals ƒ Up to 8GB DDR3 memory ƒ LVDS or VGA primary display ƒ HDMI secondary display

11 Computer-on-Module (COM) Computer-on-Modules (COMs) are highly integrated single-board computers that provide the core functionality of a system, allowing application-specific features to be designed onto a carrier board creating a semi-custom embedded PC solution. Emerson COM products feature the latest Freescale QorIQ™ and Intel® Atom™ and Core™ processors.

COMX-315 Module COMX-420 Module ® ƒ COM Express Type 2 compatible ƒ Intel Atom processor N450 at 1.6 GHz module ƒ Type 2 COM Express module ƒ 1.0 GHz Intel® Atom™ processor E640 ƒ Up to 2GB DDR2 memory ƒ Intel® Platform Controller Hub EG20T ƒ eUSB flash socket ƒ 1GB DDR2 soldered memory ƒ Gigabit Ethernet, SATA and ƒ Compact size (95 mm x 95 mm) PCI Express ports ƒ XDP debug header ƒ LVDS graphics for flat panel displays ƒ Eight USB 2.0 interfaces

COMX-430/440 Modules ƒ Intel Atom processor D410/ D510 @ 1.66 GHz COMX-CORE Series Modules ƒ Up to 4GB DDR2 memory ƒ Intel® Core™ i3, i5 and i7 processors ƒ Gigabit Ethernet, SATA and PCI Express ƒ Basic size 125 mm x 95 mm ƒ LVDS graphics for flat panel displays ƒ Type 6 for improved graphics ƒ 8x USB 2.0 interfaces ƒ Up to 8GB DDR3 memory (ECC and non-ECC available) ƒ eUSB flash socket ƒ Gigabit Ethernet, SATA and USB ports ƒ Dual graphics outputs ƒ Multiple PCI Express lanes for high speed expansion

COMX-CAR-210 Carrier ƒ Type 2 carrier board ƒ MicroATX form factor allows rich I/O and expansion ƒ Supports COMX-3 and COMX-4 Type 2 modules

COMX-CAR-610 Carrier ƒ Type 6 carrier board ƒ MicroATX form factor allows rich I/O and expansion ƒ Support for COMX-CORE Type 6 modules

12 COMX-P4080 Module COMX-P1022 Module ƒ Freescale QorIQ™ P4080 processor ƒ Freescale QorIQ P1022 processor ƒ Eight e500mc Power Architecture cores ƒ Two e500 Power Architecture cores running at 1.5 GHz running at 1.0 GHz ƒ Supports two channels of 2GB DDR3- ƒ Supports up to 2GB DDR3 ECC SO- 1333 ECC SO-UDIMM (4GB max.) UDIMM ƒ 95 mm x 125 mm compact footprint ƒ 95 mm x 95 mm compact footprint ƒ 12 configurable SERDES lanes available ƒ MicroSD card slot for on-board storage for maximum flexibility

COMX-CAR-P1 Carrier ƒ Freescale QorIQ module carrier COMX-P2020 Module ƒ MicroATX form factor allows rich I/O and ƒ Freescale QorIQ P2020 processor expansion ƒ Two e500 Power Architecture cores ƒ Supports all QorIQ modules running at 1.2 GHz ƒ On-board XGI Z11M graphics processor unit (GPU) ƒ Supports up to 2GB DDR3 ECC SO-UDIMM ƒ 95 mm x 95 mm compact footprint ƒ MicroSD card slot for on-board storage

13 RapiDexTM Board Customization Service

The ability to specify the exact features and form factor required in an embedded motherboard is within reach of every product designer with the innovative RapiDexTM board customization service from Emerson Network Power. Designed from the ground up to be fast and affordable, the RapiDex service enables embedded system designers to consider a custom motherboard for products where custom solutions were previously out of reach.

Our innovations in board design technology and manufacturing processes drastically reduce the front-end costs for custom boards. Typical customization engagements in the industry today require open-ended, non-recurring engineering fees and volume production commitments while the RapiDex service has only a minimal set-up fee and a low minimum order quantity of only 100 units. A simple specification procedure and new Emerson manufacturing processes enable customers to receive their custom board within eight weeks of the order.

The Emerson RapiDex service can remove the need to use a standard product that may not be optimized for the application, leading to improved cost, space and power profiles. By putting board customization within reach, designers extend their control.

With the low barrier-to-entry cost threshold of the RapiDex service, product designers can specify a motherboard form factor to exactly correspond with the features required in their range of products. And when the product designer wants to selectively upgrade motherboard features, such as the processor or I/O on the board, they can exercise complete control over that specification. No longer is the designer required to compromise as they search for a best-fit computing platform.

14 OpenVPX TM Products

VPXƒisƒaƒrevolutionaryƒstandardƒfromƒVITAƒforƒnextƒgenerationƒhighƒendƒcommuteƒintensiveƒapplications.ƒƒ Itƒcombinesƒlatestƒgenerationƒconnectorƒandƒpackagingƒtechnologyƒwithƒhighƒspeedƒfabricƒconnectivityƒinƒƒ bothƒ3Uƒandƒ6UƒEurocardƒformƒfactors.ƒTheƒOpenVPX™ƒstandardƒdefinesƒtheƒsystem-levelƒinteroperabilityƒforƒƒ multi-moduleƒsystemƒenvironments.ƒ

EmersonƒOpenVPXƒproductsƒofferƒtheƒlatestƒinƒprocessor,ƒmemory,ƒandƒhighƒspeedƒfabricƒtechnologiesƒwithƒƒ leading-edgeƒruggedƒandƒcoolingƒcapabilities.ƒTheyƒareƒidealƒforƒhighƒendƒindustrial,ƒcommunicationƒandƒƒ military/aerospaceƒapplications.

