National Semiconductor Annual Report 2009
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The Evolving Role of Semiconductor Consortia in the United States and Japan
Portland State University PDXScholar Business Faculty Publications and Presentations The School of Business Fall 1998 The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham University of California - Berkeley Greg Linden University of California - Berkeley Melissa M. Appleyard Portland State University, [email protected] Follow this and additional works at: https://pdxscholar.library.pdx.edu/busadmin_fac Part of the Business Administration, Management, and Operations Commons Let us know how access to this document benefits ou.y Citation Details Ham, R., Linden, G., & Appleyard, M. M. (1998). The Evolving Role of Semiconductor Consortia in the United States and Japan. California Management Review, 41(1), 137-163. This Article is brought to you for free and open access. It has been accepted for inclusion in Business Faculty Publications and Presentations by an authorized administrator of PDXScholar. Please contact us if we can make this document more accessible: [email protected]. The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham Greg Linden Melissa M. Appleyard ince the late 1970s, governments throughout the industrialized economics have proclaimed the benefits of research consortia. In the United States, tor example, ihe 1984 National Cooperative Research SAct (NCRA) relaxed U.S. antitrust laws to encourage the formation of research consortia hy firms in the same industry; by the end of 1995, over 575 consortia had heen registered under the NCRA in a variety of -
A Vhsic Hardware Description Language Compiler for Logic Cell Arrays
A VHSIC HARDWARE DESCRIPTION LANGUAGE COMPILER FOR LOGIC CELL ARRAYS by Bing Liu A thesis presented to the university of Mânitoba in partial fulfillment of úe requirements of the degree of Maste¡ of Science in Elecrical and Computel Engineering Winnipeg, Manitoba, Canada @ Bing Liu, January 1990 Bibliothèque nat¡onale rE fr"3""i"i;tjo'",' du Canada Canadian Theses Serv¡ce Service des thèses canadiennes Otta'¿/ã. Can¿da Kl A ON¡ The author has granted an inevocable non' L'auteur a accordé une licence iffévocable et exclusive licence allowing the National Library non exclusive permettant à h Bibliothèque of Canada to reproduce, loan, distribute or sell nationale du Canada.de reproduire, prêter, copies of his/her thesis by any means and in distribuer ou vendre des copies de sa thèse any form or format, making this thesis avaihble de quelque manière et sous quelque forme to ¡nterested persons. que ce soit pour mettre des exemplaires de cette thèse à la disposition des personnes intéressées. The author retains ownership of the copyright L auteur conserve la propriété du droit d'auteur in his/her thesis. Neither the thesis nor qui protà?e sa thèse. Ni la thèse ni des extraits substantial extracts from it may be printed or substantiels de celle-ci ne doivent être otherw¡se reproduced without his/her per' imprimés ou autrement reproduits sans son mission. autorisation. ISBN ø-315-7 r7s t -3 Canadä A VHSIC HARDWARE DESCRIPTION I.ANGUAGE COMPILER FOR LOG]C CEI,L ARRAYS BY BING LIU A thesis subnrined lo thc Fact¡lty of Crâduate Studies of the University of M¿nitoba in partial fulfìllment of the requirenrents of the degree of MASTM O¡' SC]MICE o 1990 Permission has becn granted to the L¡BRÁRY OF THE UNIVER' SITY OF MANITOBA to lend o¡ sell copies of tlt¡s thesis. -
Going Vertical: a New Integration Era in the Semiconductor Industry Table of Contents
