Embedded Computing Product Guide Our Customers Operate in Many Diverse Markets

Embedded Computing Business Critical Continuity™

Embedded Computing Product Guide Our customers operate in many diverse markets. What unites them is a need to work with a company that has an outstanding record as a reliable supplier. That’s Emerson Network Power. That’s the critical difference.

The Embedded Computing business of Emerson Network Power enables original equipment manufacturers and systems integrators to develop better products quickly, cost effectively and with less risk.

Emerson is a recognized leading provider of embedded computing solutions ranging from application-ready platforms, embedded PCs, enclosures, motherboards, blades and modules to enabling software and professional services.

For nearly 30 years, we have led the ecosystem required to enable new technologies to succeed including defining open specifications and driving industry-wide interoperability. This makes your integration process straightforward and allows you to quickly and easily build systems that meet your application needs.

Emerson’s engineering and technical support is backed by world-class manufacturing that can significantly reduce Table of Contents your time-to-market and help you gain a clear competitive edge. And, as part of Emerson, the Embedded Computing ® 4 AdvancedTCA Products business has strong financial credentials. 9 Commercial ATCA™ Products Let Emerson help you improve time-to-market and shift 10 Embedded Computers your development efforts to the deployment of new, 11 Motherboard & COM Products value-add features and services that create competitive 15 RapiDex™ Board Customization advantage and build market share. With Emerson behind you, anything is possible. 16 OpenVPX™ Products 17 VME™ Products 19 CompactPCI® Products 20 Solution Services 21 Innovation Partnership Program 22 Terms & Conditions

2 Our leadership and heritage includes embedded computing solutions for military, aerospace, government, medical, automation, industrial and telecommunications applications.

“This business has the DNA that includes Motorola’s embedded computing business, Artesyn, Force Computers, Heurikon, Blue Wave Systems, Mizar, Prolog, NetPlane and Spider Software! The combined strength and experience of these companies, fused with pedigrees of quality, innovation and a deep understanding of our customers’ needs, position Emerson Network Power for continued growth and leadership in the embedded computing markets.”

Stephen Dow President, Embedded Computing Emerson Network Power

3 AdvancedTCA® Products Emerson Network Power products complying with AdvancedTCA® standards and are designed to address applications requiring high performance, high reliability and long life cycles. The telecommunications industry was quick to recognize the fit with its carrier-grade requirements. Applications include control plane and packet and media processing infrastructure for wireless networks, IP Multimedia Subsystem (IMS), IPTV, other central office applications and network data center environments. ATCA™ products have also been deployed in a range of military, aerospace and industrial automation applications such as C4ISR and batch processing control.

Emerson offers a comprehensive portfolio of 10G and 40G ATCA products including shelf, switch blade and payload blade products. Payload blade options include high performance server, flexible I/O, packet processing and storage blades. Multiple business engagement models are designed to suit almost any customer – from purchasing ATCA products separately and integrating them yourself, to detailed integration and custom packaging services from our dedicated Solution Services group.

AdvancedTCA® Platform Cores The Emerson Centellis™ series of ATCA platform cores integrate the ATCA shelf (enclosure, shelf management, cooling and power distribution), switch blades, a complete software operating environment. This provides an off-the-shelf solution on which you can add your service-related hardware and software. Tested and verified hardware and software components, designed for NEBS, ETSI and other regulatory compliance, help to reduce development costs and accelerate time-to-market. Original equipment manufacturers (OEMs) can focus development resources on critical, differentiating features that provide a competitive advantage.

Centellis 2000 Platform Core Release 1: DC power options Release 2: AC power options, 10G User Card Release 3: Upgraded shelf management, Telco Alarm User Card

Centellis 2625 40GbE Platform Core Release 1: AXP640 shelf, ATCA-F125 switch blade, integrated software package

Centellis 4440 40GbE Platform Core Release 1: AXP1440 shelf, ATCA-F120 switch blade, integrated software package Release 2: AXP1440 shelf, ATCA-F140 switch blade, integrated software package

Centellis 4410 10GbE Platform Core Release 1: AXP1410 shelf, ATCA-F120 switch blade, integrated software package Release 2: AXP1411 shelf, ATCA-F125 switch blade, integrated software package

Centellis 4620 10GbE Platform Core Release 1: AXP1620 shelf, ATCA-F120 switch blade, integrated software package 4 AdvancedTCA® Shelves AdvancedTCA® Switch Blades Emerson offers a complete suite of ATCA shelf products including A variety of switch blades are available with flexible options for two-slot, six-slot, 14-slot and 16-slot shelf form factors with both processor AMCs, local storage and Telco clocking. Switch blade 10G and 40G capable backplanes. products include 10G and 40G variants to satisfy different performance and price points depending on application requirements. All ATCA™ compliant Emerson shelf products have superior power and cooling characteristics; 350 Watt/slot power distribution, front-to-rear ATCA-F140 40G Switch Blade cooling architecture and CP-TA B.4 compliant cooling performance. PICMG™ 3.0 compliant base interface Shelf Management functionality is integrated into each ATCA shelf switch and all, redundant field replaceable units (FRUs) are included. PICMG 3.1, Option 1, 9 fabric interface switch (1G/10G) 4x 10GBASE-KR fabric interface (40G) Centellis™ 2000 – 40G ATCA Shelf Single AMC site Two-slot, 3U, 19” form factor 640 Gb/s of total bandwidth 10G/40G fabric support 160 Gb/s of external bandwidth AC & DC power input options Optional SATA HDD Simplex and duplex configurations Optional Telecom clocking support available Integrated software package Front-to-rear cooling architecture

ATCA-F125 10G Switch Blade AXP640 – 40G ATCA Shelf PICMG 3.0 compliant base interface 6-slot, 7U, 19” form factor switch 10G/40G fabric support PICMG 3.1, Option 1, 9 fabric interface switch (1G/10G) AC & DC power input options Single AMC site Front-to-rear cooling architecture Optional SATA HDD Optional Telecom clocking support Integrated software package

AXP1440 – 40G ATCA Shelf 14-slot, 13U, 19” form factor 10G/40G fabric support PrAMC-7311 AMC Module ® AXP1410/1 – 10G ATCA Shelf Single Intel Core™ i7 processor running at 2.2 GHz 14-slot, 13U, 19” form factor Intel® BD82QM67 Platform Controller Hub 10G fabric support 4GB of ECC protected, DDR3 memory Complete Basic Blade Software package including Wind River PNE Linux operating system AXP1620 – 10G ATCA Shelf AMC front panel support for USB, 10/100/1000 Ethernet and serial 16-slot, 13U, 19” form factor console port 10G fabric support 8MB of BIOS flash, dual-bank architecture AMC mid-size form factor AMC.0, 1, 2, 3 compliant Design for NEBS/ETSI compliance