iVPX7223 iVPX7220 ƒƒƒ3UƒVITAƒ46ƒVPXƒandƒVITAƒ65ƒOpenVPX ƒƒƒ6UƒVITAƒ46ƒVPXƒandƒVITAƒ65ƒOpenVPX ƒƒƒVITAƒ48ƒVPXƒREDIƒtwo-levelƒmaintenanceƒ ƒƒƒVITAƒ48ƒVPXƒREDIƒtwo-levelƒmaintenanceƒ (2LM) (2LM) ƒƒƒ2ndƒgenerationƒIntel®ƒCore™ƒi7ƒvPro™ƒ ƒƒƒ2ndƒgenerationƒIntelƒoCoreƒi7ƒvPr ƒƒ 2.2ƒGHzƒprocessorƒdual-core processorƒ2.2ƒGHzƒ(dual-ƒorƒquad-core) ƒƒƒIntel®ƒQM67ƒPlatformƒControllerƒHub ƒƒƒIntel®ƒQM67ƒPlatformƒControllerƒHub ƒƒƒUpƒtoƒ8GBƒECC-protectedƒDDR3-1333ƒ ƒƒƒUpƒtoƒ16GBƒECC-protectedƒDDR3-1333ƒ soldered solderedƒ(designedƒforƒ16GB)ƒ ƒƒƒXMCƒsite ƒƒƒDualƒPMC/XMCƒsite ƒƒƒPCIƒExpressƒfatƒpipeƒfabric ƒƒƒPCIƒExpressƒfatƒpipeƒfabric ƒƒƒ1000Base-BX/KXƒcontrolƒplane ƒƒƒ1000Base-Tƒorƒ1000Base-BXƒcontrolƒplane ƒƒƒIntegratedƒ2D/3Dƒgraphicsƒwithƒdigitalƒƒ ƒƒƒIntegratedƒ2D/3Dƒgraphicsƒwithƒƒ andƒVGAƒoutput DVI/DisplayPortƒandƒVGAƒoutput ƒƒƒOptionalƒrearƒtransitionƒmodule ƒƒƒSSDƒKit ƒƒƒPayloadƒmoduleƒprofile ƒƒƒOptionalƒrearƒtransitionƒmodule –ƒ MOD3-PAY-2F2U-16.2.3-3 ƒƒƒPayloadƒmoduleƒprofile ƒƒƒPayloadƒslotƒprofile –ƒ MOD6-PAY-4F1Q2U2T-12.2.1-3ƒandƒƒ –ƒ SLT3-PAY-2F2U-14.2.3 ƒ 12.2.1-4ƒ –ƒ SLT3-PAY-1F1F2U-14.2.4 ƒƒƒPayloadƒslotƒprofile ƒƒƒAirƒandƒconductionƒcooled –ƒ SLT6-PAY-4F2T-10.2.2 ƒƒƒ-40ƒ°Cƒtoƒ+85ƒ°Cƒandƒruggedƒvariants –ƒ SLT6-PAY-4F1Q2U2T-10.2.1 ƒƒƒAirƒandƒconductionƒcooled ƒƒƒ-40ƒ°Cƒtoƒ+85ƒ°Cƒandƒruggedƒvariants

15 VME Products

A combination of high performance, rugged, modular construction and broad industry support makes Emerson VMEbus products ideal to address the needs of OEMs serving embedded computing markets.

As part of the group of innovative companies that invented the VMEbus nearly 30 years ago, we have consistently worked to enhance and extend VMEbus technology. This process continues with VXS and 2eSST technologies which boosts the performance and capability of VMEbus technology while maintaining compatibility with existing systems over long product life cycles. Multi-core processors in our latest VME boards and ruggedized, extended temperature boards are just two of the other ways in which we are continuing to push the boundaries of performance and flexibility.

Emerson VME products are supported by our industry alliance members, specialist companies that can tailor VME-based solutions to fit your application. This ecosystem, together with a worldwide sales and support network, helps to rapidly integrate the optimum solutions into customer end applications. For example, special features including extended temperature, conformal coating and ruggedized variants are options for select VME boards from our alliance partners. VMEbus technology is employed around the world in a variety of highly demanding applications.

MVME2500 iVME7210 ƒ 800 MHz or 1.2 GHz Freescale QorIQ™ ƒ Intel® Core™ i7 dual-core integrated P2010 and P2020 processors processor (1.06 GHz ULV or 2.0 GHz LV) ƒ 1GB or 2GB DDR3-800, soldered down ƒ 4GB or 8GB ECC-protected DDR3-800/1066 ƒ Three on-board Gigabit Ethernet interfaces (soldered) (one front, one rear, one configurable to ƒ Mobile Intel® 5 Series chipset: Ibex Peak-M front or rear) Platform Controller Hub (PCH) ƒ Five serial ports ƒ 256KB non-volatile F-RAM ƒ One USB 2.0 port ƒ DVI-I interface ƒ One PMC/XMC site ƒ Dual Gigabit Ethernet, USB 2.0 and SATA ƒ Optional rear transition module to VXS P0 ƒ Hard drive mounting kit available ƒ Four on-board Gigabit Ethernet (GbE) ƒ Extended temperature (-40 °C to +71 °C) interfaces and rugged variants ƒ Five serial ports ƒ Up to three front USB 2.0 ports ƒ Up to two PMC/XMC sites ƒ SATA hard drive and mounting kit available