Going vertical: A new integration era in the semiconductor industry Table of contents 01 Executive overview Integration in the 02 semiconductor industry Strategic options for 03 semiconductor companies Moving forward: what semiconductor 04 companies must consider today Going vertical: A new integration era in the semiconductor industry 2 Executive overview Like many industries, the semiconductor industry is not immune to waves of diversification and consolidation through inorganic and organic growth. While inflection points with large-scale systemic changes in the value chain are relatively rare, our perspective is that there is a systemic change currently trending in the industry. Since the inception of the industry, semiconductor companies have recognized the value of technology. Accordingly, the market has rewarded semiconductor companies for specializing in distinct parts of the value chain by developing technological advantages by investing in R&D and by scaling technology through horizontal integration. This way of working transformed an industry that was initially vertically integrated (semiconductor design, semiconductor manufacturing, and system integration) into an ecosystem focused on specific areas of design, manufacturing, and/or systems. In the past five years, business value in some segments has moved from underlying technology to specific use cases to better monetize end-customer data and experience. • 5G, automotive, AI, cloud, system integration and hardware-software integration System integrators and software and cloud platform companies are no longer just important customers for the semiconductor industry—they are directly expanding into multiple upstream areas. • Taking advantage of silicon and system design • Control more of the technology stack • Optimize system performance • Improve the customer experience This vertical integration trend is distinctly different from the vertical integration which occurred at the inception of the semiconductor and integrated device manufacturing industry more than 50 years ago. -
Computer Organization and Architecture Designing for Performance Ninth Edition
COMPUTER ORGANIZATION AND ARCHITECTURE DESIGNING FOR PERFORMANCE NINTH EDITION William Stallings Boston Columbus Indianapolis New York San Francisco Upper Saddle River Amsterdam Cape Town Dubai London Madrid Milan Munich Paris Montréal Toronto Delhi Mexico City São Paulo Sydney Hong Kong Seoul Singapore Taipei Tokyo Editorial Director: Marcia Horton Designer: Bruce Kenselaar Executive Editor: Tracy Dunkelberger Manager, Visual Research: Karen Sanatar Associate Editor: Carole Snyder Manager, Rights and Permissions: Mike Joyce Director of Marketing: Patrice Jones Text Permission Coordinator: Jen Roach Marketing Manager: Yez Alayan Cover Art: Charles Bowman/Robert Harding Marketing Coordinator: Kathryn Ferranti Lead Media Project Manager: Daniel Sandin Marketing Assistant: Emma Snider Full-Service Project Management: Shiny Rajesh/ Director of Production: Vince O’Brien Integra Software Services Pvt. Ltd. Managing Editor: Jeff Holcomb Composition: Integra Software Services Pvt. Ltd. Production Project Manager: Kayla Smith-Tarbox Printer/Binder: Edward Brothers Production Editor: Pat Brown Cover Printer: Lehigh-Phoenix Color/Hagerstown Manufacturing Buyer: Pat Brown Text Font: Times Ten-Roman Creative Director: Jayne Conte Credits: Figure 2.14: reprinted with permission from The Computer Language Company, Inc. Figure 17.10: Buyya, Rajkumar, High-Performance Cluster Computing: Architectures and Systems, Vol I, 1st edition, ©1999. Reprinted and Electronically reproduced by permission of Pearson Education, Inc. Upper Saddle River, New Jersey, Figure 17.11: Reprinted with permission from Ethernet Alliance. Credits and acknowledgments borrowed from other sources and reproduced, with permission, in this textbook appear on the appropriate page within text. Copyright © 2013, 2010, 2006 by Pearson Education, Inc., publishing as Prentice Hall. All rights reserved. Manufactured in the United States of America. -
North American Company Profiles 8X8
North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications. -
Timeline of the Semiconductor Industry in South Portland