5 AdvancedTCA® IA Server Blades Emerson is committed to closely following the Intel® Embedded ATCA-7367 6-Core Processor Blade Platform Roadmap for ATCA™ server blades. Look for Emerson to One 6-core Intel Xeon processor deliver best-in-class performance through features like dual Intel® L5638 (2.0 GHz) ® Xeon 5600 series processors, and extreme memory capacity with Up to 48GB main memory up to twelve DIMM sockets, for demanding applications like One mid-size AMC site support network, subscriber databases and video-on-demand servers. Additional storage, I/O and Telecom clocking features such as hot-swappable hard drives and telecom clock Cost-effective on-board SATA drive synchronization are also provided. All of the server blades work with a range of available rear transition modules (RTM) supporting option hot-swappable hard disks with flexible choice of storage options eUSB storage device and RAID 0/1 functionality. Unless otherwise stated, the ATCA Additional flash storage device options fabric interface on each blade is PICMG 3.1 Option 1, 9 (1/10GbE) via SATA module compliant. Multiple network and storage I/O connectivity ATCA-7370 Dual 8-Core Additional GbE or Fibre Channel New Processor Blade interfaces via RTM option Highest performance Intel® architecture using four memory controllers per processor, supporting twice the ATCA-7365 Dual 6-Core processor interconnect bandwidth of Processor Blade some competing products Two 6-core Intel Xeon processor Two 8-core Intel Xeon processors L5638 (2.0 GHz) E5-2648L, 1.8 GHz Up to 96GB main memory Up to 128GB main memory eUSB storage device Hot-swappable hard disk with flexible Additional flash storage device options choice of storage options via SATA module RAID 0/1 support Multiple network and storage I/O Multiple network and storage I/O connectivity connectivity Option 9 (1/10GbE) ATCA fabric interface Hardware off-loading functions for en/ decryption, compression, pattern look-up Sophisticated, next generation Blade Management Controller

ATCA-7368 6-Core Processor Blade High performance Intel architecture processor blade designed to meet cost-sensitive applications One 6-core Intel Xeon processor L5638 (2.0 GHz) Up to 48GB main memory One mid-size AMC site supporting offload, storage & I/O Cost-effective on-board SATA drive option eUSB storage device option Additional flash storage device options via SATA module Multiple storage and I/O connectivity

6 AdvancedTCA® I/O Blades AdvancedTCA® Packet & Media Processing Blades Through the use of industry standard mezzanines like the Emerson packet processing blades are optimized for data plane or Advanced Mezzanine Card (AMC), these blades are designed signal plane processing in telecommunications or data communications for flexibility, and can be optimized to meet the needs of applications. Our family of Cavium OCTEON processing blades is your applications. designed for IP packet processing in applications like packet gateways, 4G wireless gateways, deep packet inspection applications, and Common applications include: network security. 3G RNCs with ATM I/O and signaling interfaces IP packet gateway interfaces with security and network address Emerson packet processing blades support a wide variety of performance translation requirements and bandwidth options. On-board Ethernet switches support flexible data paths. Integrated into Emerson 10GbE and 40GbE board Modular computing applications with processor AMCs for Intel® and system core products, the Emerson packet processor products architecture, PowerPC® or Cavium OCTEON® processing offer application-ready platforms for signaling and call control, network gateway and edge functions, deep packet inspection and Differentiating features of these blades include support for security processing. 10Gb/s fabrics; redundant boot banks of flash; reset persistent memory for black box data logging; backplane clock interfaces; and flexible options for on-board storage. ATCA-9405 Many-Core Packet New Processor Blade ATCA-7301 Processor Blade Two Cavium OCTEON 32-core CN6880 processors with up to 64GB memory Intel® Core™2 Duo processor (2.16 GHz) Up to 60 Gigabit connectivity bandwidth On-board GbE switch per CN6880 processor Two mid-size AdvancedMC® sites Hardware acceleration with thread PICMG 3.1, Option 1, 2 and 9 fabric pinning, security, de-/compression, interface support improved regular expression support, SAS disk option packet queuing and scheduling functions TCAM option 40GbE Ethernet switch Up to 16x10G and up to 2x40G RTM GbE connectivity Freescale® dual core P2020 QorIQ service processor Integrated terminal server

Emerson Network Power provides customers Wind River Linux based management software including L2 and L3 switch with a complete suite of ATCA blades including high management Debian® Linux and Wind River PNE Linux performance computing, flexible I/O, packet and software support for the Cavium media processing, and storage blades. Most OCTEON+ processors including Cavium SDK support current blades support 10GbE fabric technology, 6Wind 6Windgate® support but blades supporting 40GbE fabric are imminent.

7 ATCA-8310 Media Processing Blade SRstackware™ Switching and Routing Software A unique media-gateway-on-a-blade architecture, combining DSP, packet The Emerson SRstackware™ switching and routing software suite, processing, control plane and was developed to fulfill the ever-increasing Layer 2 and Layer 3 management, and packet and TDM networking requirements of telecom and non-telecom network I/O on a single blade. elements. SRstackware softare suites support a wide range of defined Up to 30 Texas Instruments standards and protocols and enables easy integration with customer TMS320TCI6486 6-core DSPs applications. SRstackware softare suites are available on all ATCA 8-core Freescale® QorIQ™ P4080 switch blades and select ATCA payload blade products. processor for packet processing and load balancing in the IP I/O path Basic SRstackware software includes all required network functions, Pre-installed Linux on P4080 with utilities switch management and commonly used Layer 2 protocols for blade configuration, switch combined into a single product. Enhanced SRstackware is a series of management and DSP setup specific protocol modules that can be purchased separately Red Hat RHEL certified 2-core Intel® depending on application requirements. Core™ i7 processor for control plane Basic SRstackware software suites features: application Local Ethernet switch connecting all Switch Management DSPs, CPUs, ATCA networks and I/O Command Line Interface (CLI) IP RTM supporting 10Gigabit Ethernet Simple Network Management Protocol (SNMPv2) - RFC 1901, 2271 Simple Network Management Protocol (SNMPv3) - RFC 3414, 3411 Broadcast storm recovery ATCA-9305 Many-Core Packet Flow control - IEEE 802.3x Processor Blade Application Programming Interface (API) access Two Cavium OCTEON® 16-core CN5860 processors Layer 2 Switching ® Freescale MPC8548 PowerQuicc III Spanning Tree Protocol (STP) - IEEE 802.1d integrated communications processor Rapid Spanning Tree Protocol (RSTP) - IEEE 802.1w operating at 1 GHz Multiple Spanning Tree Protocol (MSTP) - IEEE 802.1 Hardware acceleration with thread Virtual LAN (VLAN) Tagging - IEEE 802.1q pinning, security, de-/compression, Link Aggregation Control Protocol (LACP) - IEEE 802.3ad regexp with RLDRAM support, packet queuing and scheduling functions VLAN Classification by Protocol and Port - IEEE 802.1v 10GbE Ethernet switch Class of Service (CoS) - IEEE 802.1p Extensive RTM portfolio with Flash Link Aggregation Control Protocol (LACP) - IEEE 802.3ad storage options, up to 18xGbE and up to Generic Attribute Registration Protocol (GARP) - IEEE 802.1q 6x10GbE connections GARP Multicast Registration Protocol (GMRP) - IEEE 802.1q Wind River PNE based management GARP VLAN Registration Protocol (GVRP) - IEEE 802.1q software including L2 and L3 switch VLAN Stacking (Q-in-Q) - IEEE 802.1ad management Static Filtering (ACL) Debian® Linux and Wind River PNE Linux Enhanced Load Balancing (by TCP/UDP port) support for the Cavium OCTEON+ processors including Cavium Enhanced SRstackware features: SDK support 6Wind 6Windgate® support Layer 3 Routing IPv4 Routing – Internet Group Management Protocol (IGMP v1) - RFC 1112 – Internet Group Management Protocol (IGMP v2) - RFC 2236 – Internet Group Management Protocol (IGMP v3) - RFC 3376 – IGMP Snooping/Proxy - RFC 4541 – Routing Information Protocol (RIPv2) - RFC 2453

– Open Shortest Path First (OSPFv2) - RFC 2328 – Virtual Router Redundant Protocol (VRRP) - RFC 3768 IPv6 Routing – RIP Next generation (RIPng) - RFC 2080

8 Commercial ATCATM Products Designed for deployment outside of the telecommunications central office, the Katana™ family of Commercial ATCA™ systems is optimized for applications which value the enhanced reliability, serviceability and longevity of AdvancedTCA® technology, without the need to meet the NEBS requirement of operating at elevated ambient temperatures (up to 55 °C). In this case, the enhanced cooling of Emerson systems conforming to ATCA specifications can be used to deliver higher levels of performance than traditional AdvancedTCA systems.