16 MVME4100 MVME6100 ƒ System-on-chip Freescale MPC8548E ƒ MPC7457 PowerPC processor running at (1.3 GHz) with PowerPC® e500 up to 1.267 GHz processor core ƒ 128-bit AltiVec coprocessor for parallel ƒ 2GB of DDR2 ECC memory, 128MB NOR processing flash and 4GB NAND flash ƒ Up to 2GB of on-board DDR ECC memory ƒ 512KB of MRAM non-volatile memory and 128MB of flash ƒ 2eSST VMEbus protocol with 320MB/s ƒ 2eSST VMEbus protocol with 320MB/s transfer rate across the VMEbus transfer rate across the VMEbus ƒ Four GbE ports; five serial ports ƒ Two 33/66/100 MHz PMC-X sites ƒ USB 2.0 controller for integrating ƒ Dual GbE interfaces for high performance cost-effective peripherals networking ƒ Dual 33/66/100MHz PMC sites for expansion MVME5500 ƒ x8 PCI Express expansion connector for ƒ MPC7457 PowerPC processor at 1 GHz PMC/XMC expansion with 256KB of on-chip L2 cache and 2MB ƒ Extended temperature -40 °C to +71 °C of L3 cache variant ƒ AltiVec coprocessor for high-perfor- mance computational applications ƒ 512MB of on-board 133 MHz SDRAM MVME7100 ECC memory ƒ System-on-chip Freescale MPC864xD ƒ 512MB additional memory via memory with dual PowerPC e600 processor cores mezzanine card ƒ Up to 2GB of DDR2 ECC memory, ƒ Two banks of soldered flash memory 128MB NOR flash and 4GB or 8GB (32MB and 8MB) NAND flash ƒ Dual independent 64-bit PCI buses and ƒ USB 2.0 controller for integrating PMC sites with a bus speed of up to 66 MHz cost-effective peripherals ƒ GbE interface plus an additional ƒ 2eSST VMEbus protocol with 320MB/s 10/100BaseTX Ethernet interface transfer rate across the VMEbus ƒ 64-bit PCI expansion mezzanine ƒ Dual 33/66/100MHz PMC-X sites for connector allowing up to four more PMCs expansion via industry standard modules ƒ x8 PCI Express expansion connector MVME5100/5110 for PMC-X and XMC expansion using ƒ MPC7410 or MPC750 microprocessor XMCspan with 32KB/32KB L1 cache and up to 2MB ƒ Extended temperature -40 °C to of secondary backside cache +71 °C variant ƒ Up to 512MB of on-board ECC SDRAM – expandable up to 1GB with optional RAM500 memory expansion modules MVME3100 ƒ 17MB flash memory ƒ System-on-chip Freescale MPC8540 ƒ Dual IEEE P1386.1 compatible 32/64-bit with PowerPC e500 processor core PMC expansion slots ƒ Two GbE ports plus an additional ƒ 64-bit PCI expansion mezzanine 10/100BaseTX port connector allowing up to four more PMCs ƒ Up to 512MB of DDR333 ECC memory ƒ Dual 16550 compatible async serial ports ƒ 2eSST VMEbus protocol with 320MB/s ƒ Dual 10BaseT/100BaseTX Ethernet transfer rate across the VMEbus interface ƒ USB 2.0 and Serial ATA controllers for integrating cost-effective peripherals XMCspan ƒ Dual 33/66/100 MHz PMC-X sites for ƒ Dual XMC/PMC expansion card for use expansion via industry standard with the MVME7100 and MVME4100 modules ƒ Two x4 PCI Express through XMC sites ƒ Configurable with dual 33/66/100MHz PMC or dual x4 PCI Express XMC ƒ Two carriers are stackable for up to four expansion slots 17 CompactPCI ® Products

CompactPCI® technology offers the performance and processor independence of the PCI bus in a rugged, modular Eurocard form factor, creating a robust embedded computing technology that is ideal for telecommunications, industrial control and imaging applications.

CompactPCI Platforms The Emerson CPX8216 family of high availability CompactPCI® systems is designed for critical telecom infrastructure applications requiring 5NINES availability. This carrier-grade platform features the ability to hot swap boards, route additional high speed sub-buses over the backplane and ® connect large amounts of I/O from a plug-in board through the backplane CompactPCI and out of the rear of a chassis. Our CompactPCI systems incorporate built-in redundancy of all major subsystems and are well suited for building media gateways, call servers, Voice over IP (VoIP) gateways and Internet edge switches.

CPX8216 CompactPCI High Availability System ƒ Dual 8-slot backplane (CPX8216 models) or backplane with H.110 bus to all I/O slots (CPX8216T models) for high availability designs ƒ PowerPC system controller CPU allows simplex or duplex configurations ƒ Three 400W hot-swappable AC or DC power supply fan units provide N+1 redundancy ƒ Front access service and installation of CompactPCI boards, drives, fans, and power supplies for easy access to active components ƒ Rear connection of I/O allows card removal without disconnecting field wiring ƒ Detection of power, temperature, and fan fail conditions supports remote reporting ƒ Adherence to PICMG 2.0 rev. 2.1, PICMG 2.1 rev. 1.0, PICMG 2.5 rev. 1.0 CompactPCI industry standard specifications provide worldwide acceptance and conformance

18 CompactPCI Boards Emerson offers processor boards featuring either Intel® or PowerPC® processors, enabling you to choose the right processor for your application.