Timeline of the Semiconductor Industry in South Portland Note: Thank you to Kathy DiPhilippo, Executive Director/Curator of the South Portland Historical Society and Judith Borelli, Governmental Relations of Texas Inc. for providing some of the information for this timeline below. Fairchild Semiconductor 1962 Fairchild Semiconductor (a subsidiary of Fairchild Camera and Instrument Corp.) opened in the former Boland's auto building (present day Back in Motion) at 185 Ocean Street in June of 1962. They were there only temporarily, as the Western Avenue building was still being constructed. 1963 Fairchild Semiconductor moves to Western Avenue in February 1963. 1979 Fairchild Camera and Instrument Corp. is acquired/merged with Schlumberger, Ltd. (New York) for $363 million. 1987 Schlumberger, Ltd. sells its Fairchild Semiconductor Corp. subsidiary to National Semiconductor Corp. for $122 million. 1997 National Semiconductor sells the majority ownership interest in Fairchild Semiconductor to an investment group (made up of Fairchild managers, including Kirk Pond, and Citcorp Venture Capital Ltd.) for $550 million. Added Corporate Campus on Running Hill Road. 1999 In an initial public offering in August 1999, Fairchild Semiconductor International, Inc. becomes a publicly traded corporation on the New York Stock Exchange. 2016 Fairchild Semiconductor International, Inc. is acquired by ON Semiconductor for $2.4 billion. National Semiconductor 1987 National Semiconductor acquires Fairchild Semiconductor Corp. from Schlumberger, Ltd. for $122 million. 1995 National Semiconductor breaks ground on new 200mm factory in December 1995. 1996 National Semiconductor announces plans for a $600 million expansion of its facilities in South Portland; construction of a new wafer fabrication plant begins. 1997 Plant construction for 200mm factory completed and production starts. -
A Vhdl-Based Digital Slot Machine Implementation Using A
A VHDL-BASED DIGITAL SLOT MACHINE IMPLEMENTATION USING A COMPLEX PROGRAMMABLE LOGIC DEVICE by Lucas C. Pascute Submitted in Partial Fulfillment ofthe Requirements for the Degree of Master ofScience ofEngineering in the Electrical Engineering Program YOUNGSTOWN STATE UNIVERSITY December, 2002 A VHDL-BASED DIGITAL SLOT MACHINE IMPLEMENTATION USING A COMPLEX PROGRAMMABLE LOGIC DEVICE Lucas C. Pascute I hereby release this thesis to the public. I understand that this thesis will be made available from the OhioLINK ETD Center and the Maag Library Circulation Desk for public access. I also authorize the University or other individuals to make copies ofthis thesis as needed for scholarly research. Signature: ;/ (' , p ~-~_.._--- c:;.--_. ~ ~b IZ-3-Cl7., Lucas C. Pascute, Student Date Approvals: r. Faramarz Mossayebi, Thesis Advisor 12-:}--02- Date S~?c~ /"L/ 0:5 /u C Dr. Salvatore Pansino, Committee Member Date Dr. Peter J. K: vinsky, Dean ofGradua 111 ABSTRACT The intent ofthis project is to provide an educational resource from which future students can learn the basics ofprogrammable logic and the design process involved. More specifically, the area ofinterest involves very large scale integration (VLSI) design and the advantages associated with it such as reduced chip count and development time. The methodology used within is to first implement a design; using small and medium scale integration (SSI/MSI) packages in order to have a baseline for comparison. The design is then translated for use with the very high speed integrated circuit hardware description language (VHDL) and implemented onto a complex programmable logic device (CPLD). A discussion ofthis implementation process as well as VHDL lessons is provided to serve as a tutorial for the interested reader. -
Serial EEPROM Cross Reference Guide