Commercial ATCA Bladed Servers and Blades The first product in this family is the Katana 2000 system. Based on the Centellis™ 2000 two-slot chassis, this system offers high performance dual Intel® Xeon® server blades, each with dual redundant hot swappable hard drives. Both DC and AC powered configurations are supported.

The ATCA-7365-CE, a commercial ATCA blade, host variants of the Intel Xeon 5600 series processors with higher processor speed compared to available NEBS variants and is designed for commercial non-NEBS environment at 35 °C ambient temperature.

ATCA-7365-CE Dual 4/6-Core ATCA-7368-CE 6-Core Processor Blade Processor Blade New High performance Intel® architecture Two 4- or 6-core Intel Xeon processor blade designed for cost- processors, E5620 or E5645 (2.4 GHz) sensitive applications Up to 96GB main memory One 4- or 6-core Intel Xeon processor, Fully supported by the ATCA-736X E5645 or E5620 (2.4 GHz) RTM family Up to 48GB main memory Hot-swappable hard disk with flexible One mid-size AMC site supporting choice of storage options offload, storage & I/O RAID 0/1 support Cost-effective on-board SATA Multiple network and storage I/O drive option connectivity Hot-swappable hard disk with flexible PICMG™ 3.1 Option 1, 9 (1/10GbE) choice of storage options via RTM ATCA fabric interface RAID 0/1 support Designed for Commercial ATCA in a Multiple storage and I/O connectivity temperature controlled environment PICMG 3.1 Option 1, 9 (1/10GbE) ATCA fabric interface Designed for Commercial ATCA in a temperature controlled environment

9 Embedded Computers Based on a selection of our highly regarded Intel® architecture motherboards, Emerson now offers a growing range of embedded computers to speed time to market for those customers needing a more integrated solution. Consisting of an embedded motherboard, processor, memory and disk integrated into an application-specific enclosure, these embedded computers are designed for long-life applications with very little or no maintenance. Typical uses include medical clinical instruments, digital security and surveillance, industrial control and digital signage.

Emerson is offering two classes of Embedded Computers: Fanless, small, metal solutions that are designed to be mounted to a screen or instrument. These are noiseless, maintenance-free embedded computers that are available to suit a variety of operating temperature environments. They are easy to use and can be customized with alternate base components as well as adding an additional wireless module. Small, low cost embedded computers with some expansion capability. These are typically supplied in a plastic enclosure with mounting options, operate in an environment of 0 °C to 35 °C and are air cooled.

KR8-820 KR8-315 The KR8-820 embedded computer from The KR8-315 from Emerson Network Emerson Network Power is designed for Power is a fully integrated embedded intelligent kiosk, digital signage, medical computer. Enclosed in a custom, fanless cart and slot machine applications and case, the KR8-315 features the Intel® offers a flexible mix of features and Atom™ E640 processor running at 1.0 GHz. expansion options. Featuring the 2nd Two versions are available – a standard generation Intel® Core™ i5 2510E temperature and an extended temperature processor (3M Cache, up to 3.10GHz) , version. The extended temperature the KR8-820 offers excellent power and version utilizes a solid state drive performance for both general and graphics eliminating all moving parts and operates processing and is fully Intel® vPro™ certified. from -20 °C to 70 °C. The KR8-820 operates from 0 °C to 40 °C in still air and is totally silent as it utilizes a solid state disk.

MCASE Series The MCASE series of embedded computers from Emerson Network Power consists of a Mini-ITX enclosure featuring the MITX-CORE-820 motherboard. MCASE is a fully configured application-ready platform ready to be powered up and loaded with applications.

10 Motherboard & COM Products Emerson is fast becoming the embedded motherboard and Computer-on-Module (COM) supplier of choice for a broad range of industries including medical, retail, automation, test and measurement, transportation and renewable energy. Based on long-life embedded silicon, Emerson’s high quality, stable motherboards are delivered from outstanding manufacturing facilities and are backed by our global service presence.

Embedded Motherboards Emerson is a Premier member of the Intel® Intelligent Systems Alliance, a global ecosystem of 200+ member companies that provide the performance, connectivity, manageability, and security developers need to create smart, connected systems. As a Premier member of the Intel® Intelligent Systems Alliance, we are able to provide innovative embedded motherboards based on new processor platforms as early as possible into the silicon cycle to maximize the market potential of your product.

NITX-300 Series Nano-ITX Motherboards <7 Watts typical power consumption Up to 1.0 GHz Intel® Atom™ processor E640 series Intel® EG20T Platform Controller Hub Up to 1GB DDR2 memory, soldered on board Gigabit Ethernet, SATA and USB PCI Express x1 and PCI Express Mini Card slot Dual display support Four serial ports

MITX-430/440 Mini-ITX Motherboards Intel Atom D410 or D510 processor Up to 4GB DDR2 memory Gigabit Ethernet, SATA and USB ports PCI Express x1 and PCI Express Mini Card socket Dual display support Six serial ports

MITX-CORE-800 Series Mini-ITX Motherboards PGA socket for 2nd generation Intel® Core™ processor Intel® QM67 or HM57 PCH Up to 16GB with 2 DDR3 SO-DIMM sockets Dual display support PCI Express x1 and PCI Express Mini Card socket 11 Emerson is quickly becoming the preferred embedded motherboard supplier to a broad range of industries including medical, retail, automation, test and measurement, transportation and renewable energy.

MATXM-CORE-411-B MicroATX Motherboard rPGA989 socket (Socket G) for Intel® Core™ i7 processor up to 2.6 GHz QM57 Express MCH Up to 8GB DDR3 memory One PCI Express x16 expansion socket and three PCI Express x1 expansions sockets Dual simultaneous display PCI Express Mini Card socket for WiFi/WiMAX Unique midplane allowing easy, cost-effective maintenance Management technology for remote diagnostics and repair

MATXM-CORE-411-WR Embedded Development Kit MATXM-CORE-411-B, Intel Core i7-620M CPU, 2GB DDR3 RAM Wind River LiveUSB evaluation kit demonstrating Hypervisor 1.1, Wind River Linux 3.0.2, Wind River VxWorks 6.8 and Wind River Workbench 3.2 Start evaluating out-of-the-box in minutes

12 Computer-on-Module (COM) Computer-on-Modules (COMs) are highly integrated single-board computers that provide the core functionality of a system, allowing application-specific features to be designed onto a carrier board creating a semi-custom embedded PC solution. Emerson COM products feature the latest Freescale® QorIQ™ and Intel® Atom™ and Intel® Core™ processors.