CPCI7203 3U CompactPCI Board ƒ Intel® Core™ i7 processor (1.06 or 2.0 GHz) with integrated memory controller ƒ Intel® Ibex Peak host controller ƒ 1GB, 2GB, 4GB, 8GB DDR3-800/1066 memory ƒ Front panel I/O includes two Gigabit Ethernet, two USB 2.0, VGA ƒ Rear I/O includes SATA, USB 2.0, PCI Express, UART ƒ 2Mb NVRAM ƒ 4GB MicroSD memory ƒ Trusted platform management ƒ VMware certified

CPCI6200 PICMG 2.0/2.16 Processor Board ƒ Freescale MPC8572 (1.3 or 1.5 GHz) dual-core integrated processor ƒ Integrated north bridge in the processor ƒ 2GB or 4GB ECC-protected DDR3-800 memory ƒ Four on-board GbE interfaces ƒ Two serial ports; one USB 2.0 port ƒ PICMG 2.9 and 2.16 CompactPCI specifica- tion support ƒ Full PICMG 2.1, R2.0 Hot Swap specification compliance ƒ Two PCI-X/PMC sites; one XMC (PCI Express x4) capable site ƒ Optional RTM in PICMG 2.16 and rear I/O variants ƒ PLX6466 PCI-to-PCI bridge technology

CPCI-6020 Host Slot Processor Board ƒ MPC7410 PowerPC processor ƒ High performance L2 cache ƒ High performance, low-latency SDRAM subsystem ƒ Up to 2GB of ECC protected capacity ƒ New DMA capability ƒ Dual 10/100BaseT Ethernet ƒ Four optional USB ports (two in the front) ƒ Two async serial ports, two async/sync serial ports, keyboard and mouse ƒ Single PMC slot

19 Solution Services

As an embedded computing industry leader, we have a deep knowledge of our customers, their diverse markets, product applications and environments. Our Solution Services portfolio extends our customers’ reach in today’s demanding markets. This suite of services was designed around our customers’ product lifecycles and allows Emerson to deliver critical services and support when and where they are needed. We can also create specialized service offerings for your specific product or industry requirements. Our engi- neers, technicians and consultants are ready to tackle your toughest challenges, allowing you to focus on what will really add value to your business.

Global Possibilities Thanks to our extensive worldwide network of logistics facilities and Deployment Services design centers in the USA, Europe, India and Asia-Pacific region, we Deployment Services are designed to protect your product investment can deliver services where you need them. Service programs can be after release to your customers or markets. You need to ensure customized and tailored to specific geographic needs depending on customer satisfaction while maintaining a predictable support cost the technology deployed, support requirements and product model. Even if you have your own services organization, our Deployment lifecycle. As global product support becomes more complex, we help offerings can complement and extend your service portfolio. simplify your service chain to insure success wherever your customers ƒ ƒ On-site Support are located. Technical Support ƒ Product Integration ƒ Installation Support Seamless Lifecycle Support ƒ Warranty Services ƒ Logistics Programs The Solution Services portfolio focuses on three service offerings ƒ Repair Services ƒ Revision Management based on typical product development and lifecycles; Design, Deployment and Renewal. Design Services can help you minimize Renewal Services design time and speed your new products to market. Deployment As your product moves into the mature stage of its lifecycle, you Services can help you to train your technical staff, resolve technical may be faced with challenges that include long-term support for issues as well as integrate and test your products efficiently and cost customers not ready to move to newer products, finding ways to effectively. Renewal Services provide long-term product and support increase the current product’s performance and/or functionality, as options and can help you to achieve a smooth transition between well as migrating legacy applications and functionality to new generations of products. platforms. With our Renewal Services, we have solutions for each of these challenges. Design Services During your project design and development phase, it’s all about ƒ Longevity of Repair time. Time-to-market and time-to-revenue are the yardsticks you use ƒ Longevity of Support to measure your success. You need to complete your project in the ƒ Product Migration Consultation shortest amount of time with the least number of changes or ƒ Platform Technology Insertion redesign cycles. Our Design Services range from product concept creation to pre-release customer acceptance. ƒ Development Consulting ƒ Performance Analysis ƒ Development Support ƒ System Concept Design ƒ Application Porting ƒ Regulatory Testing Our Solution Services portfolio extends ƒ Benchmarking ƒ Engineering Support your reach by enabling you to seamlessly deliver global services to your customers in all phases of their product lifecycle.

20 Innovation Partnership Program Emerson’s Innovation Partnership Program (IPP) brings together a select community of companies committed to transforming leading-edge embedded technologies into globally available, application-specific business solutions. IPP enables Emerson Network Power to offer complete solutions to customers by building upon the foundations of these important industry standards – ATCA, COM Express, Carrier Grade Linux and the Service Availability Forum.

With a diverse array of partners spanning a broad range of technologies and applications, the Innovation Partnership Program ensures customers that they will receive comprehensive, application-specific solutions with guaranteed interoperability from a single source.

Our partners’ capabilities span a broad range of technologies and capabilities. Silicon provider partners help us determine the appropriate product and services roadmaps to meet customers’ requirements for performance and stability. OS partners offer the ability to provide customers a choice of fully integrated, rugged operating systems. Application and protocol partners allow us to offer more complete solutions to layer on top of the OS. And finally, additional partners help us gain time-to-market advantages in specific areas such as modular storage or network I/O.

The Innovation Partnership Program is divided into three categories which reflects the depth of the offerings Emerson has with its partners.

Strategic Deep engagement exists with our Strategic partners. Not only do we validate specific products, but we work closely together to drive alignment around corporate and product strategies. We coordinate roadmaps and constantly look for better ways to serve our joint customers.

Integrated We have a similar working relationship with our Integrated partners, usually with the goal of supporting a specific customer requirement or specific product.

Emerson Compatible Compatible partners allow us to confidently extend more choices to customers across specific application areas.