SERIAL EEPROM Serial EEPROM Cross Reference Guide The purpose of this document is to provide a quick way interested in a part that is not listed in this book, please to determine the closest Microchip equivalent to Serial refer to the Microchip data book, or contact your local EEPROMs produced by other manufacturers. The distributor or sales representative for assistance. cross reference section is broken down by manufac- The manufacturers* included in this document are as turer and lists all parts from that manufacturer, and the follows: comparable Microchip part number. There is also a list- ing of manufacturer’s part numbering schemes to AKM Oki assist in determining the specifications of a particular Atmel Philips part. Catalyst Samsung There are subtle differences from manufacturer to Exel SGS-Thomson manufacturer and device to device, so Microchip rec- ommends consulting the respective manufacturer’s ISSI Siemens gadabout for specific details. Microchip Xicor Microchip provides a wide selection of Serial EEPROM Mitsubishi devices, both from a density and a packaging stand- National point, as well as several different protocols. If you are FIGURE 1: MICROCHIP SERIAL EEPROM PART NUMBER GUIDE XX XX XX XX X / XX Package W = Die in wafer form S = Die in waffle pack P = PDIP SM = Small outline .207 mil SN = Small outline .150 mil SL = 14-lead small outline .150 mil Process Temperature Blank = 0°C to +70°C I = -40°C to +125°C E = -40°C to +125°C Special Options Memory 01 1K 128 x 8 02 2K 256 x 8 04 4K 512 x 8 08 8K 1K x 8 16 16K 2K x 8 32 32K 4K x 8 65 64K 8K x 8 11 1K 128K x 8 or 64 x 16 72 1K 128 x 8 82 2K 256 x 8 92 4K 512 x 8 06 256 Bit 16 x 16 46 1K 64 x 16/128 x 8 56 2K 256 x 8/128 x 16 66 4K 512 x 8/256 x 16 Process Technology C – CMOS LC – Low Voltage (2.5V) CMOS AA – 1.8 Volt Part Number Designator 24 – 2-wire 59 – 4-wire 85 – 2-wire 93 – 3-wire *The above trademarks are property of their respective companies. -
Cad Veteran Richard Smith Joins Micro Magic, Inc. As Senior Technical Advisor
CAD Veteran Richard Smith Joins Micro Magic, Inc. Press Release CAD VETERAN RICHARD SMITH JOINS MICRO MAGIC, INC. AS SENIOR TECHNICAL ADVISOR “Dick brings a tremendous Sunnyvale, California -- June 7, 1999 -- Micro Magic, Inc. wealth of technical and (MMI) today announced the appointment of Dr. Richard business experience in C. Smith as senior technical advisor. Smith comes to MMI EDA to Micro Magic from Cadence Design Systems, Inc., where he was most re- and its customers. Dick cently a senior program manager in consulting services. At will be responsible for Cadence, he also served in software support management assisting with product and as the program manager for the Texas Instruments needs and definitions and account. Smith has held technical and management posi- for launching a design tions with Texas Instruments, National Semiconductor, and center and sales support capability in the Central Hewlett-Packard. region of the U.S.” Mark Santoro, MMI's president and CEO, stated, "Dick Mark Santoro President brings a tremendous wealth of technical and business expe- and CEO Micro Magic, rience in EDA to Micro Magic and its customers. Dick will Inc. be responsible for assisting with product needs and defini- tions and for launching a design center and sales support Contact: Heidi Vantulden capability in the Central region of the U.S." Armstrong Kendall, Inc. 503-672-4685 "MMI has a fresh new approach to EDA. It's a company of highly skilled design engineers who create very high per- heidi@armstrongkendall. formance processors and memories, and the EDA software com environment for managing the entire process," stated Dr. -
Discrete Semiconductor Products Fairchild@50
Fairchild Oral History Panel: Discrete Semiconductor Products Fairchild@50 (Panel Session # 3) Participants: Jim Diller Bill Elder Uli Hegel Bill Kirkham Moderated by: George Wells Recorded: October 5, 2007 Mountain View, California CHM Reference number: X4208.2008 © 2007 Computer History Museum Fairchild Semiconductor: Discrete Products George Wells: My name's George Wells. I came to Fairchild in 1969, right in the midst of the Hogan's Heroes, shall we say, subculture, at the time. It was difficult to be in that environment as a bystander, as someone watching a play unfold. It was a difficult time, but we got through that. I came to San Rafael, Wilf asked me to get my ass up to San Rafael and turn it around or shut it