COMX-CORE-2000 Series COMX-CORE Series Modules New 2nd generation Intel Core i7 dual or Intel Core i3, i5 and i7 processors quad core processors at up to 3.0 GHz Basic size 125 mm x 95 mm Extended temperature variant Type 6 for improved graphics Up to 16GB DDR3 memory Up to 8GB DDR3 memory (ECC and Gigabit Ethernet, SATA and USB ports non-ECC available) Dual graphics outputs eUSB flash socket Multiple PCI Express lanes for high Gigabit Ethernet, SATA and USB ports speed expansion Dual graphics outputs Multiple PCI Express lanes for high speed expansion

COMX-315 Module COM Express® Type 2 compatible module COMX-CAR-210 Carrier 1.0 GHz Intel Atom processor E640 Type 2 carrier board Intel® EG20T Platform Controller Hub MicroATX form factor allows rich I/O 1GB DDR2 soldered memory and expansion Compact size (95 mm x 95 mm) Supports COMX-3 and COMX-4 -40 to +85 °C operating temperature Type 2 modules

COMX-430/440 Modules COMX-CAR-610 Carrier Intel Atom processor D410/ D510 Type 6 carrier board @ 1.66 GHz MicroATX form factor allows rich I/O Up to 4GB DDR2 memory and expansion Gigabit Ethernet, SATA and PCI Express Support for COMX-CORE Type 6 LVDS graphics for flat panel displays modules 8x USB 2.0 interfaces

COMX-420 Module Intel Atom processor N450 at 1.6 GHz Type 2 COM Express module Up to 2GB DDR2 memory eUSB flash socket Gigabit Ethernet, SATA and PCI Express ports LVDS graphics for flat panel displays Eight USB 2.0 interfaces

13 COMX-P40x0-ENP2 COMX-P1022 Module New Freescale® QorIQ™ P4040 and P4080 Freescale QorIQ P1022 processor processors Two e500 Power Architecture cores Four or eight Power Architecture® cores running at 1.0 GHz running at 1.5 GHz Supports up to 2GB DDR3 ECC Extended temperature operation SO-UDIMM -40 °C to +85 °C 95 mm x 95 mm compact size Supports two channels of 2GB DDR3- MicroSD® card slot for on-board storage 1333 ECC SO-UDIMM (4GB max.) 95 mm x 125 mm Com Express® Basic footprint 12 configurable SERDES lanes available for maximum flexibility COMX-CAR-P1 Carrier Freescale QorIQ module carrier MicroATX form factor allows rich I/O and expansion Supports all QorIQ modules COMX-P4080 Module Freescale QorIQ P4080 processor Eight e500mc Power Architecture cores running at 1.5 GHz Supports two channels of 2GB DDR3- 1333 ECC SO-UDIMM (4GB max.) 95 mm x 125 mm basic size 12 configurable SERDES lanes available for maximum flexibility

COMX-P2020 Module Freescale QorIQ P2020 processor Two e500 Power Architecture cores running at 1.2 GHz On-board XGI Z11M graphics processor unit (GPU) Supports up to 2GB DDR3 ECC SO-UDIMM 95 mm x 95 mm compact size MicroSD card slot for on-board storage

14 RapiDexTM Board Customization Service

The ability to specify the exact features and form factor required in an embedded motherboard is possible with the innovative RapiDex™ board customization service from Emerson Network Power. Designed from the ground up to be fast and affordable, the RapiDex service enables embedded system designers to consider a custom motherboard for products where custom solutions were previously out of reach.

Our innovations in board design technology and manufacturing processes drastically reduce the front-end costs for custom boards. Typical customization engagements in the industry require open-ended, non-recurring engineering fees and high volume production commitments while the RapiDex service has only a minimal set-up fee and lower minimum order quantities. A simple specification procedure and new Emerson manufacturing processes enable customers to receive first article custom boards with targeted delivery within eight weeks of first order.

The Emerson RapiDex service can remove the need to use a standard product that may not be optimized for the application, leading to improved cost, space and power profiles. By putting board customization within reach, designers extend their control. With the low barrier-to-entry cost threshold of the RapiDex service, product designers can specify a motherboard form factor to exactly correspond with the features required in their range of products. And when the product designer wants to selectively upgrade motherboard features, such as the processor or I/O on the board, they can exercise complete control over that specification. No longer is the designer required to compromise as they search for a best-fit computing platform.

15 OpenVPXTM Products

The revolutionary VPX™ standard from VITA is for next generation high end commute intensive applications. It combines latest generation connector and packaging technology with high speed fabric connectivity in both 3U and 6U Eurocard form factors. The OpenVPX™ standard defines the system-level interoperability for multi- module system environments.

Emerson products complying with OpenVPX specifications offer the latest in processor, memory, and high speed fabric technologies with leading-edge rugged and cooling capabilities. They are ideal for high end industrial, communication and military/aerospace applications.

iVPX7223 3U VITA 46 VPX technology and VITA 65 OpenVPX technology VITA 48 VPX REDI technology two-level maintenance (2LM) 2nd generation Intel® Core™ i7 vPro™ 2.2 GHz processor dual-core Intel® QM67 Platform Controller Hub Up to 8GB ECC-protected DDR3-1333 soldered XMC site PCI Express fat pipe fabric 1000Base-BX/KX control plane Integrated 2D/3D graphics with digital and VGA output Optional rear transition module Payload module profile – MOD3-PAY-2F2U-16.2.3-3 Payload slot profile – SLT3-PAY-2F2U-14.2.3 – SLT3-PAY-1F1F2U-14.2.4 Air and conduction cooled -40 °C to +85 °C and rugged variants

16 VME TM Products

A combination of high performance, rugged, modular construction and broad industry support makes Emerson VMEbus™ compliant products ideal to address the needs of OEMs serving embedded computing markets.

As part of the group of innovative companies that invented the VMEbus technology nearly 30 years ago, we have consistently worked to enhance and extend VMEbus technology. This process continues with VXS and 2eSST technologies which boosts the performance and capability of VMEbus technology while maintaining compatibility with existing systems over long product life cycles. Multi-core processors in our latest VME boards and ruggedized, extended temperature boards are just two of the other ways in which we are continuing to push the boundaries of performance and flexibility.

Emerson products compliant with VME standards are supported by our industry alliance members, specialist companies that can tailor VME-based solutions to fit your application. This ecosystem, together with a worldwide sales and support network, helps to rapidly integrate the optimum solutions into customer end applications. For example, special features including extended temperature, conformal coating and ruggedized variants are options for select VME boards from our alliance partners. VMEbus technology is employed around the world in a variety of highly demanding applications.