For a complete list of Emerson partners, please refer to our web site at EmersonNetworkPower.com/EmbeddedComputing

21 Terms and Conditions of Sale

The Emerson Network Power company that accepts Buyer’s order for Goods is THE WARRANTIES SET FORTH IN SECTIONS 5 AND 7 ARE THE SOLE AND herein referred to as the “Seller” and the person or entity purchasing goods or EXCLUSIVE WARRANTIES GIVEN BY SELLER WITH RESPECT TO THE services (“Goods”) and/or licensing software and/or firmware which are preloaded, GOODS AND SOFTWARE AND ARE IN LIEU OF AND EXCLUDE ALL OTHER or to be loaded into Goods (“Software”) from Seller is referred to as the “Buyer.” WARRANTIES, EXPRESS OR IMPLIED, ARISING BY OPERATION OF LAW These Terms and Conditions, any price list or schedule, quotation, acknowledgment OR OTHERWISE, INCLUDING WITHOUT LIMITATION, MERCHANTABILITY or invoice from Seller relevant to the sale of the Goods and licensing of Software AND FITNESS FOR A PARTICULAR PURPOSE WHETHER OR NOT THE and all documents incorporated by specific reference herein or therein constitute PURPOSE OR USE HAS BEEN DISCLOSED TO SELLER IN SPECIFICATIONS, the complete and exclusive statement of the terms governing the sale of Goods DRAWINGS OR OTHERWISE, AND WHETHER OR NOT SELLER’S PRODUCTS and license of Software by Seller to Buyer. Seller’s acceptance of Buyer’s purchase ARE SPECIFICALLY DESIGNED AND/OR MANUFACTURED BY SELLER FOR order is expressly conditional on Buyer’s assent to all of Seller’s terms and conditions BUYER’S USE OR PURPOSE. of sale, including terms and conditions that are different from or additional to the terms and conditions of Buyer’s purchase order. Buyer’s acceptance of the Goods These warranties do not extend to any losses or damages due to misuse, accident, and/or Software will manifest Buyer’s assent to these Terms and Conditions. Seller abuse, neglect, negligence (other than Seller’s), unauthorized modification or reserves the right in its sole discretion to refuse orders. Notwithstanding anything to alteration, use beyond rated capacity, unsuitable power sources or environmental the contrary, in the event that the provisions of these Terms and Conditions conflict conditions, improper installation, repair, handling, maintenance or application or with the provisions of an effective agreement signed by a duly authorized repre- any other cause not the fault of Seller. To the extent that Buyer or its agents have sentative of both parties (“Effective Agreement”) that applies to the transaction(s) supplied specifications, information, representation of operating conditions or other contemplated herein, the Effective Agreement shall control. data to Seller in the selection or design of the Goods and the preparation of Seller’s quotation, and in the event that actual operating conditions or other conditions differ 1. PRICES: Unless otherwise specified in writing by Seller, the price quoted or from those represented by Buyer, any warranties or other provisions contained specified by Seller for the Goods and/or Software shall remain in effect for 30 days herein that are affected by such conditions shall be null and void. after the date of Seller’s quotation or acknowledgment of Buyer’s order for the Goods and/or Software, whichever occurs first, provided an unconditional authorization from If within 30 days after Buyer’s discovery of any warranty defects within the warranty Buyer for the shipment of the Goods and/or Software is received and accepted by period, Buyer notifies Seller thereof in writing, Seller shall, at its option and as Seller within such time period. If such authorization is not received by Seller within Buyer’s exclusive remedy, repair, correct or replace per its return policy, or refund such 30 day period, Seller shall have the right to change the price for the Goods and/ the purchase price for, that portion of the Goods found by Seller to be defective. or Software to Seller’s price for the Goods and/or Software at the time of shipment. Failure by Buyer to give such written notice within the applicable time period shall All prices and licensee fees are exclusive of taxes, transportation and insurance, be deemed an absolute and unconditional waiver of Buyer’s claim for such defects. which are to be borne by Buyer. Advance written permission to return Goods must be obtained from Seller. Such Goods must be shipped transportation prepaid to Seller. Returns made without 2. TAXES: Any current or future tax or governmental charge (or increase in same) proper written permission will not be accepted by Seller. Seller reserves the right affecting Seller’s costs of production, sale, or shipment, or which Seller is otherwise to inspect Goods prior to authorizing return. Goods repaired or replaced during the required to pay or collect in connection with the sale, purchase, delivery, storage, warranty period shall be covered by the foregoing warranties for the remainder of the processing, use or consumption of Goods, shall be for Buyer’s account and shall be original warranty period or 90 days from the date of shipment, whichever is longer. added to the price or billed to Buyer separately, at Seller’s election. Buyer assumes all other responsibility for any loss, damage, or injury to persons or 3. TERMS OF PAYMENT: Unless otherwise specified by Seller, terms are net property arising out of, connected with, or resulting from the use of Goods and/or 30 days from date of Seller’s invoice in U.S. currency. Seller shall have the right, Software, either alone or in combination with other products/components. among other remedies, either to terminate this agreement or to suspend further performance under this and/or other agreements with Buyer in the event Buyer fails PRE-PRODUCTION (Prototype, Engineering Verification Test, or Design to make any payment when due, which other agreements Buyer and Seller hereby Verification Test) UNITS ARE SOLD “WHERE IS, AS IS, WITH ALL FAULTS” amend accordingly. Buyer shall be liable for all expenses, including attorneys’ fees, WITHOUT WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING, relating to the collection of past due amounts. If any payment owed to Seller is not WITHOUT LIMITATION, IMPLIED WARRANTIES OF MERCHANTABILITY