down. So I was up in San Rafael for a while, and then I made my way through various different divisions, collecting about 15 of them by the time I was finished. I ended up as executive vice president, working for Wilf, and left the company about a year and a half after the Schlumberger debacle. That's it in a nutshell. Let me just turn over now to Uli Hegel, who was with Fairchild for 38 years, one of the longest serving members, I believe, in the room. Maybe the longest serving member. Uli, why don't you tell us what you did when you came, when you came and what jobs you had when you were there. Uli Hegel: I came to Fairchild in 1959, September 9, and hired into R&D as a forerunner to the preproduction days. -
IC's and Electronic Components
Aero Technical Components 2800 Gandy Blvd. North St. Petersburg, FL 33702 Phone: 1-727-577-6115 Fax: 727-577-563-9134 Email: [email protected] Aero Technical Components A Woman-Owned Small Business www.aerotechcomp.com INTE GRATED CIRCUITS & SEMI-CONDUCTORS Agilent/HP IDT PMC-Sierra Tecor-Littelfuse Actel Infineon /Siemens PMI (Acquired by Analog TelCom Semiconductor Allegro Intel Devices) Teledyne Alliance Integrated Circuit Technology PNY Technologies Pulse Teledyne Technologies Altera International Rectifier Pulse-Engineering Telefunken/Vishay AMD Intersil Corporation QLogic T.I. Analog devices Isocom Quality Semi/IDT Toshiba Atmel ISSI Quick Logic TranSwitch Corporation Broadcom Lattice Ramtron Triquint Semiconductor Brooktre e/ Conexant Level One RCA (Acquired by Intersil) TRW Burr Brow n/ T.I. LG Electronics RF Micro Tyco Electronics California Micro devices (CMD) Linear Technology Samsung Unitrode/TI Catalyst Lite-On Sandisk UMC CEL/NEC Logic devices Sanyo Semiconductor Velio Coomunications C-Cub e/ LSI Logic Lucent/Agere Saronix (Acquired by Pericom) (Acquired by LSI Logic) Vishay Chips & Tec h/Asiliant M Systems SGS Thomson/ST Micro VitelicMosel Corp(MVC) Cirrus Logic Macronix Seiko Epson Vitesse Conexant Maxim Seeq Technology VLS I/ Philips CP Clare Micrel (Acquired by LSI Logic) Waferscal e/ ST Micro Cypress Micro Networks Seiko Instruments Western Digital Dallas Microchip Semtech Winbound Dense-PAC Micron SensitronSemiconductor Xicor/Intersil Elante c/ Intersil Microsemi Sharp Xilinx Epson America Mitel/Vitelic/MVC Siemans/Infineon -
Cadence Design Systems, Inc. 2020 Proxy Statement
NOTICE OF 2020 ANNUAL MEETING OF STOCKHOLDERS The 2020 Annual Meeting of Stockholders of CADENCE DESIGN SYSTEMS, INC., a Delaware corporation, will be held as follows: When: Where: April 30, 2020 Cadence San Jose Campus 1:00 p.m. Pacific Time 2655 Seely Avenue, Building 10 San Jose, California 95134 Items of Business: The purpose of the 2020 Annual Meeting of Stockholders is to consider and take action on the following: 1. To elect the nine directors named in the proxy statement to serve until the 2021 Annual Meeting of Stockholders and until their successors are elected and qualified, or until the directors’ earlier death, resignation or removal. 2. To approve the amendment of the Omnibus Equity Incentive Plan. 3. To vote on an advisory resolution to approve named executive officer compensation. 4. To ratify the selection of PricewaterhouseCoopers LLP as the independent registered public accounting firm of Cadence for its fiscal year ending January 2, 2021. 5. To vote on a stockholder proposal regarding special stockholder meetings, if properly presented at the meeting. 6. To transact such other business as may properly come before the meeting or any adjournment or postponement thereof. These items of business are more fully described in the proxy statement accompanying this notice. Record Date: Holders of Cadence Design Systems, Inc. common stock at the close of business on March 2, 2020 are entitled to notice of and to vote at the 2020 Annual Meeting of Stockholders and any adjournment or postponement thereof. How to Vote: Your vote is important to us. Please cast your vote promptly via the internet, telephone or mail.