MVME8100 iVME7210 New Freescale® QorIQ™ P5020 1.8/2.0GHz processsor Intel® Core™ i7 dual-core integrated Up to 8GB DDR3-1333MHz ECC Memory processor (1.06 GHz ULV or 2.0 GHz LV) 512KB FRAM 4GB or 8GB ECC-protected DDR3-800/1066 2 PMC/XMC sites (soldered) Embedded NAND Flash (8GB eMMC) Mobile Intel® 5 Series chipset: QM57 Express Optional on board 2.5” SATA SSD Platform Controller Hub (PCH) 2x4 PCIe or 2x4 SRIO connectivity to VXS 256KB non-volatile F-RAM backplane P0 DVI-I interface Up to 3 USB 2.0 ports Dual Gigabit Ethernet, USB 2.0 and SATA Up to 5 Ethernet ports to VXS P0 Up to 5 Serial ports Four on-board Gigabit Ethernet (GbE) 4 GPIO interfaces Extended Temperature and Conduction Five serial ports Cooled variants Up to three front USB 2.0 ports Up to two PMC/XMC sites SATA hard drive and mounting kit available MVME2500 800 MHz or 1.2 GHz Freescale QorIQ P2010 and P2020 processors 1GB or 2GB DDR3-800, soldered down Three on-board Gigabit Ethernet interfaces (one front, one rear, one configurable to front or rear) Five serial ports One USB 2.0 port One PMC/XMC site Optional rear transition module Hard drive mounting kit available Extended temperature (-40 °C to +71 °C) and rugged variants 17 MVME4100 MVME6100 System-on-chip Freescale® MPC8548E MPC7457 PowerPC processor running at processsor (1.3 GHz) with PowerPC® up to 1.267 GHz e500 processor core 128-bit AltiVec® coprocessor for parallel 2GB of DDR2 ECC memory, 128MB NOR processing flash and 4GB NAND flash Up to 2GB of on-board DDR ECC memory 512KB of MRAM non-volatile memory and 128MB of flash 2eSST VMEbus™ protocol with 320MB/s 2eSST VMEbus protocol with 320MB/s transfer rate across the VMEbus transfer rate across the VMEbus technology technology Four GbE ports; five serial ports Two 33/66/100 MHz PMC-X sites USB 2.0 controller for integrating Dual GbE interfaces for high performance cost-effective peripherals networking Dual 33/66/100MHz PMC sites for expansion MVME5500 x8 PCI Express expansion connector for MPC7457 PowerPC processor at 1 GHz PMC/XMC expansion with 256KB of on-chip L2 cache and 2MB Extended temperature -40 °C to +71 °C of L3 cache variant AltiVec coprocessor for high-performance computational applications 512MB of on-board 133 MHz SDRAM MVME7100 ECC memory System-on-chip Freescale MPC864xD 512MB additional memory via memory processsor with dual PowerPC e600 mezzanine card processor cores Two banks of soldered flash memory Up to 2GB of DDR2 ECC memory, (32MB and 8MB) 128MB NOR flash and 4GB or 8GB Dual independent 64-bit PCI buses and NAND flash PMC sites with a bus speed of up to 66 MHz USB 2.0 controller for integrating GbE interface plus an additional cost-effective peripherals 10/100BaseTX Ethernet interface 2eSST VMEbus protocol with 320MB/s 64-bit PCI expansion mezzanine transfer rate across the VMEbus connector allowing up to four more PMCs technology Dual 33/66/100MHz PMC-X sites for MVME5100/5110 expansion via industry standard modules MPC7410 or MPC750 microprocessor x8 PCI Express expansion connector with 32KB/32KB L1 cache and up to 2MB for PMC-X and XMC expansion using of secondary backside cache XMCspan Up to 512MB of on-board ECC SDRAM – Extended temperature -40 °C to expandable up to 1GB with optional +71 °C variant RAM500 memory expansion modules 17MB flash memory Dual IEEE P1386.1 compatible 32/64-bit MVME3100 PMC expansion slots System-on-chip Freescale MPC8540 64-bit PCI expansion mezzanine processsor with PowerPC e500 connector allowing up to four more PMCs processor core Dual 16550 compatible async serial ports Two GbE ports plus an additional Dual 10BaseT/100BaseTX Ethernet 10/100BaseTX port interface Up to 512MB of DDR333 ECC memory 2eSST VMEbus protocol with 320MB/s XMCspan transfer rate across the VMEbus Dual XMC/PMC expansion card for use technology with the MVME7100 and MVME4100 USB 2.0 and Serial ATA controllers for Two x4 PCI Express through XMC sites integrating cost-effective peripherals Configurable with dual 33/66/100MHz Dual 33/66/100 MHz PMC-X sites for PMC or dual x4 PCI Express XMC expansion via industry standard Two carriers are stackable for up to four modules expansion slots 18 CompactPCI ® Products CompactPCI® technology offers the performance and processor independence of the PCI bus in a rugged, modular Eurocard form factor, creating a robust embedded computing technology that is ideal for telecommunications, industrial control and imaging applications.

CompactPCI® Boards Emerson offers processor boards featuring either Intel® or PowerPC® processors, enabling you to choose the right processor for your application. ® CPCI7203 3U CompactPCI Board CompactPCI Intel® Core™ i7 processor (1.06 or 2.0 GHz) with integrated memory controller Intel® QM57 Express host controller 1GB, 2GB, 4GB, 8GB DDR3-800/1066 memory Front panel I/O includes two Gigabit Ethernet, two USB 2.0, VGA Rear I/O includes SATA, USB 2.0, PCI Express, UART 2MB NVRAM 4GB MicroSD memory Trusted platform management VMware certified

CPCI6200 PICMG™ 2.0/2.16 Processor Board Freescale® MPC8572 (1.3 or 1.5 GHz) dual-core integrated processor Integrated north bridge in the processor 2GB or 4GB ECC-protected DDR3-800 memory Four on-board GbE interfaces Two serial ports; one USB 2.0 port PICMG 2.9 and 2.16 CompactPCI specification support Full PICMG 2.1, R2.0 Hot Swap specification compliance Two PCI-X/PMC sites; one XMC (PCI Express x4) capable site Optional RTM in PICMG 2.16 and rear I/O variants PLX6466 PCI-to-PCI bridge technology

19 Solution Services

As an embedded computing industry leader, we have a deep knowledge of our customers, their diverse markets, product applications and environments. Our Solution Services portfolio extends our customers’ reach in today’s demanding markets. This suite of services was designed around our customers’ product lifecycles and allows Emerson to deliver critical services and support when and where they are needed. We can also create specialized service offerings for your specific product or industry requirements. Our engineers, technicians and consultants are ready to tackle your toughest challenges, allowing you to focus on what will really add value to your business.

Global Possibilities Thanks to our extensive worldwide network of logistics facilities and Deployment Services design centers in the USA, Europe, India and Asia-Pacific region, we Deployment Services are designed to protect your product investment can deliver services where you need them. Service programs can be after release to your customers or markets. You need to ensure customized and tailored to specific geographic needs depending on customer satisfaction while maintaining a predictable support cost the technology deployed, support requirements and product model. Even if you have your own services organization, our Deployment lifecycle. As global product support becomes more complex, we help offerings can complement and extend your service portfolio. simplify your service chain to insure success wherever your customers On-site Support are located. Technical Support Product Integration Installation Support Seamless Lifecycle Support Warranty Services Logistics Programs The Solution Services portfolio focuses on three service offerings Repair Services Revision Management based on typical product development and lifecycles; Design, Deployment and Renewal. Design Services can help you minimize Renewal Services design time and speed your new products to market. Deployment As your product moves into the mature stage of its lifecycle, you Services can help you to train your technical staff, resolve technical may be faced with challenges that include long-term support for issues as well as integrate and test your products efficiently and cost customers not ready to move to newer products, finding ways to effectively. Renewal Services provide long-term product and support increase the current product’s performance and/or functionality, as options and can help you to achieve a smooth transition between well as migrating legacy applications and functionality to new generations of products. platforms. With our Renewal Services, we have solutions for each of these challenges. Design Services During your project design and development phase, it’s all about Longevity of Repair time. Time-to-market and time-to-revenue are the yardsticks you use Longevity of Support to measure your success. You need to complete your project in the Product Migration Consultation shortest amount of time with the least number of changes or Platform Technology Insertion redesign cycles. Our Design Services range from product concept creation to pre-release customer acceptance. Development Consulting Performance Analysis Development Support System Concept Design Application Porting Regulatory Testing Our Solution Services portfolio extends Benchmarking Engineering Support your reach by enabling you to seamlessly deliver global services to your customers in all phases of their product lifecycle.

20 Innovation Partnership Program Emerson’s Innovation Partnership Program (IPP) brings together a select community of companies committed to transforming leading-edge embedded technologies into globally available, application-specific business solutions. IPP enables Emerson Network Power to offer complete solutions to customers by building upon the foundations of these important industry standards – ATCA, COM Express and Carrier Grade Linux.

With a diverse array of partners spanning a broad range of technologies and applications, the Innovation Partnership Program ensures customers that they will receive comprehensive, application-specific solutions with guaranteed interoperability from a single source.