OR paid when due, it shall bear interest, at a rate to be determined by Seller, which shall FITNESS FOR INTENDED PURPOSE. not exceed the maximum rate permitted by law, from the date on which it is due until it is paid. Any payment due to either party under this agreement shall be made in full 6. LIMITATION OF REMEDY AND LIABILITY: THE SOLE AND EXCLUSIVE REMEDY without any set-off, restriction, condition deduction or withholding for or on account FOR BREACH OF ANY WARRANTY HEREUNDER (OTHER THAN THE of any counterclaim. Should Buyer’s financial responsibility become unsatisfactory to WARRANTY PROVIDED UNDER SECTION 7) SHALL BE LIMITED TO REPAIR, Seller, cash payments or security satisfactory to Seller may be required by Seller for CORRECTION OR REPLACEMENT, OR REFUND OF THE PURCHASE PRICE future deliveries of the Goods and/or Software. If such cash payment or security is UNDER SECTION 5. not provided, in addition to Seller’s other rights and remedies, Seller may discontinue deliveries. SELLER SHALL NOT BE LIABLE FOR DAMAGES CAUSED BY DELAY IN PERFORMANCE AND THE REMEDIES OF BUYER SET FORTH IN THIS AGREEMENT 4. SHIPMENT AND DELIVERY: While Seller will use all reasonable commercial ARE EXCLUSIVE. IN NO EVENT, REGARDLESS OF THE FORM OF THE CLAIM efforts to maintain the delivery date(s) acknowledged or quoted by Seller, all shipping OR CAUSE OF ACTION (WHETHER BASED IN CONTRACT, INFRINGEMENT, dates are approximate and not guaranteed. Seller reserves the right to make partial NEGLIGENCE, STRICT LIABILITY, OTHER TORT OR OTHERWISE), SHALL shipments. Seller, at its option, shall not be bound to tender delivery of any Goods SELLER’S LIABILITY TO BUYER AND/OR ITS CUSTOMERS EXCEED THE and/or Software for which Buyer has not provided shipping instructions and other PRICE PAID BY BUYER FOR THE SPECIFIC GOODS OR SOFTWARE PROVIDED required information. If the shipment of the Goods and/or Software is postponed BY SELLER GIVING RISE TO THE CLAIM OR CAUSE OF ACTION. BUYER or delayed by Buyer for any reason, Buyer agrees to reimburse Seller for any and AGREES THAT IN NO EVENT SHALL SELLER’S LIABILITY TO BUYER AND/OR all storage costs and other additional expenses resulting therefrom. Risk of loss ITS CUSTOMERS EXTEND TO INCLUDE INCIDENTAL, CONSEQUENTIAL OR and legal title to the Goods shall transfer from Seller to Buyer upon delivery to and PUNITIVE DAMAGES. The term “consequential damages” shall include, but not receipt by carrier at Seller’s shipping point. Unless otherwise specified by Seller, be limited to, loss of anticipated profits, business interruption, loss of use, revenue, all shipments are F.C.A. Seller’s shipping point (Incoterms 2000). Any claims for reputation and data, costs incurred, including without limitation, for capital, fuel, shortages or damages suffered in transit are the responsibility of Buyer and shall be power and loss or damage to property or equipment. submitted by Buyer directly to the carrier. Shortages or damages must be identified and signed for at the time of delivery. It is expressly understood that any technical advice furnished by Seller with respect to the use of the Goods and/or Software is given without charge, and Seller assumes Buyer shall inspect Goods delivered to it by Seller immediately upon receipt, and, no obligation or liability for the advice given, or results obtained, all such advice being any course of dealing to the contrary notwithstanding, failure of Buyer to give Seller given and accepted at Buyer’s risk. notice of any claim within 10 days after receipt of such Goods shall be an unqualified acceptance of such Goods. 7. PATENTS AND COPYRIGHTS: Subject to the limitations of the second paragraph of Section 6, Seller warrants that the Goods sold, except as are made specifically 5. LIMITED WARRANTY: Subject to the limitations of Section 6 and unless for Buyer according to Buyer’s specifications, do not infringe any valid U.S. patent or otherwise specified by Seller in writing, Seller warrants that the Goods manufactured copyright in existence as of the date of shipment. This warranty is given upon the by Seller will be free from defects in material and workmanship and substantially condition that Buyer promptly notifies Seller of any claim or suit involving Buyer in meet Seller’s published specifications at the time of shipment under normal use and which such infringement is alleged and cooperates fully with Seller and permits Seller regular service and maintenance for (a) the period specified in Seller’s then current to control completely the defense, settlement or compromise of any such allegation product data sheets from the date of manufacture by Seller for standard Embedded of infringement. Seller’s warranty as to utility patents only applies to infringement Power Goods, (b) 2 years from initial shipment for standard Embedded Computing arising solely out of the inherent operation according to Seller’s specifications and Goods, and (c) the period specified by Seller in writing for custom Embedded Power instructions of such Goods. In the event such Goods are held to infringe such a U.S. Goods and custom Embedded Computing Goods. Unless otherwise stated in a patent or copyright in such suit, and the use of such Goods is enjoined, or in the separate Software license agreement, Seller makes no warranty as to any Software. case of a compromise or settlement by Seller, Seller shall have the right, at its option 22 and expense, to procure for Buyer the right to continue using such Goods, or replace 16. BUYER’S COMPLIANCE WITH LAWS: In connection with the transactions them with non-infringing Goods, or modify same to become non-infringing, or grant contemplated by this agreement, Buyer is familiar with and shall fully comply with all Buyer a credit for the depreciated value of such Goods and accept return of them. applicable laws, regulations, rules and other requirements of the United States and In the event of the foregoing, Seller may also, at its option, cancel the agreement as of any applicable state, foreign and local governmental body in connection with the to future deliveries of such Goods, without liability. purchase, license, receipt, use, transfer and disposal of the Goods and/or Software.