Our partners’ capabilities span a broad range of technologies and capabilities. Silicon provider partners help us determine the appropriate product and services roadmaps to meet customers’ requirements for performance and stability. OS partners offer the ability to provide customers a choice of fully integrated, rugged operating systems. Application and protocol partners allow us to offer more complete solutions to layer on top of the OS. And finally, additional partners help us gain time-to-market advantages in specific areas such as modular storage or network I/O.

The Innovation Partnership Program is divided into three categories which reflects the depth of the offerings Emerson has with its partners.

Strategic Deep engagement exists with our Strategic partners. Not only do we validate specific products, but we work closely together to drive alignment around corporate and product strategies. We coordinate roadmaps and constantly look for better ways to serve our joint customers.

Integrated We have a similar working relationship with our Integrated partners, usually with the goal of supporting a specific customer requirement or specific product.

Emerson Compatible Compatible partners allow us to confidently extend more choices to customers across specific application areas.

For a complete list of Emerson partners, please refer to our web site at EmersonNetworkPower.com/EmbeddedComputing

21 Terms and Conditions of Sale

The Emerson Network Power company that accepts Buyer’s order for Goods is THE WARRANTIES SET FORTH IN SECTIONS 5 AND 7 ARE THE SOLE AND herein referred to as the “Seller” and the person or entity purchasing goods or EXCLUSIVE WARRANTIES GIVEN BY SELLER WITH RESPECT TO THE services (“Goods”) and/or licensing software and/or firmware which are preloaded, GOODS AND SOFTWARE AND ARE IN LIEU OF AND EXCLUDE ALL OTHER or to be loaded into Goods (“Software”) from Seller is referred to as the “Buyer.” WARRANTIES, EXPRESS OR IMPLIED, ARISING BY OPERATION OF LAW These Terms and Conditions, any price list or schedule, quotation, acknowledgment OR OTHERWISE, INCLUDING WITHOUT LIMITATION, MERCHANTABILITY or invoice from Seller relevant to the sale of the Goods and licensing of Software AND FITNESS FOR A PARTICULAR PURPOSE WHETHER OR NOT THE and all documents incorporated by specific reference herein or therein constitute PURPOSE OR USE HAS BEEN DISCLOSED TO SELLER IN SPECIFICATIONS, the complete and exclusive statement of the terms governing the sale of Goods DRAWINGS OR OTHERWISE, AND WHETHER OR NOT SELLER’S PRODUCTS and license of Software by Seller to Buyer. Seller’s acceptance of Buyer’s purchase ARE SPECIFICALLY DESIGNED AND/OR MANUFACTURED BY SELLER FOR order is expressly conditional on Buyer’s assent to all of Seller’s terms and conditions BUYER’S USE OR PURPOSE. of sale, including terms and conditions that are different from or additional to the terms and conditions of Buyer’s purchase order. Buyer’s acceptance of the Goods These warranties do not extend to any losses or damages due to misuse, accident, and/or Software will manifest Buyer’s assent to these Terms and Conditions. Seller abuse, neglect, negligence (other than Seller’s), unauthorized modification or reserves the right in its sole discretion to refuse orders. Notwithstanding anything to alteration, use beyond rated capacity, unsuitable power sources or environmental the contrary, in the event that the provisions of these Terms and Conditions conflict conditions, improper installation, repair, handling, maintenance or application or with the provisions of an effective agreement signed by a duly authorized repre- any other cause not the fault of Seller. To the extent that Buyer or its agents have sentative of both parties (“Effective Agreement”) that applies to the transaction(s) supplied specifications, information, representation of operating conditions or other contemplated herein, the Effective Agreement shall control. data to Seller in the selection or design of the Goods and the preparation of Seller’s quotation, and in the event that actual operating conditions or other conditions differ 1. PRICES: Unless otherwise specified in writing by Seller, the price quoted or from those represented by Buyer, any warranties or other provisions contained specified by Seller for the Goods and/or Software shall remain in effect for 30 days herein that are affected by such conditions shall be null and void. after the date of Seller’s quotation or acknowledgment of Buyer’s order for the Goods and/or Software, whichever occurs first, provided an unconditional authorization from If within 30 days after Buyer’s discovery of any warranty defects within the warranty Buyer for the shipment of the Goods and/or Software is received and accepted by period, Buyer notifies Seller thereof in writing, Seller shall, at its option and as Seller within such time period. If such authorization is not received by Seller within Buyer’s exclusive remedy, repair, correct or replace per its return policy, or refund such 30 day period, Seller shall have the right to change the price for the Goods and/ the purchase price for, that portion of the Goods found by Seller to be defective. or Software to Seller’s price for the Goods and/or Software at the time of shipment. Failure by Buyer to give such written notice within the applicable time period shall All prices and licensee fees are exclusive of taxes, transportation and insurance, be deemed an absolute and unconditional waiver of Buyer’s claim for such defects. which are to be borne by Buyer. Advance written permission to return Goods must be obtained from Seller. Such Goods must be shipped transportation prepaid to Seller. Returns made without 2. TAXES: Any current or future tax or governmental charge (or increase in same) proper written permission will not be accepted by Seller. Seller reserves the right affecting Seller’s costs of production, sale, or shipment, or which Seller is otherwise to inspect Goods prior to authorizing return. Goods repaired or replaced during the required to pay or collect in connection with the sale, purchase, delivery, storage, warranty period shall be covered by the foregoing warranties for the remainder of the processing, use or consumption of Goods, shall be for Buyer’s account and shall be original warranty period or 90 days from the date of shipment, whichever is longer. added to the price or billed to Buyer separately, at Seller’s election. Buyer assumes all other responsibility for any loss, damage, or injury to persons or 3. TERMS OF PAYMENT: Unless otherwise specified by Seller, terms are net property arising out of, connected with, or resulting from the use of Goods and/or 30 days from date of Seller’s invoice in U.S. currency. Seller shall have the right, Software, either alone or in combination with other products/components. among other remedies, either to terminate this agreement or to suspend further performance under this and/or other agreements with Buyer in the event Buyer fails PRE-PRODUCTION (Prototype, Engineering Verification Test, or Design to make any payment when due, which other agreements Buyer and Seller hereby Verification Test) UNITS ARE SOLD “WHERE IS, AS IS, WITH ALL FAULTS” amend accordingly. Buyer shall be liable for all expenses, including attorneys’ fees, WITHOUT WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING, relating to the collection of past due amounts. If any payment owed to Seller is not WITHOUT LIMITATION, IMPLIED WARRANTIES OF MERCHANTABILITY OR paid when due, it shall bear interest, at a rate to be determined by Seller, which shall FITNESS FOR INTENDED PURPOSE. not exceed the maximum rate permitted by law, from the date on which it is due until it is paid. Any payment due to either party under this agreement shall be made in full 6. LIMITATION OF REMEDY AND LIABILITY: THE SOLE AND EXCLUSIVE REMEDY without any set-off, restriction, condition deduction or withholding for or on account FOR BREACH OF ANY WARRANTY HEREUNDER (OTHER THAN THE of any counterclaim. Should Buyer’s financial responsibility become unsatisfactory to WARRANTY PROVIDED UNDER SECTION 7) SHALL BE LIMITED TO REPAIR, Seller, cash payments or security satisfactory to Seller may be required by Seller for CORRECTION OR REPLACEMENT, OR REFUND OF THE PURCHASE PRICE future deliveries of the Goods and/or Software. If such cash payment or security is UNDER SECTION 5. not provided, in addition to Seller’s other rights and remedies, Seller may discontinue deliveries. SELLER SHALL NOT BE LIABLE FOR DAMAGES CAUSED BY DELAY IN PERFORMANCE AND THE REMEDIES OF BUYER SET FORTH IN THIS AGREEMENT 4. SHIPMENT AND DELIVERY: While Seller will use all reasonable commercial ARE EXCLUSIVE. IN NO EVENT, REGARDLESS OF THE FORM OF THE CLAIM efforts to maintain the delivery date(s) acknowledged or quoted by Seller, all shipping OR CAUSE OF ACTION (WHETHER BASED IN CONTRACT, INFRINGEMENT, dates are approximate and not guaranteed. Seller reserves the right to make partial NEGLIGENCE, STRICT LIABILITY, OTHER TORT OR OTHERWISE), SHALL shipments. Seller, at its option, shall not be bound to tender delivery of any Goods SELLER’S LIABILITY TO BUYER AND/OR ITS CUSTOMERS EXCEED THE and/or Software for which Buyer has not provided shipping instructions and other PRICE PAID BY BUYER FOR THE SPECIFIC GOODS OR SOFTWARE PROVIDED required information. If the shipment of the Goods and/or Software is postponed BY SELLER GIVING RISE TO THE CLAIM OR CAUSE OF ACTION. BUYER or delayed by Buyer for any reason, Buyer agrees to reimburse Seller for any and AGREES THAT IN NO EVENT SHALL SELLER’S LIABILITY TO BUYER AND/OR all storage costs and other additional expenses resulting therefrom. Risk of loss ITS CUSTOMERS EXTEND TO INCLUDE INCIDENTAL, CONSEQUENTIAL OR and legal title to the Goods shall transfer from Seller to Buyer upon delivery to and PUNITIVE DAMAGES. The term “consequential damages” shall include, but not receipt by carrier at Seller’s shipping point. Unless otherwise specified by Seller, be limited to, loss of anticipated profits, business interruption, loss of use, revenue, all shipments are F.C.A. Seller’s shipping point (Incoterms 2000). Any claims for reputation and data, costs incurred, including without limitation, for capital, fuel, shortages or damages suffered in transit are the responsibility of Buyer and shall be power and loss or damage to property or equipment. submitted by Buyer directly to the carrier. Shortages or damages must be identified and signed for at the time of delivery. It is expressly understood that any technical advice furnished by Seller with respect to the use of the Goods and/or Software is given without charge, and Seller assumes Buyer shall inspect Goods delivered to it by Seller immediately upon receipt, and, no obligation or liability for the advice given, or results obtained, all such advice being any course of dealing to the contrary notwithstanding, failure of Buyer to give Seller given and accepted at Buyer’s risk. notice of any claim within 10 days after receipt of such Goods shall be an unqualified acceptance of such Goods. 7. PATENTS AND COPYRIGHTS: Subject to the limitations of the second paragraph of Section 6, Seller warrants that the Goods sold, except as are made specifically 5. LIMITED WARRANTY: Subject to the limitations of Section 6 and unless for Buyer according to Buyer’s specifications, do not infringe any valid U.S. patent or otherwise specified by Seller in writing, Seller warrants that the Goods manufactured copyright in existence as of the date of shipment. This warranty is given upon the by Seller will be free from defects in material and workmanship and substantially condition that Buyer promptly notifies Seller of any claim or suit involving Buyer in meet Seller’s published specifications at the time of shipment under normal use and which such infringement is alleged and cooperates fully with Seller and permits Seller regular service and maintenance for (a) the period specified in Seller’s then current to control completely the defense, settlement or compromise of any such allegation product data sheets from the date of manufacture by Seller for standard Embedded of infringement. Seller’s warranty as to utility patents only applies to infringement Power Goods, (b) 2 years from initial shipment for standard Embedded Computing arising solely out of the inherent operation according to Seller’s specifications and Goods, and (c) the period specified by Seller in writing for custom Embedded Power instructions of such Goods. In the event such Goods are held to infringe such a U.S. Goods and custom Embedded Computing Goods. Unless otherwise stated in a patent or copyright in such suit, and the use of such Goods is enjoined, or in the separate Software license agreement, Seller makes no warranty as to any Software. case of a compromise or settlement by Seller, Seller shall have the right, at its option 22 and expense, to procure for Buyer the right to continue using such Goods, or replace 16. BUYER’S COMPLIANCE WITH LAWS: In connection with the transactions them with non-infringing Goods, or modify same to become non-infringing, or grant contemplated by this agreement, Buyer is familiar with and shall fully comply with all Buyer a credit for the depreciated value of such Goods and accept return of them. applicable laws, regulations, rules and other requirements of the United States and In the event of the foregoing, Seller may also, at its option, cancel the agreement as of any applicable state, foreign and local governmental body in connection with the to future deliveries of such Goods, without liability. purchase, license, receipt, use, transfer and disposal of the Goods and/or Software.