8. EXCUSE OF PERFORMANCE: Seller shall not be liable for delays in 17. EXPORT/IMPORT: Buyer agrees that all applicable import and export control performance or for non-performance due to acts of God; acts of Buyer; war; fire; laws, regulations, orders and requirements, including without limitation those of the flood; weather; sabotage; epidemics; strikes or labor disputes; civil disturbances United States and the European Union, and the jurisdictions in which the Seller and or riots; governmental requests, restrictions, allocations, laws, regulations, orders Buyer are established or from which Goods and/or Software may be supplied, will or actions; unavailability of or delays in transportation; default of suppliers; or apply to their receipt and use. In no event shall Buyer use, transfer, release, import, unforeseen circumstances or any events or causes beyond Seller’s reasonable export, Goods and/or Software in violation of such applicable laws, regulations, control. Deliveries or other performance may be suspended for an appropriate orders or requirements. period of time or canceled by Seller upon notice to Buyer in the event of any of the foregoing, but the balance of the agreement shall otherwise remain unaffected as a 18. GOVERNMENT CONTRACT CONDITIONS: In the event Buyer supplies result of the foregoing. Goods or Software to the U.S. Government or to a prime contractor selling to the U.S. Government, the following Federal Acquisition Regulation (FAR) clauses are If Seller determines that its ability to supply the total demand for the Goods, or accepted by Seller and are made part of this agreement applicable to such supply: to obtain material used directly or indirectly in the manufacture of the Goods, is 52.222-21 Prohibition of Segregated Facilities; 52.222-26 Equal Opportunity; hindered, limited or made impracticable due to causes set forth in the preceding 52.222-35 Equal Opportunity For Special Disabled Veterans, Veterans of Vietnam paragraph, Seller may allocate its available supply of the Goods or such material Era, and Other Eligible Veterans; 52.222-36 Affirmative Action For Workers with (without obligation to acquire other supplies of any such Goods or material) among Disabilities; and 52.219-8 Utilization of Small Business Concerns. No additional FAR its purchasers on such basis as Seller determines to be equitable without liability for or FAR Supplement clauses are accepted by Seller. In the event Buyer elects to sell any failure of performance which may result therefrom. Goods or Software to the U.S. Government or any national, state, provincial or local non-U.S. governmental entity or to a prime contractor selling to such entities, Buyer 9. RESCHEDULE/CANCELLATION: Unless otherwise agreed in writing by Seller, does so solely at its own option and risk, and agrees not to obligate Seller as a sub- orders under this agreement may not be rescheduled or canceled by Buyer for any contractor or otherwise to the U.S. Government or other governmental entity except reason. as described in this Section 18. Buyer remains solely and exclusively responsible for compliance with all statutes and regulations governing sales to the U.S. Government 10. CHANGES: Buyer may request changes or additions to the Goods and/ or any national, state, provincial or local non-U.S. governmental entity. Seller makes or Software consistent with Seller’s specifications and criteria. In the event such no representations, certifications or warranties whatsoever with respect to the ability changes or additions are accepted by Seller, Seller may revise the price, license of its Goods, Software, or prices to satisfy any such statutes and regulations. fees and dates of delivery. 19. GENERAL PROVISIONS: These terms and conditions supersede all other Seller reserves the right to change designs and specifications for the Goods and/or communications, negotiations and prior oral or written statements regarding the Software without prior notice to Buyer, except with respect to Goods and/or Software subject matter of these terms and conditions. No change, modification, rescission, being made to order for Buyer. Seller shall have no obligation to install or make such discharge, abandonment, or waiver of these terms and conditions shall be binding change in any Goods and/or Software manufactured prior to the date of such change. upon the Seller unless made in writing and signed on its behalf by a duly authorized representative of Seller. No conditions, usage of trade, course of dealing or 11. NUCLEAR/MEDICAL: GOODS AND SOFTWARE SOLD HEREUNDER performance, understanding or agreement purporting to modify, vary, explain, or ARE NOT FOR USE IN CONNECTION WITH ANY NUCLEAR, MEDICAL, LIFE- supplement these terms and conditions shall be binding unless hereafter made SUPPORT AND OTHER HIGH RISK APPLICATIONS WHERE GOODS OR in writing and signed by the party to be bound, and no modification or additional SOFTWARE FAILURE COULD LEAD TO LOSS OF LIFE OR CATASTROPHIC terms shall be applicable to this agreement by Seller’s receipt, acknowledgment, or PROPERTY DAMAGE. Buyer accepts Goods and Software with the foregoing acceptance of purchase orders, shipping instruction forms, or other documentation understanding, agrees to communicate the same in writing to any subsequent containing terms at variance with or in addition to those set forth herein. Any such purchasers or users and to defend, indemnify and hold harmless Seller from any modifications or additional terms are specifically rejected and deemed a material claims, losses, suits, judgments and damages, including incidental and conse- alteration hereof. If this document shall be deemed an acceptance of a prior offer quential damages, arising from such use, whether the cause of action be based in by Buyer, such acceptance is expressly conditional upon Buyer’s assent to any tort, contract or otherwise, including allegations that the Seller’s liability is based on additional or different terms set forth herein. No waiver by either party with respect negligence or strict liability. to any breach or default or of any right or remedy, and no course of dealing, shall be deemed to constitute a continuing waiver of any other breach or default or of 12. ASSIGNMENT: Buyer shall not assign its rights or delegate its duties hereunder any other right or remedy, unless such waiver be expressed in writing and signed or any interest herein without the prior written consent of Seller, and any such by the party to be bound. All typographical or clerical errors made by Seller in any assignment, without such consent, shall be void. quotation, acknowledgment or publication are subject to correction. In the event that any provision or portion thereof contained in the Contract is held to be unenforceable, 13. SOFTWARE: Notwithstanding any other provision herein to the contrary, Seller the Contract shall be construed without such provision or portion thereof. or applicable third party licensor to Seller shall retain all rights of ownership and title in its respective Software, including without limitation all rights of ownership and (A) If Seller is a U.S. incorporated entity: This Agreement shall be governed by the title in its respective copies of such Software. Except as otherwise provided herein, laws of the State of Delaware, U.S.A., without reference to its choice or conflict of Buyer is hereby granted a nonexclusive, non-transferable royalty free license to laws principles. The parties agree to submit to the exclusive jurisdiction of the courts use the Software incorporated into the Goods solely for purposes of Buyer properly of the State of Delaware for all actions arising in connection herewith. utilizing such Goods purchased from Seller. All other Software shall be furnished to, and used by, Buyer only after execution of Seller’s (or the licensor’s) applicable (B) If Seller is a European incorporated entity: This Agreement shall be standard license agreement, the terms of which are incorporated herein by reference. governed by the laws of England. Any dispute arising out of or in connection The Software is Seller’s own or Seller’s supplier’s proprietary information, and Buyer with this Agreement that cannot be resolved through friendly consultation and its employees and agents shall not disclose the Software to others without shall be referred to and finally resolved by arbitration in London, England Seller’s prior written consent. before the London Court of International Arbitration in accordance with its arbitration rules. The arbitral award shall be final and binding on the parties. 14. TOOLING: Tool, die, and pattern charges, if any, are in addition to the price of the Goods and are due and payable upon completion of the tooling. All such tools, (C) If Seller is an entity incorporated in the Asia Pacific region: This Agreement dies and patterns shall be and remain the property of Seller. Charges for tools, dies, shall be governed by the laws of the Hong Kong Special Administrative Region of and patterns do not convey to Buyer, title, ownership interest in, or rights to possession the People’s Republic of China. Any dispute arising out of or in connection with this or removal, or prevent their use by Seller for other purchasers, except as otherwise Agreement that cannot be resolved through friendly consultation shall be referred to expressly provided by Seller and Buyer in writing with reference to this provision. and finally resolved by arbitration in Hong Kong before the Hong Kong International Arbitration Centre in accordance with its arbitration rules. The arbitral award shall be 15. INTELLECTUAL PROPERTY: Seller’s intellectual property, including without final and binding on the parties. limitation, all patents, copyrights, trade secrets, trade-dress and any other intellectual property of any kind (including without limitation, that which exists in the underlying (D) No action, regardless of form, arising out of transactions relating to this technology), furnished by Seller to Buyer in connection with this agreement is the agreement, may be brought by either party more than two (2) years after the cause property of Seller and Seller retains all rights, including without limitation, exclusive of action has accrued. The U.N. Convention on Contracts for the International Sales rights of use, licensing, and sale. Possession of Goods, pre-production units, speci- of Goods shall not apply to this agreement. fications, prints or drawings, or any other materials does not convey to Buyer any rights or license thereto. Revised July 8, 2010 23 Ecosystem Leadership Just as nature relies on communities of organisms functioning as an ecological unit, embedded computing platforms depend on a broad and powerful ecosystem, including standards bodies, industry associations, building block suppliers and software vendors. Emerson Network Power brings a wealth of innovation and many years experience to accredited standards development organizations, specification consortia and industry associations through our executive memberships and key committee positions. We have long been committed to a strong ecosystem that works to further the development of the industries and technologies that are important to our customers’ success.