8. EXCUSE OF PERFORMANCE: Seller shall not be liable for delays in 17. EXPORT/IMPORT: Buyer agrees that all applicable import and export control performance or for non-performance due to acts of God; acts of Buyer; war; fire; laws, regulations, orders and requirements, including without limitation those of the flood; weather; sabotage; epidemics; strikes or labor disputes; civil disturbances United States and the European Union, and the jurisdictions in which the Seller and or riots; governmental requests, restrictions, allocations, laws, regulations, orders Buyer are established or from which Goods and/or Software may be supplied, will or actions; unavailability of or delays in transportation; default of suppliers; or apply to their receipt and use. In no event shall Buyer use, transfer, release, import, unforeseen circumstances or any events or causes beyond Seller’s reasonable export, Goods and/or Software in violation of such applicable laws, regulations, control. Deliveries or other performance may be suspended for an appropriate orders or requirements. period of time or canceled by Seller upon notice to Buyer in the event of any of the foregoing, but the balance of the agreement shall otherwise remain unaffected as a 18. GOVERNMENT CONTRACT CONDITIONS: In the event Buyer supplies result of the foregoing. Goods or Software to the U.S. Government or to a prime contractor selling to the U.S. Government, the following Federal Acquisition Regulation (FAR) clauses are If Seller determines that its ability to supply the total demand for the Goods, or accepted by Seller and are made part of this agreement applicable to such supply: to obtain material used directly or indirectly in the manufacture of the Goods, is 52.222-21 Prohibition of Segregated Facilities; 52.222-26 Equal Opportunity; hindered, limited or made impracticable due to causes set forth in the preceding 52.222-35 Equal Opportunity For Special Disabled Veterans, Veterans of Vietnam paragraph, Seller may allocate its available supply of the Goods or such material Era, and Other Eligible Veterans; 52.222-36 Affirmative Action For Workers with (without obligation to acquire other supplies of any such Goods or material) among Disabilities; and 52.219-8 Utilization of Small Business Concerns. No additional FAR its purchasers on such basis as Seller determines to be equitable without liability for or FAR Supplement clauses are accepted by Seller. In the event Buyer elects to sell any failure of performance which may result therefrom. Goods or Software to the U.S. Government or any national, state, provincial or local non-U.S. governmental entity or to a prime contractor selling to such entities, Buyer 9. RESCHEDULE/CANCELLATION: Unless otherwise agreed in writing by Seller, does so solely at its own option and risk, and agrees not to obligate Seller as a sub- orders under this agreement may not be rescheduled or canceled by Buyer for any contractor or otherwise to the U.S. Government or other governmental entity except reason. as described in this Section 18. Buyer remains solely and exclusively responsible for compliance with all statutes and regulations governing sales to the U.S. Government 10. CHANGES: Buyer may request changes or additions to the Goods and/ or any national, state, provincial or local non-U.S. governmental entity. Seller makes or Software consistent with Seller’s specifications and criteria. In the event such no representations, certifications or warranties whatsoever with respect to the ability changes or additions are accepted by Seller, Seller may revise the price, license of its Goods, Software, or prices to satisfy any such statutes and regulations. fees and dates of delivery. 19. GENERAL PROVISIONS: These terms and conditions supersede all other Seller reserves the right to change designs and specifications for the Goods and/or communications, negotiations and prior oral or written statements regarding the Software without prior notice to Buyer, except with respect to Goods and/or Software subject matter of these terms and conditions. No change, modification, rescission, being made to order for Buyer. Seller shall have no obligation to install or make such discharge, abandonment, or waiver of these terms and conditions shall be binding change in any Goods and/or Software manufactured prior to the date of such change. upon the Seller unless made in writing and signed on its behalf by a duly authorized representative of Seller. No conditions, usage of trade, course of dealing or 11. NUCLEAR/MEDICAL: GOODS AND SOFTWARE SOLD HEREUNDER performance, understanding or agreement purporting to modify, vary, explain, or ARE NOT FOR USE IN CONNECTION WITH ANY NUCLEAR, MEDICAL, LIFE- supplement these terms and conditions shall be binding unless hereafter made SUPPORT AND OTHER HIGH RISK APPLICATIONS WHERE GOODS OR in writing and signed by the party to be bound, and no modification or additional SOFTWARE FAILURE COULD LEAD TO LOSS OF LIFE OR CATASTROPHIC terms shall be applicable to this agreement by Seller’s receipt, acknowledgment, or PROPERTY DAMAGE. Buyer accepts Goods and Software with the foregoing acceptance of purchase orders, shipping instruction forms, or other documentation understanding, agrees to communicate the same in writing to any subsequent containing terms at variance with or in addition to those set forth herein. Any such purchasers or users and to defend, indemnify and hold harmless Seller from any modifications or additional terms are specifically rejected and deemed a material claims, losses, suits, judgments and damages, including incidental and conse- alteration hereof. If this document shall be deemed an acceptance of a prior offer quential damages, arising from such use, whether the cause of action be based in by Buyer, such acceptance is expressly conditional upon Buyer’s assent to any tort, contract or otherwise, including allegations that the Seller’s liability is based on additional or different terms set forth herein. No waiver by either party with respect negligence or strict liability. to any breach or default or of any right or remedy, and no course of dealing, shall be deemed to constitute a continuing waiver of any other breach or default or of 12. ASSIGNMENT: Buyer shall not assign its rights or delegate its duties hereunder any other right or remedy, unless such waiver be expressed in writing and signed or any interest herein without the prior written consent of Seller, and any such by the party to be bound. All typographical or clerical errors made by Seller in any assignment, without such consent, shall be void. quotation, acknowledgment or publication are subject to correction. In the event that any provision or portion thereof contained in the Contract is held to be unenforceable, 13. SOFTWARE: Notwithstanding any other provision herein to the contrary, Seller the Contract shall be construed without such provision or portion thereof. or applicable third party licensor to Seller shall retain all rights of ownership and title in its respective Software, including without limitation all rights of ownership and (A) If Seller is a U.S. incorporated entity: This Agreement shall be governed by the title in its respective copies of such Software. Except as otherwise provided herein, laws of the State of Delaware, U.S.A., without reference to its choice or conflict of Buyer is hereby granted a nonexclusive, non-transferable royalty free license to laws principles. The parties agree to submit to the exclusive jurisdiction of the courts use the Software incorporated into the Goods solely for purposes of Buyer properly of the State of Delaware for all actions arising in connection herewith. utilizing such Goods purchased from Seller. All other Software shall be furnished to, and used by, Buyer only after execution of Seller’s (or the licensor’s) applicable (B) If Seller is a European incorporated entity: This Agreement shall be standard license agreement, the terms of which are incorporated herein by reference. governed by the laws of England. Any dispute arising out of or in connection The Software is Seller’s own or Seller’s supplier’s proprietary information, and Buyer with this Agreement that cannot be resolved through friendly consultation and its employees and agents shall not disclose the Software to others without shall be referred to and finally resolved by arbitration in London, England Seller’s prior written consent. before the London Court of International Arbitration in accordance with its arbitration rules. The arbitral award shall be final and binding on the parties. 14. TOOLING: Tool, die, and pattern charges, if any, are in addition to the price of the Goods and are due and payable upon completion of the tooling. All such tools, (C) If Seller is an entity incorporated in the Asia Pacific region: This Agreement dies and patterns shall be and remain the property of Seller. Charges for tools, dies, shall be governed by the laws of the Hong Kong Special Administrative Region of and patterns do not convey to Buyer, title, ownership interest in, or rights to possession the People’s Republic of China. Any dispute arising out of or in connection with this or removal, or prevent their use by Seller for other purchasers, except as otherwise Agreement that cannot be resolved through friendly consultation shall be referred to expressly provided by Seller and Buyer in writing with reference to this provision. and finally resolved by arbitration in Hong Kong before the Hong Kong International Arbitration Centre in accordance with its arbitration rules. The arbitral award shall be 15. INTELLECTUAL PROPERTY: Seller’s intellectual property, including without final and binding on the parties. limitation, all patents, copyrights, trade secrets, trade-dress and any other intellectual property of any kind (including without limitation, that which exists in the underlying (D) No action, regardless of form, arising out of transactions relating to this technology), furnished by Seller to Buyer in connection with this agreement is the agreement, may be brought by either party more than two (2) years after the cause property of Seller and Seller retains all rights, including without limitation, exclusive of action has accrued. The U.N. Convention on Contracts for the International Sales rights of use, licensing, and sale. Possession of Goods, pre-production units, speci- of Goods shall not apply to this agreement. fications, prints or drawings, or any other materials does not convey to Buyer any rights or license thereto. Revised Jun 06, 2012 23 Ecosystem Leadership Just as nature relies on communities of organisms functioning as an ecological unit, embedded computing platforms depend on a broad and powerful ecosystem, including standards bodies, industry associations, building block suppliers and software vendors. Emerson Network Power brings a wealth of innovation and many years experience to accredited standards development organizations, specification consortia and industry associations through our executive memberships and key committee positions. We have long been committed to a strong ecosystem that works to further the development of the industries and technologies that are important to our customers’ success.

RapiDex, CENTELLIS, KATANA, SRSTACKWARE and VME are trademarks of Emerson Network Power-Embedded Computing, Inc. and are registered in the U.S. and elsewhere. PICMG, AdvancedTCA, ATCA, CompactPCI, COM Express, CompactPCI and AdvancedMC marks are trademarks of PICMG-PCI Industrial Computer Manufacturers Group. Intel, Pentium, Xeon, Celeron, Core and Atom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the U.S. and other countries. PowerPC is a trademark of IBM Corp. Microsoft, Windows, and the Windows logo are registered trademarks of Microsoft Corporation in the United States and/or other countries. The Vita, VPX, VPX Redi, Open VPX and VMEbus Technology and related marks are trademarks of VITA. All other product or service names are the property of their respective owners.

This brochure identifies products, their specifications, and their characteristics, which may be suitable for certain applications. It does not constitute an offer to sell or a commitment of present or future availability, and should not be relied upon to state the terms and conditions, including warranties and disclaimers thereof, on which Emerson may sell products. A prospective buyer should exercise its own independent judgment to confirm the suitability of the products for particular applications. Emerson reserves the right to make changes, without notice, to any products or information herein which will, in its sole discretion, improve reliability, function, or design. Emerson does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent or other intellectual property rights or under others. This disclaimer extends to any prospective buyer, and it includes Emerson’s licensee, licensee’s transferees, and licensee’s customers and users. Availability of some of the products and services described herein may be restricted in some locations.

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