RapiDex is a trademark of Emerson Network Power. PICMG, AdvancedTCA, ATCA, CompactPCI, COM Express, the AdvancedTCA logo, COM Express logo and CompactPCI logo are registered trademarks, and AdvancedMC and the AdvancedMC logo are trademarks of PCI Industrial Computer Manufacturers Group. Intel, Pentium, Xeon, Celeron, Core and Atom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the U.S. and other countries. The EDGE® and EDGE® Innovation Network are registered trademarks of General Dynamics C4 Systems. PowerPC is a trademark of IBM Corp. Service Availability Forum and the Service Availability Forum logo are proprietary trademarks and service marks used under license. All other product or service names are the property of their respective owners.

This brochure identifies products, their specifications, and their characteristics, which may be suitable for certain applications. It does not constitute an offer to sell or a commitment of present or future availability, and should not be relied upon to state the terms and conditions, including warranties and disclaimers thereof, on which Emerson may sell products. A prospective buyer should exercise its own independent judgment to confirm the suitability of the products for particular applications. Emerson reserves the right to make changes, without notice, to any products or information herein which will, in its sole discretion, improve reliability, function, or design. Emerson does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent or other intellectual property rights or under others. This disclaimer extends to any prospective buyer, and it includes Emerson’s licensee, licensee’s transferees, and licensee’s customers and users. Availability of some of the products and services described herein may be restricted in some locations.

Emerson Network Power. Emerson.com/EmbeddedComputing The global leader in enabling Business Critical Continuity™.

AC Power Embedded Computing Outside Plant Racks & Integrated Cabinets Connectivity Embedded Power Power Switching & Controls Services DC Power Infrastructure Management & Monitoring Precision Cooling Surge Protection

Offices: Tempe, AZ U.S.A. 1 800 759 1107 or +1 602 438 5720 Emerson, Business-Critical Continuity and Paris, France +33 1 60 92 31 20 • Munich, Germany +44 1509 236490 • Tel Aviv, Israel +972 9 956 0361 Emerson Network Power are trademarks of Hong Kong +852 2176 3540 • Shanghai, China +86 21 3395 0289 • Tokyo, Japan +81 3 5403 2730 • Seoul, Korea +82 2 3483 1500 Emerson Electric Co. or one of its affiliated ENPPG-R4 03/11 companies. ©2011 Emerson Electric Co.